DeLaCruz; Javier A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for DeLaCruz; Javier A..The latest application filed is for "protective elements for bonded structures".
Company Profile
65.63.100
- DeLaCruz; Javier A. - San Jose CA
- Delacruz; Javier A - San Jose CA
- DeLaCruz; Javier A. - Santa Clara CA
- DeLaCruz; Javier A. - Santa Cruz CA
Patent Activity
| Patent | Date |
|---|---|
| Protective Elements For Bonded Structures App 20220302048 - DeLaCruz; Javier A. ; et al. | 2022-09-22 |
| Dielets On Flexible And Stretchable Packaging For Microelectronics App 20220278048 - Huang; Shaowu ; et al. | 2022-09-01 |
| Bond Enhancement Structure In Microelectronics For Trapping Contaminants During Direct-bonding Processes App 20220246564 - Gao; Guilian ; et al. | 2022-08-04 |
| Direct-Bonded Native Interconnects And Active Base Die App 20220238339 - DeLaCruz; Javier A. ; et al. | 2022-07-28 |
| Security circuitry for bonded structures Grant 11,385,278 - DeLaCruz , et al. July 12, 2 | 2022-07-12 |
| Mixed Exposure For Large Die App 20220216180 - Delacruz; Javier A. ; et al. | 2022-07-07 |
| Protective elements for bonded structures Grant 11,373,963 - DeLaCruz , et al. June 28, 2 | 2022-06-28 |
| Bonded Structures Without Intervening Adhesive App 20220199560 - Haba; Belgacem ; et al. | 2022-06-23 |
| Stacked transmission line Grant 11,369,020 - Huang , et al. June 21, 2 | 2022-06-21 |
| Dielets on flexible and stretchable packaging for microelectronics Grant 11,355,443 - Huang , et al. June 7, 2 | 2022-06-07 |
| Systems and methods for releveled bump planes for chiplets Grant 11,348,898 - Delacruz , et al. May 31, 2 | 2022-05-31 |
| Wire bonding method and apparatus for electromagnetic interference shielding Grant 11,335,647 - Huang , et al. May 17, 2 | 2022-05-17 |
| Symbiotic Network On Layers App 20220150184 - DeLaCruz; Javier A. ; et al. | 2022-05-12 |
| Network On Layer Enabled Architectures App 20220139883 - DeLaCruz; Javier A. ; et al. | 2022-05-05 |
| Wafer-level Bonding Of Obstructive Elements App 20220139849 - DeLaCruz; Javier A. ; et al. | 2022-05-05 |
| Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes Grant 11,296,044 - Gao , et al. April 5, 2 | 2022-04-05 |
| Direct-bonded native interconnects and active base die Grant 11,289,333 - Delacruz , et al. March 29, 2 | 2022-03-29 |
| Symbiotic network on layers Grant 11,270,979 - Delacruz , et al. March 8, 2 | 2022-03-08 |
| Mixed exposure for large die Grant 11,264,357 - Delacruz , et al. March 1, 2 | 2022-03-01 |
| Network on layer enabled architectures Grant 11,264,361 - Delacruz , et al. March 1, 2 | 2022-03-01 |
| Integrated Optical Waveguides, Direct-bonded Waveguide Interface Joints, Optical Routing And Interconnects App 20220043209 - HUANG; Shaowu ; et al. | 2022-02-10 |
| Back Biasing of FD-SOI Circuit Block App 20220020741 - Delacruz; Javier A. ; et al. | 2022-01-20 |
| Techniques For Manufacturing Split-cell 3d-nand Memory Devices App 20220005827 - Chang; Xu ; et al. | 2022-01-06 |
| Wafer-level bonding of obstructive elements Grant 11,205,625 - DeLaCruz , et al. December 21, 2 | 2021-12-21 |
| Active Bridging Apparatus App 20210351159 - Delacruz; Javier A. ; et al. | 2021-11-11 |
| Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects Grant 11,169,326 - Huang , et al. November 9, 2 | 2021-11-09 |
| Systems and methods for inter-die block level design Grant 11,157,670 - Delacruz , et al. October 26, 2 | 2021-10-26 |
| Embedded Organic Interposer For High Bandwidth App 20210327851 - Delacruz; Javier A. ; et al. | 2021-10-21 |
| Abstracted NAND logic in stacks Grant 11,139,283 - Delacruz , et al. October 5, 2 | 2021-10-05 |
