loadpatents
Patent applications and USPTO patent grants for Douglas; Leonard Richard.The latest application filed is for "method and apparatus for fabricating waveguides and waveguides fabricated therefrom".
Patent | Date |
---|---|
Waveguide including a plurality of waveguide segments Grant 7,146,081 - Balch , et al. December 5, 2 | 2006-12-05 |
Method and apparatus for fabricating waveguides and waveguides fabricated therefrom App 20060002676 - Balch; Ernest Wayne ;   et al. | 2006-01-05 |
Method and apparatus for fabricating waveguides and waveguides fabricated therefrom Grant 6,957,007 - Balch , et al. October 18, 2 | 2005-10-18 |
Apparatus for aligning die to interconnect metal on flex substrate Grant 6,790,703 - Saia , et al. September 14, 2 | 2004-09-14 |
Method and apparatus for fabricating waveguides and waveguides fabricated therefrom App 20040017974 - Balch, Ernest Wayne ;   et al. | 2004-01-29 |
High temperature circuit apparatus Grant 6,603,145 - Wojnarowski , et al. August 5, 2 | 2003-08-05 |
Computerized systems and methods for the creation and sharing of project templates App 20030004763 - LaBlanc, Michael Robert ;   et al. | 2003-01-02 |
Computerized systems and methods for acquiring and disseminating process management information App 20030005057 - LaBlanc, Michael Robert ;   et al. | 2003-01-02 |
Apparatus, method and product therefrom, for aligning die to interconnect metal on flex substrate App 20020197767 - Saia, Richard Joseph ;   et al. | 2002-12-26 |
Computerized systems and methods for performing new product introductions App 20020194044 - Lablanc, Michael Robert ;   et al. | 2002-12-19 |
Method for aligning die to interconnect metal on flex substrate Grant 6,475,877 - Saia , et al. November 5, 2 | 2002-11-05 |
High temperature circuit apparatus App 20020121691 - Wojnarowski, Robert John ;   et al. | 2002-09-05 |
Circuit chip package and fabrication method Grant 6,396,153 - Fillion , et al. May 28, 2 | 2002-05-28 |
HDI chip attachment method for reduced processing Grant 6,284,564 - Balch , et al. September 4, 2 | 2001-09-04 |
Circuit chip package and fabrication method App 20010009779 - Fillion, Raymond Albert ;   et al. | 2001-07-26 |
Circuit chip package and fabrication method Grant 6,242,282 - Fillion , et al. June 5, 2 | 2001-06-05 |
Method for fabricating a thin film inductor Grant 6,040,226 - Wojnarowski , et al. March 21, 2 | 2000-03-21 |
Method for fabricating a thin film capacitor Grant 5,872,040 - Wojnarowski , et al. February 16, 1 | 1999-02-16 |
Method for fabricating a thin film resistor Grant 5,683,928 - Wojnarowski , et al. November 4, 1 | 1997-11-04 |
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