| Patent | Date |
|---|
Retaining Ring With Shaped Surface And Method Of Forming
App 20220152778 - Chen; Hung Chih ; et al. | 2022-05-19 |
Retaining ring with shaped surface
Grant 11,260,500 - Chen , et al. March 1, 2 | 2022-03-01 |
Retaining Ring with Shaped Surface
App 20200398399 - Chen; Hung Chih ; et al. | 2020-12-24 |
Retaining ring with shaped surface
Grant 10,766,117 - Chen , et al. Sep | 2020-09-08 |
Retaining Ring With Shaped Surface
App 20180185979 - Chen; Hung Chih ; et al. | 2018-07-05 |
Retaining ring with Shaped Surface
Grant 9,937,601 - Chen , et al. April 10, 2 | 2018-04-10 |
Retaining Ring With Shaped Surface
App 20160045997 - Chen; Hung Chih ; et al. | 2016-02-18 |
Retaining ring with shaped surface
Grant 9,186,773 - Chen , et al. November 17, 2 | 2015-11-17 |
Retaining Ring With Shaped Surface
App 20140053981 - Chen; Hung Chih ; et al. | 2014-02-27 |
Retaining ring with shaped surface
Grant 8,585,468 - Chen , et al. November 19, 2 | 2013-11-19 |
Method For Fabricating Vertical Light Emitting Diode (vled) Dice With Wavelength Conversion Layers
App 20130240834 - TRAN; CHUONG ANH ; et al. | 2013-09-19 |
Methods and systems for controlling temperature during microfeature workpiece processing, E.G., CVD deposition
Grant 8,518,184 - Beaman , et al. August 27, 2 | 2013-08-27 |
Methods For Forming Small-scale Capacitor Structures
App 20130166057 - Zheng; Lingyi A. ; et al. | 2013-06-27 |
Methods for forming small-scale capacitor structures
Grant 8,384,192 - Zheng , et al. February 26, 2 | 2013-02-26 |
Retaining Ring With Shaped Surface
App 20120071067 - Chen; Hung Chih ; et al. | 2012-03-22 |
Container capacitor structure and method of formation thereof
Grant 8,124,491 - Durcan , et al. February 28, 2 | 2012-02-28 |
Systems And Methods For Producing White-light Light Emitting Diodes
App 20120032184 - TRAN; CHUONG A. ; et al. | 2012-02-09 |
Method for an integrated circuit contact
Grant 8,097,514 - Dennison , et al. January 17, 2 | 2012-01-17 |
Retaining ring with shaped surface
Grant 8,066,551 - Chen , et al. November 29, 2 | 2011-11-29 |
Light-emitting Diode (led) Structure Having A Wavelength-converting Layer And Method Of Producing
App 20110284866 - TRAN; CHUONG A. ; et al. | 2011-11-24 |
Semiconductor structures including vertical diode structures and methods for making the same
Grant 8,034,716 - Gonzalez , et al. October 11, 2 | 2011-10-11 |
Coating process for a light-emitting diode (LED)
Grant 8,012,774 - Tran , et al. September 6, 2 | 2011-09-06 |
Retaining Ring With Shaped Surface
App 20110195639 - Chen; Hung Chih ; et al. | 2011-08-11 |
Methods For Forming Small-scale Capacitor Structures
App 20110163416 - Zheng; Lingyi A. ; et al. | 2011-07-07 |
Co-sputter deposition of metal-doped chalcogenides
Grant 7,964,436 - Li , et al. June 21, 2 | 2011-06-21 |
Controllable ovonic phase-change semiconductor memory device and methods of programming the same
Grant 7,935,950 - Doan , et al. May 3, 2 | 2011-05-03 |
Retaining ring with shaped surface
Grant 7,927,190 - Chen , et al. April 19, 2 | 2011-04-19 |
Methods for forming small-scale capacitor structures
Grant 7,906,393 - Zheng , et al. March 15, 2 | 2011-03-15 |
Method for an integrated circuit contact
Grant 7,871,934 - Dennison , et al. January 18, 2 | 2011-01-18 |
Methods And Systems For Controlling Temperature During Microfeature Workpiece Processing, E.g., Cvd Deposition
App 20100282164 - Beaman; Kevin L. ; et al. | 2010-11-11 |
Die-wafer package and method of fabricating same
Grant 7,807,503 - Doan October 5, 2 | 2010-10-05 |
Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD deposition
Grant 7,771,537 - Beaman , et al. August 10, 2 | 2010-08-10 |
Apparatus For Use In Semiconductor Wafer Processing For Laterally Displacing Individual Semiconductor Devices Away From One Another
App 20100102433 - Doan; Trung T. | 2010-04-29 |
Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another
Grant 7,656,012 - Doan February 2, 2 | 2010-02-02 |
Method For An Integrated Circuit Contact
App 20100019388 - Dennison; Charles H. ; et al. | 2010-01-28 |
Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
Grant 7,647,886 - Kubista , et al. January 19, 2 | 2010-01-19 |
Container Capacitor Structure And Method Of Formation Thereof
App 20090311843 - Durcan; D. Mark ; et al. | 2009-12-17 |
Selective provision of a diblock copolymer material
Grant 7,625,694 - Marsh , et al. December 1, 2 | 2009-12-01 |
Container capacitor structure and method of formation thereof
Grant 7,625,795 - Durcan , et al. December 1, 2 | 2009-12-01 |
Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
Grant 7,588,677 - Lee , et al. September 15, 2 | 2009-09-15 |
