Doan; Trung Tri

Patent Applications and Registrations

Patent applications and USPTO patent grants for Doan; Trung Tri.The latest application filed is for "method for making electronic device arrays using a temporary substrate and a carrier substrate".

Company Profile

6.172.158

Doan; Trung Tri - Baoshan Township TW
DOAN; TRUNG TRI - HSINCHU COUNTY 308 TW
Doan; Trung Tri - Hsinchu County TW
Doan; Trung Tri - HSINCHU CITY TW
Doan; Trung Tri - Baoshan TW
Doan; Trung Tri - Baoshan Hsinchu N/A TW
Doan; Trung-Tri - Hsinchu N/A TW
Doan; Trung Tri - Los Gatos CA
DOAN; TRUNG TRI - Baoshan Hsinchu 308 TW
Doan; Trung Tri - US
Doan; Trung Tri - Boise ID
Doan; Trung Tri - Vallejo CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Making Electronic Device Arrays Using A Temporary Substrate And A Carrier Substrate App 20220278261 - Doan; David Trung ; et al.	2022-09-01
Method For Fabricating (LED) Dice Using Semiconductor Structures On A Substrate And Laser Lift-Off To A Receiving Plate App 20220271198 - Chu; Chen-Fu ; et al.	2022-08-25
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate Grant 11,417,799 - Chu , et al. August 16, 2	2022-08-16
Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrate Grant 11,387,397 - Doan , et al. July 12, 2	2022-07-12
Single Light Emitting Diode (LED) Structure Having Epitaxial Structure Separated Into Light Emitting Zones App 20210119088 - Doan; Trung Tri ; et al.	2021-04-22
Single light emitting diode (LED) structure Grant 10,964,851 - Doan , et al. March 30, 2	2021-03-30
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate App 20210066541 - Chu; Chen-Fu ; et al.	2021-03-04
Semiconductor Components And Semiconductor Structures And Methods Of Fabrication App 20210066547 - Doan; Trung Tri ; et al.	2021-03-04
Method For Making Light Emitting Device (LED) Arrays Using A Temporary Substrate And A Carrier Substrate App 20210043820 - Doan; David Trung ; et al.	2021-02-11
Method for making light emitting device LED arrays Grant 10,910,535 - Doan , et al. February 2, 2	2021-02-02
Method For Making Light Emitting Device LED Arrays App 20190165231 - Doan; David Trung ; et al.	2019-05-30
Single Light Emitting Diode (LED) Structure App 20190067529 - Doan; Trung Tri ; et al.	2019-02-28
Light emitting diode Grant 9,231,152 - Doan , et al. January 5, 2	2016-01-05
Light emitting diode (LED) system having lighting device and wireless control system Grant 9,214,456 - Doan December 15, 2	2015-12-15
Light emitting diode Grant 9,190,589 - Doan , et al. November 17, 2	2015-11-17
Smart integrated semiconductor light emitting system including nitride based light emitting diodes (LED) and application specific integrated circuits (ASIC) Grant 8,933,467 - Doan , et al. January 13, 2	2015-01-13
Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulses Grant 8,921,204 - Chu , et al. December 30, 2	2014-12-30
Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrate Grant 8,871,547 - Chu , et al. October 28, 2	2014-10-28
Lighting device comprising LEDs with phosphor layers Grant 8,835,953 - Liu , et al. September 16, 2	2014-09-16
Method for handling a semiconductor wafer assembly Grant 8,802,465 - Doan , et al. August 12, 2	2014-08-12
Method of fabricating semiconductor die using handling layer Grant 8,802,469 - Chu , et al. August 12, 2	2014-08-12
Method for defining semiconductor devices Grant 8,778,780 - Doan , et al. July 15, 2	2014-07-15
Light emitting diode (LED) die having recessed electrode and light extraction structures and method of fabrication Grant 8,759,128 - Chu , et al. June 24, 2	2014-06-24
Method For Fabricating Vertical Light Emitting Diode (vled) Structure Using A Laser Pulse To Remove A Carrier Substrate App 20140154821 - CHU; CHEN-FU ; et al.	2014-06-05
Protection For The Epitaxial Structure Of Metal Devices App 20140151630 - Fan; Feng-Hsu ; et al.	2014-06-05
Light emitting diode (LED) die having peripheral electrode frame and method of fabrication Grant 8,723,160 - Chu , et al. May 13, 2	2014-05-13
Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths Grant 8,716,041 - Doan , et al. May 6, 2	2014-05-06
Method to make low resistance contact Grant 8,685,764 - Chu , et al. April 1, 2	2014-04-01
Method For Handling A Semiconductor Wafer Assembly App 20140087499 - Doan; Trung Tri ; et al.	2014-03-27
Vertical light emitting diodes (LED) having metal substrate and spin coated phosphor layer for producing white light Grant 8,680,534 - Tran , et al. March 25, 2	2014-03-25
Light Emitting Diode App 20140070164 - DOAN; TRUNG-TRI ; et al.	2014-03-13
Light Emitting Diode App 20140061585 - DOAN; TRUNG-TRI ; et al.	2014-03-06
