| Patent | Date |
|---|
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant RE48,408 - Pagaila , et al. January 26, 2 | 2021-01-26 |
Semiconductor Device and Method to Minimize Stress on Stack Via
App 20200402855 - Lin; Yaojian ; et al. | 2020-12-24 |
Semiconductor device and method to minimize stress on stack via
Grant 10,804,153 - Lin , et al. October 13, 2 | 2020-10-13 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant RE48,111 - Pagaila , et al. | 2020-07-21 |
Semiconductor device and method of controlling warpage in reconstituted wafer
Grant 10,297,556 - Heng , et al. | 2019-05-21 |
Semiconductor device and method of controlling warpage in reconstituted wafer
Grant 10,163,747 - Heng , et al. Dec | 2018-12-25 |
Semiconductor device and method of forming stress relief layer between die and interconnect structure
Grant 10,083,916 - Shim , et al. September 25, 2 | 2018-09-25 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant 9,893,045 - Pagaila , et al. February 13, 2 | 2018-02-13 |
Package-on-package using through-hole via die on saw streets
Grant 9,847,253 - Do , et al. December 19, 2 | 2017-12-19 |
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer
App 20170194228 - Heng; Kian Meng ; et al. | 2017-07-06 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 9,666,500 - Lin , et al. May 30, 2 | 2017-05-30 |
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer
App 20170133330 - Heng; Kian Meng ; et al. | 2017-05-11 |
Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region
Grant 9,620,557 - Chow , et al. April 11, 2 | 2017-04-11 |
Semiconductor device and method of controlling warpage in reconstituted wafer
Grant 9,607,965 - Heng , et al. March 28, 2 | 2017-03-28 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 9,559,029 - Shim , et al. January 31, 2 | 2017-01-31 |
Package-in-package using through-hole via die on saw streets
Grant 9,524,938 - Do , et al. December 20, 2 | 2016-12-20 |
Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant
Grant 9,515,016 - Huang , et al. December 6, 2 | 2016-12-06 |
Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
Grant 9,508,621 - Lin , et al. November 29, 2 | 2016-11-29 |
Semiconductor Device and Method to Minimize Stress on Stack Via
App 20160276237 - Lin; Yaojian ; et al. | 2016-09-22 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20160111410 - Pagaila; Reza A. ; et al. | 2016-04-21 |
Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region
App 20160104731 - Chow; Seng Guan ; et al. | 2016-04-14 |
Integrated circuit packaging system with patterned substrate and method of manufacture thereof
Grant 9,299,648 - Shim , et al. March 29, 2 | 2016-03-29 |
Semiconductor package system with cavity substrate and manufacturing method therefor
Grant 9,293,350 - Chow , et al. March 22, 2 | 2016-03-22 |
Semiconductor device and method of forming semiconductor package using panel form carrier
Grant 9,275,877 - Lin , et al. March 1, 2 | 2016-03-01 |
Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices
Grant 9,257,356 - Huang , et al. February 9, 2 | 2016-02-09 |
Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region
Grant 9,252,172 - Chow , et al. February 2, 2 | 2016-02-02 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 9,252,066 - Shim , et al. February 2, 2 | 2016-02-02 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant 9,240,380 - Pagaila , et al. January 19, 2 | 2016-01-19 |
Semiconductor package system with cut multiple lead pads
Grant 9,202,777 - Tay , et al. December 1, 2 | 2015-12-01 |
Integrated circuit package system with locking terminal
Grant 9,177,898 - Shim , et al. November 3, 2 | 2015-11-03 |
Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package
Grant 9,171,769 - Chow , et al. October 27, 2 | 2015-10-27 |
Integrated circuit packaging system with package underfill and method of manufacture thereof
Grant 9,123,733 - Huang , et al. September 1, 2 | 2015-09-01 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20150228552 - Lin; Yaojian ; et al. | 2015-08-13 |
Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
Grant 9,099,455 - Chow , et al. August 4, 2 | 2015-08-04 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 9,087,930 - Lin , et al. July 21, 2 | 2015-07-21 |
Integrated circuit package system with mounting features for clearance
Grant 9,084,377 - Chow July 14, 2 | 2015-07-14 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20150179587 - Shim; Il Kwon ; et al. | 2015-06-25 |
Embedded semiconductor die package and method of making the same using metal frame carrier
Grant 9,059,186 - Shim , et al. June 16, 2 | 2015-06-16 |
Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP
App 20150145126 - Lin; Yaojian ; et al. | 2015-05-28 |
Integrated circuit package system with internal stacking module
Grant 9,030,006 - Chow , et al. May 12, 2 | 2015-05-12 |
Semiconductor device and method of forming stress relief layer between die and interconnect structure