Container capacitor structure and method of formation thereof
Grant 7,579,235 - Durcan , et al. August 25, 2 | 2009-08-25 |
Method for an integrated circuit contact
Grant 7,569,485 - Dennison , et al. August 4, 2 | 2009-08-04 |
Attaching components of a carrier head
Grant 7,530,153 - Doan , et al. May 12, 2 | 2009-05-12 |
Co-sputter Deposition Of Metal-doped Chalcogenides
App 20090098717 - Li; Jiutao ; et al. | 2009-04-16 |
Refurbishment of sputtering targets
Grant 7,504,008 - Doan , et al. March 17, 2 | 2009-03-17 |
Approach to avoid buckling in BPSG by using an intermediate barrier layer
Grant 7,485,961 - Doan , et al. February 3, 2 | 2009-02-03 |
Die-wafer Package And Method Of Fabricating Same
App 20090011540 - Doan; Trung T. | 2009-01-08 |
Chemical dispensing system for semiconductor wafer processing
Grant 7,470,344 - Doan December 30, 2 | 2008-12-30 |
Co-sputter deposition of metal-doped chalcogenides
Grant 7,446,393 - Li , et al. November 4, 2 | 2008-11-04 |
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
Grant 7,422,635 - Zheng , et al. September 9, 2 | 2008-09-09 |
Retaining Ring With Shaped Surface
App 20080196833 - Chen; Hung Chih ; et al. | 2008-08-21 |
Die-wafer package and method of fabricating same
Grant 7,413,928 - Doan August 19, 2 | 2008-08-19 |
Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
Grant 7,344,755 - Beaman , et al. March 18, 2 | 2008-03-18 |
Retaining ring with shaped surface
Grant 7,344,434 - Chen , et al. March 18, 2 | 2008-03-18 |
Coating for aluminum component
Grant 7,323,230 - Doan , et al. January 29, 2 | 2008-01-29 |
Controllable Ovonic Phase-change Semiconductor Memory Device And Methods Of Programming The Same
App 20080019167 - Doan; Trung T. ; et al. | 2008-01-24 |
Semiconductor device having integrated circuit contact
Grant 7,315,082 - Dennison , et al. January 1, 2 | 2008-01-01 |
Method For An Integrated Circuit Contact
App 20070281487 - Dennison; Charles H. ; et al. | 2007-12-06 |
Integrated circuit contact
Grant 7,282,440 - Dennison , et al. October 16, 2 | 2007-10-16 |
Method for an integrated circuit contact
Grant 7,282,447 - Dennison , et al. October 16, 2 | 2007-10-16 |
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
Grant 7,279,398 - Basceri , et al. October 9, 2 | 2007-10-09 |
Method for an integrated circuit contact
Grant 7,276,448 - Dennison , et al. October 2, 2 | 2007-10-02 |
Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
Grant 7,258,892 - Beaman , et al. August 21, 2 | 2007-08-21 |
Controllable ovonic phase-change semiconductor memory device
Grant 7,253,430 - Doan , et al. August 7, 2 | 2007-08-07 |
Connector assembly
Grant 7,247,944 - Doan July 24, 2 | 2007-07-24 |
Co-sputter deposition of metal-doped chalcogenides
App 20070164398 - Li; Jiutao ; et al. | 2007-07-19 |
Attaching components of a carrier head
App 20070143980 - Doan; Trung T. ; et al. | 2007-06-28 |
Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
Grant 7,235,138 - Zheng , et al. June 26, 2 | 2007-06-26 |
Contact/via force fill techniques and resulting structures
Grant 7,224,065 - Doan May 29, 2 | 2007-05-29 |
Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by same
Grant 7,220,670 - Sandhu , et al. May 22, 2 | 2007-05-22 |
Chamber components with polymer coatings and methods of manufacture
App 20070108161 - Murugesh; Laxman ; et al. | 2007-05-17 |
Co-sputter deposition of metal-doped chalcogenides
Grant 7,202,104 - Li , et al. April 10, 2 | 2007-04-10 |
Container capacitor structure and method of formation thereof
App 20070032035 - Durcan; D. Mark ; et al. | 2007-02-08 |
Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
Grant 7,169,691 - Doan January 30, 2 | 2007-01-30 |
Container capacitor structure and method of formation thereof
Grant 7,160,785 - Durcan , et al. January 9, 2 | 2007-01-09 |
Coating Process
App 20070001178 - Tran; Chuong A. ; et al. | 2007-01-04 |
Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
Grant 7,153,410 - Moore , et al. December 26, 2 | 2006-12-26 |
Die-wafer package and method of fabricating same
App 20060264023 - Doan; Trung T. | 2006-11-23 |
Planarization process for semiconductor substrates
App 20060249723 - Doan; Trung T. ; et al. | 2006-11-09 |
High density direct connect LOC assembly
App 20060231940 - Doan; Trung T. | 2006-10-19 |
Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
App 20060234604 - Lee; Whonchee ; et al. | 2006-10-19 |
Die-wafer package and method of fabricating same
Grant 7,122,906 - Doan October 17, 2 | 2006-10-17 |
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
App 20060213440 - Zheng; Lingyi A. ; et al. | 2006-09-28 |
Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
Grant 7,112,121 - Lee , et al. September 26, 2 | 2006-09-26 |
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
App 20060205187 - Zheng; Lingyi A. ; et al. | 2006-09-14 |
Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD deposition
App 20060204649 - Beaman; Kevin L. ; et al. | 2006-09-14 |
Machine state storage apparatus and method
App 20060206652 - Doan; Trung T. ; et al. | 2006-09-14 |
Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
App 20060197190 - Doan; Trung T. | 2006-09-07 |
Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
App 20060198955 - Zheng; Lingyi A. ; et al. | 2006-09-07 |
Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
App 20060196538 - Kubista; David J. ; et al. | 2006-09-07 |
Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
Grant RE39,195 - Doan , et al. July 18, 2 | 2006-07-18 |
Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs
Grant RE39,126 - Yu , et al. June 13, 2 | 2006-06-13 |
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
App 20060121689 - Basceri; Cem ; et al. | 2006-06-08 |
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
Grant 7,056,806 - Basceri , et al. June 6, 2 | 2006-06-06 |
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
App 20060115957 - Basceri; Cem ; et al. | 2006-06-01 |
High density direct connect loc assembly
App 20060099740 - Doan; Trung T. | 2006-05-11 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
Grant 7,009,298 - Sandhu , et al. March 7, 2 | 2006-03-07 |
Method and system providing high flux of point of use activated reactive species for semiconductor processing
Grant 7,001,481 - Sandhu , et al. February 21, 2 | 2006-02-21 |
Coating for aluminum component
App 20060024517 - Doan; Trung T. ; et al. | 2006-02-02 |
Profile detection and refurbishment of deposition targets
App 20060021870 - Tsai; Kenneth ; et al. | 2006-02-02 |
Container capacitor structure and method of formation thereof
App 20060006445 - Durcan; D. Mark ; et al. | 2006-01-12 |
Selective provision of a diblock copolymer material
App 20050250053 - Marsh, Eugene P. ; et al. | 2005-11-10 |
Methods for preparing samples for atom probe analysis
Grant 6,956,210 - Doan October 18, 2 | 2005-10-18 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
Grant 6,953,743 - Sandhu , et al. October 11, 2 | 2005-10-11 |
Contact/via force fill techniques
Grant 6,949,464 - Doan September 27, 2 | 2005-09-27 |
Refurbishment of sputtering targets
App 20050199486 - Doan, Trung T. ; et al. | 2005-09-15 |
Retaining ring with shaped surface
App 20050191947 - Chen, Hung Chih ; et al. | 2005-09-01 |
High density direct connect LOC assembly
App 20050173794 - Doan, Trung T. | 2005-08-11 |
Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
App 20050167799 - Doan, Trung T. | 2005-08-04 |
Die-wafer package and method of fabricating same
App 20050167798 - Doan, Trung T. | 2005-08-04 |
Methods for forming small-scale capacitor structures
App 20050164466 - Zheng, Lingyi A. ; et al. | 2005-07-28 |
Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
App 20050126489 - Beaman, Kevin L. ; et al. | 2005-06-16 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
Grant 6,903,010 - Sandhu , et al. June 7, 2 | 2005-06-07 |
Controllable ovanic phase-change semiconductor memory device
Grant 6,897,467 - Doan , et al. May 24, 2 | 2005-05-24 |
Co-sputter deposition of metal-doped chalcogenides
Grant 6,890,790 - Li , et al. May 10, 2 | 2005-05-10 |
Minimally spaced MRAM structures
Grant 6,885,051 - Durcan , et al. April 26, 2 | 2005-04-26 |
Methods for preparing samples for atom probe analysis
App 20050082475 - Doan, Trung T. | 2005-04-21 |
Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
App 20050081786 - Kubista, David J. ; et al. | 2005-04-21 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
Grant 6,881,667 - Sandhu , et al. April 19, 2 | 2005-04-19 |
Probe card for testing microelectronic components
Grant 6,881,974 - Wood , et al. April 19, 2 | 2005-04-19 |
High density direct connect LOC assembly
Grant 6,882,033 - Doan April 19, 2 | 2005-04-19 |
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
App 20050059261 - Basceri, Cem ; et al. | 2005-03-17 |
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
App 20050045102 - Zheng, Lingyi A. ; et al. | 2005-03-03 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
Grant 6,861,351 - Sandhu , et al. March 1, 2 | 2005-03-01 |
Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
App 20050039680 - Beaman, Kevin L. ; et al. | 2005-02-24 |
Contact/via force fill techniques and resulting structures
App 20050029670 - Doan, Trung T. | 2005-02-10 |
Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by same
App 20050029570 - Sandhu, Gurtej S. ; et al. | 2005-02-10 |
Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by same
App 20050029571 - Sandhu, Gurtej S. ; et al. | 2005-02-10 |
Method for an integrated circuit contact
App 20050020049 - Dennison, Charles H. ; et al. | 2005-01-27 |
Method for an integrated circuit contact
App 20050020056 - Dennison, Charles H. ; et al. | 2005-01-27 |
Method for an integrated circuit contact
App 20050020090 - Dennison, Charles H. ; et al. | 2005-01-27 |
Removable programmable conductor memory card and associated read/write device and method of operation
Grant 6,847,535 - Gilton , et al. January 25, 2 | 2005-01-25 |
MOCVD process using ozone as a reactant to deposit a metal oxide barrier layer
Grant 6,846,739 - Cathey , et al. January 25, 2 | 2005-01-25 |
MOCVD process using ozone as a reactant to deposit a metal oxide barrier layer
App 20050003655 - Cathey, David A. ; et al. | 2005-01-06 |
Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by the same
Grant 6,831,324 - Sandhu , et al. December 14, 2 | 2004-12-14 |
Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections
Grant 6,828,812 - Farnworth , et al. December 7, 2 | 2004-12-07 |
Method for fabricating a memory chip
Grant 6,825,107 - Doan , et al. November 30, 2 | 2004-11-30 |
Co-sputter deposition of metal-doped chalcogenides
App 20040235235 - Li, Jiutao ; et al. | 2004-11-25 |
Planarization process for semiconductor substrates
App 20040209475 - Doan, Trung T. ; et al. | 2004-10-21 |
Minimally spaced MRAM structures
App 20040195609 - Durcan, D. Mark ; et al. | 2004-10-07 |
Approach to avoid buckling in BPSG by using an intermediate barrier layer
App 20040188840 - Doan, Trung T. ; et al. | 2004-09-30 |
Method of providing high flux of point of use activated reactive species for semiconductor processing
Grant 6,793,736 - Sandhu , et al. September 21, 2 | 2004-09-21 |
Chemical dispensing system for semiconductor wafer processing
Grant 6,793,764 - Doan September 21, 2 | 2004-09-21 |
Atomic layer deposition of capacitor dielectric
App 20040166647 - Zheng, Lingyi A. ; et al. | 2004-08-26 |
Controlable ovonic phase-change semiconductor memory device
Grant 6,781,145 - Doan , et al. August 24, 2 | 2004-08-24 |
Probe card, e.g., for testing microelectronic components, and methods for making same
Grant 6,773,938 - Wood , et al. August 10, 2 | 2004-08-10 |
Self-aligned, trenchless mangetoresitive random-access memory (MRAM) structure with sidewall containment of MRAM structure
Grant 6,765,250 - Doan , et al. July 20, 2 | 2004-07-20 |
Container capacitor array having a common top capacitor plate
Grant 6,753,565 - Durcan , et al. June 22, 2 | 2004-06-22 |
Probe card, e.g., for testing microelectronic components, and methods for making same
App 20040113644 - Wood, Alan G. ; et al. | 2004-06-17 |
Minimally spaced MRAM structures
Grant 6,750,069 - Durcan , et al. June 15, 2 | 2004-06-15 |
Atomic layer doping apparatus and method
Grant 6,746,934 - Sandhu , et al. June 8, 2 | 2004-06-08 |
Planarization process for semiconductor substrates
Grant 6,743,724 - Doan , et al. June 1, 2 | 2004-06-01 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
App 20040053486 - Sandhu, Gurtej S. ; et al. | 2004-03-18 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
App 20040053492 - Sandhu, Gurtej S. ; et al. | 2004-03-18 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
App 20040053494 - Sandhu, Gurtej S. ; et al. | 2004-03-18 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
App 20040053493 - Sandhu, Gurtej S. ; et al. | 2004-03-18 |
Probe Card , E.g., For Testing Microelectronic Components, And Methods For Making Same
App 20040040149 - Wood, Alan G. ; et al. | 2004-03-04 |
Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same
App 20040036065 - Doan, Trung T. ; et al. | 2004-02-26 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
App 20040033650 - Sandhu, Gurtej S. ; et al. | 2004-02-19 |
Container capacitor structure and method of formation thereof
Grant 6,693,319 - Durcan , et al. February 17, 2 | 2004-02-17 |
Method for forming minimally spaced MRAM structures
Grant 6,689,661 - Durcan , et al. February 10, 2 | 2004-02-10 |
Approach to avoid buckling BPSG by using an intermediate barrier layer
Grant 6,690,044 - Doan , et al. February 10, 2 | 2004-02-10 |
Method of forming self-aligned, trenchless mangetoresitive random-access memory (MRAM) structure with sidewall containment of MRAM structure
Grant 6,689,624 - Doan , et al. February 10, 2 | 2004-02-10 |
Method of providing high flux of point of use activated reactive species for semiconductor processing
