Ding; Peijun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ding; Peijun.The latest application filed is for "semiconductor manufacturing process".

Company Profile

11.101.92

Ding; Peijun - Beijing CN
DING; Peijun - Saratoga CA
Ding; Peijun - San Jose CA
Ding; Peijun - Albany NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Degassing chamber and semiconductor processing apparatus Grant 11,328,940 - Jia , et al. May 10, 2	2022-05-10
Semiconductor manufacturing process Grant 11,107,699 - Ding , et al. August 31, 2	2021-08-31
Plasma processing apparatus Grant 10,984,993 - Chen , et al. April 20, 2	2021-04-20
Annealing method, process chamber and annealing apparatus Grant 10,886,142 - Bai , et al. January 5, 2	2021-01-05
Semiconductor Manufacturing Process App 20200118836 - DING; Peijun ; et al.	2020-04-16
Precleaning chamber and plasma processing apparatus Grant 10,622,224 - She , et al.	2020-04-14
Magnetic thin film deposition chamber and thin film deposition apparatus Grant 10,622,145 - Yang , et al.	2020-04-14
Annealing Method, Process Chamber And Annealing Apparatus App 20190259628 - BAI; Zhimin ; et al.	2019-08-22
Magnetron and magnetron sputtering device Grant 10,381,202 - Yang , et al. A	2019-08-13
Magnetic Thin Film Deposition Chamber And Thin Film Deposition Apparatus App 20190244754 - YANG; Yujie ; et al.	2019-08-08
Magnetic Thin Film Laminated Structure Deposition Method, Magnetic Thin Film Laminated Structure And Micro-inductance Device App 20190244736 - YANG; Yujie ; et al.	2019-08-08
Degassing Method, Degassing Chamber, And Semiconductor Processing Apparatus App 20190218660 - YE; Hua ; et al.	2019-07-18
Degassing Chamber And Semiconductor Processing Apparatus App 20190221454 - JIA; Qiang ; et al.	2019-07-18
Process chamber and semiconductor processing apparatus Grant 10,347,470 - Lv , et al. July 9, 2	2019-07-09
Hot plate and substrate processing equipment using the same Grant 10,287,686 - Zhao , et al.	2019-05-14
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20180327893 - DING; Peijun ; et al.	2018-11-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 10,047,430 - Ding , et al. August 14, 2	2018-08-14
Method for depositing a diffusion barrier layer and a metal conductive layer Grant 9,991,157 - Chiang , et al. June 5, 2	2018-06-05
Precleaning Chamber And Plasma Processing Apparatus App 20170330769 - SHE; Qing ; et al.	2017-11-16
Low-cost High-efficiency Solar Module Using Epitaxial Si Thin-film Absorber And Double-sided Heterojunction Solar Cell With Integrated Module Fabrication App 20170148943 - Heng; Jiunn Benjamin ; et al.	2017-05-25
Magnetron And Magnetron Sputtering Device App 20170011894 - YANG; Yujie ; et al.	2017-01-12
Low-cost high-efficiency solar module using epitaxial Si thin-film absorber and double-sided heterojunction solar cell with integrated module fabrication Grant 9,537,032 - Heng , et al. January 3, 2	2017-01-03
Cassette Positioning Device And Semiconductor Processing Apparatus App 20160329228 - LI; Meng ; et al.	2016-11-10
Process Chamber And Semiconductor Processing Apparatus App 20160322206 - LV; Feng ; et al.	2016-11-03
Method For Depositing A Diffusion Barrier Layer And A Metal Conductive Layer App 20160322255 - CHIANG; Tony ; et al.	2016-11-03
Method for depositing a diffusion barrier layer and a metal conductive layer Grant 9,390,970 - Chiang , et al. July 12, 2	2016-07-12
Pre-cleaning Chamber And A Semiconductor Processing Apparatus Containing The Same App 20160148789 - CHEN; PENG ; et al.	2016-05-26
Stackable Multi-port Gas Nozzles App 20150176127 - Poppe; Steve ; et al.	2015-06-25
Stackable multi-port gas nozzles Grant 8,968,473 - Poppe , et al. March 3, 2	2015-03-03
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20140305802 - DING; Peijun ; et al.	2014-10-16
Scalable, high-throughput, multi-chamber epitaxial reactor for silicon deposition Grant 8,845,809 - Poppe , et al. September 30, 2	2014-09-30
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,696,875 - Ding , et al. April 15, 2	2014-04-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,668,816 - Ding , et al. March 11, 2	2014-03-11
