Dordi; Yezdi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dordi; Yezdi.The latest application filed is for "zincating and doping of metal liner for liner passivation and adhesion improvement".

Company Profile

6.97.101

Dordi; Yezdi - Palo Alto CA
Dordi; Yezdi - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment Grant 11,225,714 - Venkatraman , et al. January 18, 2	2022-01-18
Zincating And Doping Of Metal Liner For Liner Passivation And Adhesion Improvement App 20210166971 - Joi; Aniruddha ; et al.	2021-06-03
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias Grant 10,640,874 - Joi , et al.	2020-05-05
Electrochemical Doping Of Thin Metal Layers Employing Underpotential Deposition And Thermal Treatment App 20200063256 - Venkatraman; Kailash ; et al.	2020-02-27
Layer-by-layer deposition using hydrogen Grant 10,508,351 - Joi , et al. Dec	2019-12-17
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment Grant 10,501,846 - Venkatraman , et al. Dec	2019-12-10
Via Prefill In A Fully Aligned Via App 20190363048 - Zhao; Lie ; et al.	2019-11-28
Self-forming barrier process Grant 10,483,163 - Joi , et al. Nov	2019-11-19
Self-forming Barrier Process App 20190122922 - Joi; Aniruddha ; et al.	2019-04-25
Interlevel conductor pre-fill utilizing selective barrier deposition Grant 10,262,943 - Kolics , et al.	2019-04-16
Electrochemical Doping Of Thin Metal Layers Employing Underpotential Deposition And Thermal Treatment App 20190078202 - Venkatraman; Kailash ; et al.	2019-03-14
Selective Electroless Electrochemical Atomic Layer Deposition In An Aqueous Solution Without External Voltage Bias App 20190048472 - Joi; Aniruddha ; et al.	2019-02-14
Self-forming Barrier Process App 20180374747 - Joi; Aniruddha ; et al.	2018-12-27
Self-forming barrier process Grant 10,163,695 - Joi , et al. Dec	2018-12-25
Layer-by-layer Deposition Using Hydrogen App 20180266001 - Joi; Aniruddha ; et al.	2018-09-20
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition App 20180151503 - Kolics; Artur ; et al.	2018-05-31
Interlevel conductor pre-fill utilizing selective barrier deposition Grant 9,875,968 - Kolics , et al. January 23, 2	2018-01-23
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition App 20170162512 - Kolics; Artur ; et al.	2017-06-08
Method For A Non-aqueous Electroless Polyol Deposition Of Metal Or Metal Alloy In Features Of A Substrate App 20170073815 - Patel; Mehul N. ; et al.	2017-03-16
Interlevel conductor pre-fill utilizing selective barrier deposition Grant 9,583,386 - Kolics , et al. February 28, 2	2017-02-28
Electroless deposition of continuous platinum layer using complexed Co.sup.2+ metal ion reducing agent Grant 9,499,913 - Norkus , et al. November 22, 2	2016-11-22
Highly Selective Deposition Of Amorphous Carbon As A Metal Diffusion Barrier Layer App 20160329213 - Tang; Wei ; et al.	2016-11-10
Selective deposition and co-deposition processes for ferromagnetic thin films Grant 9,476,124 - Joi , et al. October 25, 2	2016-10-25
Electroless deposition of continuous platinum layer Grant 9,469,902 - Norkus , et al. October 18, 2	2016-10-18
Electroless deposition of continuous cobalt layer using complexed Ti.sup.3+ metal ions as reducing agents Grant 9,428,836 - Norkus , et al. August 30, 2	2016-08-30
Selective Deposition And Co-deposition Processes For Ferromagnetic Thin Films App 20160194761 - Joi; Aniruddha ; et al.	2016-07-07
Apparatus and method for atomic layer deposition Grant 9,359,673 - Yoon , et al. June 7, 2	2016-06-07
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition App 20160118296 - Kolics; Artur ; et al.	2016-04-28
