| Patent | Date |
|---|
Method for manufacturing a printed circuit board including an embedded electronic component
Grant 10,887,995 - Lee , et al. January 5, 2 | 2021-01-05 |
Substrate for camera module and camera module having the same
Grant 10,270,948 - Lee , et al. | 2019-04-23 |
Fan-out semiconductor package
Grant 10,199,329 - Yi , et al. Fe | 2019-02-05 |
Printed Circuit Board Including Embedded Electronic Component And Method For Manufacturing The Same
App 20180279478 - LEE; Seung Eun ; et al. | 2018-09-27 |
Printed circuit board including embedded electronic component and method for manufacturing the same
Grant 10,015,884 - Lee , et al. July 3, 2 | 2018-07-03 |
Fan-out Semiconductor Package
App 20180068952 - YI; Moon Hee ; et al. | 2018-03-08 |
Fan-out semiconductor package
Grant 9,875,970 - Yi , et al. January 23, 2 | 2018-01-23 |
Fan-out Semiconductor Package
App 20170309571 - YI; Moon Hee ; et al. | 2017-10-26 |
Substrate For Camera Module And Camera Module Having The Same
App 20170294469 - LEE; Seung Eun ; et al. | 2017-10-12 |
Circuit board and method of manufacturing the same
Grant 9,788,433 - Lee , et al. October 10, 2 | 2017-10-10 |
Circuit board and method of manufacturing the same
Grant 9,788,409 - Lee , et al. October 10, 2 | 2017-10-10 |
Printed Circuit Board
App 20160374198 - KIM; Heung-Kyu ; et al. | 2016-12-22 |
Printed circuit board including electronic component embedded therein and method for manufacturing the same
Grant 9,526,177 - Lee , et al. December 20, 2 | 2016-12-20 |
Multilayered substrate
Grant 9,474,167 - Shin , et al. October 18, 2 | 2016-10-18 |
Circuit Board And Method Of Manufacturing The Same
App 20160302299 - LEE; Young-Kwan ; et al. | 2016-10-13 |
Electronic component embedded substrate and manufacturing method thereof
Grant 9,462,697 - Chung , et al. October 4, 2 | 2016-10-04 |
Substrate embedding passive element
Grant 9,420,683 - Lee , et al. August 16, 2 | 2016-08-16 |
Circuit Board And Method Of Manufacturing The Same
App 20160205773 - LEE; Doo Hwan ; et al. | 2016-07-14 |
Multilayer ceramic capacitor and printed circuit board including the same
Grant 9,345,141 - Lee , et al. May 17, 2 | 2016-05-17 |
Printed Circuit Board And Method Of Fabricating The Same
App 20160105956 - HWANG; Jun Oh ; et al. | 2016-04-14 |
Substrate having electronic component embedded therein and method of manufacturing the same
Grant 9,313,893 - Lee , et al. April 12, 2 | 2016-04-12 |
Multilayered substrate and method of manufacturing the same
Grant 9,307,632 - Lee , et al. April 5, 2 | 2016-04-05 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20160029488 - KANG; Myung Sam ; et al. | 2016-01-28 |
Chip Embedded Substrate And Method Of Manufacturing The Same
App 20160021755 - LEE; Jung Han ; et al. | 2016-01-21 |
Passive device embedded in substrate and substrate with passive device embedded therein
Grant 9,155,199 - Shin , et al. October 6, 2 | 2015-10-06 |
Semiconductor package and method of manufacturing the same
Grant 9,087,837 - Lee , et al. July 21, 2 | 2015-07-21 |
Multilayered Substrate And Method Of Manufacturing The Same
App 20150195907 - CHUNG; Yul Kyo ; et al. | 2015-07-09 |
Printed Circuit Board Including Electronic Component Embedded Therein And Method For Manufacturing The Same
App 20140321084 - LEE; Seung Eun ; et al. | 2014-10-30 |
Semiconductor package and method of manufacturing the same
Grant 8,871,569 - Lee , et al. October 28, 2 | 2014-10-28 |
Embedded printed circuit board and manufacturing method thereof
Grant 8,802,999 - Ryu , et al. August 12, 2 | 2014-08-12 |
Substrate Having Electronic Component Embedded Therein And Method Of Manufacturing The Same
App 20140182896 - LEE; Doo Hwan ; et al. | 2014-07-03 |
Printed Circuit Board Including Embedded Electronic Component And Method For Manufacturing The Same
App 20140182911 - Lee; Seung Eun ; et al. | 2014-07-03 |
Multilayered Substrate
App 20140182889 - SHIN; Yee Na ; et al. | 2014-07-03 |
Circuit Board And Method Of Manufacturing The Same
App 20140182916 - SHIN; Yee Na ; et al. | 2014-07-03 |
Multilayered Substrate And Method Of Manufacturing The Same