Method For Fabricating A Vertical Light Emitting Diode (vled) Die Having Epitaxial Structure With Protective Layer App 20140051197 - FAN; FENG-HSU ; et al.	2014-02-20
Protection for the epitaxial structure of metal devices Grant 8,614,449 - Fan , et al. December 24, 2	2013-12-24
Method For Fabricating Side By Side Light Emitting Diode (led) Having Separate Electrical And Heat Transfer Paths App 20130337590 - DOAN; TRUNG TRI ; et al.	2013-12-19
Method For Fabricating Semiconductor Dice By Separating A Substrate From Semiconductor Structures Using Multiple Laser Pulses App 20130302926 - Chu; Chen-Fu ; et al.	2013-11-14
Light-emitting diode with increased light extraction Grant 8,552,451 - Tran , et al. October 8, 2	2013-10-08
Side by side light emitting diode (LED) having separate electrical and heat transfer paths Grant 8,552,458 - Doan , et al. October 8, 2	2013-10-08
Method And System For Tagging And Organizing Images Generated By Mobile Communications Devices App 20130250139 - Doan; Trung Tri	2013-09-26
Light Emitting Diode (LED) Die Having Recessed Electrode And Light Extraction Structures And Method Of Fabrication App 20130248816 - CHU; Jiunn-Yi ; et al.	2013-09-26
Wall structures for a semiconductor wafer Grant 8,507,302 - Chu , et al. August 13, 2	2013-08-13
LLB bulb having light extracting rough surface pattern (LERSP) and method of fabrication Grant 8,434,883 - Doan , et al. May 7, 2	2013-05-07
Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method Grant 8,410,508 - Yen , et al. April 2, 2	2013-04-02
Method For Fabricating Light Emitting Diode (led) Devices Having Output With Selected Characteristics App 20130062639 - DOAN; TRUNG TRI ; et al.	2013-03-14
Light Emitting Diode (led) Package Having Wavelength Conversion Member And Wafer Level Fabrication Method App 20130062640 - YEN; JUI- KANG ; et al.	2013-03-14
Light Emitting Diode (led) System Having Lighting Device And Wireless Control System App 20130057156 - DOAN; TRUNG TRI	2013-03-07
Light Emitting Diode (led) System Having Application Specific Integrated Circuit (asic) And Wireless System App 20130057178 - DOAN; TRUNG TRI	2013-03-07
Light Emitting Diode (led) Die Having Peripheral Electrode Frame And Method Of Fabrication App 20130026448 - CHU; CHEN-FU ; et al.	2013-01-31
Light Emitting Diode (LED) Lighting System Having Adjustable Output App 20120327663 - DOAN; TRUNG TRI	2012-12-27
Light emitting device with high color rendering index and high luminescence efficiency Grant 8,319,252 - Liu , et al. November 27, 2	2012-11-27
Method for handling a semiconductor wafer assembly Grant 8,318,519 - Doan , et al. November 27, 2	2012-11-27
Vertical light emitting diode (VLED) die having electrode frame and method of fabrication Grant 8,283,652 - Chu , et al. October 9, 2	2012-10-09
Llb Bulb Having Light Extracting Rough Surface Pattern (lersp) And Method Of Fabrication App 20120092852 - Doan; Trung Tri ; et al.	2012-04-19
Smart Integrated Semiconductor Light Emitting System Including Nitride Based Light Emitting Diodes (LED) And Application Specific Integrated Circuits (ASIC) App 20120091466 - Doan; Trung Tri ; et al.	2012-04-19
Protection For The Epitaxial Structure Of Metal Devices App 20120074384 - FAN; FENG-HSU ; et al.	2012-03-29
Method for removing semiconductor street material Grant 8,143,112 - Doan , et al. March 27, 2	2012-03-27
Die separation Grant 8,124,454 - Chu , et al. February 28, 2	2012-02-28
Vertical Light Emitting Diode (VLED) Die Having Electrode Frame And Method Of Fabrication App 20120025167 - Chu; Chen-Fu ; et al.	2012-02-02
Side By Side Light Emitting Diode (LED) Having Separate Electrical And Heat Transfer Paths And Method Of Fabrication App 20110316034 - Doan; Trung Tri ; et al.	2011-12-29
Smart integrated semiconductor light emitting system including light emitting diodes and application specific integrated circuits (ASIC) Grant 8,084,780 - Doan , et al. December 27, 2	2011-12-27
Lighting Device Comprising Leds With Phosphor Layers App 20110309390 - Liu; Wen-Huang ; et al.	2011-12-22
Light-emitting Diode With Increased Light Extraction App 20110284867 - Tran; Chuong Anh ; et al.	2011-11-24
Method Of Separating Semiconductor Dies App 20110217799 - Chu; Chen-Fu ; et al.	2011-09-08
Light-emitting diode with increased light extraction Grant 8,008,678 - Tran , et al. August 30, 2	2011-08-30
Method of separating semiconductor dies Grant 7,968,379 - Chu , et al. June 28, 2	2011-06-28
Memory array having floating gate semiconductor device Grant 7,956,396 - Doan , et al. June 7, 2	2011-06-07
Semiconductor constructions Grant 7,944,025 - Doan , et al. May 17, 2	2011-05-17
Die separation Grant 7,892,891 - Chu , et al. February 22, 2	2011-02-22
