Cowley; Andrew P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cowley; Andrew P..The latest application filed is for "via bottom contact and method of manufacturing same".

Company Profile

0.14.16

Cowley; Andrew P. - Wappingers Falls NY
Cowley; Andrew P. - Hopewell Junction NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for prediction of premature dielectric breakdown in a semiconductor Grant 8,053,257 - Chanda , et al. November 8, 2	2011-11-08
Via bottom contact and method of manufacturing same Grant 7,830,019 - Chanda , et al. November 9, 2	2010-11-09
Structure for modeling stress-induced degradation of conductive interconnects Grant 7,692,439 - Chanda , et al. April 6, 2	2010-04-06
Structure for monitoring stress-induced degradation of conductive interconnects Grant 7,639,032 - Chanda , et al. December 29, 2	2009-12-29
Interconnect structure Grant 7,598,616 - Yang , et al. October 6, 2	2009-10-06
VIA bottom contact and method of manufacturing same Grant 7,585,764 - Chanda , et al. September 8, 2	2009-09-08
Via Bottom Contact And Method Of Manufacturing Same App 20090200673 - Chanda; Kaushik ; et al.	2009-08-13
Method of fabrication of interconnect structures Grant 7,563,710 - Yang , et al. July 21, 2	2009-07-21
Interconnect structure and method of fabrication of same Grant 7,528,493 - Yang , et al. May 5, 2	2009-05-05
Back end interconnect with a shaped interface Grant 7,494,915 - Clevenger , et al. February 24, 2	2009-02-24
Interconnect Structure And Method Of Fabrication Of Same App 20080246151 - Yang; Chih-Chao ; et al.	2008-10-09
Structure for modeling stress-induced degradation of conductive interconnects App 20080231312 - Chanda; Kaushik ; et al.	2008-09-25
Method For Prediction Of Premature Dielectric Breakdown In A Semiconductor App 20080174334 - Chanda; Kaushik ; et al.	2008-07-24
Structure and method for monitoring stress-induced degradation of conductive interconnects Grant 7,397,260 - Chanda , et al. July 8, 2	2008-07-08
Method for monitoring stress-induced degradation of conductive interconnects App 20080107149 - Chanda; Kaushik ; et al.	2008-05-08
Interconnect structure and method of fabrication of same Grant 7,335,588 - Yang , et al. February 26, 2	2008-02-26
Interconnect Structure And Method Of Fabrication Of Same App 20080014744 - Yang; Chih-Chao ; et al.	2008-01-17
Interconnect Structure And Method Of Fabrication Of Same App 20080006944 - Yang; Chih-Chao ; et al.	2008-01-10
Structure And Method For Monitoring Stress-induced Degradation Of Conductive Interconnects App 20070115018 - Chanda; Kaushik ; et al.	2007-05-24
Post-etch removal of fluorocarbon-based residues from a hybrid dielectric structure App 20070059922 - Clevenger; Lawrence A. ; et al.	2007-03-15
Via Bottom Contact And Method Of Manufacturing Same App 20070037403 - Chanda; Kaushik ; et al.	2007-02-15
Back End Interconnect With A Shaped Interface App 20060292852 - Clevenger; Lawrence A. ; et al.	2006-12-28
Method For Prediction Of Premature Dielectric Breakdown In A Semiconductor App 20060281338 - Chanda; Kaushik ; et al.	2006-12-14
Interconnect structure and method of fabrication of same App 20060234497 - Yang; Chih-Chao ; et al.	2006-10-19
Back end interconnect with a shaped interface Grant 7,122,462 - Clevenger , et al. October 17, 2	2006-10-17
Crystallographic modification of hard mask properties Grant 7,001,835 - Clevenger , et al. February 21, 2	2006-02-21
Back End Interconnect With a Shaped Interface App 20050112864 - Clevenger, Lawrence A. ; et al.	2005-05-26
Crystallographic Modification of Hard mask Properties App 20050112862 - Clevenger, Lawrence A. ; et al.	2005-05-26
Method of forming an on-chip decoupling capacitor with bottom hardmask Grant 6,387,754 - Dalton , et al. May 14, 2	2002-05-14
Method of forming an on-chip decoupling capacitor with bottom hardmask App 20010036753 - Dalton, Timothy J. ; et al.	2001-11-01

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