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Classification Device And Classification Method Based On Neural Network
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Human-machine interface system and communication control device thereof
Grant 11,243,520 - Chiu , et al. February 8, 2 | 2022-02-08 |
Board defect filtering method based on defect list and circuit layout image and device thereof and computer-readable recording medium
Grant 11,132,786 - Liang , et al. September 28, 2 | 2021-09-28 |
Human-machine Interface System And Communication Control Device Thereof
App 20200110392 - CHIU; Chih Chung ; et al. | 2020-04-09 |
Chip temperature computation method and chip temperature computation device
Grant 10,540,474 - Chien , et al. Ja | 2020-01-21 |
Board Defect Filtering Method And Device Thereof And Computer-readable Recording Medium
App 20190213725 - Liang; Ming-Kaan ; et al. | 2019-07-11 |
Roller with pressure sensor and R to R device
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Chip Temperature Computation Method And Chip Temperature Computation Device
App 20190188357 - Chien; Heng-Chieh ; et al. | 2019-06-20 |
Intelligent diagnosis system for power module and method thereof
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Intelligent Diagnosis System For Power Module And Method Thereof
App 20180136287 - CHIU; Chih-Chung ; et al. | 2018-05-17 |
Method Of Manufacturing Foot Auxiliary Equpiment
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Structure Of Thermoelectric Module And Fabricating Method Thereof
App 20180040798 - Liao; Li-Ling ; et al. | 2018-02-08 |
Semiconductor Device Having A Rib Structure And Manufacturing Method Of The Same
App 20180033772 - SHEN; Chih-Ming ; et al. | 2018-02-01 |
Roller With Pressure Sensor And R To R Device
App 20180022563 - Liang; Ming-Kaan ; et al. | 2018-01-25 |
Semiconductor Device And Manufacturing Method Of The Same
App 20170170146 - SHEN; Chih-Ming ; et al. | 2017-06-15 |
Measurement method, measurement apparatus, and computer program product
Grant 9,448,121 - Chien , et al. September 20, 2 | 2016-09-20 |
Structure Of Thermoelectric Module And Fabricating Method Thereof
App 20160163950 - Liao; Li-Ling ; et al. | 2016-06-09 |
Encapsulation of backside illumination photosensitive device
Grant 9,130,080 - Hsiao , et al. September 8, 2 | 2015-09-08 |
Encapsulation Of Backside Illumination Photosensitive Device
App 20140291790 - Hsiao; Zhi-Cheng ; et al. | 2014-10-02 |
Semiconductor device
Grant 8,674,491 - Liu , et al. March 18, 2 | 2014-03-18 |
Thermoelectric apparatus and method of fabricating the same
Grant 8,664,509 - Liu , et al. March 4, 2 | 2014-03-04 |
Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices
Grant 8,609,454 - Dai , et al. December 17, 2 | 2013-12-17 |
Self-assembly Apparatus, Device Self-assembling Method, And Method Of Assembling Thermoelectric Devices
App 20130302935 - Dai; Ming-Ji ; et al. | 2013-11-14 |
Measurement Method, Measurement Apparatus, And Computer Program Product
App 20130276464 - Chien; Heng-Chieh ; et al. | 2013-10-24 |
Heat dissipation structure for electronic device and fabrication method thereof
Grant 8,552,554 - Tain , et al. October 8, 2 | 2013-10-08 |
Electronic device packaging structure
Grant 8,536,701 - Tain , et al. September 17, 2 | 2013-09-17 |
Filled Through-silicon Via And The Fabrication Method Thereof
App 20130234325 - Dai; Ming-Ji ; et al. | 2013-09-12 |
Chip stacking structure and fabricating method of the chip stacking structure
Grant 8,519,524 - Wu , et al. August 27, 2 | 2013-08-27 |
Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensor
Grant 8,507,909 - Tain , et al. August 13, 2 | 2013-08-13 |
Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor
Grant 8,502,224 - Tain , et al. August 6, 2 | 2013-08-06 |
Filled through-silicon via with conductive composite material
Grant 8,456,017 - Dai , et al. June 4, 2 | 2013-06-04 |
Light emitting apparatus and fabrication method thereof