Smart Integrated Semiconductor Light Emitting System Including Light Emitting Diodes And Application Specific Integrated Circuits (ASIC) App 20110037082 - Doan; Trung Tri ; et al.	2011-02-17
Solid state lighting system and maintenance method therein Grant 7,852,015 - Yen , et al. December 14, 2	2010-12-14
Method of separating semiconductor dies Grant 7,829,440 - Chu , et al. November 9, 2	2010-11-09
Light Emitting Device With High Color Rendering Index And High Luminescence Efficiency App 20100264432 - Liu; Wen-Huang ; et al.	2010-10-21
Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors Grant 7,776,647 - Farnworth , et al. August 17, 2	2010-08-17
Epitaxial structure for metal devices Grant 7,723,718 - Doan , et al. May 25, 2	2010-05-25
Method for removing semiconductor street material Grant 7,687,322 - Doan , et al. March 30, 2	2010-03-30
Systems and methods for producing white-light light emitting diodes Grant 7,646,033 - Tran , et al. January 12, 2	2010-01-12
Method of making light emitting diodes (LEDs) with improved light extraction by roughening Grant 7,629,195 - Tran , et al. December 8, 2	2009-12-08
Methods Of Making Semiconductor Structures Including Vertical Diode Structures App 20090218656 - Gonzalez; Fernando ; et al.	2009-09-03
Atomic layer deposition methods Grant 7,576,012 - Doan , et al. August 18, 2	2009-08-18
Semiconductor structures including vertical diode structures and methods of making the same Grant 7,563,666 - Gonzalez , et al. July 21, 2	2009-07-21
Method of making light-emitting diodes (LEDs) with improved light extraction by roughening Grant 7,563,625 - Tran , et al. July 21, 2	2009-07-21
Electronic systems Grant 7,528,430 - Chen , et al. May 5, 2	2009-05-05
Method Of Separating Semiconductor Dies App 20090093075 - Chu; Chen-Fu ; et al.	2009-04-09
Semiconductor component sealed on five sides by polymer sealing layer Grant 7,482,702 - Farnworth , et al. January 27, 2	2009-01-27
Method Of Making A Light-emitting Diode App 20090014743 - TRAN; CHUONG Anh ; et al.	2009-01-15
Light emitting diodes (LEDs) with improved light extraction by roughening Grant 7,473,936 - Tran , et al. January 6, 2	2009-01-06
Method for fabricating semiconductor component with thinned substrate having pin contacts Grant 7,473,582 - Wood , et al. January 6, 2	2009-01-06
Method of exposing a substrate to a surface microwave plasma, etching method, deposition method, surface microwave plasma generating apparatus, semiconductor substrate etching apparatus, semiconductor substrate deposition apparatus, and microwave plasma generating antenna assembly Grant 7,465,406 - Blalock , et al. December 16, 2	2008-12-16
LIGHT EMITTING DIODES (LEDs) WITH IMPROVED LIGHT EXTRACTION BY ROUGHENING App 20080293171 - Tran; Chuong Anh ; et al.	2008-11-27
Method of separating semiconductor dies Grant 7,452,739 - Chu , et al. November 18, 2	2008-11-18
Atomic layer deposition apparatus and method Grant 7,431,773 - Doan , et al. October 7, 2	2008-10-07
Semiconductor component and system having thinned, encapsulated dice Grant 7,432,604 - Farnworth , et al. October 7, 2	2008-10-07
Light emitting diode with conducting metal substrate Grant 7,432,119 - Doan October 7, 2	2008-10-07
System having semiconductor component with multiple stacked dice Grant 7,432,600 - Klein , et al. October 7, 2	2008-10-07
Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts Grant 7,417,325 - Farnworth , et al. August 26, 2	2008-08-26
Method of making a light emitting diode Grant 7,413,918 - Tran , et al. August 19, 2	2008-08-19
Die Separation App 20080194051 - CHU; CHEN-FU ; et al.	2008-08-14
Capacitor constructions and semiconductor structures Grant 7,405,438 - Chen , et al. July 29, 2	2008-07-29
Atomic layer deposition methods Grant 7,402,518 - Doan , et al. July 22, 2	2008-07-22
Semiconductor components having stacked dice Grant 7,388,294 - Klein , et al. June 17, 2	2008-06-17
Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts Grant 7,382,060 - Farnworth , et al. June 3, 2	2008-06-03
Systems and methods for producing light emitting diode array Grant 7,378,288 - Tran , et al. May 27, 2	2008-05-27
Variable temperature deposition methods Grant 7,368,014 - Doan May 6, 2	2008-05-06
Semiconductor processing methods of removing conductive material Grant 7,367,871 - Doan , et al. May 6, 2	2008-05-06
Protection For The Epitaxial Structure Of Metal Devices App 20080087875 - Fan; Feng-Hsu ; et al.	2008-04-17
Memory array having floating gate semiconductor device App 20080054342 - Doan; Trung Tri ; et al.	2008-03-06
Semiconductor component having multiple stacked dice Grant 7,335,994 - Klein , et al. February 26, 2	2008-02-26