Method and apparatus for wafer electroless plating Grant 9,287,110 - Thie , et al. March 15, 2	2016-03-15
ELECTROLESS DEPOSITION OF CONTINUOUS COBALT LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS App 20150307993 - NORKUS; Eugenijus ; et al.	2015-10-29
ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS App 20150307995 - NORKUS; Eugenijus ; et al.	2015-10-29
ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS App 20150307994 - NORKUS; Eugenijus ; et al.	2015-10-29
ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEXED Co2+ METAL ION REDUCING AGENT App 20150284857 - NORKUS; Eugenijus ; et al.	2015-10-08
Controlled ambient system for interface engineering Grant 9,117,860 - Boyd , et al. August 25, 2	2015-08-25
Electroless Deposition Of Continuous Platinum Layer App 20150232995 - NORKUS; Eugenijus ; et al.	2015-08-20
Processes And Systems For Engineering A Barrier Surface For Copper Deposition App 20150214093 - Dordi; Yezdi ; et al.	2015-07-30
Process integration scheme to lower overall dielectric constant in BEoL interconnect structures Grant 9,076,844 - Bright , et al. July 7, 2	2015-07-07
Methods For Barrier Interface Preparation Of Copper Interconnect App 20150132946 - Yoon; Hyungsuk Alexander ; et al.	2015-05-14
Apparatus For Barrier Interface Preparation Of Copper Interconnect App 20150128861 - Yoon; Hyungsuk Alexander ; et al.	2015-05-14
System And Method For Forming Patterned Copper Lines Through Electroless Copper Plating App 20150034589 - Lee; Alan ; et al.	2015-02-05
Method for barrier interface preparation of copper interconnect Grant 8,916,232 - Yoon , et al. December 23, 2	2014-12-23
Methods for removing a metal oxide from a substrate Grant 8,883,027 - Yoon , et al. November 11, 2	2014-11-11
Processes And Systems For Engineering A Copper Surface For Selective Metal Deposition App 20140322446 - Dordi; Yezdi ; et al.	2014-10-30
Fluid handling system for wafer electroless plating and associated methods Grant 8,844,461 - Thie , et al. September 30, 2	2014-09-30
Processes and systems for engineering a copper surface for selective metal deposition Grant 8,771,804 - Dordi , et al. July 8, 2	2014-07-08
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide Grant 8,747,960 - Dordi , et al. June 10, 2	2014-06-10
Wet Activation Of Ruthenium Containing Liner/barrier App 20140154406 - Dordi; Yezdi ; et al.	2014-06-05
Methods and apparatuses for three dimensional integrated circuits Grant 8,673,769 - Boyd , et al. March 18, 2	2014-03-18
Simultaneous electroless plating of two substrates Grant 8,622,020 - Thie , et al. January 7, 2	2014-01-07
Methods for atomic layer deposition Grant 8,623,456 - Yoon , et al. January 7, 2	2014-01-07
Method and Apparatus for Wafer Electroless Plating App 20130280917 - Thie; William ; et al.	2013-10-24
Device with post-contact back end of line through-hole via integration Grant 8,519,461 - Boyd , et al. August 27, 2	2013-08-27
Method and apparatus for material deposition Grant 8,490,573 - Dordi , et al. July 23, 2	2013-07-23
Method and apparatus for wafer electroless plating Grant 8,485,120 - Thie , et al. July 16, 2	2013-07-16
Methods For Three-dimensional Integrated Circuit Through Hole Via Gapfill And Overburden Removal App 20130171820 - Boyd; John ; et al.	2013-07-04
Electroplating head and method for operating the same Grant 8,419,917 - Dordi , et al. April 16, 2	2013-04-16
Pre-planarization system and method Grant 8,403,727 - Redeker , et al. March 26, 2	2013-03-26
Methods For Atomic Layer Deposition App 20130040460 - Yoon; Hyungsuk Alexander ; et al.	2013-02-14