Scalable, high-throughput, multi-chamber epitaxial reactor for silicon deposition Grant 8,652,259 - Poppe , et al. February 18, 2	2014-02-18
Solar cells fabricated by using CVD epitaxial Si films on metallurgical-grade Si wafers Grant 8,637,761 - Fu , et al. January 28, 2	2014-01-28
Protective Offset Sputtering App 20130327641 - YE; Mengqi ; et al.	2013-12-12
Vapour Chamber And Substrate Processing Equipment Using Same App 20130269614 - Zhao; Mengxin ; et al.	2013-10-17
Plasma Processing Apparatus App 20130256129 - Chen; Peng ; et al.	2013-10-03
Sputtering of thermally resistive materials including metal chalcogenides Grant 8,500,963 - Ye , et al. August 6, 2	2013-08-06
Protective offset sputtering Grant 8,460,519 - Ye , et al. June 11, 2	2013-06-11
Protective offset sputtering Grant 8,454,804 - Ye , et al. June 4, 2	2013-06-04
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features Grant 8,158,511 - Chiang , et al. April 17, 2	2012-04-17
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features App 20110256716 - Chiang; Tony ; et al.	2011-10-20
Methods And Apparatus For Magnetron Metallization For Semiconductor Fabrication App 20110220494 - DING; PEIJUN	2011-09-15
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features Grant 7,989,343 - Chiang , et al. August 2, 2	2011-08-02
Stackable Multi-port Gas Nozzles App 20110067632 - Poppe; Steve ; et al.	2011-03-24
Thin film deposition Grant 7,884,032 - Ye , et al. February 8, 2	2011-02-08
Low-cost High-efficiency Solar Module Using Epitaxial Si Thin-film Absorber And Double-sided Heterojunction Solar Cell With Integrated Module Fabrication App 20100300506 - Heng; Jiunn Benjamin ; et al.	2010-12-02
High Efficiency Low Cost Crystalline-si Thin Film Solar Module App 20100300507 - Heng; Jiunn Benjamin ; et al.	2010-12-02
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features App 20100255678 - Chiang; Tony ; et al.	2010-10-07
Small scanned magentron Grant 7,807,030 - Hong , et al. October 5, 2	2010-10-05
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate Grant 7,795,138 - Chiang , et al. September 14, 2	2010-09-14
Multi-component doping of copper seed layer Grant 7,749,361 - Chen , et al. July 6, 2	2010-07-06
Scalable, High-throughput, Multi-chamber Epitaxial Reactor For Silicon Deposition App 20100092697 - Poppe; Steve ; et al.	2010-04-15
Scalable, High-throughput, Multi-chamber Epitaxial Reactor For Silicon Deposition App 20100092698 - Poppe; Steve ; et al.	2010-04-15
Metal / metal nitride barrier layer for semiconductor device applications Grant 7,687,909 - Ding , et al. March 30, 2	2010-03-30
Solar Cells Fabricated By Using Cvd Epitaxial Si Films On Metallurgical-grade Si Wafers App 20100065111 - Fu; Jianming ; et al.	2010-03-18
Mechanism for varying the spacing between sputter magnetron and target Grant 7,674,360 - Hong , et al. March 9, 2	2010-03-09
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate App 20090269922 - Chiang; Tony ; et al.	2009-10-29
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20090233438 - DING; Peijun ; et al.	2009-09-17
Method of depositing a sculptured copper seed layer Grant 7,589,016 - Chiang , et al. September 15, 2	2009-09-15
Shields usable with an inductively coupled plasma reactor Grant 7,569,125 - Gung , et al. August 4, 2	2009-08-04
Chalcogenide Target And Method App 20090107834 - Ye; Mengqi ; et al.	2009-04-30
Method of depositing a diffusion barrier layer which provides an improved interconnect App 20090053888 - Ding; Peijun ; et al.	2009-02-26
Method of depositing a sculptured copper seed layer App 20080166869 - Chiang; Tony ; et al.	2008-07-10
Method of depositing a metal seed layer on semiconductor substrates Grant 7,381,639 - Chiang , et al. June 3, 2	2008-06-03
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20080110747 - DING; Peijun ; et al.	2008-05-15
Sputtering Of Thermally Resistive Materials Including Metal Chalcogenides App 20080099326 - YE; MENGQI ; et al.	2008-05-01