| Back biasing of FD-SOI circuit blocks Grant 11,127,738 - Delacruz , et al. September 21, 2 | 2021-09-21 |
| Systems and Methods for Releveled Bump Planes for Chiplets App 20210249383 - Delacruz; Javier A. ; et al. | 2021-08-12 |
| Selective Alteration Of Interconnect Pads For Direct Bonding App 20210242152 - FOUNTAIN, JR.; Gaius Gillman ; et al. | 2021-08-05 |
| Systems And Methods For Flash Stacking App 20210225811 - Haba; Belgacem ; et al. | 2021-07-22 |
| Transistor Level Interconnection Methodologies Utilizing 3D Interconnects App 20210217858 - Delacruz; Javier A. ; et al. | 2021-07-15 |
| Embedded organic interposer for high bandwidth Grant 11,063,017 - Delacruz , et al. July 13, 2 | 2021-07-13 |
| 3d Chip Sharing Data Bus App 20210202445 - DeLaCruz; Javier A. ; et al. | 2021-07-01 |
| Bonded Structures App 20210202428 - Wang; Liang ; et al. | 2021-07-01 |
| Stacked Ic Structure With Orthogonal Interconnect Layers App 20210202387 - Mohammed; Ilyas ; et al. | 2021-07-01 |
| Apparatus For Non-Volatile Random Access Memory Stacks App 20210193624 - Delacruz; Javier A. ; et al. | 2021-06-24 |
| Circuitry For Electrical Redundancy In Bonded Structures App 20210193603 - DeLACruz; Javier A. ; et al. | 2021-06-24 |
| Systems and Methods for Releveled Bump Planes for Chiplets App 20210175206 - Delacruz; Javier A. ; et al. | 2021-06-10 |
| Hard IP Blocks With Physically Bidirectional Passageways App 20210166995 - Delacruz; Javier A. | 2021-06-03 |
| Formation of a light-emitting diode display Grant 11,024,220 - Wang , et al. June 1, 2 | 2021-06-01 |
| 3d Memory Circuit App 20210149586 - DeLaCruz; Javier A. ; et al. | 2021-05-20 |
| Scalable Architecture for Reduced Cycles Across SoC App 20210143125 - Delacruz; Javier A. ; et al. | 2021-05-13 |
| Cavity Packages App 20210134689 - Huang; Shaowu ; et al. | 2021-05-06 |
| Interface structures and methods for forming same Grant 10,998,265 - Huang , et al. May 4, 2 | 2021-05-04 |
| Transistor level interconnection methodologies utilizing 3D interconnects Grant 10,991,804 - Delacruz , et al. April 27, 2 | 2021-04-27 |
| Systems and methods for flash stacking Grant 10,991,676 - Haba , et al. April 27, 2 | 2021-04-27 |
| Non-Volatile Dynamic Random Access Memory App 20210118864 - Delacruz; Javier A. ; et al. | 2021-04-22 |
| Direct Gang Bonding Methods And Structures App 20210098412 - Haba; Belgacem ; et al. | 2021-04-01 |
| Hard IP blocks with physically bidirectional passageways Grant 10,923,413 - Delacruz February 16, 2 | 2021-02-16 |
| Cavity packages Grant 10,923,408 - Huang , et al. February 16, 2 | 2021-02-16 |
| Systems and methods for releveled bump planes for chiplets Grant 10,910,344 - Delacruz , et al. February 2, 2 | 2021-02-02 |
| Bonded structures Grant 10,879,207 - Wang , et al. December 29, 2 | 2020-12-29 |
| Bonded structures Grant 10,879,210 - Enquist , et al. December 29, 2 | 2020-12-29 |
| Connecting Multiple Chips Using An Interconnect Device App 20200402913 - Delacruz; Javier A. ; et al. | 2020-12-24 |
| Device Disaggregation For Improved Performance App 20200403006 - Delacruz; Javier A. ; et al. | 2020-12-24 |
| Symbiotic Network On Layers App 20200387471 - Delacruz; Javier A. ; et al. | 2020-12-10 |
| Network On Layer Enabled Architectures App 20200388592 - Delacruz; Javier A. ; et al. | 2020-12-10 |
| Security Circuitry For Bonded Structures App 20200371154 - DeLaCruz; Javier A. ; et al. | 2020-11-26 |
| Systems And Methods For Inter-die Block Level Design App 20200356714 - DELACRUZ; Javier A. ; et al. | 2020-11-12 |
