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Process for preparing quinoline-3-carboxamide derivatives Grant 8,552,194 - Dixit , et al. October 8, 2 | 2013-10-08 |
Process For Preparing Varenicline, Varenicline Intermediates, And Pharmaceutically Acceptable Salts Thereof App 20130072682 - Dixit; Girish ;   et al. | 2013-03-21 |
Solid state forms of laquinimod and its sodium salt Grant 8,354,428 - Dixit , et al. January 15, 2 | 2013-01-15 |
Self aligning non contact shadow ring process kit Grant 8,342,119 - Yudovsky , et al. January 1, 2 | 2013-01-01 |
Process for preparing varenicline, varenicline intermediates, pharmaceutically acceptable salts thereof Grant 8,314,235 - Dixit , et al. November 20, 2 | 2012-11-20 |
Interfacial capping layers for interconnects Grant 8,268,722 - Yu , et al. September 18, 2 | 2012-09-18 |
Paliperidone Or A Pharmaceutically Acceptable Salt Thereof Substantially Free Of Impurities App 20120164188 - Dixit; Girish ;   et al. | 2012-06-28 |
Solid State Forms Of Paliperidone Salts And Process For The Preparation Thereof App 20120100188 - Dixit; Girish ;   et al. | 2012-04-26 |
Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties Grant 8,124,522 - Wu , et al. February 28, 2 | 2012-02-28 |
Quetiapine salts and their polymorphs Grant 8,101,597 - Dixit , et al. January 24, 2 | 2012-01-24 |
Highly Pure Laquinimod Or A Pharmaceutically Acceptable Salt Thereof App 20120009226 - Dixit; Girish ;   et al. | 2012-01-12 |
Processes For Preparing Substantially Pure Arformoterol And Its Intermediates App 20110313199 - Dixit; Girish ;   et al. | 2011-12-22 |
Ternary tungsten-containing resistive thin films Grant 8,062,977 - Ashtiani , et al. November 22, 2 | 2011-11-22 |
Process For Preparing Varenicline, Varenicline Intermediates, And Pharmaceutically Acceptable Salts Thereof App 20110224437 - Dixit; Girish ;   et al. | 2011-09-15 |
Deposition of doped copper seed layers having improved reliability Grant 8,017,523 - Wu , et al. September 13, 2 | 2011-09-13 |
Novel Solid State Forms Of Laquinimod And Its Sodium Salt App 20110171270 - Dixit; Girish ;   et al. | 2011-07-14 |
Amorphous Coprecipitates of Atorvastatin Pharmaceutically Acceptable Salts App 20110142883 - Dixit; Girish ;   et al. | 2011-06-16 |
Process for Preparing Quinoline-3-Carboxamide Derivatives App 20110105756 - Dixit; Girish ;   et al. | 2011-05-05 |
Substantially Pure and a Stable Crystalline Form of Bosentan App 20110021547 - Dixit; Girish ;   et al. | 2011-01-27 |
Novel Polymorphs of Bosentan App 20110014291 - Dixit; Girish ;   et al. | 2011-01-20 |
Amorphous Arformoterol L-(+)-tartrate App 20110014246 - Dixit; Girish ;   et al. | 2011-01-20 |
Interfacial Capping Layers For Interconnects App 20100308463 - Yu; Jengyi ;   et al. | 2010-12-09 |
System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss Grant 7,848,839 - Zutshi , et al. December 7, 2 | 2010-12-07 |
Quetiapine Salts And Their Polymorphs App 20100278878 - Dixit; Girish ;   et al. | 2010-11-04 |
Novel Polymorph of Atorvastatin Calcium and Use Thereof for the Preparation of Amorphous Atorvastatin Calcium App 20100260851 - Dixit; Girish ;   et al. | 2010-10-14 |
Compositionally graded titanium nitride film for diffusion barrier applications Grant 7,727,882 - Wu , et al. June 1, 2 | 2010-06-01 |
Lercanidipine Hydrochloride Polymorphs and an Improved Process for Preparation of 1,1,N-Trimethyl-N-(3,3-Diphenylpropyl)-2-Aminoethyl Acetoacetate App 20100104649 - Dixit; Girish ;   et al. | 2010-04-29 |
Amorphous and Crystalline Forms of Aprepitant and Processes for the Preparation Thereof App 20090192161 - Sawant; Mangesh Shivram ;   et al. | 2009-07-30 |
System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss App 20080109104 - Zutshi; Ajoy ;   et al. | 2008-05-08 |
Self Aligning Non Contact Shadow Ring Process Kit App 20080072823 - Yudovsky; Joseph ;   et al. | 2008-03-27 |
Amorphous pregabalin and process for the preparation thereof App 20080014280 - Kumar; Bobba Venkata Siva ;   et al. | 2008-01-17 |
Controlled multi-step magnetron sputtering process App 20070095654 - Gopalraja; Praburam ;   et al. | 2007-05-03 |
Chemical mechanical polishing techniques for integrated circuit fabrication App 20070082479 - Padhi; Deenesh ;   et al. | 2007-04-12 |
Integrated circuit fabricating techniques employing sacrificial liners App 20070082477 - Naik; Mehul ;   et al. | 2007-04-12 |
System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss App 20060079007 - Zutshi; Ajoy ;   et al. | 2006-04-13 |
Multi-step magnetron sputtering process Grant 6,991,709 - Gopalraja , et al. January 31, 2 | 2006-01-31 |
Controlled multi-step magnetron sputtering process App 20050255700 - Gopalraja, Praburam ;   et al. | 2005-11-17 |
Method of application of electrical biasing to enhance metal deposition Grant 6,913,680 - Zheng , et al. July 5, 2 | 2005-07-05 |
