Co; Reynaldo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Co; Reynaldo.The latest application filed is for "package-on-package assembly with wire bond vias".

Company Profile

5.41.37

Co; Reynaldo - Santa Cruz CA
Co; Reynaldo - Scotts Valley CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package-on-package Assembly With Wire Bond Vias App 20220165703 - Chau; Ellis ; et al.	2022-05-26
Package-on-package assembly with wire bond vias Grant 11,189,595 - Chau , et al. November 30, 2	2021-11-30
Package-on-package Assembly With Wire Bond Vias App 20210035948 - Chau; Ellis ; et al.	2021-02-04
Pressing of wire bond wire tips to provide bent-over tips Grant 10,806,036 - Co , et al. October 13, 2	2020-10-13
Package-on-package assembly with wire bond vias Grant 10,756,049 - Chau , et al. A	2020-08-25
BVA interposer Grant 10,297,582 - Caskey , et al.	2019-05-21
Pressing of Wire Bond Wire Tips to Provide Bent-Over Tips App 20180146557 - Co; Reynaldo ; et al.	2018-05-24
Wire bond support structure and microelectronic package including wire bonds therefrom Grant 9,947,641 - Co , et al. April 17, 2	2018-04-17
Off substrate kinking of bond wire Grant 9,893,033 - Haba , et al. February 13, 2	2018-02-13
Pressing of wire bond wire tips to provide bent-over tips Grant 9,888,579 - Co , et al. February 6, 2	2018-02-06
Package-on-package Assembly With Wire Bond Vias App 20180026007 - Chau; Ellis ; et al.	2018-01-25
Flipped die stack Grant 9,825,002 - Katkar , et al. November 21, 2	2017-11-21
Ball bonding metal wire bond wires to metal pads Grant 9,761,554 - Subido , et al. September 12, 2	2017-09-12
Package-on-package assembly with wire bond vias Grant 9,761,558 - Chau , et al. September 12, 2	2017-09-12
Method for package-on-package assembly with wire bonds to encapsulation surface Grant 9,691,679 - Co , et al. June 27, 2	2017-06-27
Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface Grant 9,615,456 - Haba , et al. April 4, 2	2017-04-04
Flipped Die Stack App 20170018529 - Katkar; Rajesh ; et al.	2017-01-19
Coupling of side surface contacts to a circuit platform Grant 9,530,749 - Co , et al. December 27, 2	2016-12-27
Electrical connector between die pad and z-interconnect for stacked die assemblies Grant 9,508,689 - Co , et al. November 29, 2	2016-11-29
BVA interposer Grant 9,502,390 - Caskey , et al. November 22, 2	2016-11-22
Wire Bond Support Structure And Microelectronic Package Including Wire Bonds Therefrom App 20160329308 - Co; Reynaldo ; et al.	2016-11-10
Ball Bonding Metal Wire Bond Wires To Metal Pads App 20160329294 - SUBIDO; Willmar ; et al.	2016-11-10
Coupling Of Side Surface Contacts To A Circuit Platform App 20160322325 - CO; Reynaldo ; et al.	2016-11-03
Pressing Of Wire Bond Wire Tips To Provide Bent-over Tips App 20160262268 - CO; Reynaldo ; et al.	2016-09-08
Method For Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20160260647 - Co; Reynaldo ; et al.	2016-09-08
Wire bond support structure and microelectronic package including wire bonds therefrom Grant 9,412,714 - Co , et al. August 9, 2	2016-08-09
Off Substrate Kinking Of Bond Wire App 20160225739 - Haba; Belgacem ; et al.	2016-08-04
Method for package-on-package assembly with wire bonds to encapsulation surface Grant 9,349,706 - Co , et al. May 24, 2	2016-05-24
Bva Interposer App 20160079214 - Caskey; Terrence ; et al.	2016-03-17
Package-on-package assembly with wire bond vias Grant 9,252,122 - Chau , et al. February 2, 2	2016-02-02
Electrical Connector Between Die Pad And Z-interconnect For Stacked Die Assemblies App 20160027761 - Co; Reynaldo ; et al.	2016-01-28
Wire Bond Support Structure And Microelectronic Package Including Wire Bonds Therefrom App 20150348928 - Co; Reynaldo ; et al.	2015-12-03
