| Patent | Date |
|---|
Forming Self-aligned Multi-metal Interconnects
App 20220262736 - DUTTA; Ashim ; et al. | 2022-08-18 |
Creating different width lines and spaces in a metal layer
Grant 11,373,880 - Penny , et al. June 28, 2 | 2022-06-28 |
Vertical Field Effect Transistor With Crosslink Fin Arrangement
App 20220199776 - Seshadri; Indira ; et al. | 2022-06-23 |
Low Capacitance Low Rc Wrap-around-contact
App 20220199787 - Xie; Ruilong ; et al. | 2022-06-23 |
Forming self-aligned multi-metal interconnects
Grant 11,355,442 - Dutta , et al. June 7, 2 | 2022-06-07 |
Staggered Stacked Vertical Crystalline Semiconducting Channels
App 20220149042 - Kang; Tsung-Sheng ; et al. | 2022-05-12 |
Metal brush layer for EUV patterning
Grant 11,307,496 - De Silva , et al. April 19, 2 | 2022-04-19 |
Semiconductor structure with fully aligned vias
Grant 11,302,573 - De Silva , et al. April 12, 2 | 2022-04-12 |
Line break repairing layer for extreme ultraviolet patterning stacks
Grant 11,300,881 - Meli Thompson , et al. April 12, 2 | 2022-04-12 |
Creating Different Width Lines And Spaces In A Metal Layer
App 20220093414 - Penny; Christopher J ; et al. | 2022-03-24 |
Staggered stacked vertical crystalline semiconducting channels
Grant 11,251,182 - Kang , et al. February 15, 2 | 2022-02-15 |
Litho-etch-litho-etch with self-aligned blocks
Grant 11,239,077 - Liu , et al. February 1, 2 | 2022-02-01 |
Placing Top Vias At Line Ends By Selective Growth Of Via Mask From Line Cut Dielectric
App 20220028784 - DUTTA; Ashim ; et al. | 2022-01-27 |
Using E0 Exposures for Track/Cluster Monitoring
App 20220019139 - Murray; Cody J. ; et al. | 2022-01-20 |
Partial Wrap Around Top Contact
App 20220020634 - Xie; Ruilong ; et al. | 2022-01-20 |
Self-priming resist for generic inorganic hardmasks
Grant 11,226,561 - Liu , et al. January 18, 2 | 2022-01-18 |
Resist Underlayer Surface Modification
App 20220011670 - Guo; Jing ; et al. | 2022-01-13 |
Spacer-defined Process For Lithography-etch Double Patterning For Interconnects
App 20220013405 - Felix; Nelson ; et al. | 2022-01-13 |
Metal Cut Patterning And Etching To Minimize Interlayer Dielectric Layer Loss
App 20220005698 - Chung; Kisup ; et al. | 2022-01-06 |
Inverse Tone Pillar Printing
App 20210398816 - Felix; Nelson ; et al. | 2021-12-23 |
Embedded MRAM device with top via
Grant 11,205,678 - Dutta , et al. December 21, 2 | 2021-12-21 |
Selective Shrink for Contact Trench
App 20210384306 - Xie; Ruilong ; et al. | 2021-12-09 |
Back-end-of-line compatible processing for forming an array of pillars
Grant 11,195,995 - Liu , et al. December 7, 2 | 2021-12-07 |
Lithography process delay characterization and effective dose compensation
Grant 11,194,254 - Robinson , et al. December 7, 2 | 2021-12-07 |
Placing top vias at line ends by selective growth of via mask from line cut dielectric
Grant 11,189,561 - Dutta , et al. November 30, 2 | 2021-11-30 |
Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography
Grant 11,177,130 - De Silva , et al. November 16, 2 | 2021-11-16 |
Spacer-defined process for lithography-etch double patterning for interconnects
Grant 11,164,772 - Felix , et al. November 2, 2 | 2021-11-02 |
Dielectric Structure to Prevent Hard Mask Erosion
App 20210335618 - Li; Tao ; et al. | 2021-10-28 |
Organic Photoresist Adhesion To Metal Oxide Hardmasks
App 20210325784 - Arceo de la Pena; Abraham ; et al. | 2021-10-21 |
