Cumbie; Michael W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cumbie; Michael W..The latest application filed is for "monolithic carrier structure including fluid routing for digital dispensing".
Company Profile
140.178.200
- Cumbie; Michael W. - Corvallis OR
- Cumbie; Michael W - Corvallis OR
- Cumbie; Michael W - Albany OR
- Cumbie; Michael W. - Albany OR
- Cumbie; Michael W. - US
- CUMBIE; Michael W. - Spring TX
- Cumbie; Michael W. - Covallis OR
- - Albany OR US
Patent Activity
| Patent | Date |
|---|---|
| Liquid sensor package Grant 11,453,222 - Gardner , et al. September 27, 2 | 2022-09-27 |
| Monolithic Carrier Structure Including Fluid Routing For Digital Dispensing App 20220297113 - NIELSEN; Jeffrey A. ; et al. | 2022-09-22 |
| Plurality of filters Grant 11,440,009 - Chen , et al. September 13, 2 | 2022-09-13 |
| Microfluidic device with capillary chamber Grant 11,440,008 - Mourey , et al. September 13, 2 | 2022-09-13 |
| Conductive elements electrically coupled to fluidic dies Grant 11,433,670 - Cumbie , et al. September 6, 2 | 2022-09-06 |
| Integrated Circuits Including Customization Bits App 20220274399 - Linn; Scott A. ; et al. | 2022-09-01 |
| Molding a fluid flow structure Grant 11,426,900 - Chen , et al. August 30, 2 | 2022-08-30 |
| Logic circuitry Grant 11,427,010 - Gardner , et al. August 30, 2 | 2022-08-30 |
| Fluid ejection devices including contact pads Grant 11,413,865 - Gardner , et al. August 16, 2 | 2022-08-16 |
| Die for a printhead Grant 11,413,864 - Gardner , et al. August 16, 2 | 2022-08-16 |
| Digital Microfluidics Device With Droplet Processing Components App 20220250077 - Cumbie; Michael W. ; et al. | 2022-08-11 |
| Logic circuitry package Grant 11,407,228 - Linn , et al. August 9, 2 | 2022-08-09 |
| Temperature detection and control Grant 11,407,220 - Cumbie , et al. August 9, 2 | 2022-08-09 |
| Nozzle Arrangements And Supply Channels App 20220227131 - Cook; Galen ; et al. | 2022-07-21 |
| Fluidic dies Grant 11,390,075 - Choy , et al. July 19, 2 | 2022-07-19 |
| Print Component With Memory Array Using Intermittent Clock Signal App 20220219452 - Gardner; James Michael ; et al. | 2022-07-14 |
| Monolithic carrier structure including fluid routing for digital dispensing Grant 11,383,230 - Nielsen , et al. July 12, 2 | 2022-07-12 |
| Fluid Circulation And Ejection App 20220203696 - Choy; Si-Iam ; et al. | 2022-06-30 |
| Monolithic carrier structure for digital dispensing Grant 11,364,492 - Nielsen , et al. June 21, 2 | 2022-06-21 |
| Planarization layers over silicon dies Grant 11,364,493 - Cumbie , et al. June 21, 2 | 2022-06-21 |
| Coplanar fluidic interconnect Grant 11,364,496 - Chen , et al. June 21, 2 | 2022-06-21 |
| Fluid sensing Grant 11,366,000 - Cumbie , et al. June 21, 2 | 2022-06-21 |
| Embedded microfluidic devices Grant 11,364,497 - Chen , et al. June 21, 2 | 2022-06-21 |
| Print component with memory array using intermittent clock signal Grant 11,364,719 - Gardner , et al. June 21, 2 | 2022-06-21 |
| Circulation Path For Bubbler App 20220176708 - Ng; Boon Bing ; et al. | 2022-06-09 |
| Fluid Property Sensor App 20220176707 - STUDER; Anthony D. ; et al. | 2022-06-09 |
| Integrated circuits including customization bits Grant 11,351,775 - Linn , et al. June 7, 2 | 2022-06-07 |
| Replaceable print apparatus component Grant 11,345,159 - Cumbie , et al. May 31, 2 | 2022-05-31 |
| Logic circuitry Grant 11,331,925 - Gardner , et al. May 17, 2 | 2022-05-17 |
| Fluid ejection dies Grant 11,331,915 - Chen , et al. May 17, 2 | 2022-05-17 |
| Coplanar Modular Printbars App 20220143883 - Chen; Chien-Hua ; et al. | 2022-05-12 |
| Method of preparing test samples Grant 11,326,200 - Cumbie , et al. May 10, 2 | 2022-05-10 |
| Print head interposers Grant 11,325,378 - Cumbie , et al. May 10, 2 | 2022-05-10 |
| Fluid property sensor Grant 11,318,750 - Chen , et al. May 3, 2 | 2022-05-03 |
| Cassette substrates made of polyetherimide Grant 11,318,458 - Lutnesky , et al. May 3, 2 | 2022-05-03 |
| Molded Structures With Channels App 20220126577 - Chen; Chien-Hua ; et al. | 2022-04-28 |
| Nozzle arrangements and supply channels Grant 11,305,537 - Cook , et al. April 19, 2 | 2022-04-19 |
| Molded Structures With Channels App 20220111647 - Chen; Chien-Hua ; et al. | 2022-04-14 |
| Fluid Propelling Apparatus Including A Heat Sink App 20220111645 - Clark; Garrett E. ; et al. | 2022-04-14 |
| Fluid Ejection Polymeric Recirculation Channel App 20220105725 - Chen; Chien-Hua ; et al. | 2022-04-07 |
| Printheads App 20220105726 - Clark; Garrett E. ; et al. | 2022-04-07 |