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface App 20150334831 - Haba; Belgacem ; et al.	2015-11-19
Electrical connector between die pad and z-interconnect for stacked die assemblies Grant 9,153,517 - Co , et al. October 6, 2	2015-10-06
Package-on-package Assembly With Wire Bond Vias App 20150255424 - Chau; Ellis ; et al.	2015-09-10
Package-on-package assembly with wire bond vias Grant 9,105,483 - Chau , et al. August 11, 2	2015-08-11
Structure for microelectronic packaging with bond elements to encapsulation surface Grant 9,095,074 - Haba , et al. July 28, 2	2015-07-28
Off substrate kinking of bond wire Grant 9,087,815 - Haba , et al. July 21, 2	2015-07-21
Severing bond wire by kinking and twisting Grant 9,082,753 - Haba , et al. July 14, 2	2015-07-14
Package-on-package assembly with wire bond vias Grant 9,041,227 - Chau , et al. May 26, 2	2015-05-26
Off Substrate Kinking Of Bond Wire App 20150129646 - Haba; Belgacem ; et al.	2015-05-14
Severing Bond Wire By Kinking And Twisting App 20150129647 - Haba; Belgacem ; et al.	2015-05-14
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface App 20150034371 - Haba; Belgacem ; et al.	2015-02-05
Method For Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20150017765 - Co; Reynaldo ; et al.	2015-01-15
Semiconductor die array structure Grant 8,884,403 - Co , et al. November 11, 2	2014-11-11
Structure for microelectronic packaging with bond elements to encapsulation surface Grant 8,878,353 - Haba , et al. November 4, 2	2014-11-04
Package-on-package assembly with wire bond vias Grant 8,836,136 - Chau , et al. September 16, 2	2014-09-16
Method for package-on-package assembly with wire bonds to encapsulation surface Grant 8,772,152 - Co , et al. July 8, 2	2014-07-08
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface App 20140175671 - Haba; Belgacem ; et al.	2014-06-26
Electrical interconnect for die stacked in zig-zag configuration Grant 8,680,687 - Co , et al. March 25, 2	2014-03-25
Bva Interposer App 20140036454 - Caskey; Terrence ; et al.	2014-02-06
Package-on-package Assembly With Wire Bond Vias App 20130328219 - Chau; Ellis ; et al.	2013-12-12
Method For Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20130224914 - Co; Reynaldo ; et al.	2013-08-29
Package-on-package Assembly With Wire Bond Vias App 20130200533 - Chau; Ellis ; et al.	2013-08-08
Package-on-package Assembly With Wire Bond Vias App 20130093087 - Chau; Ellis ; et al.	2013-04-18
Package-on-package Assembly With Wire Bond Vias App 20130095610 - Chau; Ellis ; et al.	2013-04-18
Package-on-package Assembly With Wire Bond Vias App 20130093088 - Chau; Ellis ; et al.	2013-04-18
Package-on-package assembly with wire bond vias Grant 8,404,520 - Chau , et al. March 26, 2	2013-03-26
Method for package-on-package assembly with wire bonds to encapsulation surface Grant 8,372,741 - Co , et al. February 12, 2	2013-02-12
Wafer level surface passivation of stackable integrated circuit chips Grant 8,324,081 - McElrea , et al. December 4, 2	2012-12-04
Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies App 20120119385 - Co; Reynaldo ; et al.	2012-05-17
Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20110147943 - McElrea; Simon J. S. ; et al.	2011-06-23
Semiconductor Die Separation Method App 20110101505 - Co; Reynaldo ; et al.	2011-05-05
Wafer level surface passivation of stackable integrated circuit chips Grant 7,923,349 - McElrea , et al. April 12, 2	2011-04-12
Semiconductor die separation method Grant 7,863,159 - Co , et al. January 4, 2	2011-01-04
Electrical interconnect for die stacked in zig-zag configuration App 20100327461 - Co; Reynaldo ; et al.	2010-12-30
Semiconductor Die Separation Method App 20090315174 - Co; Reynaldo ; et al.	2009-12-24
Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20080315434 - McElrea; Simon J.S. ; et al.	2008-12-25