Grant 9,006,888 - Shim , et al. April 14, 2 | 2015-04-14 |
Integrated circuit package with molded cavity
Grant 8,999,754 - Chow , et al. April 7, 2 | 2015-04-07 |
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer
App 20150084213 - Heng; Kian Meng ; et al. | 2015-03-26 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20150061124 - Shim; Il Kwon ; et al. | 2015-03-05 |
Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof
Grant 8,963,309 - Do , et al. February 24, 2 | 2015-02-24 |
Integrated circuit packaging system with embedded circuitry and post
Grant 8,957,530 - Shim , et al. February 17, 2 | 2015-02-17 |
Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
Grant 8,912,648 - Lin , et al. December 16, 2 | 2014-12-16 |
Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
Grant 8,896,109 - Pagaila , et al. November 25, 2 | 2014-11-25 |
Integrated Circuit Package System With Mounting Structure
App 20140335655 - Huang; Rui ; et al. | 2014-11-13 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20140327145 - Pagaila; Reza A. ; et al. | 2014-11-06 |
Integrated circuit package system employing resilient member mold system technology
Grant 8,852,986 - Kuan , et al. October 7, 2 | 2014-10-07 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 8,846,454 - Shim , et al. September 30, 2 | 2014-09-30 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20140246779 - Lin; Yaojian ; et al. | 2014-09-04 |
Integrated circuit package system with mounting structure
Grant 8,803,330 - Huang , et al. August 12, 2 | 2014-08-12 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 8,759,155 - Lin , et al. June 24, 2 | 2014-06-24 |
Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
Grant 8,723,305 - Do , et al. May 13, 2 | 2014-05-13 |
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
App 20140127858 - Shim; Il Kwon ; et al. | 2014-05-08 |
Integrated circuit package system with exposed interconnects
Grant 8,704,349 - Chow , et al. April 22, 2 | 2014-04-22 |
Integrated circuit package system with interposer
Grant 8,685,792 - Chow , et al. April 1, 2 | 2014-04-01 |
Embedded semiconductor die package and method of making the same using metal frame carrier
Grant 8,659,113 - Shim , et al. February 25, 2 | 2014-02-25 |
Integrated circuit package-on-package stacking system and method of manufacture thereof
Grant 8,643,163 - Shim , et al. February 4, 2 | 2014-02-04 |
Integrated circuit packaging system with encapsulation connector and method of manufacture thereof
Grant 8,624,364 - Chow , et al. January 7, 2 | 2014-01-07 |
Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof
Grant 8,604,602 - Chow , et al. December 10, 2 | 2013-12-10 |
Integrated circuit protruding pad package system and method for manufacturing thereof
Grant 8,587,098 - Chow , et al. November 19, 2 | 2013-11-19 |
Dual molded multi-chip package system
Grant 8,558,399 - Ramakrishna , et al. October 15, 2 | 2013-10-15 |
Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
Grant 8,546,195 - Do , et al. October 1, 2 | 2013-10-01 |
Embedded integrated circuit package-on-package system
Grant 8,546,929 - Ong , et al. October 1, 2 | 2013-10-01 |
Mountable integrated circuit package system with mountable integrated circuit die
Grant 8,536,692 - Kuan , et al. September 17, 2 | 2013-09-17 |
Package-in-Package Using Through-Hole Via Die on Saw Streets
App 20130214385 - Do; Byung Tai ; et al. | 2013-08-22 |
Integrated circuit leaded stacked package system
Grant 8,513,542 - Kuan , et al. August 20, 2 | 2013-08-20 |
Integrated circuit package system with shield
Grant 8,507,319 - Chow , et al. August 13, 2 | 2013-08-13 |
Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof
Grant 8,492,204 - Do , et al. July 23, 2 | 2013-07-23 |
Integrated circuit package system with redistribution layer and method for manufacturing thereof
Grant 8,487,434 - Kuan , et al. July 16, 2 | 2013-07-16 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20130175696 - Lin; Yaojian ; et al. | 2013-07-11 |
Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
Grant 8,476,120 - Huang , et al. July 2, 2 | 2013-07-02 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 8,456,002 - Lin , et al. June 4, 2 | 2013-06-04 |
Package-in-package using through-hole via die on saw streets
Grant 8,445,325 - Do , et al. May 21, 2 | 2013-05-21 |
Semiconductor Device And Method Of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20130113092 - Lin; Yaojian ; et al. | 2013-05-09 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20130105989 - Pagaila; Reza A. ; et al. | 2013-05-02 |
Circuit system with leads and method of manufacture thereof
Grant 8,420,950 - Chow , et al. April 16, 2 | 2013-04-16 |
Integrated circuit package system employing a support structure with a recess
Grant 8,422,243 - Chow , et al. April 16, 2 | 2013-04-16 |
Integrated circuit packaging system with flex tape and method of manufacture thereof
Grant 8,421,202 - Shim , et al. April 16, 2 | 2013-04-16 |
