| Patent | Date |
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Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
Grant 10,037,956 - Datta , et al. July 31, 2 | 2018-07-31 |
Copper-containing C4 Ball-limiting Metallurgy Stack For Enhanced Reliability Of Packaged Structures And Method Of Making Same
App 20170141062 - Datta; Madhav ; et al. | 2017-05-18 |
Copper-containing C4 Ball-limiting Metallurgy Stack For Enhanced Reliability Of Packaged Structures And Method Of Making Same
App 20150132940 - Datta; Madhav ; et al. | 2015-05-14 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
Grant 8,952,550 - Datta , et al. February 10, 2 | 2015-02-10 |
Bonded metal and ceramic plates for thermal management of optical and electronic devices
Grant 8,299,604 - Datta , et al. October 30, 2 | 2012-10-30 |
Microheat exchanger for laser diode cooling
Grant 8,254,422 - Datta , et al. August 28, 2 | 2012-08-28 |
Fabrication Of High Surface Area, High Aspect Ratio Mini-channels And Their Application In Liquid Cooling Systems
App 20110073292 - Datta; Madhav ; et al. | 2011-03-31 |
Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
Grant 7,836,597 - Datta , et al. November 23, 2 | 2010-11-23 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
App 20100117229 - Datta; Madhav ; et al. | 2010-05-13 |
Bonded Metal And Ceramic Plates For Thermal Management Of Optical And Electronic Devices
App 20100035024 - Datta; Madhav ; et al. | 2010-02-11 |
Microheat Exchanger For Laser Diode Cooling
App 20100032143 - Datta; Madhav ; et al. | 2010-02-11 |
Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems
App 20080210405 - Datta; Madhav ; et al. | 2008-09-04 |
Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect
App 20070256825 - Conway; Bruce R. ; et al. | 2007-11-08 |
Re-workable metallic TIM for efficient heat exchange
App 20070175621 - Datta; Madhav ; et al. | 2007-08-02 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
Grant 7,250,678 - Datta , et al. July 31, 2 | 2007-07-31 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
Grant 7,196,001 - Datta , et al. March 27, 2 | 2007-03-27 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
App 20060148233 - Datta; Madhav ; et al. | 2006-07-06 |
Method of electroless introduction of interconnect structures
Grant 6,977,224 - Dubin , et al. December 20, 2 | 2005-12-20 |
Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps
Grant 6,917,106 - Datta July 12, 2 | 2005-07-12 |
Under bump metallurgy for Lead-Tin bump over copper pad
Grant 6,878,465 - Moon , et al. April 12, 2 | 2005-04-12 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
Grant 6,853,076 - Datta , et al. February 8, 2 | 2005-02-08 |
Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps
App 20040224491 - Datta, Madhav | 2004-11-11 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
App 20040159944 - Datta, Madhav ; et al. | 2004-08-19 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
App 20040159947 - Datta, Madhav ; et al. | 2004-08-19 |
Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps
Grant 6,750,133 - Datta June 15, 2 | 2004-06-15 |
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same
Grant 6,740,427 - Datta , et al. May 25, 2 | 2004-05-25 |
Method for testing chips on flat solder bumps
App 20040087046 - Datta, Madhav ; et al. | 2004-05-06 |
Selective Ball-limiting Metallurgy Etching Processes For Fabrication Of Electroplated Tin Bumps
App 20040080024 - Datta, Madhav | 2004-04-29 |
Under bump metallurgy for Lead-Tin bump over copper pad
App 20040060970 - Moon, Peter K. ; et al. | 2004-04-01 |
Under bump metallurgy for lead-tin bump over copper pad
Grant 6,703,069 - Moon , et al. March 9, 2 | 2004-03-09 |
Interconnect structures and a method of electroless introduction of interconnect structures