Electroless deposition method Grant 6,905,622 - Padhi , et al. June 14, 2 | 2005-06-14 |
Electroless deposition method Grant 6,899,816 - Padhi , et al. May 31, 2 | 2005-05-31 |
Multi-step magnetron sputtering process App 20050056536 - Gopalraja, Praburam ;   et al. | 2005-03-17 |
Electroless plating system Grant 6,824,612 - Stevens , et al. November 30, 2 | 2004-11-30 |
Methods in electroanalytical techniques to analyze organic components in plating baths Grant 6,808,611 - Sun , et al. October 26, 2 | 2004-10-26 |
Method and apparatus for improved electroplating fill of an aperture Grant 6,797,620 - Lewis , et al. September 28, 2 | 2004-09-28 |
Operating a magnetron sputter reactor in two modes Grant 6,787,006 - Gopalraja , et al. September 7, 2 | 2004-09-07 |
Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives Grant 6,773,569 - Sun , et al. August 10, 2 | 2004-08-10 |
Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects App 20040118699 - Padhi, Deenesh ;   et al. | 2004-06-24 |
ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature Grant 6,746,591 - Zheng , et al. June 8, 2 | 2004-06-08 |
Ecp Gap Fill By Modulating The Voltage On The Seed Layer To Increase Cut Concentration Inside Feature App 20040045831 - Zheng, Bo ;   et al. | 2004-03-11 |
Self aligning non contact shadow ring process kit App 20040003780 - Yudovsky, Joseph ;   et al. | 2004-01-08 |
Methods in electroanalytical techniques to analyze organic components in plating baths App 20040000484 - Sun, Zhi-wen ;   et al. | 2004-01-01 |
Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives App 20030209440 - Sun, Zhi-Wen ;   et al. | 2003-11-13 |
Planarization by chemical polishing for ULSI applications App 20030209523 - Padhi, Deenesh ;   et al. | 2003-11-13 |
Method and apparatus for improved electroplating fill of an aperture App 20030194850 - Lewis, John S. ;   et al. | 2003-10-16 |
Electroless deposition method App 20030190426 - Padhi, Deenesh ;   et al. | 2003-10-09 |
Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects App 20030188974 - Padhi, Deenesh ;   et al. | 2003-10-09 |
Electroless deposition method App 20030189026 - Padhi, Deenesh ;   et al. | 2003-10-09 |
Electroless deposition method App 20030190812 - Padhi, Deenesh ;   et al. | 2003-10-09 |
Additives for electroplating solution App 20030159941 - Bajaj, Rajeev ;   et al. | 2003-08-28 |
Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature Grant 6,610,189 - Wang , et al. August 26, 2 | 2003-08-26 |
Electroplating solution composition control App 20030150734 - Bajaj, Rajeev ;   et al. | 2003-08-14 |
Method for forming copper interconnects App 20030146102 - Ramanathan, Sivakami ;   et al. | 2003-08-07 |
Method for determining a concentration of conductive species in an aqueous system App 20030127334 - Padhi, Deenesh ;   et al. | 2003-07-10 |
Self aligning non contact shadow ring process kit Grant 6,589,352 - Yudovsky , et al. July 8, 2 | 2003-07-08 |
Electroless plating system App 20030118732 - Stevens, Joseph J. ;   et al. | 2003-06-26 |
Operating a magnetron sputter reactor in two modes App 20020185370 - Gopalraja, Praburam ;   et al. | 2002-12-12 |
Integrated copper fill process Grant 6,485,618 - Gopalraja , et al. November 26, 2 | 2002-11-26 |
Vault shaped target and magnetron operable in two sputtering modes Grant 6,451,177 - Gopalraja , et al. September 17, 2 | 2002-09-17 |
Plating bath organic additive analyzer App 20020125142 - Sun, Zhi-Wen ;   et al. | 2002-09-12 |
Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths App 20020112964 - Gandikota, Srinivas ;   et al. | 2002-08-22 |
Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature App 20020084189 - Wang, Hougong ;   et al. | 2002-07-04 |
Passivation of inlaid metallization Grant 6,355,559 - Havemann , et al. March 12, 2 | 2002-03-12 |
Metallization structure, and associated method, to improve crystallographic texture and cavity fill for CVD aluminum/PVD aluminum alloy films Grant 6,355,558 - Dixit , et al. March 12, 2 | 2002-03-12 |
Integrated copper fill process App 20010050226 - Gopalraja, Praburam ;   et al. | 2001-12-13 |
Vault shaped target and magnetron having both distributed and localized magnets App 20010032783 - Gopalraja, Praburam ;   et al. | 2001-10-25 |
Integrated process for copper via filling using a magnetron and target producing highly energetic ions Grant 6,277,249 - Gopalraja , et al. August 21, 2 | 2001-08-21 |
Integrated process for copper via filling Grant 6,274,008 - Gopalraja , et al. August 14, 2 | 2001-08-14 |
Method for forming local interconnect for integrated circuits Grant 5,391,520 - Chen , et al. February 21, 1 | 1995-02-21 |
Local interconnect for integrated circuits Grant 5,319,245 - Chen , et al. June 7, 1 | 1994-06-07 |