Integrated circuit package system for package stacking and method of manufacture therefor
Grant 8,409,920 - Pendse , et al. April 2, 2 | 2013-04-02 |
Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die
App 20130075903 - Pagaila; Reza A. ; et al. | 2013-03-28 |
Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant
App 20130075902 - Chow; Seng Guan ; et al. | 2013-03-28 |
Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
App 20130075899 - Huang; Rui ; et al. | 2013-03-28 |
Integrated circuit packaging system with package underfill and method of manufacture thereof
Grant 8,405,228 - Huang , et al. March 26, 2 | 2013-03-26 |
Semiconductor Device and Method of Forming Semiconductor Package Using Panel Form Carrier
App 20130069241 - Lin; Yaojian ; et al. | 2013-03-21 |
Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist
Grant 8,399,305 - Huang , et al. March 19, 2 | 2013-03-19 |
Integrated circuit package to package stacking system
Grant 8,395,251 - Shim , et al. March 12, 2 | 2013-03-12 |
Integrated circuit packaging system with stacking interconnect and method of manufacture thereof
Grant 8,390,108 - Cho , et al. March 5, 2 | 2013-03-05 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant 8,383,457 - Pagaila , et al. February 26, 2 | 2013-02-26 |
Integrated circuit package system with image sensor system
Grant 8,378,502 - Chow , et al. February 19, 2 | 2013-02-19 |
Integrated circuit package system for stackable devices and method for manufacturing thereof
Grant 8,368,199 - Chow , et al. February 5, 2 | 2013-02-05 |
Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
Grant 8,354,297 - Pagaila , et al. January 15, 2 | 2013-01-15 |
Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
Grant 8,354,746 - Huang , et al. January 15, 2 | 2013-01-15 |
Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
Grant 8,354,304 - Chow , et al. January 15, 2 | 2013-01-15 |
Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region
App 20120306038 - Chow; Seng Guan ; et al. | 2012-12-06 |
Integrated Circuit Package System With Internal Stacking Module
App 20120292750 - Chow; Seng Guan ; et al. | 2012-11-22 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die having Pre-Applied Protective Layer
App 20120286422 - Shim; II Kwon ; et al. | 2012-11-15 |
Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof
Grant 8,309,397 - Shim , et al. November 13, 2 | 2012-11-13 |
Integrated circuit packaging system with package-on-package and method of manufacture thereof
Grant 8,304,880 - Chow , et al. November 6, 2 | 2012-11-06 |
Integrated circuit packaging system with bump conductors and method of manufacture thereof
Grant 8,299,596 - Huang , et al. October 30, 2 | 2012-10-30 |
Integrated circuit packaging system with package stacking and method of manufacture thereof
Grant 8,288,844 - Huang , et al. October 16, 2 | 2012-10-16 |
Integrated circuit package system with internal stacking module
Grant 8,278,141 - Chow , et al. October 2, 2 | 2012-10-02 |
Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof
Grant 8,269,320 - Huang , et al. September 18, 2 | 2012-09-18 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20120223426 - Shim; Il Kwon ; et al. | 2012-09-06 |
Encapsulant interposer system with integrated passive devices and manufacturing method therefor
Grant 8,258,612 - Kuan , et al. September 4, 2 | 2012-09-04 |
Integrated circuit package system with penetrable film adhesive
Grant 8,258,015 - Chow , et al. September 4, 2 | 2012-09-04 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20120217647 - Shim; Il Kwon ; et al. | 2012-08-30 |
Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
App 20120217634 - Shim; Il Kwon ; et al. | 2012-08-30 |
Integrated Circuit Package With Molded Cavity
App 20120217659 - Chow; Seng Guan ; et al. | 2012-08-30 |
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
App 20120199971 - Shim; Il Kwon ; et al. | 2012-08-09 |
Package-on-Package Using Through-Hole Via Die on Saw Streets
App 20120199963 - Do; Byung Tai ; et al. | 2012-08-09 |
Dual Molded Multi-chip Package System
App 20120193805 - Ramakrishna; Kambhampati ; et al. | 2012-08-02 |
Stackable integrated circuit package system with multiple interconnect interface
Grant 8,232,658 - Chow , et al. July 31, 2 | 2012-07-31 |
Embedded semiconductor die package and method of making the same using metal frame carrier
Grant 8,222,717 - Shim , et al. July 17, 2 | 2012-07-17 |
Semiconductor Device and Method of Forming No-Flow Underfill Material Around Vertical Interconnect Structure
App 20120175771 - Huang; Rui ; et al. | 2012-07-12 |
Semiconductor Device and Method of Forming Three-Dimensional Vertically Oriented Integrated Capacitors
App 20120168963 - Huang; Rui ; et al. | 2012-07-05 |
Semiconductor package heat spreader
Grant 8,207,598 - Ararao , et al. June 26, 2 | 2012-06-26 |
Integrated Circuit Packaging System With Bump Conductors And Method Of Manufacture Thereof
App 20120146241 - Huang; Rui ; et al. | 2012-06-14 |