| Molded die slivers with exposed front and back surfaces Grant 11,292,257 - Chen , et al. April 5, 2 | 2022-04-05 |
| Fluid circulation and ejection Grant 11,292,265 - Choy , et al. April 5, 2 | 2022-04-05 |
| Ink container Grant 11,292,263 - Ng , et al. April 5, 2 | 2022-04-05 |
| Fluid feed hole port dimensions Grant 11,285,731 - Clark , et al. March 29, 2 | 2022-03-29 |
| Microfluidic chip Grant 11,278,887 - Shkolnikov , et al. March 22, 2 | 2022-03-22 |
| Chip to chip fluidic interconnect Grant 11,278,892 - Cumbie , et al. March 22, 2 | 2022-03-22 |
| Fluidic dies with conductive members Grant 11,279,130 - Cumbie , et al. March 22, 2 | 2022-03-22 |
| Fluid Ejection Device With Break(s) In Cover Layer App 20220072858 - Cumbie; Michael W. ; et al. | 2022-03-10 |
| Die for a printhead Grant 11,267,243 - Gardner , et al. March 8, 2 | 2022-03-08 |
| Nozzle arrangements and feed holes Grant 11,247,470 - Cook , et al. February 15, 2 | 2022-02-15 |
| Curved Fluid Ejection Devices App 20220032626 - Chen; Chien-Hua ; et al. | 2022-02-03 |
| Coplanar microfluidic manipulation Grant 11,235,328 - Cumbie , et al. February 1, 2 | 2022-02-01 |
| Fluid propelling apparatus including a heat sink Grant 11,235,574 - Clark , et al. February 1, 2 | 2022-02-01 |
| Temperature-cycling microfluidic devices Grant 11,235,324 - Higgins , et al. February 1, 2 | 2022-02-01 |
| Horizontal interface for fluid supply cartridge having digital fluid level sensor Grant 11,230,107 - Studer , et al. January 25, 2 | 2022-01-25 |
| Thermal contact dies Grant 11,225,086 - Cumbie , et al. January 18, 2 | 2022-01-18 |
| Two-step molding for a lead frame Grant 11,227,807 - Cumbie , et al. January 18, 2 | 2022-01-18 |
| Fluidic dies with inlet and outlet channels Grant 11,225,074 - Cumbie , et al. January 18, 2 | 2022-01-18 |
| Printheads Grant 11,220,107 - Clark , et al. January 11, 2 | 2022-01-11 |
| Fluid ejection die interlocked with molded body Grant 11,214,065 - Cumbie , et al. January 4, 2 | 2022-01-04 |
| Liquid Level Sensor Package For Replaceable Liquid Reservoir App 20210402786 - GARDNER; James Michael ; et al. | 2021-12-30 |
| Circuit Die Alignment Target App 20210402782 - Fuller; Anthony M. ; et al. | 2021-12-30 |
| Sensor Circuitry Package For Replacement Print Apparatus Component App 20210402787 - LINN; Scott A. ; et al. | 2021-12-30 |
| Logic Circuitry Package App 20210372840 - CUMBIE; Michael W. ; et al. | 2021-12-02 |
| Fluid ejection device Grant 11,186,090 - Chen , et al. November 30, 2 | 2021-11-30 |
| Conductive elements electrically coupled to fluidic dies Grant 11,186,082 - Chen , et al. November 30, 2 | 2021-11-30 |
| Circuit package Grant 11,183,437 - Chen , et al. November 23, 2 | 2021-11-23 |
| Die For A Printhead App 20210354461 - Gardner; James Michael ; et al. | 2021-11-18 |
| Die For A Printhead App 20210354455 - Linn; Scott A. ; et al. | 2021-11-18 |
| Logic Circuitry App 20210354472 - GARDNER; James Michael ; et al. | 2021-11-18 |
| Temperature Detection And Control App 20210354457 - Cumbie; Michael W. ; et al. | 2021-11-18 |
| Communicating Print Component App 20210354456 - Linn; Scott A. ; et al. | 2021-11-18 |
| Temperature Detection And Control App 20210354458 - Cumbie; Michael W. ; et al. | 2021-11-18 |
| Die For A Printhead App 20210354460 - Gardner; James Michael ; et al. | 2021-11-18 |
| Die For A Printhead App 20210354462 - Cumbie; Michael W. ; et al. | 2021-11-18 |
| Fluidic ejection devices with enclosed cross-channels Grant 11,155,086 - Choy , et al. October 26, 2 | 2021-10-26 |
| Fluidic Die Assemblies With Rigid Bent Substrates App 20210323312 - Chen; Chien-Hua ; et al. | 2021-10-21 |
| Fluid Feed Hole Port Dimensions App 20210323315 - Clark; Garrett E. ; et al. | 2021-10-21 |
| Imaging Medium App 20210323333 - Bhatt; Jayprakash C. ; et al. | 2021-10-21 |
| Curved Fluid Ejection Modules App 20210316553 - Chen; Chien-Hua ; et al. | 2021-10-14 |
| Integrated circuits including memory cells Grant 11,141,973 - Linn , et al. October 12, 2 | 2021-10-12 |
| Die contact formations Grant 11,135,839 - Cumbie , et al. October 5, 2 | 2021-10-05 |
| Mixing chamber for laundry supplies Grant 11,136,703 - Cumbie , et al. October 5, 2 | 2021-10-05 |
| Microfluidic Devices App 20210299662 - Shkolnikov; Viktor ; et al. | 2021-09-30 |
| Molded fluid flow structure Grant 11,130,339 - Chen , et al. September 28, 2 | 2021-09-28 |
| Vertical Interface For Fluid Supply Cartridge Having Digital Fluid Level Sensor App 20210291540 - Studer; Anthony D. ; et al. | 2021-09-23 |
| Nozzle Arrangements App 20210291520 - Cook; Galen ; et al. | 2021-09-23 |
