Ehmke; John Charles
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ehmke; John Charles.The latest application filed is for "vertical shear weld wafer bonding".
- Ehmke; John Charles - Garland TX
| Patent | Date |
|---|---|
| Vertical Shear Weld Wafer Bonding App 20210371272 - Ehmke; John Charles ; et al. | 2021-12-02 |
| Selective wafer removal process for wafer bonding applications Grant 11,167,983 - Ehmke November 9, 2 | 2021-11-09 |
| Dark Mirror Thin Films App 20210255372 - EHMKE; John Charles | 2021-08-19 |
| Through-substrate conductor support Grant 11,084,717 - Ararao , et al. August 10, 2 | 2021-08-10 |
| Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of MEMS devices Grant 11,000,915 - Ehmke , et al. May 11, 2 | 2021-05-11 |
| Vertical Shear Weld Wafer Bonding App 20200391993 - Ehmke; John Charles ; et al. | 2020-12-17 |
| Hermetic vertical shear weld wafer bonding Grant 10,759,658 - Ehmke , et al. Sep | 2020-09-01 |
| Transparent display panel cooling Grant 10,750,645 - Ehmke , et al. A | 2020-08-18 |
| Selective Wafer Removal Process For Wafer Bonding Applications App 20200223690 - EHMKE; John Charles | 2020-07-16 |
| Transparent Display Panel Cooling App 20200196481 - Ehmke; John Charles ; et al. | 2020-06-18 |
| Hermetic Vertical Shear Weld Wafer Bonding App 20200180946 - Ehmke; John Charles ; et al. | 2020-06-11 |
| Through-substrate Conductor Support App 20190382262 - Ararao; Virgil Cotoco ; et al. | 2019-12-19 |
| Hermetically sealed MEMS device and its fabrication Grant 10,427,932 - Ehmke , et al. October 1, 2 | 2019-10-01 |
| Through-substrate conductor support Grant 10,392,246 - Ararao , et al. A | 2019-08-27 |
| Through-substrate Conductor Support App 20180186629 - Ararao; Virgil Cotoco ; et al. | 2018-07-05 |
| Hermetically Sealed Mems Device And Its Fabrication App 20180148319 - Ehmke; John Charles ; et al. | 2018-05-31 |
| Hermetically sealed MEMS device and its fabrication Grant 9,890,036 - Ehmke , et al. February 13, 2 | 2018-02-13 |
| Leak detection using cavity surface quality factor Grant 9,796,585 - Ehmke October 24, 2 | 2017-10-24 |
| Stabilized Transient Liquid Phase Metal Bonding Material For Hermetic Wafer Level Packaging Of Mems Devices App 20170283255 - EHMKE; John Charles ; et al. | 2017-10-05 |
| Leak Detection Using Cavity Surface Quality Factor App 20170174511 - Ehmke; John Charles | 2017-06-22 |
| Hermetically Sealed Mems Device And Its Fabrication App 20170152136 - Ehmke; John Charles ; et al. | 2017-06-01 |
| Hermetically-sealed Mems Device And Its Fabrication App 20170050844 - Ehmke; John Charles ; et al. | 2017-02-23 |
| Hermetically-sealed MEMS device and its fabrication Grant 9,567,213 - Ehmke , et al. February 14, 2 | 2017-02-14 |
| Semiconductor device and method of fabrication Grant 7,449,765 - Ehmke , et al. November 11, 2 | 2008-11-11 |
| Semiconductor device and method of fabrication App 20070200222 - Ehmke; John Charles ; et al. | 2007-08-30 |
| Method for adhesive bonding in electronic packaging App 20060243384 - Ehmke; John Charles ; et al. | 2006-11-02 |
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