App 20140182895 - LEE; Doo Hwan ; et al. | 2014-07-03 |
Circuit Board And Method Of Manufacturing The Same
App 20140182897 - LEE; Doo Hwan ; et al. | 2014-07-03 |
Substrate Embedding Passive Element
App 20140185258 - LEE; Doo Hwan ; et al. | 2014-07-03 |
Core Substrate And Method For Manufacturing The Same, And Substrate With Built-in Electronic Components And Method For Manufacturing The Same
App 20140177192 - Lee; Seung Eun ; et al. | 2014-06-26 |
Electronic Component Embedded Substrate And Manufacturing Method Thereof
App 20140151104 - CHUNG; Yul Kyo ; et al. | 2014-06-05 |
Electronic Component Embedded Substrate And Manufacturing Method Thereof
App 20140144676 - CHUNG; Yul Kyo ; et al. | 2014-05-29 |
Capacitor Embedded Substrate
App 20140131084 - Lee; Doo Hwan ; et al. | 2014-05-15 |
Method Of Processing Cavity Of Core Substrate
App 20140123486 - JEONG; Jin-Soo ; et al. | 2014-05-08 |
Multilayer Ceramic Capacitor And Printed Circuit Board Including The Same
App 20140116761 - Lee; Seung Eun ; et al. | 2014-05-01 |
Passive Device Embedded In Substrate And Substrate With Passive Device Embedded Therein
App 20140090881 - SHIN; Yee Na ; et al. | 2014-04-03 |
Semiconductor Package And Method Of Manufacturing The Same
App 20140080266 - Lee; Doo Hwan ; et al. | 2014-03-20 |
Method of processing cavity of core substrate
Grant 8,633,397 - Jeong , et al. January 21, 2 | 2014-01-21 |
Electronics component embedded PCB
Grant 08618421 - | 2013-12-31 |
Electronics component embedded PCB
Grant 8,618,421 - Byun , et al. December 31, 2 | 2013-12-31 |
Semiconductor Package And Method Of Manufacturing The Same
App 20130320516 - Lee; Doo Hwan ; et al. | 2013-12-05 |
Circuit board and method for testing component built in the circuit board
Grant 8,547,132 - Kim , et al. October 1, 2 | 2013-10-01 |
PCB strip and manufacturing method for electronic component embedded PCB
Grant 8,482,890 - Kim , et al. July 9, 2 | 2013-07-09 |
Test method for passive device embedded printed circuit board
Grant 8,482,310 - Kim , et al. July 9, 2 | 2013-07-09 |
Printed Circuit Board Having Electro Component And Manufacturing Method Thereof
App 20130139382 - LEE; Sang-Chul ; et al. | 2013-06-06 |
Semiconductor Package And Method Of Manufacturing The Same
App 20130119553 - JEONG; Tae Sung ; et al. | 2013-05-16 |
Electronic Component-embedded Printed Circuit Board And Method Of Manufacturing The Same
App 20130105201 - Ryu; Jong In ; et al. | 2013-05-02 |
Embedded Printed Circuit Board And Manufacturing Method Thereof
App 20130098667 - RYU; Jong In ; et al. | 2013-04-25 |
Printed Circuit Board Having Electro-component And Manufacturing Method Thereof
App 20120291274 - LEE; Jin-Won ; et al. | 2012-11-22 |
Printed Circuit Board Having Embedded Electronic Component And Method Of Manufacturing The Same
App 20120160549 - Kim; Moon Il ; et al. | 2012-06-28 |
Capacitor and manufacturing method thereof
Grant 8,199,456 - Lim , et al. June 12, 2 | 2012-06-12 |
Method of manufacturing PCB having electronic components embedded therein
App 20120017435 - Sohn; Seung Hyun ; et al. | 2012-01-26 |
Method of manufacturing printed circuit board including electronic component embedded therein
App 20110314667 - Baek; Sang Jin ; et al. | 2011-12-29 |
Semiconductor chip package and printed circuit board
Grant 8,064,215 - Chung , et al. November 22, 2 | 2011-11-22 |
Circut Board And Mehtod For Testing Component Built In The Circuit Board
App 20110273202 - KIM; Hyun Ho ; et al. | 2011-11-10 |
Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
Grant 8,049,117 - Lee , et al. November 1, 2 | 2011-11-01 |
Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
Grant 8,039,759 - Lee , et al. October 18, 2 | 2011-10-18 |
Test Method For Passive Device Embedded Printed Circuit Board
App 20110215828 - KIM; Hyun-Ho ; et al. | 2011-09-08 |
Electro Device Embedded Printed Circuit Board And Manufacturing Method Thereof
App 20110216515 - LEE; Jin-Won ; et al. | 2011-09-08 |
Electro Device Embedded Printed Circuit Board And Manufacturng Method Thereof
App 20110214913 - Lee; Jin-Won ; et al. | 2011-09-08 |
Pcb Strip And Manufacturing Method For Electronic Component Embedded Pcb