Metal cut patterning and etching to minimize interlayer dielectric layer loss
Grant 11,133,189 - Chung , et al. September 28, 2 | 2021-09-28 |
Inverse tone pillar printing method using polymer brush grafts
Grant 11,133,195 - Felix , et al. September 28, 2 | 2021-09-28 |
Staggered Stacked Vertical Crystalline Semiconducting Channels
App 20210296314 - Kang; Tsung-Sheng ; et al. | 2021-09-23 |
Embedded MRAM Device with Top Via
App 20210242277 - Dutta; Ashim ; et al. | 2021-08-05 |
Semiconductor device with multiple threshold voltages
Grant 11,075,081 - Joseph , et al. July 27, 2 | 2021-07-27 |
Dynamic adjustment of post exposure bake during lithography utilizing real-time feedback for wafer exposure delay
Grant 11,067,896 - Murray , et al. July 20, 2 | 2021-07-20 |
Back-end-of-line Compatible Processing For Forming An Array Of Pillars
App 20210210679 - Liu; Chi-Chun ; et al. | 2021-07-08 |
Multi-layer bottom electrode for embedded memory devices
Grant 11,043,628 - Dutta , et al. June 22, 2 | 2021-06-22 |
Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography
Grant 11,037,786 - De Silva , et al. June 15, 2 | 2021-06-15 |
Metal Brush Layer For Euv Patterning
App 20210149298 - De Silva; Ekmini Anuja ; et al. | 2021-05-20 |
Litho-etch-litho-etch With Self-aligned Blocks
App 20210143013 - Liu; Chi-Chun ; et al. | 2021-05-13 |
Lithography Process Delay Characterization and Effective Dose Compensation
App 20210132502 - Robinson; Christopher ; et al. | 2021-05-06 |
Sequential infiltration synthesis extreme ultraviolet single expose patterning
Grant 10,998,192 - De Silva , et al. May 4, 2 | 2021-05-04 |
Hard mask films with graded vertical concentration formed using reactive sputtering in a radio frequency deposition chamber
Grant 10,975,464 - De Silva , et al. April 13, 2 | 2021-04-13 |
Processes For Forming Fully Aligned Vias
App 20210104432 - De Silva; Ekmini Anuja ; et al. | 2021-04-08 |
Multi-layer Bottom Electrode For Embedded Memory Devices
App 20210104660 - Dutta; Ashim ; et al. | 2021-04-08 |
Extreme ultraviolet lithography patterning with directional deposition
Grant 10,957,552 - Xu , et al. March 23, 2 | 2021-03-23 |
Placing Top Vias At Line Ends By Selective Growth Of Via Mask From Line Cut Dielectric
App 20210082807 - DUTTA; Ashim ; et al. | 2021-03-18 |
Sequential Infiltration Synthesis Extreme Ultraviolet Single Expose Patterning
App 20210082697 - De Silva; Ekmini Anuja ; et al. | 2021-03-18 |
Patterning directly on an amorphous silicon hardmask
Grant 10,950,440 - Arceo de la Pena , et al. March 16, 2 | 2021-03-16 |
Extreme ultraviolet (EUV) lithography patterning methods utilizing EUV resist hardening
Grant 10,901,317 - Briggs , et al. January 26, 2 | 2021-01-26 |
Controlling active fin height of FinFET device
Grant 10,892,193 - Song , et al. January 12, 2 | 2021-01-12 |
Encapsulated memory pillars
Grant 10,886,462 - Dutta , et al. January 5, 2 | 2021-01-05 |
Method of forming barrier free contact for metal interconnects
Grant 10,879,107 - Dutta , et al. December 29, 2 | 2020-12-29 |
Dynamic Adjustment Of Post Exposure Bake During Lithography Utilizing Real-time Feedback For Wafer Exposure Delay
App 20200379354 - MURRAY; Cody John ; et al. | 2020-12-03 |
Forming Self-aligned Multi-metal Interconnects
App 20200357748 - DUTTA; Ashim ; et al. | 2020-11-12 |
Inverse Tone Pillar Printing