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal Grant 8,323,460 - Boyd , et al. December 4, 2	2012-12-04
Wafer electroless plating system and associated methods Grant 8,314,027 - Thie , et al. November 20, 2	2012-11-20
Electroless deposition from non-aqueous solutions Grant 8,298,325 - Norkus , et al. October 30, 2	2012-10-30
Processes and Systems for Engineering a Barrier Surface for Copper Deposition App 20120269987 - Dordi; Yezdi ; et al.	2012-10-25
Apparatus and method for atomic layer deposition Grant 8,287,647 - Yoon , et al. October 16, 2	2012-10-16
Apparatus And Method For Atomic Layer Deposition App 20120248219 - Yoon; Hyungsuk Alexander ; et al.	2012-10-04
Device With Post-contact Back End Of Line Through-hole Via Integration App 20120205807 - Boyd; John ; et al.	2012-08-16
Processes and systems for engineering a barrier surface for copper deposition Grant 8,241,701 - Dordi , et al. August 14, 2	2012-08-14
Electroless Deposition from Non-Aqueous Solutions App 20120152147 - Norkus; Eugenijus ; et al.	2012-06-21
Methods of post-contact back end of line through-hole via integration Grant 8,187,968 - Boyd , et al. May 29, 2	2012-05-29
Methods and systems for barrier layer surface passivation Grant 8,133,812 - Dordi , et al. March 13, 2	2012-03-13
Wafer Electroless Plating System and Associated Methods App 20120045897 - Thie; William ; et al.	2012-02-23
Apparatuses And Systems For Fabricating Three Dimensional Integrated Circuits App 20120024230 - Li; Shijian ; et al.	2012-02-02
Interconnect Structure And Method Of Manufacturing A Damascene Structure App 20110306203 - Dordi; Yezdi ; et al.	2011-12-15
Wafer electroless plating system and associated methods Grant 8,069,813 - Thie , et al. December 6, 2	2011-12-06
Methods and systems for low interfacial oxide contact between barrier and copper metallization Grant 8,053,355 - Redeker , et al. November 8, 2	2011-11-08
Method and apparatus for plating semiconductor wafers Grant 8,048,283 - Dordi , et al. November 1, 2	2011-11-01
Methods, apparatuses, and systems for fabricating three dimensional integrated circuits Grant 8,034,409 - Li , et al. October 11, 2	2011-10-11
Interconnect structure and method of manufacturing a damascene structure Grant 8,026,605 - Dordi , et al. September 27, 2	2011-09-27
Method and Apparatus for Material Deposition App 20110081779 - Dordi; Yezdi ; et al.	2011-04-07
Thermal methods for cleaning post-CMP wafers Grant 7,884,017 - Wang , et al. February 8, 2	2011-02-08
Method for electroless depositing a material on a surface of a wafer Grant 7,875,554 - Dordi , et al. January 25, 2	2011-01-25
Electroless Plating Method and Apparatus App 20110011335 - Thie; William ; et al.	2011-01-20
Electroless plating method and apparatus Grant 7,829,152 - Thie , et al. November 9, 2	2010-11-09
Methods And Systems For Low Interfacial Oxide Contact Between Barrier And Copper Metallization App 20100267229 - Redeker; Fritz ; et al.	2010-10-21
Apparatus for Applying a Plating Solution for Electroless Deposition App 20100239767 - Dordi; Yezdi ; et al.	2010-09-23
Apparatus for applying a plating solution for electroless deposition Grant 7,752,996 - Dordi , et al. July 13, 2	2010-07-13
Method and Apparatus for Plating Semiconductor Wafers App 20100170803 - Dordi; Yezdi ; et al.	2010-07-08
Methods and systems for low interfacial oxide contact between barrier and copper metallization Grant 7,749,893 - Redeker , et al. July 6, 2	2010-07-06
Thermal Methods For Cleaning Post-cmp Wafers App 20100136788 - Wang; Zhonghui Alex ; et al.	2010-06-03
