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Patent applications and USPTO patent grants for Dow, Daniel B..The latest application filed is for "method of fabricating a semiconductor work object".
Patent | Date |
---|---|
Method of fabricating a semiconductor work object App 20040214436 - Dow, Daniel B. | 2004-10-28 |
Method of fabricating a semiconductor work object Grant 6,737,356 - Dow May 18, 2 | 2004-05-18 |
Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members Grant 6,358,129 - Dow March 19, 2 | 2002-03-19 |
Method and apparatus for electrically endpointing a chemical-mechanical planarization process Grant 6,319,420 - Dow November 20, 2 | 2001-11-20 |
Backing Members And Planarizing Machines For Mechanical And Chemical-mechanical Planarization Of Microelectronic-device Substrate Assemblies, And Methods Of Making And Using Such Backing Members App 20010018322 - DOW, DANIEL B. | 2001-08-30 |
Methods and apparatuses for removing material from discrete areas on a semiconductor wafer Grant 6,153,532 - Dow , et al. November 28, 2 | 2000-11-28 |
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