App 20110176246 - KIM; Moon-il ; et al. | 2011-07-21 |
Electronic Component Embedded Printed Circuit Board And Method Of Manufacturing The Same
App 20110141711 - SOHN; Seung-Hyun ; et al. | 2011-06-16 |
Insulator And Manufacturing Method For Printed Circuit Board Having Electro Component
App 20110123808 - Lee; Sang-Chul ; et al. | 2011-05-26 |
Printed Circuit Board Having Electro-component And Manufacturing Method Thereof
App 20110116246 - LEE; Jin-Won ; et al. | 2011-05-19 |
Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor
Grant 7,943,858 - Lee , et al. May 17, 2 | 2011-05-17 |
Electronics Component Embedded Pcb
App 20110100689 - BYUN; Jung-Soo ; et al. | 2011-05-05 |
Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
Grant 7,927,517 - Bae , et al. April 19, 2 | 2011-04-19 |
Method Of Processing Cavity Of Core Substrate
App 20110048780 - Jeong; Jin-Soo ; et al. | 2011-03-03 |
Thin film capacitor-embedded printed circuit board and method of manufacturing the same
Grant 7,886,436 - Moon , et al. February 15, 2 | 2011-02-15 |
Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
Grant 7,887,879 - Bae , et al. February 15, 2 | 2011-02-15 |
Composite Dielectric Composition Having Small Variation Of Capacitance With Temperature And Signal-matching Embedded Capacitor Prepared Using The Same
App 20110034606 - PARK; Eun Tae ; et al. | 2011-02-10 |
Printed Circuit Board Having Electro Component And Manufacturing Method Thereof
App 20110005823 - LEE; Sang-Chul ; et al. | 2011-01-13 |
Method of manufacturing circuit board embedding thin film capacitor
Grant 7,845,073 - Lee , et al. December 7, 2 | 2010-12-07 |
Semiconductor chip having alignment mark and method of manufacturing the same
Grant 7,812,465 - Lee , et al. October 12, 2 | 2010-10-12 |
Method for manufacturing capacitor embedded in PCB
Grant 7,736,397 - Lee , et al. June 15, 2 | 2010-06-15 |
Printed circuit board with film capacitor embedded therein and method for manufacturing the same
Grant 7,737,529 - Moon , et al. June 15, 2 | 2010-06-15 |
Method of manufacturing component-embedded printed circuit board
Grant 7,730,612 - Park , et al. June 8, 2 | 2010-06-08 |
Printed Circuit Board And Manufacturing Method Thereof
App 20100097770 - Park; Hwa-Sun ; et al. | 2010-04-22 |
Thin film-capacitor-embedded printed circuit board and method of manufacturing the same
Grant 7,675,756 - Moon , et al. March 9, 2 | 2010-03-09 |
Semiconductor chip having alignment mark and method of manufacturing the same
App 20090315194 - Lee; Jae Kul ; et al. | 2009-12-24 |
Printed circuit board including electronic component embedded therein and method of manufacturing the same
App 20090310323 - Baek; Sang Jin ; et al. | 2009-12-17 |
Printed circuit board including electronic component embedded therein and method of manufacturing the same
App 20090301766 - Park; Hwa Sun ; et al. | 2009-12-10 |
PCB having electronic components embedded therein and method of manufacturing the same
App 20090277673 - Sohn; Seung Hyun ; et al. | 2009-11-12 |
High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same
Grant 7,609,504 - Park , et al. October 27, 2 | 2009-10-27 |
Method For Manufacturing A Printed Circuit Board With A Thin Film Capacitor Embedded Therein Having A Dielectric Film By Using Laser Lift-off, And Printed Circuit Board With A Thin Film Capacitor Embedded Therein Manufactured Thereby
App 20090223706 - LEE; Jung Won ; et al. | 2009-09-10 |
Method For Manufacturing A Printed Circuit Board With A Thin Film Capacitor Embedded Therein Having A Dielectric Film By Using Laser Lift-off, And Printed Circuit Board With A Thin Film Capacitor Embedded Therein Manufactured Thereby
App 20090223045 - Lee; Jung Won ; et al. | 2009-09-10 |
Coating Solution For Forming High Dielectric Constant Thin Film And Method For Forming Dielectric Thin Film Using The Same
App 20090219671 - BAE; Jun Hee ; et al. | 2009-09-03 |
Coating Solution For Forming High Dielectric Constant Thin Film And Method For Forming Dielecric Thin Film Using The Same
App 20090214776 - BAE; Jun Hee ; et al. | 2009-08-27 |