| Fluidic Ejection Dies With Enclosed Cross-channels App 20210291547 - Choy; Si-Iam ; et al. | 2021-09-23 |
| Ink Container App 20210283920 - Ng; Boon Bing ; et al. | 2021-09-16 |
| Thermal Contact Dies App 20210283926 - Cumbie; Michael W ; et al. | 2021-09-16 |
| Imaging Media App 20210283936 - Toles; Christopher ; et al. | 2021-09-16 |
| Horizontal Interface For Fluid Supply Cartridge Having Digital Fluid Level Sensor App 20210276337 - Studer; Anthony D. ; et al. | 2021-09-09 |
| Preloaded storage container and print head to dispense fluid Grant 11,110,714 - Nielsen , et al. September 7, 2 | 2021-09-07 |
| Fluid Ejection Devices Including Electrical Interconnect Elements For Fluid Ejection Dies App 20210260872 - FULLER; Anthony M. ; et al. | 2021-08-26 |
| Fluid ejection die molded into molded body Grant 11,097,537 - Chen , et al. August 24, 2 | 2021-08-24 |
| Fluid Property Sensor App 20210252871 - STUDER; Anthony D. ; et al. | 2021-08-19 |
| Conductive Elements Electrically Coupled To Fluidic Dies App 20210252860 - Chen; Chien-Hua ; et al. | 2021-08-19 |
| Conductive Elements Electrically Coupled To Fluidic Dies App 20210252858 - Cumbie; Michael W ; et al. | 2021-08-19 |
| Complex impedance detection Grant 11,090,929 - Chen , et al. August 17, 2 | 2021-08-17 |
| Dual Direction Dispensers App 20210245151 - CUMBIE; Michael W. ; et al. | 2021-08-12 |
| Replaceable Print Apparatus Component App 20210240400 - CUMBIE; Michael W. ; et al. | 2021-08-05 |
| Accessing Registers Of Fluid Ejection Devices App 20210229425 - LINN; Scott A. ; et al. | 2021-07-29 |
| Integrated Circuits Including Customization Bits App 20210229426 - LINN; Scott A. ; et al. | 2021-07-29 |
| Fluidic Dies With Conductive Members App 20210229440 - CUMBIE; Michael W ; et al. | 2021-07-29 |
| Integrated Circuit With Address Drivers For Fluidic Die App 20210221120 - LINN; Scott A. ; et al. | 2021-07-22 |
| Fluid Ejection Devices Including Contact Pads App 20210221133 - GARDNER; James Michael ; et al. | 2021-07-22 |
| Logic Circuitry Package App 20210221121 - LINN; Scott A. ; et al. | 2021-07-22 |
| Print Component With Memory Array Using Intermittent Clock Signal App 20210221127 - GARDNER; James Michael ; et al. | 2021-07-22 |
| Cross-die recirculation channels and chamber recirculation channels Grant 11,065,883 - Chen , et al. July 20, 2 | 2021-07-20 |
| Integrated Circuits Including Memory Cells App 20210213731 - LINN; Scott A. ; et al. | 2021-07-15 |
| Multiple Circuits Coupled To An Interface App 20210213732 - GARDNER; James Michael ; et al. | 2021-07-15 |
| Fluidic ejection dies with enclosed cross-channels Grant 11,059,291 - Choy , et al. July 13, 2 | 2021-07-13 |
| Microfluidic Device Channel Layer App 20210197199 - SHKOLNIKOV; Viktor ; et al. | 2021-07-01 |
| Fluid ejection die heat exchangers Grant 11,046,073 - Chen , et al. June 29, 2 | 2021-06-29 |
| Liquid level sensing Grant 11,046,084 - Cumbie , et al. June 29, 2 | 2021-06-29 |
| Fluid Ejection Assemblies App 20210187957 - Choy; Si-lam ; et al. | 2021-06-24 |
| Nozzle arrangements Grant 11,034,151 - Cook , et al. June 15, 2 | 2021-06-15 |
| Logic circuitry Grant 11,034,157 - Gardner , et al. June 15, 2 | 2021-06-15 |
| Embedded Microfluidic Devices App 20210170401 - CHEN; Chien-Hua ; et al. | 2021-06-10 |
| Fluid Testing App 20210170396 - CUMBIE; Michael W. ; et al. | 2021-06-10 |
| Printhead Grant 11,020,967 - Chen , et al. June 1, 2 | 2021-06-01 |
| Fluid property sensing with electrodes Grant 11,009,383 - Cumbie , et al. May 18, 2 | 2021-05-18 |
| Liquid level sensing Grant 11,009,382 - Chen , et al. May 18, 2 | 2021-05-18 |
| Fluid Dispenser App 20210138470 - Shkolnikov; Viktor ; et al. | 2021-05-13 |
| Fluidic Ejection Dies With Enclosed Cross-channels App 20210129534 - Choy; Si-lam ; et al. | 2021-05-06 |
| Slidable Service Assemblies App 20210129536 - Choy; Si-lam ; et al. | 2021-05-06 |
| Fluid Property Sensor App 20210129549 - Cumbie; Michael W ; et al. | 2021-05-06 |
| Fluid Property Sensor App 20210129550 - Chen; Chien-Hua ; et al. | 2021-05-06 |
| Molded fluid flow structure with saw cut channel Grant 10,994,541 - Chen , et al. May 4, 2 | 2021-05-04 |
| Fluid flow structure forming method Grant 10,994,539 - Chen , et al. May 4, 2 | 2021-05-04 |
| Detecting a level of printable fluid in a container Grant 10,960,658 - Anderson , et al. March 30, 2 | 2021-03-30 |
| Logic Circuitry App 20210078334 - GARDNER; James Michael ; et al. | 2021-03-18 |
| Encapsulating a bonded wire with low profile encapsulation Grant 10,946,658 - Chen , et al. March 16, 2 | 2021-03-16 |
