Chung; Young Suk
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chung; Young Suk.The latest application filed is for "card storage mobile phone case".
Company Profile
0.40.24
- Chung; Young Suk - Yongin-si KR
- Chung; Young Suk - Goyang-Si KR
- Chung; Young Suk - Seoul KR
- Chung; Young Suk - Hwaseong-si N/A KR
- Chung; Young Suk - Suwon-Si KR
- Chung; Young-Suk - Gumi-si KR
- Chung; Young-Suk - Pusan KR
- Chung, Young-Suk - Pusan-City KR
Patent Activity
| Patent | Date |
|---|---|
| Heat sink for memory modules Grant D962,880 - Chung September 6, 2 | 2022-09-06 |
| Earphone case Grant D958,527 - Chung July 26, 2 | 2022-07-26 |
| Earphone case Grant D958,528 - Chung July 26, 2 | 2022-07-26 |
| Heat sink for memory modules Grant D956,706 - Chung July 5, 2 | 2022-07-05 |
| Mobile phone case Grant D925,514 - Chung July 20, 2 | 2021-07-20 |
| Holder for smart device Grant D879,090 - Chung | 2020-03-24 |
| Holder for smart device Grant D872,727 - Chung Ja | 2020-01-14 |
| Cell phone case with card storage capability Grant 10,511,342 - Chung Dec | 2019-12-17 |
| Card storage mobile phone case Grant 10,256,860 - Chung | 2019-04-09 |
| Mobile phone case Grant D837,776 - Chung J | 2019-01-08 |
| Mobile phone case Grant D830,352 - Chung October 9, 2 | 2018-10-09 |
| Card Storage Mobile Phone Case App 20180191395 - CHUNG; Young Suk | 2018-07-05 |
| Card-receptible semiautomatic slide case for mobile phone Grant 9,661,116 - Chung May 23, 2 | 2017-05-23 |
| Semiconductor Device And Manufacturing Method Thereof App 20170133334 - Kim; Do Hyung ; et al. | 2017-05-11 |
| Electronic device package structure and method of fabricating the same Grant 9,478,517 - Paek , et al. October 25, 2 | 2016-10-25 |
| Leadframe and semiconductor package made using the leadframe Grant 9,362,210 - Ahn , et al. June 7, 2 | 2016-06-07 |
| Electronic Device Package Structure And Method Fabricating The Same App 20150049421 - Paek; Jong Sik ; et al. | 2015-02-19 |
| Clothing dryer Grant 8,615,896 - Chung December 31, 2 | 2013-12-31 |
| Leadframe And Semiconductor Package Made Using The Leadframe App 20130181335 - Ahn; Byung Hoon ; et al. | 2013-07-18 |
| Leadframe and semiconductor package made using the leadframe Grant 8,410,585 - Ahn , et al. April 2, 2 | 2013-04-02 |
| Clothing dryer Grant 8,347,523 - Chung January 8, 2 | 2013-01-08 |
| Wafer level chip size package having redistribution layers Grant 7,977,783 - Park , et al. July 12, 2 | 2011-07-12 |
| Semiconductor device having improved contact interface reliability and method therefor Grant 7,944,043 - Chung , et al. May 17, 2 | 2011-05-17 |
| Drum type washer and door Grant 7,765,839 - Chung August 3, 2 | 2010-08-03 |
| Clothing dryer App 20100088918 - Chung; Young Suk | 2010-04-15 |
| Clothing dryer App 20100071224 - Chung; Young Suk | 2010-03-25 |
| Clothes drying machine Grant 7,644,516 - Chung January 12, 2 | 2010-01-12 |
| Liquid crystal display module including hook assembly Grant 7,567,315 - Chung July 28, 2 | 2009-07-28 |
| Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Grant 7,564,122 - Yee , et al. July 21, 2 | 2009-07-21 |
| Mobile phone Grant D593,051 - Chung May 26, 2 | 2009-05-26 |
| Drum type washer and door App 20080302141 - Chung; Young Suk | 2008-12-11 |
| Washing machine detecting condensed water temperature and drying control method of the same App 20080216517 - Chung; Young Suk | 2008-09-11 |