Integrated circuit package with molded cavity
Grant 8,198,735 - Chow , et al. June 12, 2 | 2012-06-12 |
Semiconductor Device and Method of Forming Openings Through Encapsulant to Reduce Warpage and Stress on Semiconductor Package
App 20120139120 - Chow; Seng Guan ; et al. | 2012-06-07 |
Mountable integrated circuit package system with mounting interconnects
Grant 8,188,586 - Chow , et al. May 29, 2 | 2012-05-29 |
Integrated circuit package-on-package system with anti-mold flash feature
Grant 8,183,675 - Chow , et al. May 22, 2 | 2012-05-22 |
Dual molded multi-chip package system
Grant 8,178,982 - Ramakrishna , et al. May 15, 2 | 2012-05-15 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20120112340 - Lin; Yaojian ; et al. | 2012-05-10 |
Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor
App 20120104599 - Do; Byung Tai ; et al. | 2012-05-03 |
Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure
Grant 8,163,597 - Huang , et al. April 24, 2 | 2012-04-24 |
Bridge stack integrated circuit package-on-package system
Grant 8,163,600 - Chow , et al. April 24, 2 | 2012-04-24 |
Integrated circuit package in package system
Grant 8,164,172 - Ho , et al. April 24, 2 | 2012-04-24 |
Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor
App 20120094444 - Do; Byung Tai ; et al. | 2012-04-19 |
Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
Grant 8,159,047 - Huang , et al. April 17, 2 | 2012-04-17 |
Integrated circuit packaging system substrates and method of manufacture thereof
Grant 8,143,107 - Do , et al. March 27, 2 | 2012-03-27 |
Integrated circuit package system with offset stacking and anti-flash structure
Grant 8,143,711 - Chow , et al. March 27, 2 | 2012-03-27 |
Semiconductor Device and Method of Forming Dam Material With Openings Around Semiconductor Die for Mold Underfill Using Dispenser and Vacuum Assist
App 20120068353 - Huang; Rui ; et al. | 2012-03-22 |
Integrated circuit package system with wire-in-film encapsulation
Grant 8,138,590 - Chow , et al. March 20, 2 | 2012-03-20 |
Package system for shielding semiconductor dies from electromagnetic interference
Grant 8,138,024 - Do , et al. March 20, 2 | 2012-03-20 |
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof
App 20120061854 - Chow; Seng Guan ; et al. | 2012-03-15 |
Stacked integrated circuit package system with conductive spacer
Grant 8,134,227 - Tay , et al. March 13, 2 | 2012-03-13 |
Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die
App 20120056316 - Pagaila; Reza A. ; et al. | 2012-03-08 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20120056329 - Pagaila; Reza A. ; et al. | 2012-03-08 |
Method of manufacture for semiconductor package with flow controller
Grant 8,129,231 - Chow , et al. March 6, 2 | 2012-03-06 |
Integrated circuit package system employing an exposed thermally conductive coating
Grant 8,124,460 - Chow , et al. February 28, 2 | 2012-02-28 |
Semiconductor packaging system with stacking and method of manufacturing thereof
Grant 8,106,496 - Ramakrishna , et al. January 31, 2 | 2012-01-31 |
Stackable integrated circuit package system
Grant 8,106,500 - Chow , et al. January 31, 2 | 2012-01-31 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20120018882 - Shim; Il Kwon ; et al. | 2012-01-26 |
Integrated circuit package system with die and package combination
Grant 8,102,040 - Chow , et al. January 24, 2 | 2012-01-24 |
Encapsulant Cavity Integrated Circuit Package System And Method Of Fabrication Thereof
App 20120007217 - Shim; Il Kwon ; et al. | 2012-01-12 |
Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP
App 20120001325 - Lin; Yaojian ; et al. | 2012-01-05 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20110316171 - Shim; Il Kwon ; et al. | 2011-12-29 |
Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
Grant 8,084,302 - Do , et al. December 27, 2 | 2011-12-27 |
Integrated circuit package system with offset stacking
Grant 8,084,849 - Chow , et al. December 27, 2 | 2011-12-27 |
Integrated Circuit Packaging System With Flip Chip Mounting And Method Of Manufacture Thereof
App 20110309481 - Huang; Rui ; et al. | 2011-12-22 |
Integrated circuit packaging system with multi level contact and method of manufacture thereof
Grant 8,080,885 - Chow , et al. December 20, 2 | 2011-12-20 |
Integrated Circuit Package System For Package Stacking And Method Of Manufacture Thereof
App 20110306168 - Pendse; Rajendra D. ; et al. | 2011-12-15 |
Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die
Grant 8,072,059 - Shim , et al. December 6, 2 | 2011-12-06 |
Embedded integrated circuit package system and method of manufacture thereof
Grant 8,067,832 - Ong , et al. November 29, 2 | 2011-11-29 |
Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die
Grant 8,062,929 - Do , et al. November 22, 2 | 2011-11-22 |
Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof
App 20110266652 - Do; Byung Tai ; et al. | 2011-11-03 |
Integrated circuit package system with flexible substrate and recessed package
