Crisp; Richard Dewitt

Patent Applications and Registrations

Patent applications and USPTO patent grants for Crisp; Richard Dewitt.The latest application filed is for "low-pincount high-bandwidth memory and memory bus".

Company Profile

6.122.121

Crisp; Richard Dewitt - Hornitos CA
Crisp; Richard Dewitt - Homitos CA
Crisp; Richard Dewitt - Castro Valley CA
Crisp; Richard DeWitt - San Jose CA
Crisp; Richard DeWitt - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low-Pincount High-Bandwidth Memory And Memory Bus App 20210294773 - Crisp; Richard Dewitt	2021-09-23
Low-pincount high-bandwidth memory and memory bus Grant 11,086,811 - Crisp August 10, 2	2021-08-10
Low-Pincount High-Bandwidth Memory And Memory Bus App 20200301870 - Crisp; Richard Dewitt	2020-09-24
Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows Grant 10,692,842 - Crisp , et al.	2020-06-23
Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows Grant 10,643,977 - Crisp , et al.	2020-05-05
Low-pincount high-bandwidth memory and memory bus Grant 10,642,776 - Crisp	2020-05-05
Superscalar Memory IC, Bus And System For Use Therein App 20200125506 - Crisp; Richard Dewitt	2020-04-23
Low-pincount High-bandwidth Memory And Memory Bus App 20190303337 - Crisp; Richard Dewitt	2019-10-03
Low-pincount high-bandwidth memory and memory bus Grant 10,380,060 - Crisp A	2019-08-13
Microelectronic Package Including Microelectronic Elements Having Stub Minimization For Wirebond Assemblies Without Windows App 20190035769 - Crisp; Richard Dewitt ; et al.	2019-01-31
Microelectronic Package Having Stub Minimization Using Symmetrically-Positioned Duplicate Sets of Terminals for Wirebond Assemblies Without Windows App 20180331074 - Crisp; Richard Dewitt ; et al.	2018-11-15
Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows Grant 10,090,280 - Crisp , et al. October 2, 2	2018-10-02
Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows Grant 10,032,752 - Crisp , et al. July 24, 2	2018-07-24
Microelectronic element with bond elements to encapsulation surface Grant 10,008,477 - Haba , et al. June 26, 2	2018-06-26
Flip-chip, Face-up And Face-down Centerbond Memory Wirebond Assemblies App 20180025967 - Haba; Belgacem ; et al.	2018-01-25
Low-pincount High-bandwidth Memory And Memory Bus App 20170364469 - Crisp; Richard Dewitt	2017-12-21
Flip-chip, face-up and face-down centerbond memory wirebond assemblies Grant 9,806,017 - Haba , et al. October 31, 2	2017-10-31
Stub Minimization For Wirebond Assemblies Without Windows App 20170256519 - Crisp; Richard Dewitt ; et al.	2017-09-07
Reconfigurable PoP Grant 9,728,495 - Haba , et al. August 8, 2	2017-08-08
Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other Grant 9,679,876 - Crisp , et al. June 13, 2	2017-06-13
Stub minimization for assemblies without wirebonds to package substrate Grant 9,679,838 - Crisp , et al. June 13, 2	2017-06-13
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20170084584 - Crisp; Richard Dewitt ; et al.	2017-03-23
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20170062389 - Crisp; Richard Dewitt ; et al.	2017-03-02
Microelectronic Element With Bond Elements To Encapsulation Surface App 20170025390 - Haba; Belgacem ; et al.	2017-01-26
Stub minimization using duplicate sets of signal terminals Grant 9,530,458 - Crisp , et al. December 27, 2	2016-12-27
Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis Grant 9,515,053 - Crisp , et al. December 6, 2	2016-12-06
Memory module in a package Grant 9,508,629 - Haba , et al. November 29, 2	2016-11-29
Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis Grant 9,496,243 - Crisp , et al. November 15, 2	2016-11-15
Enhanced stacked microelectronic assemblies with central contacts Grant 9,461,015 - Haba , et al. October 4, 2	2016-10-04
Single package dual channel memory with co-support Grant 9,460,758 - Crisp , et al. October 4, 2	2016-10-04
Stub Minimization For Wirebond Assemblies Without Windows App 20160276316 - Crisp; Richard Dewitt ; et al.	2016-09-22
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20160268187 - Crisp; Richard Dewitt ; et al.	2016-09-15
Microelectronic Package With Consolidated Chip Structures App 20160260671 - Haba; Belgacem ; et al.	2016-09-08
Multiple die face-down stacking for two or more die Grant 9,437,579 - Haba , et al. September 6, 2	2016-09-06
