Chung; Dean S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chung; Dean S..The latest application filed is for "void-free damascene copper deposition process and means of monitoring thereof".
- Chung; Dean S. - Essex Junction VT
| Patent | Date |
|---|---|
| Void-free damascene copper deposition process and means of monitoring thereof Grant 7,678,258 - Andricacos , et al. March 16, 2 | 2010-03-16 |
| Electroplated copper interconnection structure, process for making and electroplating bath Grant 7,227,265 - Andricacos , et al. June 5, 2 | 2007-06-05 |
| Void-free damascene copper deposition process and means of monitoring thereof App 20050006242 - Andricacos, Panayotis ; et al. | 2005-01-13 |
| Electroplated copper interconnection structure, process for making and electroplating bath App 20040178077 - Andricacos, Panayotis C. ; et al. | 2004-09-16 |
| Electroplated copper interconnection structure, process for making and electroplating bath App 20040178078 - Andricacos, Panayotis C. ; et al. | 2004-09-16 |
| Selective deposition of a conductive material Grant 6,605,534 - Chung , et al. August 12, 2 | 2003-08-12 |
| Multi-step potentiostatic/galvanostatic plating control Grant 6,409,903 - Chung , et al. June 25, 2 | 2002-06-25 |
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