Multi-component doping of copper seed layer App 20070278089 - Chen; Jie ; et al.	2007-12-06
Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement Grant 7,294,574 - Ding , et al. November 13, 2	2007-11-13
Metal / metal nitride barrier layer for semiconductor device applications App 20070241458 - Ding; Peijun ; et al.	2007-10-18
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system Grant 7,253,109 - Ding , et al. August 7, 2	2007-08-07
Damage-free sculptured coating deposition App 20070178682 - Chiang; Tony ; et al.	2007-08-02
Small Scanned Magentron App 20070102284 - HONG; Ilyoung Richard ; et al.	2007-05-10
Protective offset sputtering App 20070095651 - Ye; Mengqi ; et al.	2007-05-03
Protective offset sputtering App 20070095650 - Ye; Mengqi ; et al.	2007-05-03
Thin film deposition App 20070099438 - Ye; Mengqi ; et al.	2007-05-03
Magnetron executing planetary motion adjacent a sputtering target Grant 7,169,271 - Hong , et al. January 30, 2	2007-01-30
Method of depositing a metal seed layer on semiconductor substrates App 20070020922 - Chiang; Tony ; et al.	2007-01-25
Method of depositing a metal seed layer on semiconductor substrates Grant 7,074,714 - Chiang , et al. July 11, 2	2006-07-11
Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith Grant 7,041,201 - Gung , et al. May 9, 2	2006-05-09
Sequential sputter and reactive precleans of vias and contacts Grant 7,014,887 - Cohen , et al. March 21, 2	2006-03-21
Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement App 20060030151 - Ding; Peijun ; et al.	2006-02-09
Method of depositing low resistivity barrier layers for copper interconnects App 20050272254 - Ding, Peijun ; et al.	2005-12-08
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050255691 - Ding, Peijun ; et al.	2005-11-17
Rotational and reciprocal radial movement of a sputtering magnetron Grant 6,960,284 - Fu , et al. November 1, 2	2005-11-01
Method of depositing a tantalum nitride / tantalum diffusion barrier layer system App 20050208767 - Ding, Peijun ; et al.	2005-09-22
Shields usable with an inductively coupled plasma reactor App 20050199491 - Gung, Tza-Jing ; et al.	2005-09-15
Method of preventing diffusion of copper through a tantalum-comprising barrier layer Grant 6,919,275 - Chiang , et al. July 19, 2	2005-07-19
Method of depositing a TaN seed layer Grant 6,911,124 - Tang , et al. June 28, 2	2005-06-28
Mechanism for varying the spacing between sputter magnetron and target App 20050133365 - Hong, Ilyoung Richard ; et al.	2005-06-23
Compensation of spacing between magnetron and sputter target App 20050133361 - Ding, Peijun ; et al.	2005-06-23
Multi-step process for depositing copper seed layer in a via Grant 6,893,541 - Chiang , et al. May 17, 2	2005-05-17
Tailored barrier layer which provides improved copper interconnect electromigration resistance Grant 6,887,353 - Ding , et al. May 3, 2	2005-05-03
Method of depositing a metal seed layer on semiconductor substrates App 20050085068 - Chiang, Tony ; et al.	2005-04-21
Integrated deposition process for copper metallization Grant 6,881,673 - Ding , et al. April 19, 2	2005-04-19
Auxiliary magnet array in conjunction with magnetron sputtering Grant 6,875,321 - Ding , et al. April 5, 2	2005-04-05
Barrier layer for electroplating processes App 20050031784 - Ding, Peijun ; et al.	2005-02-10
Two step method for filling holes with copper App 20050032369 - Ding, Peijun ; et al.	2005-02-10
Small epicyclic magnetron with controlled radial sputtering profile Grant 6,852,202 - Miller , et al. February 8, 2	2005-02-08
Method of depositing a diffusion barrier layer and a metal conductive layer App 20050020080 - Chiang, Tony ; et al.	2005-01-27
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050006222 - Ding, Peijun ; et al.	2005-01-13
Small planetary magnetron Grant 6,841,050 - Hong , et al. January 11, 2	2005-01-11
Magnetron executing planetary motion adjacent a sputtering target App 20040222087 - Hong, Ilyoung Richard ; et al.	2004-11-11
Sputtering method for filling holes with copper Grant 6,793,779 - Ding , et al. September 21, 2	2004-09-21