App 20040020511 - Sandhu, Gurtej S. ; et al. | 2004-02-05 |
Method for forming minimally spaced MRAM structures
Grant 6,682,943 - Durcan , et al. January 27, 2 | 2004-01-27 |
Co-sputter deposition of metal-doped chalcogenides
App 20030228717 - Li, Jiutao ; et al. | 2003-12-11 |
Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
App 20030226764 - Moore, Scott E. ; et al. | 2003-12-11 |
Container capacitor structure and method of formation thereof
Grant 6,661,051 - Durcan , et al. December 9, 2 | 2003-12-09 |
Method of forming self-aligned, trenchless mangetoresistive random-access memory (MRAM) structure with sidewall containment of MRAM structure
Grant 6,653,154 - Doan , et al. November 25, 2 | 2003-11-25 |
Self-aligned, trenchless mangetoresitive random-access memory (MRAM) structure with sidewall containment of MRAM structure
App 20030215961 - Doan, Trung T. ; et al. | 2003-11-20 |
Methods for high density direct connect LOC assembly
Grant 6,645,844 - Doan November 11, 2 | 2003-11-11 |
Self-aligned, trenchless mangetoresitive random-access memory (MRAM) structure with sidewall containment of MRAM structure
App 20030207471 - Doan, Trung T. ; et al. | 2003-11-06 |
Minimally spaced MRAM structures
App 20030199106 - Durcan, D. Mark ; et al. | 2003-10-23 |
Integrated circuit contact
App 20030197273 - Dennison, Charles H. ; et al. | 2003-10-23 |
Method of forming low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
Grant 6,632,736 - Sandhu , et al. October 14, 2 | 2003-10-14 |
Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
Grant 6,628,410 - Doan September 30, 2 | 2003-09-30 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
Grant 6,624,517 - Sandhu , et al. September 23, 2 | 2003-09-23 |
Method of forming a contact structure and a container capacitor structure
Grant 6,620,680 - Durcan , et al. September 16, 2 | 2003-09-16 |
Atomic layer deposition of capacitor dielectric
App 20030166318 - Zheng, Lingyi A. ; et al. | 2003-09-04 |
Removable programmable conductor memory card and associated read/write device and method of operation
App 20030156467 - Gilton, Terry L. ; et al. | 2003-08-21 |
Container capacitor structure and method of formation thereof
Grant 6,608,342 - Durcan , et al. August 19, 2 | 2003-08-19 |
Controllable ovanic phase-change semiconductor memory device
App 20030127669 - Doan, Trung T. ; et al. | 2003-07-10 |
High density direct connect LOC assembly
App 20030116834 - Doan, Trung T. | 2003-06-26 |
Method and system providing high flux of point of use activated reactive species for semiconductor processing
App 20030102008 - Sandhu, Gurtej S. ; et al. | 2003-06-05 |
Machine state storage apparatus and method
App 20030101312 - Doan, Trung T. ; et al. | 2003-05-29 |
Atomic layer deposition of capacitor dielectric
App 20030098480 - Zheng, Lingyi A. ; et al. | 2003-05-29 |
Atomic layer deposition of capacitor dielectric
Grant 6,551,893 - Zheng , et al. April 22, 2 | 2003-04-22 |
Atomic layer doping apparatus and method
App 20030073318 - Sandhu, Gurtej ; et al. | 2003-04-17 |
Atomic layer doping apparatus and method
Grant 6,541,353 - Sandhu , et al. April 1, 2 | 2003-04-01 |
Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by same
App 20030020113 - Sandhu, Gurtej S. ; et al. | 2003-01-30 |
Method to create a controlable ovanic phase-change semiconductor memory device and methods of fabricating the same
App 20020175322 - Doan, Trung T. ; et al. | 2002-11-28 |
Method for forming minimally spaced MRAM structures
App 20020160541 - Durcan, D. Mark ; et al. | 2002-10-31 |
Method for forming minimally spaced MRAM structures
App 20020146849 - Durcan, D. Mark ; et al. | 2002-10-10 |
Integrated circuit contact
App 20020130395 - Dennison, Charles H. ; et al. | 2002-09-19 |
Self-aligned, trenchless mangetoresitive random-access memory (MRAM) structure with sidewall containment of MRAM structure
App 20020132375 - Doan, Trung T. ; et al. | 2002-09-19 |
Container capacitor structure and method of formation thereof
App 20020125508 - Durcan, D. Mark ; et al. | 2002-09-12 |
Integrated circuit contact
App 20020117752 - Dennison, Charles H. ; et al. | 2002-08-29 |
Self-aligned, magnetoresitive random-access memory (MRAM) structure utilizing a spacer containment scheme
App 20020105035 - Sandhu, Gurtej ; et al. | 2002-08-08 |
Method of forming a contact structure and a container capacitor structure
App 20020098654 - Durcan, D. Mark ; et al. | 2002-07-25 |
Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same
Grant 6,423,621 - Doan , et al. July 23, 2 | 2002-07-23 |
Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
App 20020071128 - Doan, Trung T. | 2002-06-13 |