| Direct-Bonded Native Interconnects And Active Base Die App 20200357641 - Delacruz; Javier A. ; et al. | 2020-11-12 |
| Direct-bonded native interconnects and active base die Grant 10,832,912 - Delacruz , et al. November 10, 2 | 2020-11-10 |
| Protective Elements For Bonded Structures App 20200328162 - Haba; Belgacem ; et al. | 2020-10-15 |
| Protective Elements For Bonded Structures App 20200328164 - DeLaCruz; Javier A. ; et al. | 2020-10-15 |
| Wafer-level Bonding Of Obstructive Elements App 20200328165 - DeLaCruz; Javier A. ; et al. | 2020-10-15 |
| Over And Under Interconnects App 20200321275 - Haba; Belgacem ; et al. | 2020-10-08 |
| Bonding of laminates with electrical interconnects Grant 10,790,222 - Delacruz , et al. September 29, 2 | 2020-09-29 |
| Interface structures and methods for forming same Grant 10,784,191 - Huang , et al. Sept | 2020-09-22 |
| Bonded Structures With Integrated Passive Component App 20200294908 - Haba; Belgacem ; et al. | 2020-09-17 |
| Probe methodology for ultrafine pitch interconnects Grant 10,748,824 - Delacruz , et al. A | 2020-08-18 |
| Wire Bonding Method And Apparatus For Electromagnetic Interference Shielding App 20200227360 - Huang; Shaowu ; et al. | 2020-07-16 |
| Bonded Structures App 20200227367 - Haba; Belgacem ; et al. | 2020-07-16 |
| Systems And Methods For Flash Stacking App 20200212013 - Haba; Belgacem ; et al. | 2020-07-02 |
| Device disaggregation for improved performance Grant 10,700,094 - Delacruz , et al. | 2020-06-30 |
| Abstracted NAND Logic In Stacks App 20200203330 - Delacruz; Javier A. ; et al. | 2020-06-25 |
| Stacked Architecture For Three-dimensional Nand App 20200203316 - Morein; Stephen ; et al. | 2020-06-25 |
| Direct-bonded Native Interconnects And Active Base Die App 20200194262 - DELACRUZ; Javier A. ; et al. | 2020-06-18 |
| Self healing compute array Grant 10,684,929 - Delacruz , et al. | 2020-06-16 |
| Systems and methods for inter-die block level design Grant 10,664,564 - Delacruz , et al. | 2020-05-26 |
| Selective recess Grant 10,658,313 - Delacruz , et al. | 2020-05-19 |
| Wire bonding method and apparatus for electromagnetic interference shielding Grant 10,658,302 - Huang , et al. | 2020-05-19 |
| Bonded Structures App 20200144217 - Enquist; Paul M. ; et al. | 2020-05-07 |
| Bonded Structures App 20200126945 - Wang; Liang ; et al. | 2020-04-23 |
| Probe Methodology For Ultrafine Pitch Interconnects App 20200105630 - DELACRUZ; Javier A. ; et al. | 2020-04-02 |
| Increased contact alignment tolerance for direct bonding Grant 10,607,937 - Enquist , et al. | 2020-03-31 |
| Vertical capacitors for microelectronics Grant 10,600,747 - Haba , et al. | 2020-03-24 |
| Systems and methods for flash stacking Grant 10,593,651 - Haba , et al. | 2020-03-17 |
| Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes App 20200075520 - GAO; Guilian ; et al. | 2020-03-05 |
| Integrated Voltage Regulator And Passive Components App 20200075553 - DELACRUZ; Javier A. ; et al. | 2020-03-05 |
| Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes App 20200075533 - GAO; Guilian ; et al. | 2020-03-05 |
| Device Disaggregation For Improved Performance App 20200051999 - Delacruz; Javier A. ; et al. | 2020-02-13 |
| Interface Structures And Methods For Forming Same App 20200043848 - Huang; Shaowu ; et al. | 2020-02-06 |
| Bonded structures Grant 10,546,832 - Wang , et al. Ja | 2020-01-28 |
| Probe methodology for ultrafine pitch interconnects Grant 10,529,634 - Delacruz , et al. J | 2020-01-07 |
| Bonded structures Grant 10,522,499 - Enquist , et al. Dec | 2019-12-31 |
| Direct-bonded native interconnects and active base die Grant 10,522,352 - Delacruz , et al. Dec | 2019-12-31 |