Grant 6,696,758 - Dubin , et al. February 24, 2 | 2004-02-24 |
Method for testing chips on flat solder bumps
Grant 6,656,750 - Datta , et al. December 2, 2 | 2003-12-02 |
Electrochemical/ mechanical polishing
App 20030205484 - Datta, Madhav | 2003-11-06 |
Interconnect structures and a method of electroless introduction of interconnect structures
App 20030071355 - Dubin, Valery M. ; et al. | 2003-04-17 |
Dual-stack, ball-limiting metallurgy and method of making same
App 20030060041 - Datta, Madhav ; et al. | 2003-03-27 |
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same
App 20030059644 - Datta, Madhav ; et al. | 2003-03-27 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
App 20030057551 - Datta, Madhav ; et al. | 2003-03-27 |
Interconnect structures and a method of electroless introduction of interconnect structures
App 20020084529 - Dubin, Valery M. ; et al. | 2002-07-04 |
Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
App 20020064592 - Datta, Madhav ; et al. | 2002-05-30 |
Reflow of low melt solder tip C4's
App 20020009869 - Cotte, John Michael ; et al. | 2002-01-24 |
Flip-Chip interconnections using lead-free solders
Grant 6,224,690 - Andricacos , et al. May 1, 2 | 2001-05-01 |
Apparatus and method for the electrochemical etching of a wafer
Grant 6,103,096 - Datta , et al. August 15, 2 | 2000-08-15 |
High performance lithium polymer electrolyte battery
Grant 6,030,728 - Cotte , et al. February 29, 2 | 2000-02-29 |
High energy density, flexible lithium primary batteries
Grant 5,989,751 - Cotte , et al. November 23, 1 | 1999-11-23 |
Lithium polymer electrolyte battery for sub-ambient temperature applications
Grant 5,939,223 - Cotte , et al. August 17, 1 | 1999-08-17 |
Barrier layers for electroplated SnPb eutectic solder joints
Grant 5,937,320 - Andricacos , et al. August 10, 1 | 1999-08-10 |
Electrochemical etching apparatus and method for spirally etching a workpiece
Grant 5,865,984 - Corbin, Jr. , et al. February 2, 1 | 1999-02-02 |
Tool and method for electroetching
Grant 5,614,076 - Brophy , et al. March 25, 1 | 1997-03-25 |
Electrochemical metal removal technique for planarization of surfaces
Grant 5,567,300 - Datta , et al. October 22, 1 | 1996-10-22 |
Elimination of island formation and contact resistance problems during electroetching of blanket or patterned thin metallic layers on insulating substrate
Grant 5,567,304 - Datta , et al. October 22, 1 | 1996-10-22 |
Method for making a thin flexible primary battery for microelectronics applications
Grant 5,558,957 - Datta , et al. September 24, 1 | 1996-09-24 |
Electroetching method and apparatus
Grant 5,543,032 - Datta , et al. August 6, 1 | 1996-08-06 |
Electroetching tool using localized application of channelized flow of electrolyte
Grant 5,531,874 - Brophy , et al. July 2, 1 | 1996-07-02 |
Electroetching process for seed layer removal in electrochemical fabrication of wafers
Grant 5,486,282 - Datta , et al. January 23, 1 | 1996-01-23 |
Fabrication of moly masks by electroetching
Grant 5,476,575 - Brophy , et al. December 19, 1 | 1995-12-19 |
Selective etching of TiW for C4 fabrication
Grant 5,462,638 - Datta , et al. October 31, 1 | 1995-10-31 |
Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces
Grant 5,284,554 - Datta , et al. February 8, 1 | 1994-02-08 |
Etching processes for avoiding edge stress in semiconductor chip solder bumps
Grant 5,268,072 - Agarwala , et al. December 7, 1 | 1993-12-07 |
High performance metal cone contact
Grant 5,190,463 - Datta , et al. March 2, 1 | 1993-03-02 |
Method for making a detachable electrical contact
Grant 5,105,537 - Datta , et al. April 21, 1 | 1992-04-21 |
Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands
Grant 5,066,370 - Andreshak , et al. November 19, 1 | 1991-11-19 |
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