App 20200350177 - Felix; Nelson ; et al. | 2020-11-05 |
Fabrication Of Embedded Memory Devices Utilizing A Self Assembled Monolayer
App 20200328251 - DUTTA; Ashim ; et al. | 2020-10-15 |
High temperature ultra-fast annealed soft mask for semiconductor devices
Grant 10,804,106 - Ebrish , et al. October 13, 2 | 2020-10-13 |
Direct gate metal cut using selective deposition to protect the gate end line from metal shorts
Grant 10,790,372 - Greene , et al. September 29, 2 | 2020-09-29 |
Co-optimization of lithographic and etching processes with complementary post exposure bake by laser annealing
Grant 10,768,532 - Sha , et al. Sep | 2020-09-08 |
Controlling active fin height of FinFET device using etch protection layer to prevent recess of isolation layer during gate oxide removal
Grant 10,770,361 - Song , et al. Sep | 2020-09-08 |
Enabling Residue Free Gap Fill Between Nanosheets
App 20200279956 - SESHADRI; Indira ; et al. | 2020-09-03 |
Selective Encapsulation For Metal Electrodes Of Embedded Memory Devices
App 20200274066 - DUTTA; Ashim ; et al. | 2020-08-27 |
Fabricating electrically nonconductive blocks using a polymer brush and a sequential infiltration synthesis process
Grant 10,755,928 - Liu , et al. A | 2020-08-25 |
Patterning directly on an amorphous silicon hardmask
Grant 10,755,926 - Arceo de la Pena , et al. A | 2020-08-25 |
Metal cut patterning and etching to minimize interlayer dielectric layer loss
Grant 10,734,234 - Chung , et al. | 2020-08-04 |
Fabricating Electrically Nonconductive Blocks Using A Polymer Brush And A Sequential Infiltration Synthesis Process
App 20200243335 - Liu; Chi-Chun ; et al. | 2020-07-30 |
Direct Extreme Ultraviolet Lithography On Hard Mask With Reverse Tone
App 20200234957 - MIGNOT; Yann ; et al. | 2020-07-23 |
Direct Gate Metal Cut Using Selective Deposition To Protect The Gate End Line From Metal Shorts
App 20200227532 - Greene; Andrew ; et al. | 2020-07-16 |
Controlling Active Fin Height Of Finfet Device Using Etch Protection Layer To Prevent Recess Of Isolation Layer During Gate Oxid
App 20200176332 - Song; Yi ; et al. | 2020-06-04 |
Controlling active fin height of FinFET device using etch protection layer to prevent recess of isolation layer during gate oxide removal
Grant 10,665,514 - Song , et al. | 2020-05-26 |
Semiconductor device with multiple threshold voltages
Grant 10,665,461 - Joseph , et al. | 2020-05-26 |
Encapsulated Memory Pillars
App 20200161540 - Dutta; Ashim ; et al. | 2020-05-21 |
Extreme ultraviolet lithography patterning with directional deposition
Grant 10,658,190 - Xu , et al. | 2020-05-19 |
Patterning material film stack with hard mask layer configured to support selective deposition on patterned resist layer
Grant 10,656,527 - De Silva , et al. | 2020-05-19 |
Enabling residue free gap fill between nanosheets
Grant 10,658,521 - Seshadri , et al. | 2020-05-19 |
Spin On Adhesion Promoters
App 20200150532 - GOLDFARB; Dario ; et al. | 2020-05-14 |
Method Of Forming Barrier Free Contact For Metal Interconnects
App 20200144107 - Dutta; Ashim ; et al. | 2020-05-07 |
Hard Mask Replenishment For Etching Processes
App 20200135898 - Joseph; Praveen ; et al. | 2020-04-30 |
Spacer-defined Process For Lithography-etch Double Patterning For Interconnects
App 20200135542 - Felix; Nelson ; et al. | 2020-04-30 |
Line Break Repairing Layer For Extreme Ultraviolet Patterning Stacks
