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Semiconductor devices having crack-inhibiting structures
Grant 11,444,037 - Chun , et al. September 13, 2 | 2022-09-13 |
Thermal management of circuit boards
Grant 11,419,239 - Qu , et al. August 16, 2 | 2022-08-16 |
Heat spreaders for use in semiconductor device testing, such as burn-in testing
Grant 11,385,281 - Qu , et al. July 12, 2 | 2022-07-12 |
Semiconductor Device Assemblies And Systems With Improved Thermal Performance And Methods For Making The Same
App 20220122942 - Chun; Hyunsuk ; et al. | 2022-04-21 |
Two-step Solder-mask-defined Design
App 20220111457 - Sinha; Koustav ; et al. | 2022-04-14 |
Thermal Management Of Gpu-hbm Package By Microchannel Integrated Substrate
App 20210407889 - Qu; Xiaopeng ; et al. | 2021-12-30 |
Semiconductor Device Assemblies And Systems With Improved Thermal Performance And Methods For Making The Same
App 20210407964 - Chun; Hyunsuk ; et al. | 2021-12-30 |
Substrates For Semiconductor Device Assemblies And Systems With Improved Thermal Performance And Methods For Making The Same
App 20210407882 - Chun; Hyunsuk ; et al. | 2021-12-30 |
Thermal Management Of Circuit Boards
App 20210410278 - Qu; Xiaopeng ; et al. | 2021-12-30 |
Semiconductor device assemblies and systems with improved thermal performance and methods for making the same
Grant 11,211,364 - Chun , et al. December 28, 2 | 2021-12-28 |
Two-step solder-mask-defined design
Grant 11,207,744 - Sinha , et al. December 28, 2 | 2021-12-28 |
Methods And Apparatus For Temperature Modification And Reduction Of Contamination In Bonding Stacked Microelectronic Devices
App 20210384042 - Qu; Xiaopeng ; et al. | 2021-12-09 |
Thermal Management Materials For Semiconductor Devices, And Associated Systems And Methods
App 20210272872 - Qu; Xiaopeng ; et al. | 2021-09-02 |
Methods For Making Double-sided Semiconductor Devices And Related Devices, Assemblies, Packages And Systems
App 20210233851 - Chun; Hyunsuk | 2021-07-29 |
Heat Spreaders For Semiconductor Devices, And Associated Systems And Methods
App 20210225733 - Qu; Xiaopeng ; et al. | 2021-07-22 |
Semiconductor Device
App 20210202337 - Chun; Hyunsuk ; et al. | 2021-07-01 |
Semiconductor Interconnect Structures With Narrowed Portions, And Associated Systems And Methods
App 20210202430 - Chun; Hyunsuk ; et al. | 2021-07-01 |
Heat spreaders for semiconductor devices, and associated systems and methods
Grant 11,011,452 - Qu , et al. May 18, 2 | 2021-05-18 |
Two-step Solder-mask-defined Design
App 20210121969 - Sinha; Koustav ; et al. | 2021-04-29 |
Redistribution Layers Including Reinforcement Structures And Related Semiconductor Device Packages, Systems And Methods
App 20210074623 - Chun; Hyunsuk ; et al. | 2021-03-11 |
Heat Spreaders For Use In Semiconductor Device Testing, Such As Burn-in Testing
App 20210055343 - Qu; Xiaopeng ; et al. | 2021-02-25 |
Semiconductor Devices Having Crack-inhibiting Structures
App 20210020585 - Arifeen; Shams U. ; et al. | 2021-01-21 |
Semiconductor Devices Having Crack-inhibiting Structures
App 20200402925 - Chun; Hyunsuk ; et al. | 2020-12-24 |
Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods
Grant 10,861,782 - Chun , et al. December 8, 2 | 2020-12-08 |
Semiconductor devices having crack-inhibiting structures
Grant 10,811,365 - Arifeen , et al. October 20, 2 | 2020-10-20 |
Semiconductor devices having crack-inhibiting structures
Grant 10,784,212 - Chun , et al. Sept | 2020-09-22 |
Semiconductor Devices Having Crack-inhibiting Structures
App 20200211982 - Arifeen; Shams U. ; et al. | 2020-07-02 |
Semiconductor Devices Having Crack-inhibiting Structures
App 20200211983 - Chun; Hyunsuk ; et al. | 2020-07-02 |
Heat Spreaders For Semiconductor Devices, And Associated Systems And Methods
App 20200176353 - Qu; Xiaopeng ; et al. | 2020-06-04 |
Kits for enhanced cooling of components of computing devices and related computing devices, systems and methods
Grant 10,653,033 - Qu , et al. | 2020-05-12 |
Kits For Enhanced Cooling Of Components Of Computing Devices And Related Computing Devices, Systems And Methods
App 20200137923 - Qu; Xiaopeng ; et al. | 2020-04-30 |
Redistribution Layers Including Reinforcement Structures And Related Semiconductor Device Packages, Systems And Methods
App 20200066625 - Chun; Hyunsuk ; et al. | 2020-02-27 |
Semiconductor devices
Grant 10,515,911 - Chun , et al. Dec | 2019-12-24 |
Semiconductor Device
App 20190067145 - Chun; Hyunsuk ; et al. | 2019-02-28 |
Semiconductor package and method of manufacturing the same
Grant 9,601,466 - Yoon , et al. March 21, 2 | 2017-03-21 |
Semiconductor package having magnetic connection member
Grant 9,402,315 - Chun , et al. July 26, 2 | 2016-07-26 |
Semiconductor package
Grant 9,397,052 - Park , et al. July 19, 2 | 2016-07-19 |
Semiconductor Package And Method Of Manufacturing The Same
App 20160071824 - Yoon; Jeongwon ; et al. | 2016-03-10 |
Semiconductor Package Having Magnetic Connection Member
App 20150115468 - CHUN; Hyunsuk ; et al. | 2015-04-30 |
Semiconductor Package
App 20150048522 - PARK; Soojae ; et al. | 2015-02-19 |
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