| Fluid ejection die fluid recirculation Grant 10,946,648 - Chen , et al. March 16, 2 | 2021-03-16 |
| Logic circuitry Grant 10,940,693 - Gardner , et al. March 9, 2 | 2021-03-09 |
| Detecting fluid levels using a variable threshold voltage Grant 10,940,694 - Anderson , et al. March 9, 2 | 2021-03-09 |
| Temperature-cycling Microfluidic Devices App 20210060548 - HIGGINS; Adam ; et al. | 2021-03-04 |
| Detecting fluid levels using a counter Grant 10,933,648 - Anderson , et al. March 2, 2 | 2021-03-02 |
| Fluid dispenser Grant 10,933,640 - Chen , et al. March 2, 2 | 2021-03-02 |
| Logic Circuitry App 20210053353 - GARDNER; James Michael ; et al. | 2021-02-25 |
| Printing apparatus and methods for detecting fluid levels Grant 10,926,548 - Anderson , et al. February 23, 2 | 2021-02-23 |
| Logic Circuitry App 20210046760 - GARDNER; James Michael ; et al. | 2021-02-18 |
| Imaging Medium App 20210039401 - BHATT; Jayprakash C. ; et al. | 2021-02-11 |
| Imaging Medium App 20210039414 - Bhatt; Jayprakash C. ; et al. | 2021-02-11 |
| Print Head Interposers App 20210039390 - Cumbie; Michael W. ; et al. | 2021-02-11 |
| Imaging Medium App 20210023867 - Bhatt; Jayprakash C. ; et al. | 2021-01-28 |
| Logic circuitry Grant 10,894,423 - Gardner , et al. January 19, 2 | 2021-01-19 |
| Logic circuitry Grant 10,875,318 - Gardner , et al. December 29, 2 | 2020-12-29 |
| Nozzle Arrangements And Feed Holes App 20200398564 - Cook; Galen ; et al. | 2020-12-24 |
| Nozzle Arrangements And Supply Channels App 20200398563 - Cook; Galen ; et al. | 2020-12-24 |
| Logic Circuitry App 20200398579 - GARDNER; James Michael ; et al. | 2020-12-24 |
| Nozzle Arrangements App 20200398562 - Cook; Galen ; et al. | 2020-12-24 |
| Fluid ejection device including integrated circuit Grant 10,864,719 - Cumbie , et al. December 15, 2 | 2020-12-15 |
| Logic Circuitry App 20200376849 - GARDNER; James Michael ; et al. | 2020-12-03 |
| Fluid Thermal Processing App 20200368750 - ELY; Hilary ; et al. | 2020-11-26 |
| Molded Printhead App 20200369031 - Choy; Silam J. ; et al. | 2020-11-26 |
| Print head interposers Grant 10,836,162 - Cumbie , et al. November 17, 2 | 2020-11-17 |
| Printing fluid cartridge with electrodes and method to the level of fluid in a printing fluid cartridge Grant 10,836,178 - Ge , et al. November 17, 2 | 2020-11-17 |
| Molded printhead Grant 10,836,169 - Choy , et al. November 17, 2 | 2020-11-17 |
| Detecting fluid levels using a voltage comparator Grant 10,837,818 - Anderson , et al. November 17, 2 | 2020-11-17 |
| Frame layer receiving a substrate supported SEL stage Grant 10,830,704 - Chen , et al. November 10, 2 | 2020-11-10 |
| Liquid Level Indicating App 20200348163 - Cumbie; Michael W. ; et al. | 2020-11-05 |
| Transfer molded fluid flow structure Grant 10,821,729 - Chen , et al. November 3, 2 | 2020-11-03 |
| Two-step Molding For A Lead Frame App 20200343153 - Cumbie; Michael W. ; et al. | 2020-10-29 |
| Composite wafers Grant 10,815,121 - Choy , et al. October 27, 2 | 2020-10-27 |
| Fluid Ejection Device Including Fluid Output Channel App 20200331264 - Cumbie; Michael W ; et al. | 2020-10-22 |
| Complex Impedance Detection App 20200331259 - CHEN; Chien-Hua ; et al. | 2020-10-22 |
| Printbars and methods of forming printbars Grant 10,780,696 - Chen , et al. Sept | 2020-09-22 |
| Fluid ejection dies Grant 10,780,697 - Chen , et al. Sept | 2020-09-22 |
| Fluid Circulation And Ejection App 20200290365 - Choy; Si-lam ; et al. | 2020-09-17 |
| Planarization Layers Over Silicon Dies App 20200282394 - Cumbie; Michael W. ; et al. | 2020-09-10 |
| Cross-die Recirculation Channels And Chamber Recirculation Channels App 20200282738 - Chen; Chien-Hua ; et al. | 2020-09-10 |
| Relative pressure sensor Grant 10,753,815 - Cumbie , et al. A | 2020-08-25 |
| Flexible carrier for fluid flow structure Grant 10,751,997 - Chen , et al. A | 2020-08-25 |
| Liquid level indicating Grant 10,739,181 - Cumbie , et al. A | 2020-08-11 |
| Microfluidic Devices App 20200246799 - Kind Code | 2020-08-06 |
| Fluid Ejection Die Molded Into Molded Body App 20200247123 - Kind Code | 2020-08-06 |
| Fluid Ejection Die Heat Exchangers App 20200238695 - Chen; Chien-Hua ; et al. | 2020-07-30 |
| Fluidic Dies App 20200238699 - Choy; Si-lam ; et al. | 2020-07-30 |
| Fluid ejection device including fluid output channel Grant 10,723,128 - Cumbie , et al. | 2020-07-28 |
| Fluid Ejection Die Interlocked With Molded Body App 20200223226 - Cumbie; Michael W ; et al. | 2020-07-16 |
| Electroporation App 20200224145 - Shkolnikov; Viktor ; et al. | 2020-07-16 |