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 9,423,824 - Crisp , et al. August 23, 2	2016-08-23
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20160197058 - Crisp; Richard Dewitt ; et al.	2016-07-07
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20160190100 - Crisp; Richard Dewitt ; et al.	2016-06-30
Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows Grant 9,377,824 - Crisp , et al. June 28, 2	2016-06-28
Stub minimization for assemblies without wirebonds to package substrate Grant 9,373,565 - Crisp , et al. June 21, 2	2016-06-21
Memory Module In A Package App 20160172332 - Haba; Belgacem ; et al.	2016-06-16
Co-support circuit panel and microelectronic packages Grant 9,368,477 - Crisp , et al. June 14, 2	2016-06-14
Microelectronic package with consolidated chip structures Grant 9,355,996 - Haba , et al. May 31, 2	2016-05-31
Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics Grant 9,312,239 - Haba , et al. April 12, 2	2016-04-12
Stub Minimization Using Duplicate Sets Of Signal Terminals App 20160093339 - Crisp; Richard Dewitt ; et al.	2016-03-31
Co-support for XFD packaging Grant 9,293,444 - Crisp , et al. March 22, 2	2016-03-22
Memory module in a package Grant 9,287,216 - Haba , et al. March 15, 2	2016-03-15
Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows Grant 9,287,195 - Crisp , et al. March 15, 2	2016-03-15
Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate Grant 9,281,271 - Crisp , et al. March 8, 2	2016-03-08
RECONFIGURABLE PoP App 20160035656 - Haba; Belgacem ; et al.	2016-02-04
In-package fly-by signaling Grant 9,241,420 - Crisp , et al. January 19, 2	2016-01-19
Stub minimization using duplicate sets of signal terminals Grant 9,224,431 - Crisp , et al. December 29, 2	2015-12-29
Microelectronic Package With Consolidated Chip Structures App 20150371968 - Haba; Belgacem ; et al.	2015-12-24
Microelectronic unit and package with positional reversal Grant 9,219,050 - Crisp , et al. December 22, 2	2015-12-22
Co-support For Xfd Packaging App 20150364450 - Crisp; Richard Dewitt ; et al.	2015-12-17
Stub minimization with terminal grids offset from center of package Grant 9,214,455 - Crisp , et al. December 15, 2	2015-12-15
Single Package Dual Channel Memory With Co-support App 20150302901 - Crisp; Richard Dewitt ; et al.	2015-10-22
Impedence controlled packages with metal sheet or 2-layer RDL Grant 9,136,197 - Haba , et al. September 15, 2	2015-09-15
Microelectronic package with consolidated chip structures Grant 9,123,600 - Haba , et al. September 1, 2	2015-09-01
Co-support for XFD packaging Grant 9,123,555 - Crisp , et al. September 1, 2	2015-09-01
Lead structures with vertical offsets Grant 9,123,713 - Crisp , et al. September 1, 2	2015-09-01
Multiple Die In A Face Down Package App 20150243631 - Haba; Belgacem ; et al.	2015-08-27
Multiple Die Face-down Stacking For Two Or More Die App 20150221617 - Haba; Belgacem ; et al.	2015-08-06
Microelectronic Unit And Package With Positional Reversal App 20150214178 - Crisp; Richard Dewitt ; et al.	2015-07-30
Flip-chip, face-up and face-down wirebond combination package Grant 9,093,291 - Haba , et al. July 28, 2	2015-07-28
Stub minimization for multi-die wirebond assemblies with parallel windows App 20150198971 - Crisp; Richard Dewitt ; et al.	2015-07-16
Single package dual channel memory with co-support Grant 9,070,423 - Crisp , et al. June 30, 2	2015-06-30
Stub Minimization With Terminal Grids Offset From Center Of Package App 20150179619 - Crisp; Richard Dewitt ; et al.	2015-06-25
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Thermal Characteristics App 20150145117 - Haba; Belgacem ; et al.	2015-05-28
Flip-chip, Face-up And Face-down Centerbond Memory Wirebond Assemblies App 20150115477 - Haba; Belgacem ; et al.	2015-04-30
Co-support For Xfd Packaging App 20150115472 - Crisp; Richard Dewitt ; et al.	2015-04-30
Multiple die face-down stacking for two or more die Grant 9,013,033 - Haba , et al. April 21, 2	2015-04-21
Multiple die in a face down package Grant 9,000,583 - Haba , et al. April 7, 2	2015-04-07
Microelectronic unit and package with positional reversal Grant 8,994,170 - Crisp , et al. March 31, 2	2015-03-31
Microelectronic Element With Bond Elements To Encapsulation Surface App 20150076714 - Haba; Belgacem ; et al.	2015-03-19
