Dishongh; Terrance J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dishongh; Terrance J..The latest application filed is for "methods and apparatus for efficiently tracking activity using radio frequency identification".

Company Profile

0.39.37

Dishongh; Terrance J. - Hillsboro OR
Dishongh; Terrance J. - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for passive phase change thermal management Grant 7,886,809 - Searls , et al. February 15, 2	2011-02-15
Method of fabricating flexible display Grant 7,791,585 - Jackson , et al. September 7, 2	2010-09-07
Methods and apparatus for efficiently tracking activity using radio frequency identification Grant 7,663,490 - Dishongh February 16, 2	2010-02-16
Methods and Apparatus for Efficiently Tracking Activity Using Radio Frequency Identification App 20090085721 - Dishongh; Terrance J.	2009-04-02
Fuel efficient navigation system Grant 7,512,486 - Needham , et al. March 31, 2	2009-03-31
Apparatus And Method For Passive Phase Change Thermal Management App 20080066890 - Searls; Damion T. ; et al.	2008-03-20
Method for passive phase change thermal management Grant 7,316,265 - Searls , et al. January 8, 2	2008-01-08
Via shielding for power/ground layers on printed circuit board Grant 7,271,349 - Jessep , et al. September 18, 2	2007-09-18
Method Of Fabricating Flexible Display App 20070092689 - Jackson; James D. ; et al.	2007-04-26
Method of creating solder bar connections on electronic packages Grant 7,185,799 - Pearson , et al. March 6, 2	2007-03-06
Methods for forming via shielding Grant 7,168,164 - Jessep , et al. January 30, 2	2007-01-30
Fuel efficient navigation system App 20070005237 - Needham; Bradford H. ; et al.	2007-01-04
Flexible display Grant 7,158,111 - Jackson , et al. January 2, 2	2007-01-02
Selective PCB stiffening with preferentially oriented fibers Grant 7,041,357 - Hsieh , et al. May 9, 2	2006-05-09
Electronic assembly and a method of constructing an electronic assembly Grant 6,996,899 - Searls , et al. February 14, 2	2006-02-14
Method of creating solder bar connections on electronic packages App 20050211750 - Pearson, Tom E. ; et al.	2005-09-29
Surface mount technology to via-in-pad interconnections Grant 6,927,346 - McCormick , et al. August 9, 2	2005-08-09
Constructing of an electronic assembly having a decoupling capacitor App 20050090041 - Dishongh, Terrance J. ; et al.	2005-04-28
Constructing of an electronic assembly having a decoupling capacitor Grant 6,884,939 - Dishongh , et al. April 26, 2	2005-04-26
Electronic assembly having an indium thermal couple Grant 6,882,043 - Dishongh , et al. April 19, 2	2005-04-19
Attaching components to a printed circuit card Grant 6,878,305 - Hsieh , et al. April 12, 2	2005-04-12
Attaching components to a printed circuit card Grant 6,875,367 - Hsieh , et al. April 5, 2	2005-04-05
Apparatus and method for passive phase change thermal management App 20050051300 - Searls, Damion T. ; et al.	2005-03-10
Method and apparatus using nanotubes for cooling and grounding die Grant 6,856,016 - Searls , et al. February 15, 2	2005-02-15
Constructing of an electronic assembly having a decoupling capacitor App 20040256133 - Dishongh, Terrance J. ; et al.	2004-12-23
Via shielding for power/ground layers on printed circuit board App 20040238216 - Jessep, Rebecca A. ; et al.	2004-12-02
Attaching components to a printed circuit card Grant 6,818,155 - Hsieh , et al. November 16, 2	2004-11-16
Circuit board with via through surface mount device contact Grant 6,803,527 - Dishongh , et al. October 12, 2	2004-10-12
Ganged land grid array socket contacts for improved power delivery Grant 6,793,503 - Dishongh , et al. September 21, 2	2004-09-21
Ganged land grid array socket contacts for improved power delivery Grant 6,793,505 - Dishongh , et al. September 21, 2	2004-09-21
Surface mount connector lead Grant 6,774,310 - Dishongh , et al. August 10, 2	2004-08-10
Selective PCB stiffening with preferentially oriented fibers App 20040131824 - Hsieh, George ; et al.	2004-07-08
Surface mount technology to via-in-pad interconnections App 20040118606 - McCormick, Carolyn R. ; et al.	2004-06-24
Iodine-containing thermal interface material Grant 6,752,204 - Dishongh , et al. June 22, 2	2004-06-22
Attaching components to a printed circuit card App 20040109974 - Hsieh, George ; et al.	2004-06-10
Attaching components to a printed circuit card App 20040087173 - Hsieh, George ; et al.	2004-05-06
Apparatus and method for interconnection between a component and a printed circuit board App 20040084210 - Dishongh, Terrance J. ; et al.	2004-05-06
Electronic assembly and a method of constructing an electronic assembly Grant 6,730,860 - Searls , et al. May 4, 2	2004-05-04
