Combs; Edward G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Combs; Edward G..The latest application filed is for "method of manufacturing enhanced thermal dissipation integrated circuit package".

Company Profile

0.8.10

Combs; Edward G. - Foster CA
Combs; Edward G. - Foster City CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing enhanced thermal dissipation integrated circuit package App 20060223237 - Combs; Edward G. ; et al.	2006-10-05
Method of manufacturing an enhanced thermal dissipation integrated circuit package Grant 7,015,072 - Combs , et al. March 21, 2	2006-03-21
Integrated circuit package App 20050077613 - McLellan, Neil Robert ; et al.	2005-04-14
Method of manufacturing an enhanced thermal dissipation integrated circuit package App 20050003585 - Combs, Edward G. ; et al.	2005-01-06
Method of manufacturing an integrated circuit package Grant 6,790,710 - McLellan , et al. September 14, 2	2004-09-14
Enhanced thermal dissipation integrated circuit package Grant 6,734,552 - Combs , et al. May 11, 2	2004-05-11
Molded plastic package with heat sink and enhanced electrical performance Grant 6,724,071 - Combs April 20, 2	2004-04-20
Method of manufacturing enhanced thermal dissipation integrated circuit package App 20040046241 - Combs, Edward G. ; et al.	2004-03-11
Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package App 20030178719 - Combs, Edward G. ; et al.	2003-09-25
Encapsulated integrated circuit package and method of manufacturing an integrated circuit package App 20030143781 - McLellan, Neil Robert ; et al.	2003-07-31
Molded plastic package with heat sink and enhanced electrical performance Grant 6,552,417 - Combs April 22, 2	2003-04-22
Molded plastic package with heat sink and enhanced electrical performance App 20030038382 - Combs, Edward G.	2003-02-27
Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package App 20030011064 - Combs, Edward G. ; et al.	2003-01-16
Molded plastic package with heat sink and enhanced electrical performance App 20020074627 - Combs, Edward G.	2002-06-20
Molded plastic package with heat sink and enhanced electrical performance Grant 6,326,678 - Karnezos , et al. December 4, 2	2001-12-04
Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly Grant 6,285,075 - Combs , et al. September 4, 2	2001-09-04
Molded plastic package with heat sink and enhanced electrical performance App 20010000924 - Karnezos, Marcos ; et al.	2001-05-10
High power dissipation plastic encapsulated package for integrated circuit die Grant 5,596,231 - Combs January 21, 1	1997-01-21

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