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 8,981,547 - Crisp , et al. March 17, 2	2015-03-17
Impedance controlled packages with metal sheet or 2-layer rdl Grant 8,981,579 - Haba , et al. March 17, 2	2015-03-17
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Ground Or Power Distribution App 20150043181 - Haba; Belgacem ; et al.	2015-02-12
Manufacture of face-down microelectronic packages Grant 8,945,987 - Crisp , et al. February 3, 2	2015-02-03
Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics Grant 8,941,999 - Haba , et al. January 27, 2	2015-01-27
Flip-chip, face-up and face-down centerbond memory wirebond assemblies Grant 8,928,153 - Haba , et al. January 6, 2	2015-01-06
Stub minimization with terminal grids offset from center of package Grant 8,917,532 - Crisp , et al. December 23, 2	2014-12-23
Memory Module In A Package App 20140367866 - Haba; Belgacem ; et al.	2014-12-18
Single Package Dual Channel Memory With Co-support App 20140362629 - Crisp; Richard Dewitt ; et al.	2014-12-11
Power Boosting Circuit For Semiconductor Packaging App 20140333371 - Crisp; Richard Dewitt ; et al.	2014-11-13
Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution Grant 8,885,356 - Haba , et al. November 11, 2	2014-11-11
Stub Minimization For Wirebond Assemblies Without Windows App 20140328015 - Crisp; Richard Dewitt ; et al.	2014-11-06
Stub Minimization For Multi-die Wirebond Assemblies With Parallel Windows App 20140328016 - Crisp; Richard Dewitt ; et al.	2014-11-06
Impedance Controlled Packages With Metal Sheet Or 2-layer Rdl App 20140291871 - Haba; Belgacem ; et al.	2014-10-02
Co-support module and microelectronic assembly Grant 8,848,392 - Crisp , et al. September 30, 2	2014-09-30
Co-support component and microelectronic assembly Grant 8,848,391 - Crisp , et al. September 30, 2	2014-09-30
Manufacture Of Face-down Microelectronic Packages App 20140273346 - Crisp; Richard Dewitt ; et al.	2014-09-18
In-package Fly-by Signaling App 20140268537 - Crisp; Richard Dewitt ; et al.	2014-09-18
Memory module in a package Grant 8,823,165 - Haba , et al. September 2, 2	2014-09-02
Microelectronic Unit And Package With Positional Reversal App 20140239491 - Crisp; Richard Dewitt ; et al.	2014-08-28
Microelectronic Package With Consolidated Chip Structures App 20140239514 - Haba; Belgacem ; et al.	2014-08-28
Enhanced Stacked Microelectronic Assemblies With Central Contacts App 20140239513 - Haba; Belgacem ; et al.	2014-08-28
Enhanced stacked microelectronic assemblies with central contacts Grant 8,787,032 - Haba , et al. July 22, 2	2014-07-22
Reconfigurable pop Grant 8,786,069 - Haba , et al. July 22, 2	2014-07-22
Co-support system and microelectronic assembly Grant 8,787,034 - Crisp , et al. July 22, 2	2014-07-22
Impedance controlled packages with metal sheet or 2-layer RDL Grant 8,786,083 - Haba , et al. July 22, 2	2014-07-22
Stub Minimization Using Duplicate Sets Of Signal Terminals App 20140185354 - Crisp; Richard Dewitt ; et al.	2014-07-03
Deskewed multi-die packages Grant 8,759,982 - Crisp , et al. June 24, 2	2014-06-24
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20140167278 - Crisp; Richard Dewitt ; et al.	2014-06-19
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20140167279 - Crisp; Richard Dewitt ; et al.	2014-06-19
In-package fly-by signaling Grant 8,723,329 - Crisp , et al. May 13, 2	2014-05-13
Multiple Die In A Face Down Package App 20140117516 - Haba; Belgacem ; et al.	2014-05-01
Co-support Circuit Panel And Microelectronic Packages App 20140110832 - Crisp; Richard Dewitt ; et al.	2014-04-24
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20140103535 - Crisp; Richard Dewitt ; et al.	2014-04-17
Power boosting circuit for semiconductor packaging Grant 8,692,611 - Crisp , et al. April 8, 2	2014-04-08
Stub minimization using duplicate sets of signal terminals Grant 8,670,261 - Crisp , et al. March 11, 2	2014-03-11
Co-support Component And Microelectronic Assembly App 20140055970 - Crisp; Richard Dewitt ; et al.	2014-02-27
Co-support System And Microelectronic Assembly App 20140055941 - Crisp; Richard Dewitt ; et al.	2014-02-27
Co-support Module And Microelectronic Assembly App 20140055942 - Crisp; Richard Dewitt ; et al.	2014-02-27