Grant 8,050,047 - Chow , et al. November 1, 2 | 2011-11-01 |
Integrated circuit package system with insulator over circuitry
Grant 8,049,314 - Do , et al. November 1, 2 | 2011-11-01 |
Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
App 20110254157 - Huang; Rui ; et al. | 2011-10-20 |
Leadless semiconductor chip carrier system
Grant 8,039,311 - Kuan , et al. October 18, 2 | 2011-10-18 |
Method of forming stress relief layer between die and interconnect structure
Grant 8,039,303 - Shim , et al. October 18, 2 | 2011-10-18 |
Integrated Circuit Package In Package System
App 20110248411 - Ho; Tsz Yin ; et al. | 2011-10-13 |
Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
Grant 8,034,661 - Lin , et al. October 11, 2 | 2011-10-11 |
Integrated circuit package system with flexible substrate and mounded package
Grant 8,031,475 - Chow , et al. October 4, 2 | 2011-10-04 |
Semiconductor Device and Method of Forming Three-Dimensional Vertically Oriented Integrated Capacitors
App 20110233726 - Huang; Rui ; et al. | 2011-09-29 |
Integrated Circuit Protruding Pad Package System And Method For Manufacturing Thereof
App 20110233744 - Chow; Seng Guan ; et al. | 2011-09-29 |
Encapsulant cavity integrated circuit package system and method of fabrication thereof
Grant 8,021,924 - Shim , et al. September 20, 2 | 2011-09-20 |
Circuit System With Leads And Method Of Manufacture Thereof
App 20110214911 - Chow; Seng Guan ; et al. | 2011-09-08 |
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof
App 20110210436 - Chow; Seng Guan ; et al. | 2011-09-01 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 8,004,095 - Shim , et al. August 23, 2 | 2011-08-23 |
Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
Grant 7,993,941 - Huang , et al. August 9, 2 | 2011-08-09 |
Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof
Grant 7,989,269 - Do , et al. August 2, 2 | 2011-08-02 |
Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
Grant 7,989,270 - Huang , et al. August 2, 2 | 2011-08-02 |
Integrated Circuit Package-in-package System With Wire-in-film Encapsulant And Method For Manufacturing Thereof
App 20110180914 - Do; Byung Tai ; et al. | 2011-07-28 |
Semiconductor package system with substrate having different bondable heights at lead finger tips
Grant 7,986,032 - Chow , et al. July 26, 2 | 2011-07-26 |
Integrated circuit package on package system
Grant 7,986,043 - Merilo , et al. July 26, 2 | 2011-07-26 |
Integrated circuit package system with interconnect lock
Grant 7,985,628 - Kuan , et al. July 26, 2 | 2011-07-26 |
Integrated circuit package in package system
Grant 7,981,702 - Ho , et al. July 19, 2 | 2011-07-19 |
Integrated circuit protruding pad package system
Grant 7,968,377 - Chow , et al. June 28, 2 | 2011-06-28 |
Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
App 20110147926 - Shim; Il Kwon ; et al. | 2011-06-23 |
Integrated Circuit Packaging System With Package Stacking And Method Of Manufacture Thereof
App 20110147901 - Huang; Rui ; et al. | 2011-06-23 |
Integrated Circuit Packaging System With Stacking Interconnect And Method Of Manufacture Thereof
App 20110140259 - Cho; NamJu ; et al. | 2011-06-16 |
Semiconductor package with passive device integration
Grant 7,960,816 - Chow , et al. June 14, 2 | 2011-06-14 |
Integrated Circuit Package System For Electromagnetic Isolation And Method For Manufacturing Thereof
App 20110133316 - Huang; Rui ; et al. | 2011-06-09 |
Integrated Circuit Packaging System With Embedded Circuitry And Post
App 20110127678 - Shim; Il Kwon ; et al. | 2011-06-02 |
Semiconductor assembly with component pads attached on die back side
Grant 7,952,211 - Chow , et al. May 31, 2 | 2011-05-31 |
Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP
App 20110121449 - Lin; Yaojian ; et al. | 2011-05-26 |
Wafer level chip scale package system with a thermal dissipation structure
Grant 7,939,368 - Chow , et al. May 10, 2 | 2011-05-10 |
Integrated circuit package-in-package system with wire-in-film encapsulant
Grant 7,923,846 - Do , et al. April 12, 2 | 2011-04-12 |
Semiconductor device and method of forming the device using sacrificial carrier
Grant 7,923,295 - Shim , et al. April 12, 2 | 2011-04-12 |
Embedded Integrated Circuit Package System And Method Of Manufacture Thereof
App 20110079899 - Ong; You Yang ; et al. | 2011-04-07 |
Integrated Circuit Package System For Stackable Devices And Method For Manufacturing Thereof
App 20110079891 - Chow; Seng Guan ; et al. | 2011-04-07 |
Integrated circuit package system for electromagnetic isolation
Grant 7,902,644 - Huang , et al. March 8, 2 | 2011-03-08 |
Encapsulant Interposer System With Integrated Passive Devices And Manufacturing Method Therefor
App 20110049687 - Kuan; Heap Hoe ; et al. | 2011-03-03 |
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
App 20110037154 - Shim; Il Kwon ; et al. | 2011-02-17 |
Integrated Circuit Package System With Image Sensor System
