Chua; Swee Kwang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chua; Swee Kwang.The latest application filed is for "stackable semiconductor assemblies and methods of manufacturing such assemblies".

Company Profile

0.32.24

Chua; Swee Kwang - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stackable semiconductor assemblies and methods of manufacturing such assemblies Grant 8,669,657 - Chua March 11, 2	2014-03-11
Stackable Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20140008784 - Chua; Swee Kwang	2014-01-09
Wafer level packaging Grant 8,564,106 - Chua , et al. October 22, 2	2013-10-22
Method for packaging circuits Grant 8,555,495 - Chia , et al. October 15, 2	2013-10-15
Stackable semiconductor assemblies and methods of manufacturing such assemblies Grant 8,518,747 - Chua August 27, 2	2013-08-27
Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material Grant 8,362,594 - Chua , et al. January 29, 2	2013-01-29
Stackable Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20130011966 - Chua; Swee Kwang	2013-01-10
Stackable semiconductor assemblies and methods of manufacturing such assemblies Grant 8,288,874 - Chua October 16, 2	2012-10-16
Wafer Level Packaging App 20120119263 - Chua; Swee Kwang ; et al.	2012-05-17
Method For Packaging Circuits App 20120064697 - Chia; Yong Poo ; et al.	2012-03-15
Wafer level packaging Grant 8,106,488 - Chua , et al. January 31, 2	2012-01-31
Method for packaging circuits Grant 8,065,792 - Chia , et al. November 29, 2	2011-11-29
Stackable Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20110095407 - Chua; Swee Kwang	2011-04-28
Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die Grant 7,915,711 - Chua , et al. March 29, 2	2011-03-29
Wafer Level Packaging App 20110018143 - Chua; Swee Kwang ; et al.	2011-01-27
Stackable semiconductor assemblies and methods of manufacturing such assemblies Grant 7,863,722 - Chua January 4, 2	2011-01-04
Wafer level packaging Grant 7,820,484 - Chua , et al. October 26, 2	2010-10-26
Thin semiconductor die packages and associated systems and methods Grant 7,816,750 - Chua October 19, 2	2010-10-19
Method For Packaging Circuits And Packaged Circuits App 20100146780 - Chia; Yong Poo ; et al.	2010-06-17
Method for packaging circuits and packaged circuits Grant 7,712,211 - Chia , et al. May 11, 2	2010-05-11
Stackable Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20100096737 - Chua; Swee Kwang	2010-04-22
Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material Grant 7,674,655 - Chua , et al. March 9, 2	2010-03-09
Multiple chip semiconductor package Grant 7,553,697 - Eng , et al. June 30, 2	2009-06-30
Method of making multichip wafer level packages and computing systems incorporating same Grant 7,485,562 - Chua , et al. February 3, 2	2009-02-03
Wafer Level Packaging App 20080211113 - Chua; Swee Kwang ; et al.	2008-09-04
Method of forming a conductive via through a wafer Grant 7,375,009 - Chua , et al. May 20, 2	2008-05-20
Castellation wafer level packaging of integrated circuit chips Grant 7,304,375 - Boon , et al. December 4, 2	2007-12-04
Leadless packaging for image sensor devices Grant 7,274,094 - Boon , et al. September 25, 2	2007-09-25
Castellation wafer level packaging of integrated circuit chips Grant 7,193,312 - Boon , et al. March 20, 2	2007-03-20
Multiple chip semiconductor package App 20070059862 - Eng; Meow Koon ; et al.	2007-03-15
Multiple chip semiconductor package Grant 7,173,330 - Eng , et al. February 6, 2	2007-02-06
Leadless packaging for image sensor devices and methods of assembly Grant 7,112,471 - Boon , et al. September 26, 2	2006-09-26
Multichip wafer level packages and computing systems incorporating same Grant 7,087,992 - Chua , et al. August 8, 2	2006-08-08
Multiple chip semiconductor package and method of fabricating same Grant 6,987,031 - Eng , et al. January 17, 2	2006-01-17
Castellation wafer level packaging of integrated circuit chips App 20060001143 - Boon; Suan Jeung ; et al.	2006-01-05
Multi-chip wafer level system packages and methods of forming same Grant 6,964,881 - Chua , et al. November 15, 2	2005-11-15
Multiple chip semiconductor package and method of fabricating same App 20050236709 - Eng, Meow Koon ; et al.	2005-10-27
Multiple chip semiconductor package Grant 6,958,537 - Eng , et al. October 25, 2	2005-10-25
Method of making multichip wafer level packages and computing systems incorporating same App 20050116337 - Chua, Swee Kwang ; et al.	2005-06-02
Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead Grant 6,882,021 - Boon , et al. April 19, 2	2005-04-19
Multichip wafer level packages and computing systems incorporating same App 20050073029 - Chua, Swee Kwang ; et al.	2005-04-07
Multiple chip semiconductor package App 20050006748 - Eng, Meow Koon ; et al.	2005-01-13
Packaged microelectronic devices and methods of packaging microelectronic devices App 20040238909 - Boon, Suan Jeung ; et al.	2004-12-02
Multichip wafer level packages and computing systems incorporating same Grant 6,825,553 - Chua , et al. November 30, 2	2004-11-30
Multichip wafer level system packages and methods of forming same App 20040229400 - Chua, Swee Kwang ; et al.	2004-11-18
Method for packaging circuits and packaged circuits App 20040221451 - Chia, Yong Poo ; et al.	2004-11-11
Leadless packaging for image sensor devices and methods of assembly App 20040084741 - Boon, Suan Jeung ; et al.	2004-05-06
Multichip wafer level packages and computing systems incorporating same App 20040046250 - Chua, Swee Kwang ; et al.	2004-03-11
Leadless packaging for image sensor devices and methods of assembly App 20040041221 - Boon, Suan Jeung ; et al.	2004-03-04
Multi-chip wafer level system packages and methods of forming same App 20040043533 - Chua, Swee Kwang ; et al.	2004-03-04
Multiple chip semiconductor package and method of fabricating same App 20040042190 - Eng, Meow Koon ; et al.	2004-03-04
Wafer level packaging App 20030232488 - Chua, Swee Kwang ; et al.	2003-12-18