Corona; Pietro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Corona; Pietro.The latest application filed is for "process for manufacturing a wafer by annealing of buried channels".

Company Profile

1.27.23

Corona; Pietro - Milan N/A IT
CORONA; Pietro - Roma IT
Corona; Pietro - Rome IT
Corona; Pietro - Milano IT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process for manufacturing a membrane microelectromechanical device, and membrane microelectromechanical device Grant 9,162,876 - Corona , et al. October 20, 2	2015-10-20
Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufactured Grant 9,105,690 - Barlocchi , et al. August 11, 2	2015-08-11
Capacitive semiconductor pressure sensor Grant 8,575,710 - Villa , et al. November 5, 2	2013-11-05
Process For Manufacturing A Wafer By Annealing Of Buried Channels App 20130200484 - VILLA; Flavio ; et al.	2013-08-08
Method for forming buried cavities within a semiconductor body, and semiconductor body thus made Grant 8,420,428 - Barlocchi , et al. April 16, 2	2013-04-16
Process for manufacturing MEMS devices having buried cavities and MEMS device obtained thereby Grant 8,344,466 - Corona , et al. January 1, 2	2013-01-01
Process for manufacturing a wafer by annealing of buried channels Grant 8,334,188 - Villa , et al. December 18, 2	2012-12-18
Process For Manufacturing A Membrane Microelectromechanical Device, And Membrane Microelectromechanical Device App 20120237061 - Corona; Pietro ; et al.	2012-09-20
Capacitive Semiconductor Pressure Sensor App 20120223402 - Villa; Flavio Francesco ; et al.	2012-09-06
Method for manufacturing a semiconductor pressure sensor Grant 8,173,513 - Villa , et al. May 8, 2	2012-05-08
Integrated differential pressure sensor Grant 8,008,738 - Villa , et al. August 30, 2	2011-08-30
Process For Manufacturing A Semiconductor Wafer Having Soi-insulated Wells And Semiconductor Wafer Thereby Manufactured App 20110133186 - BARLOCCHI; Gabriele ; et al.	2011-06-09
Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufactured Grant 7,906,406 - Barlocchi , et al. March 15, 2	2011-03-15
Process For Manufacturing Mems Devices Having Buried Cavities And Mems Device Obtained Thereby App 20110031567 - Corona; Pietro ; et al.	2011-02-10
Process for manufacturing thick suspended structures of semiconductor material Grant 7,871,894 - Corona , et al. January 18, 2	2011-01-18
Method For Forming Buried Cavities Within A Semiconductor Body, And Semiconductor Body Thus Made App 20100330721 - BARLOCCHI; GABRIELE ; et al.	2010-12-30
Process for manufacturing a high-quality SOI wafer Grant 7,846,811 - Villa , et al. December 7, 2	2010-12-07
Integrated Differential Pressure Sensor App 20100269595 - Villa; Flavio Francesco ; et al.	2010-10-28
Method for forming buried cavities within a semiconductor body, and semiconductor body thus made Grant 7,811,848 - Barlocchi , et al. October 12, 2	2010-10-12
Process For Manufacturing A Wafer By Annealing Of Buried Channels App 20100237459 - VILLA; Flavio ; et al.	2010-09-23
Integrated differential pressure sensor and manufacturing process thereof Grant 7,763,487 - Villa , et al. July 27, 2	2010-07-27
Process for manufacturing a wafer by annealing of buried channels Grant 7,754,578 - Villa , et al. July 13, 2	2010-07-13
Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate Grant 7,678,600 - Villa , et al. March 16, 2	2010-03-16
Process for manufacturing a microfluidic device with buried channels Grant 7,452,713 - Barlocchi , et al. November 18, 2	2008-11-18
Method For Manufacturing A Semiconductor Pressure Sensor App 20080261345 - Villa; Flavio Francesco ; et al.	2008-10-23
Process For Manufacturing A Membrane Of Semiconductor Material Integrated In, And Electrically Insulated From, A Substrate App 20080224242 - Villa; Flavio Franceso ; et al.	2008-09-18
Process for manufacturing a wafer by annealing of buried channels App 20080036030 - Villa; Flavio ; et al.	2008-02-14
Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufactured App 20080029817 - Barlocchi; Gabriele ; et al.	2008-02-07
Process for manufacturing an SOI wafer by annealing and oxidation of buried channels Grant 7,294,536 - Villa , et al. November 13, 2	2007-11-13
Process for manufacturing thick suspended structures of semiconductor material App 20070126071 - Corona; Pietro ; et al.	2007-06-07
Method for forming buried cavities within a semiconductor body, and semiconductor body thus made App 20070057355 - Barlocchi; Gabriele ; et al.	2007-03-15
Process for manufacturing a high-quality SOI wafer App 20070042558 - Villa; Flavio Francesco ; et al.	2007-02-22
Integrated differential pressure sensor and manufacturing process thereof App 20060260408 - Villa; Flavio Francesco ; et al.	2006-11-23
Process for manufacturing low-cost and high-quality SOI substrates Grant 7,071,073 - Villa , et al. July 4, 2	2006-07-04
Process for forming a buried cavity in a semiconductor material wafer and a buried cavity Grant 6,992,367 - Erratico , et al. January 31, 2	2006-01-31
Process for manufacturing an SOI wafer by annealing and oxidation of buried channels App 20060017131 - Villa; Flavio ; et al.	2006-01-26
Process for manufacturing a microfluidic device with buried channels App 20050282221 - Barlocchi, Gabriele ; et al.	2005-12-22
Method for manufacturing a semiconductor pressure sensor App 20050208696 - Villa, Flavio Francesco ; et al.	2005-09-22
Method for the manufacture of electromagnetic radiation reflecting devices Grant 6,759,132 - Mastromatteo , et al. July 6, 2	2004-07-06
Process for forming a buried cavity in a semiconductor material wafer and a buried cavity App 20040106290 - Erratico, Pietro ; et al.	2004-06-03
Process for forming a buried cavity in a semiconductor material wafer and a buried cavity Grant 6,693,039 - Erratico , et al. February 17, 2	2004-02-17
Process for manufacturing an SOI wafer by annealing and oxidation of buried channels App 20030168711 - Villa, Flavio ; et al.	2003-09-11
Process for manufacturing low-cost and high-quality SOI substrates App 20030148588 - Villa, Flavio ; et al.	2003-08-07
Method for the manufacture of electromagnetic radiation reflecting devices App 20030129423 - Mastromatteo, Ubaldo ; et al.	2003-07-10
Process for manufacturing buried channels and cavities in semiconductor material wafers Grant 6,376,291 - Barlocchi , et al. April 23, 2	2002-04-23
Process for manufacturing a SOI wafer with buried oxide regions without cusps Grant 6,362,070 - Villa , et al. March 26, 2	2002-03-26

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