loadpatents
Patent applications and USPTO patent grants for Edelstein; Daniel Charles.The latest application filed is for "chemical mechanical planarization slurries and processes for platinum group metals".
Patent | Date |
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Chemical Mechanical Planarization Slurries And Processes For Platinum Group Metals App 20220277964 - Krishnan; Mahadevaiyer ;   et al. | 2022-09-01 |
Electrode-via structure Grant 11,302,630 - Standaert , et al. April 12, 2 | 2022-04-12 |
Electrode-via Structure App 20210320060 - Standaert; Theodorus E. ;   et al. | 2021-10-14 |
Embedded Metal Contamination Removal from BEOL Wafers App 20210296118 - Sil; Devika ;   et al. | 2021-09-23 |
Apparatus For Reducing Wafer Contamination During ION-Beam Etching Processes App 20210183627 - Arnold; John ;   et al. | 2021-06-17 |
Contact via with pillar of alternating layers Grant 11,031,542 - Yang , et al. June 8, 2 | 2021-06-08 |
Embedding Magneto-resistive Random-access Memory Devices Between Metal Levels App 20210134883 - DUTTA; Ashim ;   et al. | 2021-05-06 |
Electrode with Alloy Interface App 20210104406 - Yang; Chih-Chao ;   et al. | 2021-04-08 |
Sacrificial Buffer Layer For Metal Removal At A Bevel Edge Of A Substrate App 20210013400 - Dutta; Ashim ;   et al. | 2021-01-14 |
Sacrificial buffer layer for metal removal at a bevel edge of a substrate Grant 10,892,404 - Dutta , et al. January 12, 2 | 2021-01-12 |
Contact Via App 20200350486 - Yang; Chih-Chao ;   et al. | 2020-11-05 |
Method and apparatus for single chamber treatment Grant 9,824,917 - Yang , et al. November 21, 2 | 2017-11-21 |
Structure And Process For Metal Cap Integration App 20170301620 - YANG; Chih-chao ;   et al. | 2017-10-19 |
Method And Apparatus For Single Chamber Treatment App 20170301584 - YANG; Chih-chao ;   et al. | 2017-10-19 |
Method and apparatus for single chamber treatment Grant 9,702,042 - Yang , et al. July 11, 2 | 2017-07-11 |
Method and apparatus for single chamber treatment Grant 9,536,780 - Yang , et al. January 3, 2 | 2017-01-03 |
Method For Forming An Indium Cap Layer App 20100252775 - McGlashan-Powell; Maurice ;   et al. | 2010-10-07 |
Method For Forming An Indium Cap Layer App 20080179280 - McGlashan-Powell; Maurice ;   et al. | 2008-07-31 |
Silicon chip carrier with conductive through-vias and method for fabricating same Grant 7,276,787 - Edelstein , et al. October 2, 2 | 2007-10-02 |
Silicon chip carrier with conductive through-vias and method for fabricating same App 20060027934 - Edelstein; Daniel Charles ;   et al. | 2006-02-09 |
Electroplated interconnection structures on integrated circuit chips App 20060017169 - Andricacos; Panayotis Constantinou ;   et al. | 2006-01-26 |
Silicon chip carrier with conductive through-vias and method for fabricating same App 20050121768 - Edelstein, Daniel Charles ;   et al. | 2005-06-09 |
Electroplated interconnection structures on integrated circuit chips App 20040229456 - Andricacos, Panayotis Constantinou ;   et al. | 2004-11-18 |
BEOL decoupling capacitor App 20040195694 - Duncombe, Peter Richard ;   et al. | 2004-10-07 |
BEOL decoupling capacitor Grant 6,777,809 - Duncombe , et al. August 17, 2 | 2004-08-17 |
Method of making electroplated interconnection structures on integrated circuit chips Grant 6,709,562 - Andricacos , et al. March 23, 2 | 2004-03-23 |
Method for forming Co-W-P-Au films Grant 6,646,345 - Sambucetti , et al. November 11, 2 | 2003-11-11 |
BEOL decoupling capacitor App 20030089943 - Duncombe, Peter Richard ;   et al. | 2003-05-15 |
Beol decoupling capacitor App 20030085447 - Duncombe, Peter Richard ;   et al. | 2003-05-08 |
Dual damascene horn antenna App 20020149530 - Ballantine, Arne Watson ;   et al. | 2002-10-17 |
Method for forming Co-W-P-Au films App 20020123220 - Sambucetti, Carlos Juan ;   et al. | 2002-09-05 |
Thin film metal barrier for electrical interconnections Grant 6,437,440 - Cabral, Jr. , et al. August 20, 2 | 2002-08-20 |
BEOL decoupling capacitor App 20020066919 - Duncombe, Peter Richard ;   et al. | 2002-06-06 |
Copper interconnection structure incorporating a metal seed layer Grant 6,399,496 - Edelstein , et al. June 4, 2 | 2002-06-04 |
Thin film metal barrier for electrical interconnections App 20020046874 - Cabral, Cyril JR. ;   et al. | 2002-04-25 |
Method for forming Co-W-P-Au films Grant 6,323,128 - Sambucetti , et al. November 27, 2 | 2001-11-27 |
BEOL decoupling capacitor App 20010040271 - Duncombe, Peter Richard ;   et al. | 2001-11-15 |
Thin metal barrier for electrical interconnections Grant 6,291,885 - Cabral, Jr. , et al. September 18, 2 | 2001-09-18 |
Beol Decoupling Capacitor App 20010013660 - DUNCOMBE, PETER RICHARD ;   et al. | 2001-08-16 |
Copper interconnection structure incorporating a metal seed layer Grant 6,181,012 - Edelstein , et al. January 30, 2 | 2001-01-30 |
Robust interconnect structure Grant 6,133,136 - Edelstein , et al. October 17, 2 | 2000-10-17 |
Integrated circuit spiral inductor Grant 6,114,937 - Burghartz , et al. September 5, 2 | 2000-09-05 |
Apparatus and method for the electrochemical etching of a wafer Grant 6,103,096 - Datta , et al. August 15, 2 | 2000-08-15 |
Method of forming an integrated circuit spiral inductor with ferromagnetic liner Grant 6,054,329 - Burghartz , et al. April 25, 2 | 2000-04-25 |
Integrated circuit inductor Grant 5,884,990 - Burghartz , et al. March 23, 1 | 1999-03-23 |
Integrated circuit toroidal inductor Grant 5,793,272 - Burghartz , et al. August 11, 1 | 1998-08-11 |
Diamond-like carbon for use in VLSI and ULSI interconnect systems Grant 5,679,269 - Cohen , et al. October 21, 1 | 1997-10-21 |
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