Method To Make Low Resistance Contact App 20080035950 - CHU; CHEN-FU ; et al.	2008-02-14
Semiconductor Structures Including Vertical Diode Structures And Methods Of Making The Same App 20080032480 - Gonzalez; Fernando ; et al.	2008-02-07
Method Of Separating Semiconductor Dies App 20080032488 - CHU; JIUNN-YI ; et al.	2008-02-07
Semiconductor device having recess and planarized layers Grant 7,323,739 - Doan , et al. January 29, 2	2008-01-29
Atomic layer deposition methods and atomic layer deposition tools Grant 7,279,041 - Sandhu , et al. October 9, 2	2007-10-09
Vertical diode structures Grant 7,279,725 - Gonzalez , et al. October 9, 2	2007-10-09
Systems And Methods For Producing White-light Light Emitting Diodes App 20070228404 - Tran; Chuong Anh ; et al.	2007-10-04
Method For Handling A Semiconductor Wafer Assembly App 20070231963 - Doan; Trung Tri ; et al.	2007-10-04
Chemical mechanical polishing process Grant 7,270,596 - Doan September 18, 2	2007-09-18
Method Of Separating Semiconductor Dies App 20070212854 - Chu; Chen-Fu ; et al.	2007-09-13
DRAM cells Grant 7,268,382 - Chen , et al. September 11, 2	2007-09-11
Methods for treating pluralities of discrete semiconductor substrates Grant 7,247,581 - Doan , et al. July 24, 2	2007-07-24
LIGHT EMITTING DIODES (LEDs) WITH IMPROVED LIGHT EXTRACTION BY ROUGHENING App 20070166851 - Tran; Chuong Anh ; et al.	2007-07-19
Wafer level semiconductor component having thinned, encapsulated dice and polymer dam Grant 7,221,059 - Farnworth , et al. May 22, 2	2007-05-22
Methods for treating semiconductor substrates Grant 7,220,312 - Doan , et al. May 22, 2	2007-05-22
Light Emitting Diodes (leds) With Improved Light Extraction By Roughening App 20070099319 - Tran; Chuong Anh ; et al.	2007-05-03
Systems and methods for producing white-light emitting diodes Grant 7,195,944 - Tran , et al. March 27, 2	2007-03-27
Light emitting diodes (LEDs) with improved light extraction by roughening Grant 7,186,580 - Tran , et al. March 6, 2	2007-03-06
Methods for treating pluralities of discrete semiconductor substrates Grant 7,183,208 - Doan , et al. February 27, 2	2007-02-27
Wafer with vertical diode structures Grant 7,170,103 - Gonzalez , et al. January 30, 2	2007-01-30
Vertical diode structures Grant 7,166,875 - Gonzalez , et al. January 23, 2	2007-01-23
Method for fabricating encapsulated semiconductor components Grant 7,157,353 - Farnworth , et al. January 2, 2	2007-01-02
Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors App 20060275949 - Farnworth; Warren M. ; et al.	2006-12-07
Variable temperature deposition methods App 20060266282 - Doan; Trung Tri	2006-11-30
Semiconductor component and assembly having female conductive members Grant 7,132,731 - Wood , et al. November 7, 2	2006-11-07
Electronic systems App 20060237763 - Chen; Shenlin ; et al.	2006-10-26
System having semiconductor component with multiple stacked dice App 20060237833 - Klein; Dean A. ; et al.	2006-10-26
Semiconductor constructions App 20060234167 - Doan; Trung Tri ; et al.	2006-10-19
DRAM cells App 20060228857 - Chen; Shenlin ; et al.	2006-10-12
Method of exposing a substrate to a surface microwave plasma, etching method, deposition method, surface microwave plasma generating apparatus, semiconductor substrate etching apparatus, semiconductor substrate deposition apparatus, and microwave plasma generating antenna assembly App 20060228891 - Blalock; Guy T. ; et al.	2006-10-12
Semiconductor processing methods of removing conductive material App 20060223425 - Doan; Trung Tri ; et al.	2006-10-05
Atomic layer deposition methods Grant 7,115,529 - Doan , et al. October 3, 2	2006-10-03
Method of atomic layer deposition on plural semiconductor substrates simultaneously Grant 7,112,544 - Doan , et al. September 26, 2	2006-09-26
Methods of forming capacitor constructions Grant 7,101,594 - Sandhu , et al. September 5, 2	2006-09-05
Method of exposing a substrate to a surface microwave plasma, etching method, deposition method, surface microwave plasma generating apparatus, semiconductor substrate etching apparatus, semiconductor substrate deposition apparatus, and microwave plasma generating antenna assembly Grant 7,097,782 - Blalock , et al. August 29, 2	2006-08-29
Semiconductor component having thinned die with polymer layers App 20060183349 - Farnworth; Warren M. ; et al.	2006-08-17
Atomic layer deposition methods App 20060172534 - Doan; Trung Tri ; et al.	2006-08-03
Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts Grant 7,081,665 - Wood , et al. July 25, 2	2006-07-25
Systems and methods for producing white-light light emitting diodes App 20060157721 - Tran; Chuong Anh ; et al.	2006-07-20
Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts Grant 7,078,266 - Wood , et al. July 18, 2	2006-07-18
Systems and methods for producing light emitting diode array App 20060154390 - Tran; Chuong Anh ; et al.	2006-07-13
Method of making a vertical light emitting diode App 20060154392 - Tran; Chuong Anh ; et al.	2006-07-13
Light emitting diode with conducting metal substrate App 20060154389 - Doan; Trung Tri	2006-07-13
Systems and methods for removing operating heat from a light emitting diode App 20060154393 - Doan; Trung Tri ; et al.	2006-07-13
Light emitting diode with thermo-electric cooler App 20060151801 - Doan; Trung Tri ; et al.	2006-07-13
Light emitting diodes (LEDs) with improved light extraction by roughening App 20060154391 - Tran; Chuong Anh ; et al.	2006-07-13
Atomic layer deposition apparatus and method App 20060144333 - Doan; Trung Tri ; et al.	2006-07-06
Semiconductor component having thinned die with conductive vias App 20060118953 - Farnworth; Warren M. ; et al.	2006-06-08
Semiconductor processing methods of removing conductive material Grant 7,056,194 - Doan , et al. June 6, 2	2006-06-06
Semiconductor device having recess and planarized layers App 20060115987 - Doan; Trung Tri ; et al.	2006-06-01
Method for fabricating semiconductor device having recess Grant 7,049,238 - Doan , et al. May 23, 2	2006-05-23
Atomic layer deposition apparatus and method Grant 7,030,037 - Doan , et al. April 18, 2	2006-04-18
Method for fabricating encapsulated semiconductor components having conductive vias Grant 7,029,949 - Farnworth , et al. April 18, 2	2006-04-18
Semiconductive substrate cleaning systems App 20060076040 - Moore; Scott E. ; et al.	2006-04-13
Atomic layer deposition methods Grant 7,022,605 - Doan , et al. April 4, 2	2006-04-04
Methods for treating pluralities of discrete semiconductor substrates App 20060057800 - Doan; Trung Tri ; et al.	2006-03-16
Methods of forming trench isolation regions Grant 7,012,010 - Doan , et al. March 14, 2	2006-03-14
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine Grant 7,001,251 - Doan , et al. February 21, 2	2006-02-21
Methods of treating surfaces of substrates Grant 7,001,845 - Moore , et al. February 21, 2	2006-02-21
Atomic layer deposition methods App 20060029738 - Doan; Trung Tri ; et al.	2006-02-09
Wafer with vertical diode structures App 20060008975 - Gonzalez; Fernando ; et al.	2006-01-12
Semiconductor component and system having back side and circuit side contacts App 20060006520 - Wood; Alan G. ; et al.	2006-01-12
Vertical diode structures App 20050280117 - Gonzalez, Fernando ; et al.	2005-12-22
Particle forming methods Grant 6,977,097 - Doan December 20, 2	2005-12-20
Chemical mechanical polishing process Grant 6,974,367 - Doan December 13, 2	2005-12-13
Semiconductor component and system having thinned, encapsulated dice App 20050269700 - Farnworth, Warren M. ; et al.	2005-12-08
Atomic layer deposition methods App 20050260854 - Doan, Trung Tri ; et al.	2005-11-24
Method of fabricating encapsulated semiconductor components by etching Grant 6,964,915 - Farnworth , et al. November 15, 2	2005-11-15
Semiconductor component having multiple stacked dice App 20050242422 - Klein, Dean A. ; et al.	2005-11-03
Atomic layer deposition methods and atomic layer deposition tools App 20050245093 - Sandhu, Gurtej S. ; et al.	2005-11-03
Method of forming trench isolation regions App 20050239265 - Doan, Trung Tri ; et al.	2005-10-27
Method of forming trench isolation regions App 20050239266 - Doan, Trung Tri ; et al.	2005-10-27
Method for fabricating encapsulated semiconductor components App 20050227415 - Farnworth, Warren M. ; et al.	2005-10-13
Semiconductor device having recess and planarized layers and method of fabrication App 20050212070 - Doan, Trung Tri ; et al.	2005-09-29
Chemical mechanical polishing process App 20050205838 - Doan, Trung Tri	2005-09-22
Encapsulated semiconductor component having thinned die with conductive vias App 20050200028 - Farnworth, Warren M. ; et al.	2005-09-15
Semiconductor component and system having thinned, encapsulated dice App 20050181540 - Farnworth, Warren M. ; et al.	2005-08-18
Methods of forming rugged semiconductor-containing surfaces Grant 6,916,723 - Chen , et al. July 12, 2	2005-07-12
Atomic layer deposition methods and atomic layer deposition tools Grant 6,916,374 - Sandhu , et al. July 12, 2	2005-07-12
Encapsulated semiconductor components and methods of fabrication App 20050148160 - Farnworth, Warren M. ; et al.	2005-07-07
Semiconductor isolator system Grant 6,914,310 - Doan , et al. July 5, 2	2005-07-05
Atomic layer deposition apparatus and method App 20050142890 - Doan, Trung Tri ; et al.	2005-06-30