| Microfluidic Devices With Lid For Loading Fluid App 20200206734 - ELY; Hilary ; et al. | 2020-07-02 |
| Microfluidic Package App 20200197935 - CHEN; Chien-Hua ; et al. | 2020-06-25 |
| Ionic Species Interrogation And Sensing App 20200197936 - ELY; Hilary ; et al. | 2020-06-25 |
| Fluidic Dies With Inlet And Outlet Channels App 20200198340 - Cumbie; Michael W. ; et al. | 2020-06-25 |
| Printing system with a fluid circulating element Grant 10,688,785 - Korthuis , et al. | 2020-06-23 |
| Multizonal Microfluidic Devices App 20200188914 - TORNIAINEN; Erik D. ; et al. | 2020-06-18 |
| Circuit package Grant 10,685,898 - Chen , et al. | 2020-06-16 |
| Molded Die Slivers With Exposed Front And Back Surfaces App 20200180314 - Chen; Chien-Hua ; et al. | 2020-06-11 |
| Optical fiber interface for optical device package Grant 10,677,995 - Morris , et al. | 2020-06-09 |
| Logic Circuitry App 20200171836 - GARDNER; James Michael ; et al. | 2020-06-04 |
| Die Contact Formations App 20200164645 - Cumbie; Michael W ; et al. | 2020-05-28 |
| Fluidic Ejection Dies With Enclosed Cross-channels App 20200164647 - Choy; Si-lam ; et al. | 2020-05-28 |
| Printheads and methods of fabricating a printhead Grant 10,661,567 - Cumbie , et al. | 2020-05-26 |
| Preloaded Storage Container And Print Head To Dispense Fluid App 20200147972 - Nielsen; Jeffrey A. ; et al. | 2020-05-14 |
| Fluid level sensor Grant 10,647,128 - Chen , et al. | 2020-05-12 |
| Encapsulating a Bonded Wire with Low Profile Encapsulation App 20200139705 - Chen; Chien-Hua ; et al. | 2020-05-07 |
| Circuit Package App 20200144148 - Chen; Chien-Hua ; et al. | 2020-05-07 |
| Microelectromechanical system (MEMS) devices Grant 10,640,369 - Chen , et al. | 2020-05-05 |
| Microfluidic Chip App 20200129979 - SHKOLNIKOV; Viktor ; et al. | 2020-04-30 |
| Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure Grant 10,632,752 - Chen , et al. | 2020-04-28 |
| Electrowetting Force Droplet Manipulation App 20200108394 - CUMBIE; Michael W. ; et al. | 2020-04-09 |
| Printhead Grant 10,603,911 - Chen , et al. | 2020-03-31 |
| Method of making a fluid structure having compression molded fluid channel Grant 10,603,916 - Chen , et al. | 2020-03-31 |
| Chip To Chip Fluidic Interconnect App 20200094247 - CUMBIE; Michael W. ; et al. | 2020-03-26 |
| Molded Panels App 20200094475 - Chen; Chien-Hua ; et al. | 2020-03-26 |
| Fluidic die Grant 10,589,522 - Linn , et al. | 2020-03-17 |
| Coplanar Fluidic Interconnect App 20200070160 - Chen; Chien-Hua ; et al. | 2020-03-05 |
| Fluid reservoir with fluid property and level detection Grant 10,576,748 - Ge , et al. | 2020-03-03 |
| Fluid Ejection Die Fluid Recirculation App 20200061992 - Chen; Chien-Hua ; et al. | 2020-02-27 |
| Cassette Substrates Made Of Polyetherimide App 20200061602 - Lutnesky; Gary G. ; et al. | 2020-02-27 |
| Substrate supported SEL stage and housing Grant 10,557,798 - Chen , et al. Feb | 2020-02-11 |
| Circuit package Grant 10,559,512 - Chen , et al. Feb | 2020-02-11 |
| Coplanar Microfluidic Manipulation App 20200038872 - Cumbie; Michael W. ; et al. | 2020-02-06 |
| Printhead App 20200031126 - Chen; Chien-Hua ; et al. | 2020-01-30 |
| Printbars And Methods Of Forming Printbars App 20200023641 - Chen; Chien-Hua ; et al. | 2020-01-23 |
| Fire pulse width adjustment Grant 10,532,568 - Korthuis , et al. Ja | 2020-01-14 |
| Printhead structure Grant 10,532,571 - Chen , et al. Ja | 2020-01-14 |
| Fluid Ejection Dies App 20190389220 - Chen; Chien-Hua ; et al. | 2019-12-26 |
| Molded die slivers with exposed front and back surfaces Grant 10,500,859 - Chen , et al. Dec | 2019-12-10 |
| Printed Circuit Board Fluid Ejection Apparatus App 20190366719 - Chen; Chien-Hua ; et al. | 2019-12-05 |
| Liquid Level Sensor Circuit App 20190368911 - Chen; Chien-Hua ; et al. | 2019-12-05 |
| Fluid level sensing with protective member Grant 10,493,766 - Chen , et al. De | 2019-12-03 |
| Printhead electrical interconnects Grant 10,479,085 - Mourey , et al. Nov | 2019-11-19 |
| Printhead Grant 10,471,714 - Chen , et al. Nov | 2019-11-12 |
| Molded fluid flow structure Grant 10,464,324 - Chen , et al. No | 2019-11-05 |
| Fluid Ejection Device Including Fluid Output Channel App 20190315125 - Cumbie; Michael W ; et al. | 2019-10-17 |
| Printing element temperature adjustment Grant 10,434,770 - Clark , et al. O | 2019-10-08 |
| Circuit packages comprising epoxy mold compounds and methods of compression molding Grant 10,438,864 - Chen , et al. O | 2019-10-08 |
| Fluid ejection die and glass-based support substrate Grant 10,434,774 - Chen , et al. O | 2019-10-08 |