Method of forming a contact structure and a container capacitor structure
Grant 6,395,600 - Durcan , et al. May 28, 2 | 2002-05-28 |
Atomic layer doping apparatus and method
App 20020046705 - Sandhu, Gurtej ; et al. | 2002-04-25 |
High density direct connect LOC assembly
App 20020045291 - Doan, Trung T. | 2002-04-18 |
Self-aligned, magnetoresistive random-access memory (MRAM) structure utilizing a spacer containment scheme
Grant 6,358,756 - Sandhu , et al. March 19, 2 | 2002-03-19 |
Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
App 20020025763 - Lee, Whonchee ; et al. | 2002-02-28 |
Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same
App 20020016054 - Doan, Trung T. ; et al. | 2002-02-07 |
Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same
App 20020009858 - Doan, Trung T. ; et al. | 2002-01-24 |
High density direct connect LOC assembly
Grant 6,335,225 - Doan January 1, 2 | 2002-01-01 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
App 20010055875 - Sandhu, Gurtej S. ; et al. | 2001-12-27 |
Planarization process for semiconductor substrates
Grant 6,331,488 - Doan , et al. December 18, 2 | 2001-12-18 |
Planarization process for semiconductor substrates
App 20010051430 - Doan, Trung T. ; et al. | 2001-12-13 |
Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same
Grant 6,329,666 - Doan , et al. December 11, 2 | 2001-12-11 |
Integrated capacitor bottom electrode with etch stop layer
Grant 6,303,953 - Doan , et al. October 16, 2 | 2001-10-16 |
Endpoint detector and method for measuring a change in wafer thickness
Grant 6,301,006 - Doan October 9, 2 | 2001-10-09 |
Bondpad Attachments Having Self-limiting Properties For Penetration Of Semiconductor Die
App 20010024118 - FARNWORTH, WARREN M. ; et al. | 2001-09-27 |
Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same
Grant 6,294,452 - Doan , et al. September 25, 2 | 2001-09-25 |
Method of forming titanium silicide and titanium by chemical vapor deposition and resulting apparatus
App 20010006240 - Doan, Trung T. ; et al. | 2001-07-05 |
Methods of forming a contact having titanium silicide and titanium formed by chemical vapor deposition
Grant 6,255,216 - Doan , et al. July 3, 2 | 2001-07-03 |
Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by the same
App 20010003670 - Sandhu, Gurtej S. ; et al. | 2001-06-14 |
Apparatus having titanium silicide and titanium formed by chemical vapor deposition
Grant 6,208,033 - Doan , et al. March 27, 2 | 2001-03-27 |
Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same
Grant 6,150,253 - Doan , et al. November 21, 2 | 2000-11-21 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
Grant 6,081,034 - Sandhu , et al. June 27, 2 | 2000-06-27 |
Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
Grant 6,075,606 - Doan June 13, 2 | 2000-06-13 |
Integrated capacitor bottom electrode with etch stop layer
Grant 6,048,763 - Doan , et al. April 11, 2 | 2000-04-11 |
IC mechanical planarization process incorporating two slurry compositions for faster material removal times
Grant 6,040,245 - Sandhu , et al. March 21, 2 | 2000-03-21 |
Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
Grant 6,004,196 - Doan , et al. December 21, 1 | 1999-12-21 |
IC mechanical planarization process incorporating two slurry compositions for faster material removal times
Grant 5,994,224 - Sandhu , et al. November 30, 1 | 1999-11-30 |
Method of forming titanium silicide and titanium by chemical vapor deposition
Grant 5,976,976 - Doan , et al. November 2, 1 | 1999-11-02 |
Chemical dispensing system for semiconductor wafer processing
Grant 5,952,050 - Doan September 14, 1 | 1999-09-14 |
Liquid vapor deposition or etching method
Grant 5,863,603 - Sandhu , et al. January 26, 1 | 1999-01-26 |
Self-aligned process for making contacts to silicon substrates during the manufacture of integrated circuits therein
Grant 5,858,877 - Dennison , et al. January 12, 1 | 1999-01-12 |
Method of making a low-resistance contact to silicon having a titanium silicide interface, an amorphous titanium nitride barrier layer and a conductive plug
Grant 5,723,382 - Sandhu , et al. March 3, 1 | 1998-03-03 |
Method to form self-aligned gate structures and focus rings
Grant 5,653,619 - Cloud , et al. August 5, 1 | 1997-08-05 |
Multiple step method of chemical-mechanical polishing which minimizes dishing
Grant 5,618,381 - Doan , et al. April 8, 1 | 1997-04-08 |
Method for packaging semiconductor dice
Grant 5,593,927 - Farnworth , et al. January 14, 1 | 1997-01-14 |
Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor
Grant 5,585,282 - Wood , et al. December 17, 1 | 1996-12-17 |