App 20110037136 - Chow; Seng Guan ; et al. | 2011-02-17 |
Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
Grant 7,888,184 - Shim , et al. February 15, 2 | 2011-02-15 |
Encapsulant Cavity Integrated Circuit Package System And Method Of Fabrication Thereof
App 20110018084 - Shim; Il Kwon ; et al. | 2011-01-27 |
Ball grid array package stacking system
Grant 7,871,862 - Chow , et al. January 18, 2 | 2011-01-18 |
Integrated circuit package system with rigid locking lead
Grant 7,872,345 - Chow , et al. January 18, 2 | 2011-01-18 |
Integrated circuit package-on-package stacking system
Grant 7,868,434 - Merilo , et al. January 11, 2 | 2011-01-11 |
Integrated circuit package system with external interconnects within a die platform
Grant 7,863,102 - Tay , et al. January 4, 2 | 2011-01-04 |
Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
Grant 7,863,109 - Chow , et al. January 4, 2 | 2011-01-04 |
Array-molded package heat spreader and fabrication method therefor
Grant 7,863,730 - Shim , et al. January 4, 2 | 2011-01-04 |
Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof
Grant 7,863,726 - Chow , et al. January 4, 2 | 2011-01-04 |
Integrated circuit package system with overhanging connection stack
Grant 7,863,099 - Do , et al. January 4, 2 | 2011-01-04 |
Ball grid array package system
Grant 7,863,732 - Chow , et al. January 4, 2 | 2011-01-04 |
Leaded stacked packages having elevated die paddle
Grant 7,858,442 - Do , et al. December 28, 2 | 2010-12-28 |
Embedded integrated circuit package system
Grant 7,859,098 - Ong , et al. December 28, 2 | 2010-12-28 |
Integrated circuit package system for stackable devices
Grant 7,859,094 - Chow , et al. December 28, 2 | 2010-12-28 |
Integrated Circuit Package System With Redistribution Layer And Method For Manufacturing Thereof
App 20100320603 - Kuan; Heap Hoe ; et al. | 2010-12-23 |
Integrated circuit package system with an encapsulant cavity and method of fabrication thereof
Grant 7,855,100 - Shim , et al. December 21, 2 | 2010-12-21 |
Embedded semiconductor die package and method of making the same using metal frame carrier
Grant 7,842,542 - Shim , et al. November 30, 2 | 2010-11-30 |
Integrated Circuit Packaging System With Coin Bonded Interconnects And Method Of Manufacture Thereof
App 20100289142 - Shim; Il Kwon ; et al. | 2010-11-18 |
Integrated Circuit Packaging System With Reinforced Encapsulant Having Embedded Interconnect And Method Of Manufacture Thereof
App 20100289134 - Chow; Seng Guan ; et al. | 2010-11-18 |
Integrated Circuit Package System With Offset Stacking And Anti-flash Structure
App 20100270680 - Chow; Seng Guan ; et al. | 2010-10-28 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20100258937 - Shim; Il Kwon ; et al. | 2010-10-14 |
Semiconductor Device and Method of Forming No-Flow Underfill Material Around Vertical Interconnect Structure
App 20100244216 - Huang; Rui ; et al. | 2010-09-30 |
Integrated Circuit Packaging System With Package Underfill And Method Of Manufacture Thereof
App 20100244277 - Huang; Rui ; et al. | 2010-09-30 |
Semiconductor Device and Method of Stacking Same Size Semiconductor Die Electrically Connected Through Conductive Via Formed Around Periphery of the Die
App 20100233852 - Do; Byung Tai ; et al. | 2010-09-16 |
Semiconductor Device and Method of Forming Three-Dimensional Vertically Oriented Integrated Capacitors
App 20100230806 - Huang; Rui ; et al. | 2010-09-16 |
Integrated Circuit Packaging System With Patterned Substrate And Method Of Manufacture Thereof
App 20100224974 - Shim; Il Kwon ; et al. | 2010-09-09 |
Integrated Circuit Packaging System With Flex Tape And Method Of Manufacture Thereof
App 20100224978 - Shim; Il Kwon ; et al. | 2010-09-09 |
Stackable Integrated Circuit Package System
App 20100219523 - Chow; Seng Guan ; et al. | 2010-09-02 |
Package-on-Package Using Through-Hole Via Die on Saw Streets
App 20100193931 - Do; Byung Tai ; et al. | 2010-08-05 |
Integrated Circuit Package-on-package Stacking System
App 20100176497 - Merilo; Dioscoro A. ; et al. | 2010-07-15 |
Integrated Circuit Packaging System For Fine Pitch Substrates And Method Of Manufacture Thereof
App 20100155926 - Do; Byung Tai ; et al. | 2010-06-24 |
Integrated Circuit Packaging System Having Through Silicon Vias With Partial Depth Metal Fill Regions And Method Of Manufacture Thereof
App 20100148336 - Do; Byung Tai ; et al. | 2010-06-17 |
Integrated Circuit Packaging System With A Protrusion On An Inner Stacking Module And Method Of Manufacture Thereof
App 20100140809 - Chow; Seng Guan ; et al. | 2010-06-10 |
Semiconductor Device and Method of Forming an IPD Beneath a Semiconductor Die with Direct Connection to External Devices
App 20100140780 - Huang; Rui ; et al. | 2010-06-10 |
Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
App 20100140771 - Huang; Rui ; et al. | 2010-06-10 |
Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant
App 20100144101 - Chow; Seng Guan ; et al. | 2010-06-10 |