Electrically modifiable product labeling App 20040017295 - Dishongh, Terrance J. ; et al.	2004-01-29
Selective PCB stiffening with preferentially oriented fibers Grant 6,682,802 - Hsieh , et al. January 27, 2	2004-01-27
Method And Apparatus Using Nanotubes For Cooling And Grounding Die App 20040005736 - Searls, Damion T. ; et al.	2004-01-08
Apparatus and method for passive phase change thermal management Grant 6,672,370 - Searls , et al. January 6, 2	2004-01-06
Ganged land grid array socket contacts for improved power delivery App 20030207598 - Dishongh, Terrance J. ; et al.	2003-11-06
Apparatus and method for interconnection between a component and a printed circuit board Grant 6,630,631 - Dishongh , et al. October 7, 2	2003-10-07
Ganged land grid array socket contacts for improved power delivery App 20030186568 - Dishongh, Terrance J. ; et al.	2003-10-02
Circuit board with via through surface mount device contact App 20030183420 - Dishongh, Terrance J. ; et al.	2003-10-02
Apparatus And Method For Interconnection Between A Component And A Printed Circuit Board App 20030183421 - Dishongh, Terrance J. ; et al.	2003-10-02
Electronic assembly with separate power and signal connections Grant 6,627,822 - Jackson , et al. September 30, 2	2003-09-30
Heat sink for cooling an electronic component of a computer Grant 6,614,657 - Searls , et al. September 2, 2	2003-09-02
Electronic assembly and a method of constructing an electronic assembly App 20030136579 - Searls, Damion T. ; et al.	2003-07-24
Frame support for a printed board assembly Grant 6,594,151 - Dixon , et al. July 15, 2	2003-07-15
Attaching components to a printed circuit card App 20030121602 - Hsieh, George ; et al.	2003-07-03
Method And Apparatus For Thermally Controlling Multiple Electronic Components App 20030117772 - Searls, Damion T. ; et al.	2003-06-26
Method and apparatus for thermally controlling multiple electronic components Grant 6,580,608 - Searls , et al. June 17, 2	2003-06-17
Frame Support For A Printed Board Assembly App 20030103337 - Dixon, Scott ; et al.	2003-06-05
Via shielding for power/ground layers on printed circuit board App 20030091730 - Jessep, Rebecca A. ; et al.	2003-05-15
Vapor chamber active heat sink Grant 6,550,531 - Searls , et al. April 22, 2	2003-04-22
Iodine-containing thermal interface material App 20030051868 - Dishongh, Terrance J. ; et al.	2003-03-20
Electronic assembly and a method of constructing an electronic assembly App 20030047356 - Searls, Damion T. ; et al.	2003-03-13
Heat sink for cooling an electronic component of a computer App 20030035267 - Searls, Damion T. ; et al.	2003-02-20
Electronic assembly with separate power and signal connections App 20030001254 - Jackson, James Daniel ; et al.	2003-01-02
Circuit card assembly having controlled vibrational properties Grant 6,486,589 - Dujari , et al. November 26, 2	2002-11-26
Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple App 20020151110 - Dishongh, Terrance J. ; et al.	2002-10-17
Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple Grant 6,461,891 - Dishongh , et al. October 8, 2	2002-10-08
Method and apparatus for early detection of reliability degradation of electronic devices Grant 6,452,502 - Dishongh , et al. September 17, 2	2002-09-17
Heat dissipation device App 20020118511 - Dujari, Prateek J. ; et al.	2002-08-29
Method and apparatus for detection of electrical overstress Grant 6,441,675 - Dishongh , et al. August 27, 2	2002-08-27
Apparatus for shielding transmission line effects on a printed circuit board App 20020108778 - Dishongh, Terrance J. ; et al.	2002-08-15
Apparatus and method for passive phase change thermal management App 20020104641 - Searls, Damion T. ; et al.	2002-08-08
Selective PCB stiffening with preferentially oriented fibers App 20020076522 - Hsieh, George ; et al.	2002-06-20
Conduited heat dissipation device App 20020067596 - Searls, Damion T. ; et al.	2002-06-06
Method and apparatus for early detection of reliability degradation of electronic devices Grant 6,366,209 - Dishongh , et al. April 2, 2	2002-04-02
Method Of Constructing An Electronic Assembly Having An Indium Thermal Couple And An Electronic Assembly Having An Indium Thermal Couple App 20020020912 - DISHONGH, TERRANCE J. ; et al.	2002-02-21
Heat sink with integrated fluid circulation pump Grant 6,327,145 - Lian , et al. December 4, 2	2001-12-04
Method and apparatus for early detection of reliability degradation of electronic devices App 20010043143 - Dishongh, Terrance J. ; et al.	2001-11-22
Method and apparatus for early detection of reliability degradation of electronic devices Grant 6,094,144 - Dishongh , et al. July 25, 2	2000-07-25