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Optically aligned hybrid semiconductor device and method
Grant 10,678,005 - Kinghorn , et al. | 2020-06-09 |
Optically Aligned Hybrid Semiconductor Device And Method
App 20190179091 - Kinghorn; David Henry ; et al. | 2019-06-13 |
Optically aligned hybrid semiconductor device and method
Grant 10,222,565 - Kinghorn , et al. | 2019-03-05 |
Optically Aligned Hybrid Semiconductor Device And Method
App 20180052290 - Kinghorn; David Henry ; et al. | 2018-02-22 |
Optically aligned hybrid semiconductor device and method
Grant 9,817,197 - Kinghorn , et al. November 14, 2 | 2017-11-14 |
Optically Aligned Hybrid Semiconductor Device and Method
App 20160291265 - Kinghorn; David Henry ; et al. | 2016-10-06 |
Reduced stress TSV and interposer structures
Grant 9,349,669 - Uzoh , et al. May 24, 2 | 2016-05-24 |
Lid design to seal optical components of a transceiver module
Grant 9,151,950 - Desai , et al. October 6, 2 | 2015-10-06 |
Reduced Stress Tsv And Interposer Structures
App 20150187673 - Uzoh; Cyprian Emeka ; et al. | 2015-07-02 |
Reduced stress TSV and interposer structures
Grant 9,000,600 - Uzoh , et al. April 7, 2 | 2015-04-07 |
Reduced Stress Tsv And Interposer Structures
App 20140217607 - Uzoh; Cyprian Emeka ; et al. | 2014-08-07 |
Reduced stress TSV and interposer structures
Grant 8,772,946 - Uzoh , et al. July 8, 2 | 2014-07-08 |
Lid Design to Seal Optical Components of a Transceiver Module
App 20140043685 - Desai; Kishor V. ; et al. | 2014-02-13 |
Reduced Stress Tsv And Interposer Structures
App 20130328186 - Uzoh; Cyprian Emeka ; et al. | 2013-12-12 |
Solder interconnect by addition of copper
Grant 8,580,621 - Bachman , et al. November 12, 2 | 2013-11-12 |
Solder Interconnect By Addition Of Copper
App 20130149857 - Bachman; Mark A. ; et al. | 2013-06-13 |
Solder interconnect by addition of copper
Grant 8,378,485 - Bachman , et al. February 19, 2 | 2013-02-19 |
Solder Interconnect By Addition Of Copper
App 20110006415 - Bachman; Mark A. ; et al. | 2011-01-13 |
Manufacture of devices including solder bumps
Grant 7,727,781 - Antol , et al. June 1, 2 | 2010-06-01 |
Manufacture of devices including solder bumps
App 20100022034 - Antol; Joze Eura ; et al. | 2010-01-28 |
Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package
Grant 7,119,432 - Desai , et al. October 10, 2 | 2006-10-10 |
Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package
App 20050224955 - Desai, Kishor V. ; et al. | 2005-10-13 |
Method of packaging a high performance chip
Grant 6,655,020 - Carden , et al. December 2, 2 | 2003-12-02 |
Interposer for semiconductor package assembly
Grant 6,618,938 - Alagaratnam , et al. September 16, 2 | 2003-09-16 |
High performance chip packaging and method
Grant 6,552,266 - Carden , et al. April 22, 2 | 2003-04-22 |
Method for attaching solderballs by selectively oxidizing traces
Grant 6,431,432 - McCormick , et al. August 13, 2 | 2002-08-13 |
High Performance Chip Packaging And Method
App 20020053449 - CARDEN, TIMOTHY F. ; et al. | 2002-05-09 |
Interposer for semiconductor package assembly
Grant 6,335,491 - Alagaratnam , et al. January 1, 2 | 2002-01-01 |
Apparatus and method for improving ball joints in semiconductor packages
Grant 6,306,751 - Patel , et al. October 23, 2 | 2001-10-23 |
Substrate structure for improving attachment reliability of semiconductor chips and modules
Grant 6,281,581 - Desai , et al. August 28, 2 | 2001-08-28 |
Use of blind vias for soldered interconnections between substrates and printed wiring boards
App 20010010628 - Armezzani, Gregg J. ; et al. | 2001-08-02 |
High performance chip packaging and method
App 20010009197 - Carden, Timothy F. ; et al. | 2001-07-26 |
High performance chip packaging and method
App 20010009196 - Carden, Timothy F. ; et al. | 2001-07-26 |
Compliant, surface-mountable interposer
Grant 6,224,396 - Chan , et al. May 1, 2 | 2001-05-01 |
Die clip assembly for semiconductor package
Grant 6,166,434 - Desai , et al. December 26, 2 | 2000-12-26 |
Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
Grant 6,002,171 - Desai , et al. December 14, 1 | 1999-12-14 |
Substrate structure and method for improving attachment reliability of semiconductor chips and modules
Grant 6,002,172 - Desai , et al. December 14, 1 | 1999-12-14 |
Apparatus and method for burn-in and testing of devices with solder bumps or preforms
Grant 5,880,590 - Desai , et al. March 9, 1 | 1999-03-09 |
Apparatus, and corresponding method, for stress testing semiconductor chips
Grant 5,604,445 - Desai , et al. February 18, 1 | 1997-02-18 |
Method of making a printed circuit board or card
Grant 5,479,703 - Desai , et al. January 2, 1 | 1996-01-02 |
Method for filling plated through holes
Grant 5,435,480 - Hart , et al. July 25, 1 | 1995-07-25 |
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
Grant 5,201,451 - Desai , et al. April 13, 1 | 1993-04-13 |
Electrical assembly with flexible circuit
Grant 5,199,879 - Kohn , et al. April 6, 1 | 1993-04-06 |
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
Grant 5,170,931 - Desai , et al. December 15, 1 | 1992-12-15 |
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
Grant 5,159,535 - Desai , et al. October 27, 1 | 1992-10-27 |
High density, separable connector and contact for use therein
Grant 5,137,456 - Desai , et al. August 11, 1 | 1992-08-11 |
Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
Grant 4,788,767 - Desai , et al. December 6, 1 | 1988-12-06 |
Method for measuring the real contact area in connectors
Grant 4,558,590 - Desai , et al. December 17, 1 | 1985-12-17 |
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