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Grant 8,659,140 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Grant 8,659,141 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Grant 8,659,139 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization for wirebond assemblies without windows Grant 8,659,143 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization for wirebond assemblies without windows Grant 8,659,142 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Grant 8,653,646 - Crisp , et al. February 18, 2	2014-02-18
Flip-chip, Face-up And Face-down Wirebond Combination Package App 20140042644 - Haba; Belgacem ; et al.	2014-02-13
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Thermal Characteristics App 20140035121 - Haba; Belgacem ; et al.	2014-02-06
Stub minimization for assemblies without wirebonds to package substrate Grant 8,629,545 - Crisp , et al. January 14, 2	2014-01-14
Stub minimization for assemblies without wirebonds to package substrate Grant 8,610,260 - Crisp , et al. December 17, 2	2013-12-17
Deskewed Multi-die Packages App 20130307138 - Crisp; Richard Dewitt ; et al.	2013-11-21
Lead Structures With Vertical Offsets App 20130299958 - Crisp; Richard Dewitt ; et al.	2013-11-14
Stub Minimization Using Duplicate Sets Of Signal Terminals App 20130286707 - Crisp; Richard Dewitt ; et al.	2013-10-31
Multiple die in a face down package Grant 8,569,884 - Haba , et al. October 29, 2	2013-10-29
Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics Grant 8,553,420 - Haba , et al. October 8, 2	2013-10-08
Stub minimization for assemblies without wirebonds to package substrate Grant 8,525,327 - Crisp , et al. September 3, 2	2013-09-03
Memory module in a package Grant 8,513,817 - Haba , et al. August 20, 2	2013-08-20
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Grant 8,513,813 - Crisp , et al. August 20, 2	2013-08-20
De-skewed multi-die packages Grant 8,502,390 - Crisp , et al. August 6, 2	2013-08-06
Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution Grant 8,466,564 - Haba , et al. June 18, 2	2013-06-18
Multiple Die Face-down Stacking For Two Or More Die App 20130127062 - Haba; Belgacem ; et al.	2013-05-23
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 8,441,111 - Crisp , et al. May 14, 2	2013-05-14
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Grant 8,436,477 - Crisp , et al. May 7, 2	2013-05-07
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 8,436,457 - Crisp , et al. May 7, 2	2013-05-07
Flip-chip, face-up and face-down wirebond combination package Grant 8,436,458 - Haba , et al. May 7, 2	2013-05-07
Stub Minimization For Wirebond Assemblies Without Windows App 20130082397 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Multi-die Wirebond Assemblies With Parallel Windows App 20130083583 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization With Terminal Grids Offset From Center Of Package App 20130083584 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20130082380 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20130082389 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Multi-die Wirebond Assemblies With Parallel Windows App 20130082394 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20130083582 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Wirebond Assemblies Without Windows App 20130082391 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20130082375 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20130082374 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20130082390 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20130082395 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Wirebond Assemblies Without Windows App 20130082398 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20130082381 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20130082396 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub minimization for wirebond assemblies without windows Grant 8,405,207 - Crisp , et al. March 26, 2	2013-03-26
Flip-chip, Face-up And Face-down Wirebond Combination Package App 20130056870 - Haba; Belgacem ; et al.	2013-03-07
Multiple Die In A Face Down Package App 20130043582 - Haba; Belgacem ; et al.	2013-02-21
Power Boosting Circuit For Semiconductor Packaging App 20130043935 - Crisp; Richard Dewitt ; et al.	2013-02-21
Memory Module In A Package App 20130015591 - Haba; Belgacem ; et al.	2013-01-17
De-skewed Multi-die Packages App 20130015586 - Crisp; Richard Dewitt ; et al.	2013-01-17