Methods For Removing A Metal Oxide From A Substrate App 20100108491 - Yoon; Hyungsuk Alexander ; et al.	2010-05-06
Thermal methods for cleaning post-CMP wafers Grant 7,709,400 - Wang , et al. May 4, 2	2010-05-04
Method and apparatus for plating semiconductor wafers Grant 7,704,367 - Dordi , et al. April 27, 2	2010-04-27
Electroless deposition from non-aqueous solutions Grant 7,686,875 - Norkus , et al. March 30, 2	2010-03-30
Methods Of Post-contact Back End Of Line Through-hole Via Integration App 20100044867 - Boyd; John ; et al.	2010-02-25
Apparatus for the removal of a metal oxide from a substrate and methods therefor Grant 7,662,253 - Yoon , et al. February 16, 2	2010-02-16
Apparatus and method for semiconductor wafer electroplanarization Grant 7,648,616 - Boyd , et al. January 19, 2	2010-01-19
Methods And Systems For Barrier Layer Surface Passivation App 20100009535 - Dordi; Yezdi ; et al.	2010-01-14
Apparatus For Integrated Surface Treatment And Deposition For Copper Interconnect App 20090320749 - Yoon; Hyungsuk Alexander ; et al.	2009-12-31
Self assembled monolayer for improving adhesion between copper and barrier layer App 20090304914 - Nalla; Praveen ; et al.	2009-12-10
Methods of post-contact back end of the line through-hole via integration Grant 7,615,480 - Boyd , et al. November 10, 2	2009-11-10
Apparatus and method for integrated surface treatment and deposition for copper interconnect Grant 7,615,486 - Yoon , et al. November 10, 2	2009-11-10
Apparatus and method for confined area planarization Grant 7,598,175 - Boyd , et al. October 6, 2	2009-10-06
Electroplating Head and Method for Operating the Same App 20090242413 - Dordi; Yezdi ; et al.	2009-10-01
Methods and systems for barrier layer surface passivation Grant 7,592,259 - Dordi , et al. September 22, 2	2009-09-22
Method and apparatus for semiconductor wafer planarization Grant 7,582,565 - Redeker , et al. September 1, 2	2009-09-01
Electroplating head and method for operating the same Grant 7,563,348 - Dordi , et al. July 21, 2	2009-07-21
Process Integration Scheme To Lower Overall Dielectric Constant In Beol Interconnect Structures App 20090134520 - Bright; Nicolas ; et al.	2009-05-28
Process integration scheme to lower overall dielectric constant in BEoL interconnect structures Grant 7,521,358 - Bright , et al. April 21, 2	2009-04-21
Electroless Deposition From Non-aqueous Solutions App 20090095198 - Norkus; Eugenijus ; et al.	2009-04-16
Electro-chemical deposition system Grant 7,497,932 - Dordi , et al. March 3, 2	2009-03-03
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal App 20080314756 - Boyd; John ; et al.	2008-12-25
Methods and apparatuses for three dimensional integrated circuits App 20080315422 - Boyd; John ; et al.	2008-12-25
Methods of post-contact back end of line through-hole via integration App 20080315418 - Boyd; John ; et al.	2008-12-25
Thermal methods for cleaning post-CMP wafers App 20080280456 - Wang; Zhonghui Alex ; et al.	2008-11-13
Apparatus And Method For Integrated Surface Treatment And Film Deposition App 20080260967 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Integrated Surface Treatment And Deposition For Copper Interconnect App 20080260940 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Atomic Layer Deposition App 20080261412 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Pre And Post Treatment Of Atomic Layer Deposition App 20080260963 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Fluid Handling System for Wafer Electroless Plating and Associated Methods App 20080251148 - Thie; William ; et al.	2008-10-16