Encapsulant Interposer System With Integrated Passive Devices And Manufacturing Method Therefor
App 20100127361 - Kuan; Heap Hoe ; et al. | 2010-05-27 |
Integrated Circuit Packaging System With Multi Level Contact And Method Of Manufacture Thereof
App 20100123251 - Chow; Seng Guan ; et al. | 2010-05-20 |
Semiconductor Package System With Cavity Substrate And Manufacturing Method Therefor
App 20100102458 - Chow; Seng Guan ; et al. | 2010-04-29 |
Multi-chip Package System Incorporating An Internal Stacking Module With Support Protrusions
App 20100090350 - Chow; Seng Guan ; et al. | 2010-04-15 |
Integrated Circuit Package System With Mounting Structure
App 20100078828 - Huang; Rui ; et al. | 2010-04-01 |
Integrated Circuit Package System For Stackable Devices
App 20100072597 - Chow; Seng Guan ; et al. | 2010-03-25 |
Integrated Circuit Package System With Image Sensor System
App 20100065936 - Chow; Seng Guan ; et al. | 2010-03-18 |
Integrated Circuit Package System With Redistribution Layer
App 20100059885 - Kuan; Heap Hoe ; et al. | 2010-03-11 |
Leadless Semiconductor Chip Carrier System
App 20100059884 - Kuan; Heap Hoe ; et al. | 2010-03-11 |
Ball Grid Array Package Stacking System
App 20100059873 - Chow; Seng Guan ; et al. | 2010-03-11 |
Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
App 20100052135 - Shim; Il Kwon ; et al. | 2010-03-04 |
Integrated Circuit Package System With Package Substrate Having Corner Contacts And Method Of Manufacture Thereof
App 20100052150 - Chow; Seng Guan ; et al. | 2010-03-04 |
Semiconductor Assembly With Component Attached On Die Back Side
App 20100032828 - Chow; Seng Guan ; et al. | 2010-02-11 |
Method Of Manufacture For Semiconductor Package With Flow Controller
App 20100009468 - Chow; Seng Guan ; et al. | 2010-01-14 |
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
App 20100006994 - Shim; Il Kwon ; et al. | 2010-01-14 |
Integrated Circuit Package System With Locking Terminal
App 20090321913 - Shim; Il Kwon ; et al. | 2009-12-31 |
Integrated Circuit Packaging System With Embedded Circuitry And Post, And Method Of Manufacture Thereof
App 20090315170 - Shim; Il Kwon ; et al. | 2009-12-24 |
Integrated Circuit Package System With Wire-in-film Encapsulation
App 20090315164 - Chow; Seng Guan ; et al. | 2009-12-24 |
Semiconductor Package System With Substrate Having Different Bondable Heights At Lead Finger Tips
App 20090309237 - Chow; Seng Guan ; et al. | 2009-12-17 |
Integrated Circuit Package System With Internal Stacking Module
App 20090309197 - Chow; Seng Guan ; et al. | 2009-12-17 |
Integrated Circuit Package System With Die And Package Combination
App 20090309207 - Chow; Seng Guan ; et al. | 2009-12-17 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20090309212 - Shim; Il Kwon ; et al. | 2009-12-17 |
Semiconductor Package System With Cut Multiple Lead Pads
App 20090294935 - Tay; Lionel Chien Hui ; et al. | 2009-12-03 |
Semiconductor Package Heat Spreader
App 20090273062 - Ararao; Virgil Cotoco ; et al. | 2009-11-05 |
Wafer Level Integration Package
App 20090261460 - Kuan; Heap Hoe ; et al. | 2009-10-22 |
Leadframe Package For Mems Microphone Assembly
App 20090263937 - Ramakrishna; Kambhampati ; et al. | 2009-10-22 |
Integrated Circuit Package System With Non-symmetrical Support Structures
App 20090243068 - Kuan; Heap Hoe ; et al. | 2009-10-01 |
Integrated Circuit Package System With Rigid Locking Lead
App 20090243077 - Chow; Seng Guan ; et al. | 2009-10-01 |
Ball Grid Array Package System
App 20090236733 - Chow; Seng Guan ; et al. | 2009-09-24 |
Semiconductor Device and Method of Forming UBM Fixed Relative to Interconnect Structure for Alignment of Semiconductor Die
App 20090236686 - Shim; Il Kwon ; et al. | 2009-09-24 |
Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof
App 20090230531 - Do; Byung Tai ; et al. | 2009-09-17 |
Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor
App 20090224402 - Do; Byung Tai ; et al. | 2009-09-10 |
Integrated Circuit Package System With External Interconnects Within A Die Platform
App 20090212415 - Tay; Lionel Chien ; et al. | 2009-08-27 |
Package System For Shielding Semiconductor Dies From Electromagnetic Interference
App 20090212401 - Do; Byung Tai ; et al. | 2009-08-27 |
Integrated Circuit Package System With Penetrable Film Adhesive
App 20090212442 - Chow; Seng Guan ; et al. | 2009-08-27 |
Integrated Circuit Package-on-package Stacking System
App 20090179312 - Merilo; Dioscoro A. ; et al. | 2009-07-16 |
Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
App 20090170241 - Shim; Il Kwon ; et al. | 2009-07-02 |
Integrated Circuit Package System With Package Integration
App 20090152701 - Kuan; Heap Hoe ; et al. | 2009-06-18 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-applied Protective Layer
App 20090152715 - Shim; Il Kwon ; et al. | 2009-06-18 |
Integrated Circuit Package System With Offset Stacking
App 20090152692 - Chow; Seng Guan ; et al. | 2009-06-18 |
Integrated Circuit Package System With Interconnect Lock