App 20200124972 - MELI THOMPSON; Luciana ; et al. | 2020-04-23 |
Low undercut N-P work function metal patterning in nanosheet replacement metal gate process
Grant 10,629,495 - Seshadri , et al. | 2020-04-21 |
Dielectric gap fill evaluation for integrated circuits
Grant 10,622,250 - Chu , et al. | 2020-04-14 |
Gate cut using selective deposition to prevent oxide loss
Grant 10,622,482 - Greene , et al. | 2020-04-14 |
Tone reversal during EUV pattern transfer using surface active layer assisted selective deposition
Grant 10,615,037 - Dutta , et al. | 2020-04-07 |
Semiconductor Device With Multiple Threshold Voltages
App 20200098569 - Joseph; Praveen ; et al. | 2020-03-26 |
Semiconductor Device With Multiple Threshold Voltages
App 20200098570 - Joseph; Praveen ; et al. | 2020-03-26 |
Extreme Ultraviolet Lithography Patterning With Directional Deposition
App 20200098581 - Xu; Yongan ; et al. | 2020-03-26 |
Extreme Ultraviolet Lithography Patterning With Directional Deposition
App 20200098578 - Xu; Yongan ; et al. | 2020-03-26 |
Patterning Directly On An Amorphous Silicon Hardmask
App 20200090928 - Arceo de la Pena; Abraham ; et al. | 2020-03-19 |
Tone Reversal During Euv Pattern Transfer Using Surface Active Layer Assisted Selective Deposition
App 20200058501 - Dutta; Ashim ; et al. | 2020-02-20 |
Patterning Material Film Stack With Hard Mask Layer Configured To Support Selective Deposition On Patterned Resist Layer
App 20200050113 - De Silva; Ekmini Anuja ; et al. | 2020-02-13 |
Self-priming Resist For Generic Inorganic Hardmasks
App 20200050108 - Liu; Chi-Chun ; et al. | 2020-02-13 |
Dynamic adjustment of post exposure bake during lithography utilizing real-time feedback for wafer exposure delay
Grant 10,545,409 - Murray , et al. Ja | 2020-01-28 |
Controlling Active Fin Height Of Finfet Device Using Etch Protection Layer To Prevent Recess Of Isolation Layer During Gate Oxid
App 20200027796 - Song; Yi ; et al. | 2020-01-23 |
Controlling Active Fin Height Of Finfet Device Using Etch Protection Layer To Prevent Recess Of Isolation Layer During Gate Oxid
App 20190385916 - Song; Yi ; et al. | 2019-12-19 |
Extreme Ultraviolet (euv) Lithography Patterning Methods Utilizing Euv Resist Hardening
App 20190384180 - Briggs; Benjamin D. ; et al. | 2019-12-19 |
Co-optimization Of Lithographic And Etching Processes With Complementary Post Exposure Bake By Laser Annealing
App 20190354022 - SHA; Jing ; et al. | 2019-11-21 |
Enabling Residue Free Gap Fill Between Nanosheets
App 20190355851 - SESHADRI; Indira ; et al. | 2019-11-21 |
Inverse Tone Direct Print Euv Lithography Enabled By Selective Material Deposition
App 20190355625 - JOSEPH; Praveen ; et al. | 2019-11-21 |
Hard Mask Films With Graded Vertical Concentration Formed Using Reactive Sputtering In A Radio Frequency Deposition Chamber
App 20190309410 - De Silva; Ekmini Anuja ; et al. | 2019-10-10 |
Patterning Material Film Stack With Metal-containing Top Coat For Enhanced Sensitivity In Extreme Ultraviolet (euv) Lithography
App 20190267234 - De Silva; Ekmini Anuja ; et al. | 2019-08-29 |
Patterning material film stack comprising hard mask layer having high metal content interface to resist layer
Grant 10,395,925 - De Silva , et al. A | 2019-08-27 |
Gate Cut Using Selective Deposition To Prevent Oxide Loss
App 20190259665 - Greene; Andrew M. ; et al. | 2019-08-22 |