Method for fabricating encapsulated semiconductor components Grant 6,908,784 - Farnworth , et al. June 21, 2	2005-06-21
Semiconductor component having backside pin contacts Grant 6,903,442 - Wood , et al. June 7, 2	2005-06-07
Chemical mechanical polishing slurry Grant 6,893,333 - Doan May 17, 2	2005-05-17
Atomic layer deposition apparatus and method Grant 6,893,506 - Doan , et al. May 17, 2	2005-05-17
Particle forming methods App 20050089649 - Doan, Trung Tri	2005-04-28
Processes for treating a substrate and removing resist from a substrate App 20050079451 - Doan, Trung Tri ; et al.	2005-04-14
Method of forming a Ta2O5 comprising layer Grant 6,863,725 - Vaartstra , et al. March 8, 2	2005-03-08
Semiconductor structures, DRAM cells and electronic systems App 20050042824 - Chen, Shenlin ; et al.	2005-02-24
Methods for treating pluralities of discrete semiconductor substrates Grant 6,835,674 - Doan , et al. December 28, 2	2004-12-28
Semiconductor component with backside contacts and method of fabrication Grant 6,828,175 - Wood , et al. December 7, 2	2004-12-07
Method of atomic layer deposition on plural semiconductor substrates simultaneously App 20040235302 - Doan, Trung Tri ; et al.	2004-11-25
Semiconductor processing methods of removing conductive material App 20040221956 - Doan, Trung Tri ; et al.	2004-11-11
Methods of treating surfaces of substrates App 20040224614 - Moore, Scott E. ; et al.	2004-11-11
Method of making vertical diode structures App 20040224464 - Gonzalez, Fernando ; et al.	2004-11-11
Semiconductor structures, and methods of forming rugged semiconductor-containing surfaces App 20040212048 - Chen, Shenlin ; et al.	2004-10-28
Methods for treating pluralities of discrete semiconductor substrates App 20040203232 - Doan, Trung Tri ; et al.	2004-10-14
Particle forming method Grant 6,803,073 - Doan October 12, 2	2004-10-12
Methods of forming conductive interconnects Grant 6,800,517 - Sandhu , et al. October 5, 2	2004-10-05
Semiconductor processing methods of removing conductive material Grant 6,790,130 - Doan , et al. September 14, 2	2004-09-14
Method of making vertical diode structures Grant 6,787,401 - Gonzalez , et al. September 7, 2	2004-09-07
Methods of forming capacitor constructions App 20040171259 - Sandhu, Gurtej S. ; et al.	2004-09-02
Method of making vertical diode structures Grant 6,784,046 - Gonzalez , et al. August 31, 2	2004-08-31
Semiconductor isolator system App 20040166643 - Doan, Trung Tri ; et al.	2004-08-26
Methods of forming conductive interconnects App 20040166622 - Sandhu, Gurtej S. ; et al.	2004-08-26
Method for fabricating a floating gate semiconductor device Grant 6,780,740 - Doan , et al. August 24, 2	2004-08-24
Method of forming a Ta2O5 comprising layer App 20040152254 - Vaartstra, Brian A. ; et al.	2004-08-05
Methods of treating dielectric materials Grant 6,764,956 - Sandhu , et al. July 20, 2	2004-07-20
Atomic layer deposition apparatus and method App 20040129219 - Doan, Trung Tri ; et al.	2004-07-08
Method for fabricating encapsulated semiconductor components having conductive vias App 20040121563 - Farnworth, Warren M. ; et al.	2004-06-24
Method for fabricating encapsulated semiconductor components by etching App 20040113283 - Farnworth, Warren M. ; et al.	2004-06-17
Methods of forming conductive interconnects Grant 6,750,089 - Sandhu , et al. June 15, 2	2004-06-15
Diode formation method Grant 6,750,091 - Gonzalez , et al. June 15, 2	2004-06-15
Method of fabricating semiconductor components Grant 6,743,699 - Doan June 1, 2	2004-06-01
Method of making vertical diode structures Grant 6,740,552 - Gonzalez , et al. May 25, 2	2004-05-25
System for real-time control of semiconductor wafer polishing Grant 6,739,944 - Sandhu , et al. May 25, 2	2004-05-25
Atomic layer deposition methods App 20040092132 - Doan, Trung Tri ; et al.	2004-05-13
Method of exposing a substrate to a surface microwave plasma, etching method, deposition method, surface microwave plasma generating apparatus, semiconductor substrate etching apparatus, semiconductor substrate deposition apparatus, and microwave plasma generating antenna assembly App 20040089631 - Blalock, Guy T. ; et al.	2004-05-13
Methods of treating surfaces of substrates Grant 6,734,121 - Moore , et al. May 11, 2	2004-05-11
Semiconductor processing methods of removing conductive material App 20040087251 - Doan, Trung Tri ; et al.	2004-05-06
Methods of forming trench isolation regions App 20040082181 - Doan, Trung Tri ; et al.	2004-04-29
Methods of forming capacitor constructions Grant 6,720,272 - Sandhu , et al. April 13, 2	2004-04-13
Method of forming trench isolation regions Grant 6,719,012 - Doan , et al. April 13, 2	2004-04-13