| Printer circuit board fluid ejection apparatus Grant 10,427,407 - Chen , et al. October 1, 2 | 2019-10-01 |
| Print bar sensors Grant 10,427,406 - Clark , et al. October 1, 2 | 2019-10-01 |
| Printbars and methods of forming printbars Grant 10,421,274 - Chen , et al. Sept | 2019-09-24 |
| Molded printhead Grant 10,421,279 - Chen , et al. Sept | 2019-09-24 |
| Fluid ejection die and plastic-based substrate Grant 10,421,278 - Chen , et al. Sept | 2019-09-24 |
| Inkjet printhead Grant 10,384,450 - Chen , et al. A | 2019-08-20 |
| Cassette Grant D857,230 - Lutnesky , et al. A | 2019-08-20 |
| Fluid Ejection Device App 20190248141 - Chen; Chien-Hua ; et al. | 2019-08-15 |
| Overmolded ink delivery device Grant 10,377,142 - Chen , et al. A | 2019-08-13 |
| Fluid Reservoir With Fluid Property And Level Detection App 20190240985 - Ge; Ning ; et al. | 2019-08-08 |
| Service structures in print heads Grant 10,369,793 - Mourey , et al. | 2019-08-06 |
| Printing Fluid Cartridge With Electrodes And Method To The Level Of Fluid In A Printing Fluid Cartridge App 20190232673 - Ge; Ning ; et al. | 2019-08-01 |
| Printheads with pressure equalization Grant 10,363,745 - Clark , et al. | 2019-07-30 |
| Relative Pressure Sensor App 20190226930 - Cumbie; Michael W. ; et al. | 2019-07-25 |
| Circuit Package App 20190214325 - Chen; Chien-Hua ; et al. | 2019-07-11 |
| Printer cartridge with multiple fluid chambers in fluid communication Grant 10,343,397 - MacKenzie , et al. July 9, 2 | 2019-07-09 |
| Printed circuit board to molded compound interface Grant 10,342,140 - Chen , et al. | 2019-07-02 |
| Printing System With a Fluid Circulating Element App 20190184704 - Korthuis; Vincent C. ; et al. | 2019-06-20 |
| Circuit package having a plurality of epoxy mold compounds with different compositions Grant 10,319,657 - Chen , et al. | 2019-06-11 |
| Fluid Level Sensor App 20190168511 - Chen; Chien-Hua ; et al. | 2019-06-06 |
| Liquid Level Sensing App 20190162576 - Chen; Chien-Hua ; et al. | 2019-05-30 |
| Printed circuit board fluid ejection apparatus Grant 10,300,701 - Chen , et al. | 2019-05-28 |
| Wide array printhead module Grant 10,300,691 - Fricke , et al. | 2019-05-28 |
| Inkjet Printhead App 20190152225 - Chen; Chien-Hua ; et al. | 2019-05-23 |
| Substrate Supported Sel Stage And Housing App 20190145898 - Chen; Chien-Hua ; et al. | 2019-05-16 |
| Print Head Interposers App 20190143688 - Cumbie; Michael W. ; et al. | 2019-05-16 |
| Plurality Of Filters App 20190143325 - Chen; Chien-Hua ; et al. | 2019-05-16 |
| Microfluidic Device With Manifold App 20190144268 - Chen; Chien-Hua ; et al. | 2019-05-16 |
| Frame Layer Receiving A Substrate Supported Sel Stage App 20190145896 - Chen; Chien-Hua ; et al. | 2019-05-16 |
| Composite Wafers App 20190135615 - Choy; Si-lam J. ; et al. | 2019-05-09 |
| Fluid Ejection Device With A Portioning Wall App 20190134977 - CHEN; Chien-Hua ; et al. | 2019-05-09 |
| Detecting Fluid Levels Using A Voltage Comparator App 20190137316 - Anderson; Daryl E. ; et al. | 2019-05-09 |
| Printing Apparatus And Methods For Detecting Fluid Levels App 20190126631 - Anderson; Daryl E. ; et al. | 2019-05-02 |
| Fluid ejection device Grant 10,272,680 - Chen , et al. | 2019-04-30 |
| Circuit package Grant 10,276,468 - Chen , et al. | 2019-04-30 |
| Fluid Level Sensing With Protective Member App 20190118540 - Chen; Chien-Hua ; et al. | 2019-04-25 |
| Detecting A Level Of Printable Fluid In A Container App 20190118527 - Anderson; Daryl E. ; et al. | 2019-04-25 |
| Microelectromechanical System (mems) Devices App 20190119104 - Chen; Chien-Hua ; et al. | 2019-04-25 |
| Method Of Preparing Test Samples App 20190119723 - Cumbie; Michael W. ; et al. | 2019-04-25 |
| Fluid Property Sensing With Electrodes App 20190120678 - Cumbie; Michael W. ; et al. | 2019-04-25 |
| Inverted Tij App 20190111680 - Cumbie; Michael W ; et al. | 2019-04-18 |
| Fluid Dispenser App 20190111683 - Chen; Chien-Hua ; et al. | 2019-04-18 |
| Liquid Level Sensing App 20190111694 - Cumbie; Michael W. ; et al. | 2019-04-18 |
| Detecting Fluid Levels Using A Variable Threshold Voltage App 20190111696 - Anderson; Daryl E. ; et al. | 2019-04-18 |
| Detecting Fluid Levels Using A Counter App 20190111695 - Anderson; Daryl E. ; et al. | 2019-04-18 |
| Printing system with a fluid circulating element Grant 10,245,830 - Korthuis , et al. | 2019-04-02 |
| Monolithic Carrier Structure For Digital Dispensing App 20190083972 - NIELSEN; Jeffrey A. ; et al. | 2019-03-21 |
| Fluid flow structure Grant 10,232,618 - Chen , et al. | 2019-03-19 |