Barrier layer for electroplating processes Grant 6,790,776 - Ding , et al. September 14, 2	2004-09-14
Method of preventing diffusion of copper through a tantalum-comprising barrier layer App 20040171250 - Chiang, Tony ; et al.	2004-09-02
Rotational and reciprocal radial movement of a sputtering magnetron App 20040140205 - Fu, Jianming ; et al.	2004-07-22
Damage-free sculptured coating deposition Grant 6,758,947 - Chiang , et al. July 6, 2	2004-07-06
Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith App 20040055880 - Gung, Tza-Jing ; et al.	2004-03-25
Auxiliary magnet array in conjunction with magnetron sputtering App 20040035692 - Ding, Peijun ; et al.	2004-02-26
One or more shields for use in a sputter reactor App 20040031680 - Miller, Michael Andrew ; et al.	2004-02-19
Sustained self-sputtering reactor having an increased density plasma Grant 6,692,617 - Fu , et al. February 17, 2	2004-02-17
Small epicyclic magnetron with controlled radial sputtering profile App 20030217914 - Miller, Michael Andrew ; et al.	2003-11-27
Small planetary magnetron App 20030217913 - Hong, Ilyoung Richard ; et al.	2003-11-27
Method and apparatus for sputter deposition App 20030216035 - Rengarajan, Suraj ; et al.	2003-11-20
Integrated deposition process for copper metallization App 20030194863 - Ding, Peijun ; et al.	2003-10-16
Method and apparatus for depositing a tantalum-containing layer on a substrate Grant 6,627,050 - Miller , et al. September 30, 2	2003-09-30
Magnet array in conjunction with rotating magnetron for plasma sputtering Grant 6,610,184 - Ding , et al. August 26, 2	2003-08-26
Sputtering method for filling holes with copper App 20030157799 - Ding, Peijun ; et al.	2003-08-21
Temperature control of a substrate Grant 6,607,640 - Sundarrajan , et al. August 19, 2	2003-08-19
Method of sputtering copper to fill trenches and vias Grant 6,605,197 - Ding , et al. August 12, 2	2003-08-12
Multi-step process for depositing copper seed layer in a via App 20030124846 - Chiang, Tony P. ; et al.	2003-07-03
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20030116427 - Ding, Peijun ; et al.	2003-06-26
Process for sputtering copper in a self ionized plasma Grant 6,582,569 - Chiang , et al. June 24, 2	2003-06-24
Monitoring process for oxide removal Grant 6,579,730 - Li , et al. June 17, 2	2003-06-17
Integrated deposition process for copper metallization Grant 6,566,259 - Ding , et al. May 20, 2	2003-05-20
Method of depositing a TaN seed layer App 20030089597 - Tang, Xianmin ; et al.	2003-05-15
Magnet array in conjunction with rotating magnetron for plasma sputtering App 20030089601 - Ding, Peijun ; et al.	2003-05-15
Monitoring process for oxide removal App 20030017628 - Li, Haojiang ; et al.	2003-01-23
Overlap design of one-turn coil Grant 6,506,287 - Ding January 14, 2	2003-01-14
Method for achieving copper fill of high aspect ratio interconnect features App 20030000844 - Carl, Daniel A. ; et al.	2003-01-02
Methods Of Producing Ultra -low Resistivity Tantalum Films. App 20020162738 - Chiang, Tony ; et al.	2002-11-07
Burn-in process for high density plasma PVD chamber App 20020144889 - Tao, Rong ; et al.	2002-10-10
Method of obtaining low temperature alpha-ta thin films using wafer bias App 20020142589 - Sundarrajan, Arvind ; et al.	2002-10-03
Integrated barrier layer structure for copper contact level metallization App 20020132473 - Chiang, Tony ; et al.	2002-09-19
Method for achieving copper fill of high aspect ratio interconnect features Grant 6,436,267 - Carl , et al. August 20, 2	2002-08-20
Barrier layer for electroplating processes App 20020092772 - Ding, Peijun ; et al.	2002-07-18
Alternate steps of IMP and sputtering process to improve sidewall coverage App 20020084181 - Gopalraja, Praburam ; et al.	2002-07-04
Method for igniting a plasma in a sputter reactor Grant 6,413,383 - Chiang , et al. July 2, 2	2002-07-02
Stress tunable tantalum and tantalum nitride films App 20020070375 - Chiang, Tony ; et al.	2002-06-13
Processes to improve electroplating fill Grant 6,399,479 - Chen , et al. June 4, 2	2002-06-04