Atomic layer deposition methods and atomic layer deposition tools App 20040065258 - Sandhu, Gurtej S. ; et al.	2004-04-08
Semiconductor component with backside contacts and method of fabrication App 20040043603 - Wood, Alan G. ; et al.	2004-03-04
Semiconductor component with backside contacts and method of fabrication App 20040041260 - Wood, Alan G. ; et al.	2004-03-04
Method of forming capacitor constructions Grant 6,683,005 - Sandhu , et al. January 27, 2	2004-01-27
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine Grant 6,663,470 - Doan , et al. December 16, 2	2003-12-16
Methods for treating pluralities of discrete semiconductor substrates App 20030176047 - Doan, Trung Tri ; et al.	2003-09-18
Methods For Treating Pluralities Of Discrete Semiconductor Substrates App 20030176060 - Doan, Trung Tri ; et al.	2003-09-18
Methods For Treating Pluralities of Discrete Semiconductor Substrates App 20030176062 - Doan, Trung Tri ; et al.	2003-09-18
Methods for treating pluralities of discrete semiconductor substrates App 20030176057 - Doan, Trung Tri ; et al.	2003-09-18
Apparatuses For Treating Pluralities of Discrete Semiconductor Substrates App 20030176061 - Doan, Trung Tri ; et al.	2003-09-18
Atomic layer deposition apparatus and method App 20030170403 - Doan, Trung Tri ; et al.	2003-09-11
Chemical mechanical polishing slurry App 20030166379 - Doan, Trung Tri	2003-09-04
Methods of forming capacitor constructions Grant 6,613,702 - Sandhu , et al. September 2, 2	2003-09-02
Particle forming method App 20030157867 - Doan, Trung Tri	2003-08-21
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine Grant 6,602,380 - Doan , et al. August 5, 2	2003-08-05
Methods of Forming Capacitor Constructions App 20030134439 - Sandhu, Gurtej S. ; et al.	2003-07-17
Method Of Forming Capacitor Constructions App 20030129773 - Sandhu, Gurtej S. ; et al.	2003-07-10
Methods of forming conductive interconnects App 20030119244 - Sandhu, Gurtej S. ; et al.	2003-06-26
Methods of forming trench isolation regions Grant 6,583,028 - Doan , et al. June 24, 2	2003-06-24
Semiconductor processing methods of removing conductive material Grant 6,582,281 - Doan , et al. June 24, 2	2003-06-24
Methods of treating dielectric materials with oxygen, and methods of forming capacitor constructions Grant 6,573,199 - Sandhu , et al. June 3, 2	2003-06-03
Method of forming trench isolation regions App 20030092241 - Doan, Trung Tri ; et al.	2003-05-15
System for real-time control of semiconductor wafer polishing App 20030073384 - Sandhu, Gurtej S. ; et al.	2003-04-17
Methods of treating surfaces of substrates Grant 6,537,915 - Moore , et al. March 25, 2	2003-03-25
Methods Of Treating Dielectric Materials With Oxygen, And Methods Of Forming Capacitor Constructions App 20030049944 - Sandhu, Gurtej S. ; et al.	2003-03-13
Methods of forming capacitor constructions App 20030045129 - Sandhu, Gurtej S. ; et al.	2003-03-06
Methods of treating dielectric materials App 20030045130 - Sandhu, Gurtej S. ; et al.	2003-03-06
Variable temperature deposition methods App 20030031787 - Doan, Trung Tri	2003-02-13
Method of forming trench isolation regions App 20020192925 - Doan, Trung Tri ; et al.	2002-12-19
System for real-time control of semiconductor wafer polishing Grant 6,488,566 - Sandhu , et al. December 3, 2	2002-12-03
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine App 20020173248 - Doan, Trung Tri ; et al.	2002-11-21
Methods Of Treating Surfaces Of Substrates App 20020155707 - MOORE, SCOTT E. ; et al.	2002-10-24
System for real-time control of semiconductor wafer polishing Grant 6,464,561 - Sandhu , et al. October 15, 2	2002-10-15
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine App 20020127953 - Doan, Trung Tri ; et al.	2002-09-12
Method of making vertical diode structures App 20020102839 - Gonzalez, Fernando ; et al.	2002-08-01
Method of making vertical diode structures App 20020102788 - Gonzalez, Fernando ; et al.	2002-08-01
Method of making vertical diode structures App 20020098716 - Gonzalez, Fernando ; et al.	2002-07-25
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine App 20020098785 - Doan, Trung Tri ; et al.	2002-07-25
Semiconductor processing methods of removing conductive material App 20020061714 - Doan, Trung Tri ; et al.	2002-05-23
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine App 20020045407 - Doan, Trung Tri ; et al.	2002-04-18
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine App 20020034928 - Doan, Trung Tri ; et al.	2002-03-21
System for real-time control of semiconductor wafer polishing App 20020034922 - Sandhu, Gurtej S. ; et al.	2002-03-21
