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Edelstein; Daniel Charles Patent Filings

Edelstein; Daniel Charles

Patent Applications and Registrations

Patent applications and USPTO patent grants for Edelstein; Daniel Charles.The latest application filed is for "chemical mechanical planarization slurries and processes for platinum group metals".

Company Profile
3.22.25
  • Edelstein; Daniel Charles - White Plains NY
  • Edelstein, Daniel Charles - New Rochelle NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Chemical Mechanical Planarization Slurries And Processes For Platinum Group Metals
App 20220277964 - Krishnan; Mahadevaiyer ;   et al.
2022-09-01
Electrode-via structure
Grant 11,302,630 - Standaert , et al. April 12, 2
2022-04-12
Electrode-via Structure
App 20210320060 - Standaert; Theodorus E. ;   et al.
2021-10-14
Embedded Metal Contamination Removal from BEOL Wafers
App 20210296118 - Sil; Devika ;   et al.
2021-09-23
Apparatus For Reducing Wafer Contamination During ION-Beam Etching Processes
App 20210183627 - Arnold; John ;   et al.
2021-06-17
Contact via with pillar of alternating layers
Grant 11,031,542 - Yang , et al. June 8, 2
2021-06-08
Embedding Magneto-resistive Random-access Memory Devices Between Metal Levels
App 20210134883 - DUTTA; Ashim ;   et al.
2021-05-06
Electrode with Alloy Interface
App 20210104406 - Yang; Chih-Chao ;   et al.
2021-04-08
Sacrificial Buffer Layer For Metal Removal At A Bevel Edge Of A Substrate
App 20210013400 - Dutta; Ashim ;   et al.
2021-01-14
Sacrificial buffer layer for metal removal at a bevel edge of a substrate
Grant 10,892,404 - Dutta , et al. January 12, 2
2021-01-12
Contact Via
App 20200350486 - Yang; Chih-Chao ;   et al.
2020-11-05
Method and apparatus for single chamber treatment
Grant 9,824,917 - Yang , et al. November 21, 2
2017-11-21
Structure And Process For Metal Cap Integration
App 20170301620 - YANG; Chih-chao ;   et al.
2017-10-19
Method And Apparatus For Single Chamber Treatment
App 20170301584 - YANG; Chih-chao ;   et al.
2017-10-19
Method and apparatus for single chamber treatment
Grant 9,702,042 - Yang , et al. July 11, 2
2017-07-11
Method and apparatus for single chamber treatment
Grant 9,536,780 - Yang , et al. January 3, 2
2017-01-03
Method For Forming An Indium Cap Layer
App 20100252775 - McGlashan-Powell; Maurice ;   et al.
2010-10-07
Method For Forming An Indium Cap Layer
App 20080179280 - McGlashan-Powell; Maurice ;   et al.
2008-07-31
Silicon chip carrier with conductive through-vias and method for fabricating same
Grant 7,276,787 - Edelstein , et al. October 2, 2
2007-10-02
Silicon chip carrier with conductive through-vias and method for fabricating same
App 20060027934 - Edelstein; Daniel Charles ;   et al.
2006-02-09
Electroplated interconnection structures on integrated circuit chips
App 20060017169 - Andricacos; Panayotis Constantinou ;   et al.
2006-01-26
Silicon chip carrier with conductive through-vias and method for fabricating same
App 20050121768 - Edelstein, Daniel Charles ;   et al.
2005-06-09
Electroplated interconnection structures on integrated circuit chips
App 20040229456 - Andricacos, Panayotis Constantinou ;   et al.
2004-11-18
BEOL decoupling capacitor
App 20040195694 - Duncombe, Peter Richard ;   et al.
2004-10-07
BEOL decoupling capacitor
Grant 6,777,809 - Duncombe , et al. August 17, 2
2004-08-17
Method of making electroplated interconnection structures on integrated circuit chips
Grant 6,709,562 - Andricacos , et al. March 23, 2
2004-03-23
Method for forming Co-W-P-Au films
Grant 6,646,345 - Sambucetti , et al. November 11, 2
2003-11-11
BEOL decoupling capacitor
App 20030089943 - Duncombe, Peter Richard ;   et al.
2003-05-15
Beol decoupling capacitor
App 20030085447 - Duncombe, Peter Richard ;   et al.
2003-05-08
Dual damascene horn antenna
App 20020149530 - Ballantine, Arne Watson ;   et al.
2002-10-17
Method for forming Co-W-P-Au films
App 20020123220 - Sambucetti, Carlos Juan ;   et al.
2002-09-05
Thin film metal barrier for electrical interconnections
Grant 6,437,440 - Cabral, Jr. , et al. August 20, 2
2002-08-20
BEOL decoupling capacitor
App 20020066919 - Duncombe, Peter Richard ;   et al.
2002-06-06
Copper interconnection structure incorporating a metal seed layer
Grant 6,399,496 - Edelstein , et al. June 4, 2
2002-06-04
Thin film metal barrier for electrical interconnections
App 20020046874 - Cabral, Cyril JR. ;   et al.
2002-04-25
Method for forming Co-W-P-Au films
Grant 6,323,128 - Sambucetti , et al. November 27, 2
2001-11-27
BEOL decoupling capacitor
App 20010040271 - Duncombe, Peter Richard ;   et al.
2001-11-15
Thin metal barrier for electrical interconnections
Grant 6,291,885 - Cabral, Jr. , et al. September 18, 2
2001-09-18
Beol Decoupling Capacitor
App 20010013660 - DUNCOMBE, PETER RICHARD ;   et al.
2001-08-16
Copper interconnection structure incorporating a metal seed layer
Grant 6,181,012 - Edelstein , et al. January 30, 2
2001-01-30
Robust interconnect structure
Grant 6,133,136 - Edelstein , et al. October 17, 2
2000-10-17
Integrated circuit spiral inductor
Grant 6,114,937 - Burghartz , et al. September 5, 2
2000-09-05
Apparatus and method for the electrochemical etching of a wafer
Grant 6,103,096 - Datta , et al. August 15, 2
2000-08-15
Method of forming an integrated circuit spiral inductor with ferromagnetic liner
Grant 6,054,329 - Burghartz , et al. April 25, 2
2000-04-25
Integrated circuit inductor
Grant 5,884,990 - Burghartz , et al. March 23, 1
1999-03-23
Integrated circuit toroidal inductor
Grant 5,793,272 - Burghartz , et al. August 11, 1
1998-08-11
Diamond-like carbon for use in VLSI and ULSI interconnect systems
Grant 5,679,269 - Cohen , et al. October 21, 1
1997-10-21

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