| Clothing drying machine and method for sensing dryness level using the same Grant 7,353,624 - Chung , et al. April 8, 2 | 2008-04-08 |
| Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant App 20080036055 - Yee; Jae Hak ; et al. | 2008-02-14 |
| Clothing dryer Grant 7,325,332 - Chung , et al. February 5, 2 | 2008-02-05 |
| Liquid crystal display module App 20060209226 - Chung; Young-Suk | 2006-09-21 |
| Leadframe and semiconductor package with improved solder joint strength Grant 7,102,208 - Lee , et al. September 5, 2 | 2006-09-05 |
| Clothes drying machine App 20060174511 - Lee; Jung Ho ; et al. | 2006-08-10 |
| Leadframe and semiconductor package made using the leadframe App 20060151858 - Ahn; Byung Hoon ; et al. | 2006-07-13 |
| Washing machine and method of controlling drying process thereof Grant 7,062,863 - Chung June 20, 2 | 2006-06-20 |
| Clothing dryer App 20060123652 - Chung; Young Suk ; et al. | 2006-06-15 |
| Leadframe having lead locks to secure leads to encapsulant Grant 7,057,280 - Yee , et al. June 6, 2 | 2006-06-06 |
| Clothing drying machine and method for sensing dryness level using the same App 20060096117 - Chung; Young Suk ; et al. | 2006-05-11 |
| Leadframe and semiconductor package made using the leadframe Grant 7,042,068 - Ahn , et al. May 9, 2 | 2006-05-09 |
| Clothes dryer and method of displaying drying time on the same App 20050278974 - Chung, Young Suk | 2005-12-22 |
| Clothes drying machine App 20050235519 - Chung, Young Suk | 2005-10-27 |
| Semiconductor package Grant 6,953,988 - Seo , et al. October 11, 2 | 2005-10-11 |
| Drying machine App 20050210703 - Chung, Young Suk | 2005-09-29 |
| Clothes drying apparatus App 20050155250 - Chung, Young Suk ; et al. | 2005-07-21 |
| Semiconductor package App 20050062148 - Seo, Seong Min ; et al. | 2005-03-24 |
| Semiconductor package Grant 6,858,919 - Seo , et al. February 22, 2 | 2005-02-22 |
| Leadframe and semiconductor package made using the leadframe App 20050029638 - Ahn, Byung Hoon ; et al. | 2005-02-10 |
| Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Grant 6,825,062 - Yee , et al. November 30, 2 | 2004-11-30 |
| Washing machine and method of controlling drying process thereof App 20040216327 - Chung, Young-Suk | 2004-11-04 |
| Semiconductor package including stacked chips with aligned input/output pads Grant 6,759,737 - Seo , et al. July 6, 2 | 2004-07-06 |
| Semiconductor package and method of making leadframe having lead locks to secure leads to encapsulant App 20040097016 - Yee, Jae Hak ; et al. | 2004-05-20 |
| Clamp and heat block assembly for wire bonding a semiconductor package assembly Grant 6,677,662 - Chung , et al. January 13, 2 | 2004-01-13 |
| Leadframe for semiconductor package and mold for molding the same Grant 6,627,976 - Chung , et al. September 30, 2 | 2003-09-30 |
| Semiconductor device having increased moisture path and increased solder joint strength Grant 6,525,406 - Chung , et al. February 25, 2 | 2003-02-25 |
| Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant App 20030020146 - Yee, Jae Hak ; et al. | 2003-01-30 |
| Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Grant 6,448,633 - Yee , et al. September 10, 2 | 2002-09-10 |
| Semiconductor package App 20020020907 - Seo, Seong Min ; et al. | 2002-02-21 |
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