System for real-time control of semiconductor wafer polishing App 20020016131 - Sandhu, Gurtej S. ; et al.	2002-02-07
Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect Grant 6,340,894 - Farnworth , et al. January 22, 2	2002-01-22
System for real-time control of semiconductor wafer polishing Grant 6,338,667 - Sandhu , et al. January 15, 2	2002-01-15
Capacitor, methods of forming capacitors, methods for forming silicon nitride layers on silicon-comprising substrates, and methods of densifying silicon nitride layers Grant 6,323,138 - Doan November 27, 2	2001-11-27
System for real-time control of semiconductor wafer polishing App 20010041501 - Sandhu, Gurtej S. ; et al.	2001-11-15
Method of forming trench isolation regions App 20010041420 - Doan, Trung Tri ; et al.	2001-11-15
Method of forming trench isolation regions Grant 6,300,219 - Doan , et al. October 9, 2	2001-10-09
Methods of treating surfaces of substrates App 20010026998 - Moore, Scott E. ; et al.	2001-10-04
Methods of treating surfaces of substrates App 20010023117 - Moore, Scott E. ; et al.	2001-09-20
Methods of treating surfaces of substrates App 20010023079 - Moore, Scott E. ; et al.	2001-09-20
Method of forming DRAM trench capacitor with metal layer over hemispherical grain polysilicon Grant 6,291,289 - Rhodes , et al. September 18, 2	2001-09-18
System for real-time control of semiconductor wafer polishing App 20010016466 - Sandhu, Gurtej S. ; et al.	2001-08-23
Method Of Forming Dram Trench Capacitor With Metal Layer Over Hemispherical Grain Polysilicon App 20010012656 - RHODES, HOWARD E. ; et al.	2001-08-09
Method of forming complementary type conductive regions on a substrate App 20010008787 - Doan, Trung Tri ; et al.	2001-07-19
System for real-time control of semiconductor wafer polishing Grant 6,261,151 - Sandhu , et al. July 17, 2	2001-07-17
Laser pyrolysis particle forming method and particle forming method Grant 6,254,928 - Doan July 3, 2	2001-07-03
Method for fabricating floating gate semiconductor devices with trench isolation structures and self aligned floating gates App 20010002714 - Doan, Trung Tri	2001-06-07
System for real-time control of semiconductor wafer polishing App 20010001755 - Sandhu, Gurtej S. ; et al.	2001-05-24
Capacitor Structures App 20010001210 - Rhodes, Howard E. ; et al.	2001-05-17
Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers Grant 6,208,425 - Sandhu , et al. March 27, 2	2001-03-27
System for real-time control of semiconductor wafer polishing Grant 6,120,347 - Sandhu , et al. September 19, 2	2000-09-19
Capacitor constructions having silicon nitride dielectric materials Grant 6,111,744 - Doan August 29, 2	2000-08-29
Method of forming a circuitry isolation region within a semiconductive wafer Grant 6,100,162 - Doan , et al. August 8, 2	2000-08-08
Method of forming complementary type conductive regions on a substrate Grant 6,074,902 - Doan , et al. June 13, 2	2000-06-13
Method and apparatus for selectively conditioning a polished pad used in planarizng substrates Grant 5,975,994 - Sandhu , et al. November 2, 1	1999-11-02
Semiconductor processing method of forming a contact opening to a region adjacent a field isolation mass Grant 5,866,465 - Doan , et al. February 2, 1	1999-02-02
Vertical diode structures with low series resistance Grant 5,854,102 - Gonzalez , et al. December 29, 1	1998-12-29
System for real-time control of semiconductor wafer polishing Grant 5,851,135 - Sandhu , et al. December 22, 1	1998-12-22
Polishing pad with elongated microcolumns Grant 5,795,218 - Doan , et al. August 18, 1	1998-08-18
Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die Grant 5,781,022 - Wood , et al. July 14, 1	1998-07-14
Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers Grant 5,777,739 - Sandhu , et al. July 7, 1	1998-07-07
Method for fabricating a flash EEPROM Grant 5,767,005 - Doan , et al. June 16, 1	1998-06-16
System for real-time control of semiconductor wafer polishing including heater Grant 5,762,537 - Sandhu , et al. June 9, 1	1998-06-09
Apparatus and method for planar end-point detection during chemical-mechanical polishing Grant 5,738,562 - Doan , et al. April 14, 1	1998-04-14
System for real-time control of semiconductor wafer polishing including optical montoring Grant 5,730,642 - Sandhu , et al. * March 24, 1	1998-03-24
System for real-time control of semiconductor wafer polishing Grant 5,700,180 - Sandhu , et al. December 23, 1	1997-12-23
System for real-time control of semiconductor wafer polishing including optical monitoring Grant 5,658,183 - Sandhu , et al. August 19, 1	1997-08-19
System for real-time control of semiconductor wafer polishing including heater Grant 5,643,060 - Sandhu , et al. July 1, 1	1997-07-01