| Printhead with s-shaped die Grant 10,232,620 - Cumbie , et al. | 2019-03-19 |
| Printhead with bond pad surrounded by dam Grant 10,232,619 - Chen , et al. | 2019-03-19 |
| Monolithic Carrier Structure Including Fluid Routing For Digital Dispensing App 20190076837 - NIELSEN; Jeffrey A. ; et al. | 2019-03-14 |
| Printbars and methods of forming printbars Grant 10,226,926 - Chen , et al. | 2019-03-12 |
| Molded printhead structure Grant 10,220,620 - Chen , et al. | 2019-03-05 |
| Microfluidic Device With Capillary Chamber App 20190060898 - MOUREY; Devin Alexander ; et al. | 2019-02-28 |
| Selecting nozzles Grant 10,207,497 - Cumbie , et al. Feb | 2019-02-19 |
| Print head interposers Grant 10,207,500 - Cumbie , et al. Feb | 2019-02-19 |
| Printhead cartridge molded with nozzle health sensor Grant 10,207,508 - Chen , et al. Feb | 2019-02-19 |
| Printhead die Grant 10,195,851 - Chen , et al. Fe | 2019-02-05 |
| Fire Pulse Width Adjustment App 20190030888 - Korthuis; Vincent C. ; et al. | 2019-01-31 |
| Printing fluid cartridge Grant 10,189,265 - Chen , et al. Ja | 2019-01-29 |
| Fluidic Die App 20190016127 - Linn; Scott A. ; et al. | 2019-01-17 |
| Printhead With Non-epoxy Mold Compound App 20190009537 - Chen; Chien-Hua ; et al. | 2019-01-10 |
| Liquid Level Indicating App 20190011306 - Cumbie; Michael W. ; et al. | 2019-01-10 |
| Printhead App 20190001676 - Chen; Chien-Hua ; et al. | 2019-01-03 |
| Mixing Chamber For Laundry Supplies App 20190003097 - Cumbie; Michael W ; et al. | 2019-01-03 |
| Molded fluid flow structure Grant 10,166,776 - Chen , et al. J | 2019-01-01 |
| Automatic Order Of Laundry Supplies App 20180371666 - Laplante; Eric M ; et al. | 2018-12-27 |
| Water Sense Chamber App 20180371671 - CUMBIE; Michael W ; et al. | 2018-12-27 |
| Molded fluid flow structure Grant 10,160,213 - Chen , et al. Dec | 2018-12-25 |
| Flexible carrier for fluid flow structure Grant 10,160,209 - Chen , et al. Dec | 2018-12-25 |
| Molded Die Slivers With Exposed Front And Back Surfaces App 20180361744 - Chen; Chien-Hua ; et al. | 2018-12-20 |
| Fluid Ejection Die And Plastic-based Substrate App 20180354268 - Chen; Chien-Hua ; et al. | 2018-12-13 |
| Molded Fluid Flow Structure With Saw Cut Channel App 20180333956 - Chen; Chien-Hua ; et al. | 2018-11-22 |
| Flexible Carrier For Fluid Flow Structure App 20180326724 - Chen; Chien-Hua ; et al. | 2018-11-15 |
| Print Bar Sensors App 20180326728 - Clark; Garrett E. ; et al. | 2018-11-15 |
| Fluid Propelling Apparatus Including A Heat Sink App 20180319655 - Clark; Garrett E. ; et al. | 2018-11-08 |
| Relative Pressure Sensor App 20180321100 - Cumbie; Michael W. ; et al. | 2018-11-08 |
| Fluid Ejection Device Including Integrated Circuit App 20180319160 - Cumbie; Michael W. ; et al. | 2018-11-08 |
| Printheads App 20180311956 - Clark; Garrett E ; et al. | 2018-11-01 |
| Printheads App 20180311959 - Clark; Garrett E. ; et al. | 2018-11-01 |
| Fluid ejection device with fluid feed holes Grant 10,112,408 - Chen , et al. October 30, 2 | 2018-10-30 |
| Molded Printhead App 20180304633 - Choy; Silam J. ; et al. | 2018-10-25 |
| Wide Array Printhead Module App 20180304624 - Fricke; Peter James ; et al. | 2018-10-25 |
| Liquid level indicating Grant 10,107,667 - Cumbie , et al. October 23, 2 | 2018-10-23 |
| Printer Cartridge With Multiple Fluid Chambers In Fluid Communication App 20180281400 - MacKenzie; Mark H. ; et al. | 2018-10-04 |
| Molded fluid flow structure with saw cut channel Grant 10,081,188 - Chen , et al. September 25, 2 | 2018-09-25 |
| Molded die slivers with exposed front and back surfaces Grant 10,081,186 - Chen , et al. September 25, 2 | 2018-09-25 |
| Fluid Ejection Die And Glass-based Support Substrate App 20180264813 - Chen; Chien-Hua ; et al. | 2018-09-20 |
| Overmolded Ink Delivery Device App 20180264834 - Chen; Chien-Hua ; et al. | 2018-09-20 |
| Selecting Nozzles App 20180264806 - Cumbie; Michael W. ; et al. | 2018-09-20 |
| Circuit Package App 20180269125 - Chen; Chien-Hua ; et al. | 2018-09-20 |
| Service Structures In Print Heads App 20180244044 - MOUREY; Devin Alexander ; et al. | 2018-08-30 |
| Wide array printhead module Grant 10,046,562 - Fricke , et al. August 14, 2 | 2018-08-14 |
| Circuit Package App 20180226316 - Chen; Chien-Hua ; et al. | 2018-08-09 |
| Printhead App 20180222194 - CHEN; Chien-Hua ; et al. | 2018-08-09 |
| Printhead Electrical Interconnects App 20180222202 - Mourey; Devin Alexander ; et al. | 2018-08-09 |
| Printheads And Methods Of Fabricating A Printhead App 20180222201 - Cumbie; Michael W. ; et al. | 2018-08-09 |