IC mechanical planarization process incorporating two slurry compositions for faster material removal times
Grant 5,540,810 - Sandhu , et al. July 30, 1 | 1996-07-30 |
Method for making self-aligned rim phase shifting masks for sub-micron lithography
Grant 5,536,606 - Doan July 16, 1 | 1996-07-16 |
Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches
Grant 5,514,245 - Doan , et al. May 7, 1 | 1996-05-07 |
Highly resistive structures for integrated circuits and method of manufacturing the same
Grant 5,496,762 - Sandhu , et al. March 5, 1 | 1996-03-05 |
System and method for real-time control of semiconductor a wafer polishing, and a polishing head
Grant 5,486,129 - Sandhu , et al. January 23, 1 | 1996-01-23 |
Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes
Grant 5,439,551 - Meikle , et al. * August 8, 1 | 1995-08-08 |
Field emission structures produced on macro-grain polysilicon substrates
Grant 5,438,240 - Cathey , et al. * August 1, 1 | 1995-08-01 |
Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus
Grant 5,421,769 - Schultz , et al. June 6, 1 | 1995-06-06 |
Method to slope conductor profile prior to dielectric deposition to improve dielectric step-coverage
Grant 5,416,048 - Blalock , et al. May 16, 1 | 1995-05-16 |
Arrays of memory integrated circuitry
Grant 5,397,908 - Dennison , et al. March 14, 1 | 1995-03-14 |
Chemical-mechanical polishing processes of planarizing insulating layers
Grant 5,395,801 - Doan , et al. March 7, 1 | 1995-03-07 |
Semiconductor processing method of producing an isolated polysilicon lined cavity and a method of forming a capacitor
Grant 5,391,511 - Doan , et al. February 21, 1 | 1995-02-21 |
Method to form a low resistant bond pad interconnect
Grant 5,384,284 - Doan , et al. January 24, 1 | 1995-01-24 |
Bilayer barrier metal method for obtaining 100% step-coverage in contact vias without junction degradation
Grant 5,380,678 - Yu , et al. January 10, 1 | 1995-01-10 |
Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers
Grant 5,376,405 - Doan , et al. * December 27, 1 | 1994-12-27 |
Approach to avoid buckling in BPSG by using an intermediate barrier layer
Grant 5,372,974 - Doan , et al. December 13, 1 | 1994-12-13 |
Slurries for chemical mechanically polishing copper containing metal layers
Grant 5,354,490 - Yu , et al. October 11, 1 | 1994-10-11 |
Planarization of a gate electrode for improved gate patterning over non-planar active area isolation
Grant 5,346,587 - Doan , et al. September 13, 1 | 1994-09-13 |
Use of a faceted etch process to eliminate stringers
Grant 5,346,585 - Doan , et al. September 13, 1 | 1994-09-13 |
Field emission structures produced on macro-grain polysilicon substrates
Grant 5,329,207 - Cathey , et al. July 12, 1 | 1994-07-12 |
Method of providing a silicon film having a roughened outer surface
Grant 5,320,880 - Sandhu , et al. June 14, 1 | 1994-06-14 |
Methods of chemical-mechanical polishing insulating inorganic metal oxide materials
Grant 5,318,927 - Sandhu , et al. June 7, 1 | 1994-06-07 |
Integrated circuit polishing method
Grant 5,314,843 - Yu , et al. May 24, 1 | 1994-05-24 |
Method of forming a configuration of interconnections on a semiconductor device having a high integration density
Grant RE34,583 - Grief , et al. April 12, 1 | 1994-04-12 |
Method of isolating semiconductor devices and arrays of memory integrated circuitry
Grant 5,292,683 - Dennison , et al. March 8, 1 | 1994-03-08 |
Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers
Grant 5,278,100 - Doan , et al. * January 11, 1 | 1994-01-11 |
Process for depositing aluminum nitride (AlN) using nitrogen plasma sputtering
Grant 5,270,263 - Kim , et al. December 14, 1 | 1993-12-14 |
Method to form self-aligned gate structures and focus rings
Grant 5,259,799 - Doan , et al. * November 9, 1 | 1993-11-09 |
Method of depositing high density titanium nitride films on semiconductor wafers
Grant 5,254,499 - Sandhu , et al. October 19, 1 | 1993-10-19 |
Method for forming a mixed phase TiN/TiSi film for semiconductor manufacture using metal organometallic precursors and organic silane
Grant 5,252,518 - Sandhu , et al. October 12, 1 | 1993-10-12 |
Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs
Grant 5,244,534 - Yu , et al. September 14, 1 | 1993-09-14 |
Corrugated storage contact capacitor and method for forming a corrugated storage contact capacitor
Grant 5,240,871 - Doan , et al. August 31, 1 | 1993-08-31 |
Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers
Grant 5,240,739 - Doan , et al. August 31, 1 | 1993-08-31 |
Method for simultaneously forming silicide and effecting dopant activation on a semiconductor wafer
Grant 5,236,865 - Sandhu , et al. August 17, 1 | 1993-08-17 |