Fabrication Method Of Composite Metal Oxide Dielectric Film, And Composite Metal Oxide Dielectric Film Fabricated Thereby
App 20090208640 - SONG; Won Hoon ; et al. | 2009-08-20 |
Thin Film Capacitor-embedded Printed Circuit Board And Method Of Manufacturing The Same
App 20090152121 - MOON; Jin Seok ; et al. | 2009-06-18 |
Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
Grant 7,540,913 - Bae , et al. June 2, 2 | 2009-06-02 |
Semiconductor chip package and printed circuit board
App 20090073667 - Chung; Yul-Kyo ; et al. | 2009-03-19 |
Image sensor package
App 20090072335 - Chung; Yul-Kyo ; et al. | 2009-03-19 |
Semiconductor memory package
App 20090057860 - Bae; Seok ; et al. | 2009-03-05 |
Method of manufacturing component-embedded printed circuit board
App 20090049686 - Park; Hwa-Sun ; et al. | 2009-02-26 |
Method for manufacturing printed circuit board with thin film capacitor embedded therein
Grant 7,485,411 - Jung , et al. February 3, 2 | 2009-02-03 |
Thin-film capacitor, laminated structure and methods of manufacturing the same
App 20080307620 - Lee; Jung-Won ; et al. | 2008-12-18 |
Capacitor and manufacturing method thereof
App 20080259523 - LIM; Sung-Taek ; et al. | 2008-10-23 |
Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor
App 20080236878 - Lee; Seung Eun ; et al. | 2008-10-02 |
Multi-layer board with decoupling function
Grant 7,417,870 - Lim , et al. August 26, 2 | 2008-08-26 |
Capacitor and multi-layer board embedding the capacitor
App 20080158777 - Sohn; Seung Hyun ; et al. | 2008-07-03 |
Method of manufacturing circuit board embedding thin film capacitor
App 20080158770 - Lee; In Hyung ; et al. | 2008-07-03 |
Capacitor embedded printed circuit board and manufacturing method thereof
App 20080100986 - Sohn; Seung Hyun ; et al. | 2008-05-01 |
Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
App 20080030969 - Lee; Jung Won ; et al. | 2008-02-07 |
Method of fabricating printed circuit board having embedded multi-layer passive devices
Grant 7,293,356 - Sohn , et al. November 13, 2 | 2007-11-13 |
Method for manufacturing capacitor embedded in PCB
App 20070234539 - Lee; Seung Eun ; et al. | 2007-10-11 |
Multi-layer board with decoupling function
App 20070194876 - Lim; Sung Taek ; et al. | 2007-08-23 |
Method for manufacturing printed circuit board with thin film capacitor embedded therein
App 20070178412 - Jung; Hyung Mi ; et al. | 2007-08-02 |
Thin film capacitor-embedded printed circuit board and method of manufacturing the same
App 20070102741 - Moon; Jin Seok ; et al. | 2007-05-10 |
Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained thereby
App 20070094871 - Moon; Jin Seok ; et al. | 2007-05-03 |
Printed circuit board with film capacitor embedded therein and method for manufacturing the same
App 20070085166 - Moon; Jin Seok ; et al. | 2007-04-19 |
Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the same
App 20070087929 - Park; Eun Tae ; et al. | 2007-04-19 |
Method of manufacturing thin film capacitor and printed circuit board having thin film capacitor embedded therein
App 20070081297 - Ko; Min Ji ; et al. | 2007-04-12 |
Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
App 20070077457 - Bae; Jun Hee ; et al. | 2007-04-05 |
Fabrication method of composite metal oxide dielectric film, and composite metal oxide dielectric film fabricated thereby
App 20070020955 - Song; Won Hoon ; et al. | 2007-01-25 |
Method for manufacturing crystalline dielectric film,crystalline dielectric film manufactured thereby and thin film capacitor having the same
App 20060276050 - Song; Won Hoon ; et al. | 2006-12-07 |
High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same
App 20060223931 - Park; Eun Tae ; et al. | 2006-10-05 |
Method of fabricating printed circuit board having embedded multi-layer passive devices
App 20060203456 - Sohn; Seung Hyun ; et al. | 2006-09-14 |
Resin composition and ceramic/polymer composite for embedded capacitors having excellent TCC property
App 20060182973 - Lee; Seung Eun ; et al. | 2006-08-17 |
Resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancy
App 20060183872 - Lee; Seung Eun ; et al. | 2006-08-17 |
| 