| Systems and methods for releveled bump planes for chiplets App 20190393190 - DELACRUZ; Javier A. ; et al. | 2019-12-26 |
| Systems and methods for inter-die block level design App 20190392104 - DELACRUZ; Javier A ; et al. | 2019-12-26 |
| Eliminating defects in stacks App 20190393204 - DELACRUZ; Javier A. ; et al. | 2019-12-26 |
| Embedded Organic Interposer For High Bandwidth App 20190385978 - Delacruz; Javier A. ; et al. | 2019-12-19 |
| Systems And Methods For Flash Stacking App 20190371765 - Haba; Belgacem ; et al. | 2019-12-05 |
| Formation of a Light-Emitting Diode Display App 20190371229 - Wang; Liang ; et al. | 2019-12-05 |
| Hard IP Blocks WIth Physically Bidirectional Passageways App 20190371708 - Delacruz; Javier A. | 2019-12-05 |
| Warpage balancing in thin packages Grant 10,483,217 - Haba , et al. Nov | 2019-11-19 |
| Dielets On Flexible And Stretchable Packaging For Microelectronics App 20190341350 - Huang; Shaowu ; et al. | 2019-11-07 |
| Transistor Level Interconnection Methodologies Utilizing 3d Interconnects App 20190305093 - Delacruz; Javier A. ; et al. | 2019-10-03 |
| Embedded organic interposers for high bandwidth Grant 10,403,599 - Delacruz , et al. Sep | 2019-09-03 |
| Dielets on flexible and stretchable packaging for microelectronics Grant 10,403,577 - Huang , et al. Sep | 2019-09-03 |
| Integrated Optical Waveguides, Direct-bonded Waveguide Interface Joints, Optical Routing And Interconnects App 20190265411 - HUANG; Shaowu ; et al. | 2019-08-29 |
| Back biasing of FD-SOI circuit blocks App 20190252375 - DELACRUZ; Javier A. ; et al. | 2019-08-15 |
| Increased Contact Alignment Tolerance For Direct Bonding App 20190244899 - Enquist; Paul M. ; et al. | 2019-08-08 |
| Bonding Of Laminates With Electrical Interconnects App 20190221510 - Delacruz; Javier A. ; et al. | 2019-07-18 |
| Multi-surface edge pads for vertical mount packages and methods of making package stacks Grant 10,354,945 - Katkar , et al. July 16, 2 | 2019-07-16 |
| Vertical Capacitors For Microelectronics App 20190214353 - Haba; Belgacem ; et al. | 2019-07-11 |
| Cavity Packages App 20190198407 - Huang; Shaowu ; et al. | 2019-06-27 |
| Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces Grant 10,325,877 - Delacruz , et al. | 2019-06-18 |
| Selective Recess App 20190181107 - DELACRUZ; Javier A. ; et al. | 2019-06-13 |
| Surface integrated waveguides and circuit structures therefor Grant 10,299,368 - Huang , et al. | 2019-05-21 |
| Wafer testing without direct probing Grant 10,295,588 - Delacruz , et al. | 2019-05-21 |
| Systems and methods for flash stacking Grant 10,290,612 - Haba , et al. | 2019-05-14 |
| Bonding of laminates with electrical interconnects Grant 10,283,445 - Delacruz , et al. | 2019-05-07 |
| Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein Grant 10,276,909 - Huang , et al. | 2019-04-30 |
| Increased contact alignment tolerance for direct bonding Grant 10,269,708 - Enquist , et al. | 2019-04-23 |
| Stacked Transmission Line App 20190069392 - Huang; Shaowu ; et al. | 2019-02-28 |
| Stacked transmission line Grant 10,149,377 - Huang , et al. De | 2018-12-04 |
| Bonded Structures App 20180337157 - Wang; Liang ; et al. | 2018-11-22 |
| Probe methodology for ultrafine pitch Interconnects App 20180331000 - DELACRUZ; Javier A. ; et al. | 2018-11-15 |
| Embedded Organic Interposers for High Bandwidth App 20180315735 - Delacruz; Javier A. ; et al. | 2018-11-01 |
| Interface Structures And Methods For Forming Same App 20180286805 - Huang; Shaowu ; et al. | 2018-10-04 |