High Temperature Ultra-fast Annealed Soft Mask For Semiconductor Devices
App 20190259616 - Ebrish; Mona ; et al. | 2019-08-22 |
Patterning Material Film Stack With Metal-containing Top Coat For Enhanced Sensitivity In Extreme Ultraviolet (euv) Lithography
App 20190259601 - De Silva; Ekmini Anuja ; et al. | 2019-08-22 |
Undercut control in isotropic wet etch processes
Grant 10,374,034 - Liu , et al. | 2019-08-06 |
Simplified block patterning with wet strippable hardmask for high-energy implantation
Grant 10,354,922 - De Silva , et al. July 16, 2 | 2019-07-16 |
Low Undercut N-p Work Function Metal Patterning In Nanosheet Replacement Metal Gate Process
App 20190214311 - Seshadri; Indira ; et al. | 2019-07-11 |
Gate cut using selective deposition to prevent oxide loss
Grant 10,347,540 - Greene , et al. July 9, 2 | 2019-07-09 |
Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography
Grant 10,347,486 - De Silva , et al. July 9, 2 | 2019-07-09 |
Patterning Material Film Stack Comprising Hard Mask Layer Having High Metal Content Interface To Resist Layer
App 20190206681 - De Silva; Ekmini Anuja ; et al. | 2019-07-04 |
Patterning Material Film Stack With Hard Mask Layer Configured To Support Selective Deposition On Patterned Resist Layer
App 20190196340 - De Silva; Ekmini Anuja ; et al. | 2019-06-27 |
Extreme Ultraviolet (euv) Lithography Patterning Methods Utilizing Euv Resist Hardening
App 20190198325 - Briggs; Benjamin D. ; et al. | 2019-06-27 |
Simplified Block Patterning With Wet Strippable Hardmask For High-energy Implantation
App 20190198398 - De Silva; Ekmini Anuja ; et al. | 2019-06-27 |
Metal Cut Patterning And Etching To Minimize Interlayer Dielectric Layer Loss
App 20190198327 - Chung; Kisup ; et al. | 2019-06-27 |
Gate Cut Using Selective Deposition To Prevent Oxide Loss
App 20190189782 - Greene; Andrew M. ; et al. | 2019-06-20 |
Dielectric Gap Fill Evaluation For Integrated Circuits
App 20190189504 - Chu; Isabel Cristina ; et al. | 2019-06-20 |
Dielectric Gap Fill Evaluation For Integrated Circuits
App 20190189503 - Chu; Isabel Cristina ; et al. | 2019-06-20 |
Patterning Material Film Stack With Metal-containing Top Coat For Enhanced Sensitivity In Extreme Ultraviolet (euv) Lithography
App 20190189428 - De Silva; Ekmini Anuja ; et al. | 2019-06-20 |
Metal Cut Patterning And Etching To Minimize Interlayer Dielectric Layer Loss
App 20190189452 - Chung; Kisup ; et al. | 2019-06-20 |
Dielectric gap fill evaluation for integrated circuits
Grant 10,312,140 - Chu , et al. | 2019-06-04 |
Inverse tone direct print EUV lithography enabled by selective material deposition
Grant 10,304,744 - Joseph , et al. | 2019-05-28 |
Patterning Directly On An Amorphous Silicon Hardmask
App 20190157072 - Arceo de la Pena; Abraham ; et al. | 2019-05-23 |
Low undercut N-P work function metal patterning in nanosheet replacement metal gate process
Grant 10,276,452 - Seshadri , et al. | 2019-04-30 |
Photoresist Patterning On Silicon Nitride
App 20190101829 - Seshadri; Indira P. ; et al. | 2019-04-04 |
Uniform bottom spacer for vertical field effect transistor
Grant 10,170,582 - Belyansky , et al. J | 2019-01-01 |
Molecular glass photoresists
Grant 7,452,658 - De Silva , et al. November 18, 2 | 2008-11-18 |
Molecular glass photoresists
App 20080044757 - De Silva; Ekmini Anuja ; et al. | 2008-02-21 |
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