Grant 8,310,037 - Liu , et al. November 13, 2 | 2012-11-13 |
Electronic Device Packaging Structure
App 20120280385 - Tain; Ra-Min ; et al. | 2012-11-08 |
Filled Through-silicon Via And The Fabrication Method Thereof
App 20120273939 - Dai; Ming-Ji ; et al. | 2012-11-01 |
Circuit board structure and manufacturing method thereof
Grant 8,288,655 - Tain , et al. October 16, 2 | 2012-10-16 |
Test Structure And Measurement Method Thereof
App 20120249176 - Chien; Heng-Chieh ; et al. | 2012-10-04 |
Heat dissipation structure for electronic device and fabrication method thereof
Grant 8,278,755 - Tain , et al. October 2, 2 | 2012-10-02 |
Active solid heatsink device and fabricating method thereof
Grant 8,222,728 - Yu , et al. July 17, 2 | 2012-07-17 |
Semiconductor Device
App 20120153454 - Liu; Chun-Kai ; et al. | 2012-06-21 |
Stacked-chip packaging structure and fabrication method thereof
Grant 8,193,625 - Liu , et al. June 5, 2 | 2012-06-05 |
Thermoelectric Apparatus and Method of Fabricating the Same
App 20120118346 - Liu; Chun-Kai ; et al. | 2012-05-17 |
Heat Dissipation Structure For Electronic Device And Fabrication Method Thereof
App 20120092834 - Tain; Ra-Min ; et al. | 2012-04-19 |
Measuring Apparatus
App 20120068177 - Tain; Ra-Min ; et al. | 2012-03-22 |
Heat Dissipation Structure For Electronic Device And Fabrication Method Thereof
App 20120038041 - Tain; Ra-Min ; et al. | 2012-02-16 |
Measuring Apparatus
App 20110309357 - Tain; Ra-Min ; et al. | 2011-12-22 |
Apparatus and method for measuring characteristic and chip temperature of LED
Grant 8,075,182 - Dai , et al. December 13, 2 | 2011-12-13 |
Integrated package structure having solar cell and thermoelectric element and method of fabricating the same
Grant 8,008,573 - Dai , et al. August 30, 2 | 2011-08-30 |
Flexible thermoelectric device
Grant 7,999,172 - Yu , et al. August 16, 2 | 2011-08-16 |
Fabricating method of light emitting diode package
Grant 7,972,877 - Dai , et al. July 5, 2 | 2011-07-05 |
Apparatus and method for measuring diode chip
Grant 7,952,368 - Dai , et al. May 31, 2 | 2011-05-31 |
Light emitting diode package structure
Grant 7,855,396 - Dai , et al. December 21, 2 | 2010-12-21 |
Stacked-chip packaging structure and fabrication method thereof
App 20100290193 - Liu; Chun-Kai ; et al. | 2010-11-18 |
Light Emitting Apparatus And Fabrication Method Thereof
App 20100267176 - Liu; Chun-Kai ; et al. | 2010-10-21 |
Circuit Board Structure And Manufacturing Method Thereof
App 20100051328 - Tain; Ra-Min ; et al. | 2010-03-04 |
Encapsulation and methods thereof
Grant 7,633,154 - Dai , et al. December 15, 2 | 2009-12-15 |
Fabricating Method Of Light Emitting Diode Package
App 20090258449 - Dai; Ming-Ji ; et al. | 2009-10-15 |
Active Solid Heatsink Device And Fabricating Method Thereof
App 20090245308 - YU; Chih-Kuang ; et al. | 2009-10-01 |
Light emitting diode package structure and fabricating method thereof
Grant 7,586,125 - Dai , et al. September 8, 2 | 2009-09-08 |
Apparatus And Method For Measuring Characteristic And Chip Temperature Of Led
App 20090154525 - Dai; Ming-Ji ; et al. | 2009-06-18 |
Lighting devices
Grant 7,517,114 - Tain , et al. April 14, 2 | 2009-04-14 |
Flexible Thermoelectric Device And Manufacturing Method Thereof
App 20090014046 - Yu; Chih-Kuang ; et al. | 2009-01-15 |
Integrated Package Structure Having Solar Cell And Thermoelectric Element And Method Of Fabricating The Same
App 20080295878 - Dai; Ming-Ji ; et al. | 2008-12-04 |
Lighting Devices
App 20080013320 - Tain; Ra-Min ; et al. | 2008-01-17 |
Light Emitting Diode Package Structure And Fabricating Method Thereof
App 20080006843 - Dai; Ming-Ji ; et al. | 2008-01-10 |
Light Emitting Diode Package Structure And Fabricating Method Thereof
App 20070194465 - Dai; Ming-Ji ; et al. | 2007-08-23 |
Encapsulation and methods thereof
App 20070187815 - Dai; Ming-Ji ; et al. | 2007-08-16 |
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