| Printing System With A Fluid Circulating Element App 20180215150 - KORTHUIS; Vincent C. ; et al. | 2018-08-02 |
| Printhead With S-shaped Die App 20180215147 - Cumbie; Michael W. ; et al. | 2018-08-02 |
| Print Head Interposers App 20180215151 - Cumbie; Michael W. ; et al. | 2018-08-02 |
| Molded printhead Grant 10,029,467 - Choy , et al. July 24, 2 | 2018-07-24 |
| Optical Modules App 20180203194 - Chen; Chien-Hua ; et al. | 2018-07-19 |
| Fluidic die Grant 10,022,962 - Linn , et al. July 17, 2 | 2018-07-17 |
| Overmolded ink delivery device Grant 10,016,983 - Chen , et al. July 10, 2 | 2018-07-10 |
| Printed Circuit Board To Molded Compound Interface App 20180168049 - Chen; Chien-Hua ; et al. | 2018-06-14 |
| Selecting nozzles Grant 9,994,014 - Cumbie , et al. June 12, 2 | 2018-06-12 |
| Printhead With Bond Pad Surrounded By Dam App 20180154632 - Chen; Chien-Hua ; et al. | 2018-06-07 |
| Printbars And Methods Of Forming Printbars App 20180154633 - Chen; Chien-Hua ; et al. | 2018-06-07 |
| Printed Circuit Board Fluid Ejection Apparatus App 20180154636 - Chen; Chien-Hua ; et al. | 2018-06-07 |
| Thermal Control System For Multi-segment Printing App 20180147841 - Clark; Garrett E. ; et al. | 2018-05-31 |
| Molded Fluid Flow Structure App 20180141338 - Chen; Chien-Hua ; et al. | 2018-05-24 |
| Molded Fluid Flow Structure App 20180141337 - Chen; Chien-Hua ; et al. | 2018-05-24 |
| Molded Fluid Flow Structure App 20180134039 - Chen; Chien-Hua ; et al. | 2018-05-17 |
| Fluid Ejection Device App 20180134038 - Chen; Chien-Hua ; et al. | 2018-05-17 |
| Fluid Flow Structure App 20180126732 - Chen; Chien-Hua ; et al. | 2018-05-10 |
| Molded Printhead Structure App 20180111374 - Chen; Chien-Hua ; et al. | 2018-04-26 |
| Molded fluid flow structure Grant 9,944,080 - Chen , et al. April 17, 2 | 2018-04-17 |
| Liquid Level Indicating App 20180100753 - Cumbie; Michael W. ; et al. | 2018-04-12 |
| Printhead with bond pad surrounded by dam Grant 9,919,524 - Chen , et al. March 20, 2 | 2018-03-20 |
| Printed circuit board fluid ejection apparatus Grant 9,919,525 - Chen , et al. March 20, 2 | 2018-03-20 |
| Molded Printhead App 20180065374 - Chen; Chien-Hua ; et al. | 2018-03-08 |
| Molded print bar Grant 9,902,162 - Chen , et al. February 27, 2 | 2018-02-27 |
| Fluid flow structure Grant 9,895,888 - Chen , et al. February 20, 2 | 2018-02-20 |
| Molded printhead structure Grant 9,889,664 - Chen , et al. February 13, 2 | 2018-02-13 |
| Circuit Package App 20180025960 - Chen; Chien-Hua ; et al. | 2018-01-25 |
| Fluid Ejection Device With Fluid Feed Holes App 20180015732 - Chen; Chien Hua ; et al. | 2018-01-18 |
| Circuit Package App 20180012816 - Chen; Chien-Hua ; et al. | 2018-01-11 |
| Printhead Structure App 20180001636 - Chen; Zhizhang ; et al. | 2018-01-04 |
| Molded printhead Grant 9,844,946 - Chen , et al. December 19, 2 | 2017-12-19 |
| Printhead dies molded with nozzle health sensor Grant 9,770,909 - Chen , et al. September 26, 2 | 2017-09-26 |
| Printing fluid cartridge Grant 9,751,319 - Chen , et al. September 5, 2 | 2017-09-05 |
| Fluid structure with compression molded fluid channel Grant 9,731,509 - Chen , et al. August 15, 2 | 2017-08-15 |
| Molded die slivers with exposed front and back surfaces Grant 9,724,920 - Chen , et al. August 8, 2 | 2017-08-08 |
| Printhead die Grant 9,707,753 - Chen , et al. July 18, 2 | 2017-07-18 |
| Printbar and method of forming same Grant 9,676,192 - Chen , et al. June 13, 2 | 2017-06-13 |
| Molded fluid flow structure with saw cut channel Grant 9,656,469 - Chen , et al. May 23, 2 | 2017-05-23 |
| Molded printhead Grant 9,539,814 - Chen , et al. January 10, 2 | 2017-01-10 |
| Printed circuit board fluid ejection apparatus Grant 9,517,626 - Chen , et al. December 13, 2 | 2016-12-13 |
| Fluid ejection apparatuses including a substrate with a bulk layer and a epitaxial layer Grant 9,457,571 - Ge , et al. October 4, 2 | 2016-10-04 |
| Fluid ejection assembly and related methods Grant 9,033,470 - Bengali , et al. May 19, 2 | 2015-05-19 |
| Fluid nozzle array Grant 8,690,295 - Bengali , et al. April 8, 2 | 2014-04-08 |
| Firing signal forwarding in a fluid ejection device Grant 8,348,373 - Martin , et al. January 8, 2 | 2013-01-08 |
| Fluid ejection device with electrodes to generate electric field within chamber Grant 8,210,654 - Wei , et al. July 3, 2 | 2012-07-03 |
| Firing Signal Forwarding In A Fluid Ejection Device App 20100328391A1 - | 2010-12-30 |
| Modulated signal resonators Grant 7,729,576 - Kornilovich , et al. June 1, 2 | 2010-06-01 |
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