Plasma reactor and shields generating self-ionized plasma for sputtering Grant 6,398,929 - Chiang , et al. June 4, 2	2002-06-04
Copper alloy seed layer for copper metallization Grant 6,387,805 - Ding , et al. May 14, 2	2002-05-14
Enhanced cooling IMP coil support App 20020046990 - Hong, Richard ; et al.	2002-04-25
Damage-free sculptured coating deposition App 20020029958 - Chiang, Tony ; et al.	2002-03-14
Method and apparatus for depositing a tantalum-containing layer on a substrate App 20020029093 - Miller, Michael Andrew ; et al.	2002-03-07
Structure for improving low temperature copper reflow in semiconductor features Grant 6,352,926 - Ding , et al. March 5, 2	2002-03-05
Alternate steps of IMP and sputtering process to improve sidewall coverage Grant 6,350,353 - Gopalraja , et al. February 26, 2	2002-02-26
Method And Apparatus For Physical Vapor Deposition Using Modulated Power App 20010050220 - CHIANG, TONY ; et al.	2001-12-13
Barrier layer for electroplating processes Grant 6,328,871 - Ding , et al. December 11, 2	2001-12-11
Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications Grant 6,313,033 - Chiang , et al. November 6, 2	2001-11-06
Copper Alloy Seed Layer For Copper Metallization App 20010034126 - DING, PEIJUN ; et al.	2001-10-25
Method for improved chamber bake-out and cool-down App 20010029888 - Sundarrajan, Arvind ; et al.	2001-10-18
Reflow chamber and process Grant 6,299,689 - Wang , et al. October 9, 2	2001-10-09
Temperature Control of a substrate App 20010025783 - Sundarrajan, Arvind ; et al.	2001-10-04
Ultra-low resistivity tantalum films and methods for their deposition App 20010018137 - Chiang, Tony ; et al.	2001-08-30
Barrier applications for aluminum planarization App 20010005629 - Singhvi, Shri ; et al.	2001-06-28
Alternate Steps Of Imp And Sputtering Process To Improve Sidewall Coverage App 20010003607 - GOPALRAJA, PRABURAM ; et al.	2001-06-14
Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performance Grant 6,235,163 - Angelo , et al. May 22, 2	2001-05-22
Sputtering chamber coil Grant D440,582 - Gopalraja , et al. April 17, 2	2001-04-17
Barrier applications for aluminum planarization Grant 6,207,558 - Singhvi , et al. March 27, 2	2001-03-27
IMP technology with heavy gas sputtering Grant 6,200,433 - Ding , et al. March 13, 2	2001-03-13
Method for improved chamber bake-out and cool-down Grant 6,193,811 - Sundarrajan , et al. February 27, 2	2001-02-27
Structure and method for improving low temperature copper reflow in semiconductor features Grant 6,184,137 - Ding , et al. February 6, 2	2001-02-06
Integrated deposition process for copper metallization Grant 6,174,811 - Ding , et al. January 16, 2	2001-01-16
Copper alloy via structure Grant 6,160,315 - Chiang , et al. December 12, 2	2000-12-12
Sputtering methods for depositing stress tunable tantalum and tantalum nitride films Grant 6,139,699 - Chiang , et al. October 31, 2	2000-10-31
Method for forming titanium silicide in situ Grant 6,110,821 - Kohara , et al. August 29, 2	2000-08-29
Copper alloy seed layer for copper metallization in an integrated circuit Grant 6,066,892 - Ding , et al. May 23, 2	2000-05-23
Tantalum-containing barrier layers for copper Grant 6,057,237 - Ding , et al. May 2, 2	2000-05-02
Sputter deposition and annealing of copper alloy metallization Grant 6,037,257 - Chiang , et al. March 14, 2	2000-03-14
Silicon-doped titanium wetting layer for aluminum plug Grant 5,911,113 - Yao , et al. June 8, 1	1999-06-08
Ceramic coated metallic insulator particularly useful in a plasma sputter reactor Grant 5,879,523 - Wang , et al. March 9, 1	1999-03-09
Passivated copper conductive layers for microelectronic applications and methods of manufacturing same Grant 5,766,379 - Lanford , et al. June 16, 1	1998-06-16
Electrically floating shield in a plasma reactor Grant 5,736,021 - Ding , et al. April 7, 1	1998-04-07
Process of making oxidation resistant high conductivity copper layers Grant 5,622,608 - Lanford , et al. April 22, 1	1997-04-22

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