Memory Module In A Package App 20130015590 - Haba; Belgacem ; et al.	2013-01-17
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 8,345,441 - Crisp , et al. January 1, 2	2013-01-01
Multiple die face-down stacking for two or more die Grant 8,338,963 - Haba , et al. December 25, 2	2012-12-25
Impedence Controlled Packages With Metal Sheet Or 2-layer Rdl App 20120313228 - Haba; Belgacem ; et al.	2012-12-13
Flip-chip, face-up and face-down wirebond combination package Grant 8,304,881 - Haba , et al. November 6, 2	2012-11-06
Multiple Die Face-down Stacking For Two Or More Die App 20120267798 - Haba; Belgacem ; et al.	2012-10-25
Flip-chip, Face-up And Face-down Wirebond Combination Package App 20120267797 - Haba; Belgacem ; et al.	2012-10-25
Flip-chip, Face-up And Face-down Centerbond Memory Wirebond Assemblies App 20120267796 - Haba; Belgacem ; et al.	2012-10-25
Stub minimization for multi-die wirebond assemblies with orthogonal windows Grant 8,278,764 - Crisp , et al. October 2, 2	2012-10-02
Stub minimization for multi-die wirebond assemblies with orthogonal windows Grant 8,254,155 - Crisp , et al. August 28, 2	2012-08-28
Metal can impedance control structure Grant 8,222,725 - Haba , et al. July 17, 2	2012-07-17
Enhanced Stacked Microelectronic Assemblies With Central Contacts App 20120155049 - Haba; Belgacem ; et al.	2012-06-21
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Ground Or Power Distribution App 20120153435 - Haba; Belgacem ; et al.	2012-06-21
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Ground Or Power Distribution App 20120155042 - Haba; Belgacem ; et al.	2012-06-21
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Thermal Characteristics App 20120092832 - Haba; Belgacem ; et al.	2012-04-19
Metal Can Impedance Control Structure App 20120068365 - Haba; Belgacem ; et al.	2012-03-22
Impedance Controlled Packages With Metal Sheet Or 2-layer Rdl App 20120068338 - Haba; Belgacem ; et al.	2012-03-22
Methods for forming connection structures for microelectronic devices Grant 7,793,414 - Haba , et al. September 14, 2	2010-09-14
Microelectronic package having interconnected redistribution paths Grant 7,768,117 - Haba , et al. August 3, 2	2010-08-03
Wafer level compliant packages for rear-face illuminated solid state image sensors App 20100053407 - Crisp; Richard Dewitt ; et al.	2010-03-04
Wafer Level Packages For Rear-face Illuminated Solid State Image Sensors App 20090212381 - Crisp; Richard Dewitt ; et al.	2009-08-27
Stack microelectronic assemblies Grant 7,545,029 - Wilson , et al. June 9, 2	2009-06-09
Packages and assemblies including lidded chips App 20080296717 - Beroz; Masud ; et al.	2008-12-04
Transmission line stacking App 20080296748 - Haba; Belgacem ; et al.	2008-12-04
Microelectronic packages and methods therefor App 20080185705 - Osborn; Philip R. ; et al.	2008-08-07
Stacked microelectronic assemblies and methods therefor App 20080042250 - Wilson; Stuart E. ; et al.	2008-02-21
Microelectronic package having stacked semiconductor devices and a process for its fabrication Grant 7,317,249 - Crisp , et al. January 8, 2	2008-01-08
Connection structures for microelectronic devices and methods for forming such structures Grant 7,262,368 - Haba , et al. August 28, 2	2007-08-28
Methods for forming connection structures for microelectronic devices App 20070094874 - Haba; Belgacem ; et al.	2007-05-03
Microelectronic package having stacked semiconductor devices and a process for its fabrication App 20060138647 - Crisp; Richard Dewitt ; et al.	2006-06-29
Solder ball formation and transfer method App 20060108402 - Crisp; Richard Dewitt ; et al.	2006-05-25
Connection structures for microelectronic devices and methods for forming such structures App 20060032670 - Haba; Belgacem ; et al.	2006-02-16
Package element and packaged chip having severable electrically conductive ties App 20050139984 - Tuckerman, David B. ; et al.	2005-06-30
High-frequency bus system Grant 6,266,730 - Perino , et al. July 24, 2	2001-07-24
High frequency bus system Grant 6,067,594 - Perino , et al. May 23, 2	2000-05-23
Method and apparatus for writing to memory components Grant 5,956,284 - Ware , et al. September 21, 1	1999-09-21
Method and apparatus for writing to memory components Grant 5,680,361 - Ware , et al. October 21, 1	1997-10-21