Method for planarizing semiconductor wafers with a non-circular polishing pad
Grant 5,234,867 - Schultz , et al. August 10, 1 | 1993-08-10 |
Method and apparatus for improving planarity of chemical-mechanical planarization operations
Grant 5,232,875 - Tuttle , et al. August 3, 1 | 1993-08-03 |
Spacers for field emission display fabricated via self-aligned high energy ablation
Grant 5,232,549 - Cathey , et al. August 3, 1 | 1993-08-03 |
Method to form self-aligned gate structures around cold cathode emitter tips using chemical mechanical polishing technology
Grant 5,229,331 - Doan , et al. July 20, 1 | 1993-07-20 |
Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing
Grant 5,225,034 - Yu , et al. July 6, 1 | 1993-07-06 |
Method for roughening a silicon or polysilicon surface for a semiconductor substrate
Grant 5,223,081 - Doan June 29, 1 | 1993-06-29 |
Semiconductor gettering process using backside chemical mechanical planarization (CMP) and dopant diffusion
Grant 5,223,734 - Lowrey , et al. June 29, 1 | 1993-06-29 |
Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing
Grant 5,209,816 - Yu , et al. May 11, 1 | 1993-05-11 |
Method to form high aspect ratio supports (spacers) for field emission display using micro-saw technology
Grant 5,205,770 - Lowrey , et al. April 27, 1 | 1993-04-27 |
Method of processing semiconductor wafers using a contact etch stop
Grant 5,206,187 - Doan , et al. April 27, 1 | 1993-04-27 |
Method of making self-aligned contacts and vertical interconnects to integrated circuits
Grant 5,204,286 - Doan April 20, 1 | 1993-04-20 |
Method of forming a capacitor in semiconductor wafer processing
Grant 5,202,278 - Mathews , et al. April 13, 1 | 1993-04-13 |
Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
Grant 5,196,353 - Sandhu , et al. March 23, 1 | 1993-03-23 |
Methods for inhibiting outgrowth of silicide in self-aligned silicide process
Grant 5,196,360 - Doan , et al. March 23, 1 | 1993-03-23 |
Method to form self-aligned gate structures and focus rings
Grant 5,186,670 - Doan , et al. February 16, 1 | 1993-02-16 |
Laser ablation deposition process for semiconductor manufacture
Grant 5,173,441 - Yu , et al. December 22, 1 | 1992-12-22 |
LPCVD process for depositing titanium films for semiconductor devices
Grant 5,173,327 - Sandhu , et al. December 22, 1 | 1992-12-22 |
Method of etching SiO.sub.2 dielectric layers using chemical mechanical polishing techniques
Grant 5,169,491 - Doan December 8, 1 | 1992-12-08 |
Semiconductor metallization method
Grant 5,147,819 - Yu , et al. September 15, 1 | 1992-09-15 |
Process for planarizing insulating dielectric material
Grant 5,139,967 - Sandhu , et al. August 18, 1 | 1992-08-18 |
Conductive contact plug and a method of forming a conductive contact plug in an integrated circuit using laser planarization
Grant 5,124,780 - Sandhu , et al. June 23, 1 | 1992-06-23 |
Stress reduction in metal films by laser annealing
Grant 5,094,977 - Yu , et al. March 10, 1 | 1992-03-10 |
Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
Grant 5,069,002 - Sandhu , et al. December 3, 1 | 1991-12-03 |
Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
Grant 5,036,015 - Sandhu , et al. July 30, 1 | 1991-07-30 |
Process for preventing a native oxide from forming on the surface of a semiconductor material and integrated circuit capacitors produced thereby
Grant 5,032,545 - Doan , et al. July 16, 1 | 1991-07-16 |
Method for improving step coverage of a metallization layer on an integrated circuit by use of a high melting point metal as an anti-reflective coating during laser planarization
Grant 5,032,233 - Yu , et al. July 16, 1 | 1991-07-16 |
Split-polysilicon CMOS process incorporating self-aligned silicidation of conductive regions
Grant 5,021,353 - Lowrey , et al. June 4, 1 | 1991-06-04 |
Method of manufacturing a semiconductor device by forming insulating side walls with voids below overhangs
Grant 5,001,079 - van Laarhoven , et al. March 19, 1 | 1991-03-19 |
Process for creating a metal etch mask which may be utilized for halogen-plasma excavation of deep trenches
Grant 5,001,085 - Cathey , et al. March 19, 1 | 1991-03-19 |
Aluminum alloy containing copper, silicon and titanium for VLSI devices
Grant 4,999,160 - Lowrey , et al. March 12, 1 | 1991-03-12 |
Method of etching back of tungsten layers on semiconductor wafers, and solution therefore
Grant 4,992,135 - Doan February 12, 1 | 1991-02-12 |
Method of forming a configuration of interconnections on a semiconductor device having a high integration density
Grant 4,936,950 - Doan , et al. June 26, 1 | 1990-06-26 |
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