Wafer Electroless Plating System and Associated Methods App 20080254621 - Thie; William ; et al.	2008-10-16
Method and Apparatus for Wafer Electroless Plating App 20080254225 - Thie; William ; et al.	2008-10-16
Apparatus and Method for Confined Area Planarization App 20080227369 - Boyd; John M. ; et al.	2008-09-18
Method and Apparatus for Semiconductor Wafer Planarization App 20080166885 - Redeker; Fred C. ; et al.	2008-07-10
Apparatus and method for confined area planarization Grant 7,396,430 - Boyd , et al. July 8, 2	2008-07-08
Methods, Apparatuses, And Systems For Fabricating Three Dimensional Integrated Circuits App 20080152464 - LI; Shijian ; et al.	2008-06-26
Self-limiting plating method App 20080152823 - Boyd; John ; et al.	2008-06-26
Method and Apparatus for Material Deposition App 20080153291 - Dordi; Yezdi ; et al.	2008-06-26
Process integration scheme to lower overall dielectric constant in BEoL interconnect structures App 20080150138 - Bright; Nicolas ; et al.	2008-06-26
Interconnect structure and method of manufacturing a damascene structure App 20080142971 - Dordi; Yezdi ; et al.	2008-06-19
Methods and systems for low interfacial oxide contact between barrier and copper metallization App 20080142972 - Redeker; Fritz ; et al.	2008-06-19
Methods and systems for barrier layer surface passivation App 20080146025 - Dordi; Yezdi ; et al.	2008-06-19
Method and apparatus for semiconductor wafer planarization Grant 7,368,017 - Redeker , et al. May 6, 2	2008-05-06
Method and apparatus for material deposition in semiconductor fabrication Grant 7,358,186 - Dordi , et al. April 15, 2	2008-04-15
Electroless Plating Method And Apparatus App 20080085370 - Thie; William ; et al.	2008-04-10
Controlled ambient system for interface engineering App 20080057221 - Boyd; John ; et al.	2008-03-06
Method For Gap Fill In Controlled Ambient System App 20080057182 - Boyd; John ; et al.	2008-03-06
Methods and apparatus for barrier interface preparation of copper interconnect App 20080057198 - Yoon; Hyungsuk Alexander ; et al.	2008-03-06
Processes and systems for engineering a copper surface for selective metal deposition App 20070292604 - Dordi; Yezdi ; et al.	2007-12-20
Processes and systems for engineering a barrier surface for copper deposition App 20070292603 - Dordi; Yezdi ; et al.	2007-12-20
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide App 20070292615 - Dordi; Yezdi ; et al.	2007-12-20
Plating solutions for electroless deposition of copper Grant 7,297,190 - Dordi , et al. November 20, 2	2007-11-20
Apparatus For Applying A Plating Solution For Electroless Deposition App 20070264436 - Dordi; Yezdi ; et al.	2007-11-15
Apparatus and method for confined area planarization App 20070227656 - Boyd; John M. ; et al.	2007-10-04
Compliant grinding wheel Grant 7,252,736 - Boyd , et al. August 7, 2	2007-08-07
Electrochemical processing cell Grant 7,247,222 - Yang , et al. July 24, 2	2007-07-24
Method And Apparatus For Annealing Copper Films App 20070128869 - Chen; B. Michelle ; et al.	2007-06-07
Apparatus for the removal of a metal oxide from a substrate and methods therefor App 20070072432 - Yoon; Hyungsuk Alexander ; et al.	2007-03-29
Method and apparatus for annealing copper films Grant 7,192,494 - Chen , et al. March 20, 2	2007-03-20
System And Method For Forming Patterned Copper Lines Through Electroless Copper Plating App 20070048447 - Lee; Alan ; et al.	2007-03-01
Electro-chemical deposition system App 20060246690 - Dordi; Yezdi ; et al.	2006-11-02