| Warpage Balancing In Thin Packages App 20180261556 - Haba; Belgacem ; et al. | 2018-09-13 |
| Embedded Wire Bond Wires for Vertical Integration With Separate Surface Mount and Wire Bond Mounting Surfaces App 20180240773 - Delacruz; Javier A. ; et al. | 2018-08-23 |
| Bonded Structures App 20180226375 - Enquist; Paul M. ; et al. | 2018-08-09 |
| Increased Contact Alignment Tolerance For Direct Bonding App 20180204798 - Enquist; Paul M. ; et al. | 2018-07-19 |
| Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding App 20180197834 - Huang; Shaowu ; et al. | 2018-07-12 |
| Structure With Integrated Metallic Waveguide App 20180191047 - Huang; Shaowu ; et al. | 2018-07-05 |
| Bonded Structures With Integrated Passive Component App 20180190583 - DeLaCruz; Javier A. ; et al. | 2018-07-05 |
| Bonded Structures With Integrated Passive Component App 20180190580 - Haba; Belgacem ; et al. | 2018-07-05 |
| Wafer Testing Without Direct Probing App 20180180665 - DELACRUZ; Javier A. ; et al. | 2018-06-28 |
| Surface Integrated Waveguides and Circuit Structures Therefor App 20180177041 - HUANG; Shaowu ; et al. | 2018-06-21 |
| Self Healing Compute Array App 20180173600 - DELACRUZ; Javier A. ; et al. | 2018-06-21 |
| Bonded Structures App 20180174995 - Wang; Liang ; et al. | 2018-06-21 |
| Bonded structures Grant 10,002,844 - Wang , et al. June 19, 2 | 2018-06-19 |
| Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces Grant 9,984,992 - DeLaCruz , et al. May 29, 2 | 2018-05-29 |
| Warpage balancing in thin packages Grant 9,972,582 - Haba , et al. May 15, 2 | 2018-05-15 |
| Bonding of Laminates with Electrical Interconnects App 20180114747 - Delacruz; Javier A. ; et al. | 2018-04-26 |
| Direct-bonded native interconnects and active base die App 20180102251 - DELACRUZ; Javier A. ; et al. | 2018-04-12 |
| Wire bonding method and apparatus for electromagnetic interference shielding Grant 9,935,075 - Huang , et al. April 3, 2 | 2018-04-03 |
| Microelectronic Packages And Assemblies With Repeaters App 20180040589 - Huang; Shaowu ; et al. | 2018-02-08 |
| Multi-surface edge pads for vertical mount packages and methods of making package stacks App 20180040544 - Katkar; Rajesh Emeka ; et al. | 2018-02-08 |
| Warpage Balancing in Thin Packages App 20180040572 - Haba; Belgacem ; et al. | 2018-02-08 |
| Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding App 20180033764 - Huang; Shaowu ; et al. | 2018-02-01 |
| Flipped die stacks with multiple rows of leadframe interconnects Grant 9,859,257 - Delacruz , et al. January 2, 2 | 2018-01-02 |
| Stacked Transmission Line App 20170374734 - Huang; Shaowu ; et al. | 2017-12-28 |
| Increased contact alignment tolerance for direct bonding Grant 9,852,988 - Enquist , et al. December 26, 2 | 2017-12-26 |
| Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces App 20170194281 - DeLaCruz; Javier A. ; et al. | 2017-07-06 |
| Increased Contact Alignment Tolerance For Direct Bonding App 20170179029 - Enquist; Paul M. ; et al. | 2017-06-22 |
| Flipped Die Stacks With Multiple Rows Of Leadframe Interconnects App 20170179081 - Delacruz; Javier A. ; et al. | 2017-06-22 |
| Stiffened wires for offset BVA Grant 9,659,848 - Villavicencio , et al. May 23, 2 | 2017-05-23 |
| Stiffened Wires For Offset Bva App 20170141020 - Villavicencio; Grant ; et al. | 2017-05-18 |
| Microelectronic packages and assemblies with improved flyby signaling operation Grant 9,595,511 - Haba , et al. March 14, 2 | 2017-03-14 |
| Flipped die stacks with multiple rows of leadframe interconnects Grant 9,508,691 - Delacruz , et al. November 29, 2 | 2016-11-29 |
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