Compliant wafer chuck Grant 7,108,591 - Boyd , et al. September 19, 2	2006-09-19
Methods of and apparatus for pre-planarizing a substrate Grant 7,090,562 - Boyd , et al. August 15, 2	2006-08-15
Semiconductor wafer material removal apparatus and method for operating the same Grant 7,048,608 - Boyd , et al. May 23, 2	2006-05-23
Semiconductor Wafer Material Removal Apparatus And Method For Operating The Same App 20060063470 - Boyd; John ; et al.	2006-03-23
Method and apparatus for plating semiconductor wafers App 20050284767 - Dordi, Yezdi ; et al.	2005-12-29
Electroplating head and method for operating the same App 20050284748 - Dordi, Yezdi ; et al.	2005-12-29
Method and apparatus for material deposition App 20050130415 - Dordi, Yezdi ; et al.	2005-06-16
Method and apparatus for semiconductor wafer planarization App 20050126932 - Redeker, Fred C. ; et al.	2005-06-16
Method of conditioning electrochemical baths in plating technology Grant 6,893,548 - Cheung , et al. May 17, 2	2005-05-17
Dynamic pulse plating for high aspect ratio features Grant 6,881,318 - Hey , et al. April 19, 2	2005-04-19
Small volume electroplating cell App 20040104119 - Edelstein, Sergio ; et al.	2004-06-03
Electro-chemical deposition system App 20040084301 - Dordi, Yezdi ; et al.	2004-05-06
Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishing App 20040055893 - Lubomirsky, Dmitry ; et al.	2004-03-25
Electro-chemical deposition cell for face-up processing of single semiconductor substrates App 20040020781 - Dordi, Yezdi ; et al.	2004-02-05
Electrochemical processing cell App 20040016636 - Yang, Michael X. ; et al.	2004-01-29
Method and apparatus for annealing copper films App 20040003873 - Chen, B. Michelle ; et al.	2004-01-08
Method of treating a substrate Grant 6,645,550 - Cheung , et al. November 11, 2	2003-11-11
Electro-chemical deposition system Grant 6,635,157 - Dordi , et al. October 21, 2	2003-10-21
Electro-chemical deposition cell for face-up processing of single semiconductor substrates Grant 6,599,402 - Dordi , et al. July 29, 2	2003-07-29
Method and apparatus for removal of unwanted electroplating deposits App 20030038107 - Nayak, Radha ; et al.	2003-02-27
Dynamic pulse plating for high aspect ratio features App 20030019755 - Hey, H. Peter W. ; et al.	2003-01-30
Method for achieving copper fill of high aspect ratio interconnect features App 20030000844 - Carl, Daniel A. ; et al.	2003-01-02
Electro-chemical deposition cell for face-up processing of single semiconductor substrates App 20020157960 - Dordi, Yezdi ; et al.	2002-10-31
Apparatus And Method For Depositing An Electroless Solution App 20020152955 - DORDI, YEZDI ; et al.	2002-10-24
Method for achieving copper fill of high aspect ratio interconnect features Grant 6,436,267 - Carl , et al. August 20, 2	2002-08-20
Electro-chemical deposition cell for face-up processing of single semiconductor substrates Grant 6,416,647 - Dordi , et al. July 9, 2	2002-07-09
Method and apparatus for conditioning electrochemical baths in plating technology App 20020033340 - Cheung, Robin ; et al.	2002-03-21
Electro-chemical deposition system App 20020029961 - Dordi, Yezdi ; et al.	2002-03-14
Electro-chemical deposition system Grant 6,267,853 - Dordi , et al. July 31, 2	2001-07-31
Electro-chemical deposition system Grant 6,258,220 - Dordi , et al. July 10, 2	2001-07-10
In-situ electroless copper seed layer enhancement in an electroplating system Grant 6,258,223 - Cheung , et al. July 10, 2	2001-07-10
Electro-chemical deposition system and method Grant 6,254,760 - Shen , et al. July 3, 2	2001-07-03