App 20090152706 - Kuan; Heap Hoe ; et al. | 2009-06-18 |
Integrated Circuit Package System With Offset Stacking And Anti-flash Structure
App 20090155960 - Chow; Seng Guan ; et al. | 2009-06-18 |
Mountable Integrated Circuit Package System With Mountable Integrated Circuit Die
App 20090152700 - Kuan; Heap Hoe ; et al. | 2009-06-18 |
Integrated Circuit Package-on-package Stacking System And Method Of Manufacture Thereof
App 20090146315 - Shim; Il Kwon ; et al. | 2009-06-11 |
Integrated Circuit Package System With Shield
App 20090146269 - Chow; Seng Guan ; et al. | 2009-06-11 |
Integrated Circuit Package System For Electromagnetic Isolation
App 20090146268 - Huang; Rui ; et al. | 2009-06-11 |
Integrated Circuit Package-on-package System With Anti-mold Flash Feature
App 20090140407 - Chow; Seng Guan ; et al. | 2009-06-04 |
Leaded Stacked Packages Having Elevated Die Paddle
App 20090142883 - Do; Byung Tai ; et al. | 2009-06-04 |
Integrated Circuit Package System With Insulator
App 20090127683 - Do; Byung Tai ; et al. | 2009-05-21 |
Integrated Circuit Package System With Package Substrate Having Corner Contacts
App 20090127719 - Chow; Seng Guan ; et al. | 2009-05-21 |
Integrated Circuit Package-in-package System With Wire-in-film Encapsulant
App 20090127680 - Do; Byung Tai ; et al. | 2009-05-21 |
Mountable Integrated Circuit Package System With Mounting Interconnects
App 20090115043 - Chow; Seng Guan ; et al. | 2009-05-07 |
Electrostatic Discharge (ESD) Protection Structure
App 20090117729 - HUANG; Rui ; et al. | 2009-05-07 |
Semiconductor Package and Method of Reducing Electromagnetic Interference Between Devices
App 20090079041 - HUANG; Rui ; et al. | 2009-03-26 |
Integrated Circuit Package-on-package System With Anti-mold Flash Feature
App 20090057863 - Chow; Seng Guan ; et al. | 2009-03-05 |
Integrated Circuit Packaging System For Fine Pitch Substrates
App 20090032932 - Do; Byung Tai ; et al. | 2009-02-05 |
Integrated Circuit Package System With Flexible Substrate And Mounded Package
App 20090016033 - Chow; Seng Guan ; et al. | 2009-01-15 |
Integrated Circuit Package System With Flexible Substrate And Recessed Package
App 20090016032 - Chow; Seng Guan ; et al. | 2009-01-15 |
Integrated Circuit Package System With Overhanging Connection Stack
App 20090001593 - Do; Byung Tai ; et al. | 2009-01-01 |
Wafer Level Integration Package
App 20080315372 - Kuan; Heap Hoe ; et al. | 2008-12-25 |
Semiconductor Packages
App 20080296759 - Ramakrishna; Kambhampati ; et al. | 2008-12-04 |
Integrated Circuit Package System Employing Resilient Member Mold System Technology
App 20080284066 - Kuan; Heap Hoe ; et al. | 2008-11-20 |
Package-in-Package Using Through-Hole via Die on Saw Streets
App 20080272504 - DO; Byung Tai ; et al. | 2008-11-06 |
Package-on-Package Using Through-Hole Via Die on Saw Streets
App 20080272477 - DO; Byung Tai ; et al. | 2008-11-06 |
Same Size Through-Hole Via Die Stacked Package
App 20080272470 - DO; Byung Tai ; et al. | 2008-11-06 |
Integrated Circuit Package System For Package Stacking
App 20080258289 - Pendse; Rajendra D. ; et al. | 2008-10-23 |
Integrated Circuit Package System With Mounting Features
App 20080235941 - Chow; Seng Guan | 2008-10-02 |
Stacked Integrated Circuit Package System With Conductive Spacer
App 20080237825 - Tay; Lionel Chien Hui ; et al. | 2008-10-02 |
Integrated Circuit Package System With Interposer
App 20080211084 - Chow; Seng Guan ; et al. | 2008-09-04 |
Stackable Integrated Circuit Package System With Multiple Interconnect Interface
App 20080203549 - Chow; Seng Guan ; et al. | 2008-08-28 |
Encapsulant Cavity Integrated Circuit Package System
App 20080179729 - Shim; Il Kwon ; et al. | 2008-07-31 |
Semiconductor Package System With Die Carrier Having Mold Flow Restricting Elements
App 20080164618 - Chow; Seng Guan ; et al. | 2008-07-10 |
Leadframe Package For Mems Microphone Assembly
App 20080157301 - Ramakrishna; Kambhampati ; et al. | 2008-07-03 |
Dual Molded Multi-chip Package System
App 20080157402 - Ramakrishna; Kambhampati ; et al. | 2008-07-03 |
Bridge Stack Integrated Circuit Package-on-package System
App 20080157318 - Chow; Seng Guan ; et al. | 2008-07-03 |
Integrated Circuit Package With Molded Cavity
App 20080157325 - Chow; Seng Guan ; et al. | 2008-07-03 |
Integrated Circuit Package System Employing A Support Structure With A Recess
App 20080142938 - Chow; Seng Guan ; et al. | 2008-06-19 |
Semiconductor assembly with component attached on die back side
App 20080067695 - Chow; Seng Guan ; et al. | 2008-03-20 |
Integrated Circuit Package-on-package Stacking System
App 20080029858 - Merilo; Dioscoro A. ; et al. | 2008-02-07 |
Leaded Stacked Packages Having Integrated Upper Lead
App 20080017957 - Do; Byung Tai ; et al. | 2008-01-24 |
Leaded Stacked Packages Having Elevated Die Paddle
App 20080017994 - Do; Byung Tai ; et al. | 2008-01-24 |
Integrated Circuit Package System Employing An Exposed Thermally Conductive Coating
App 20080012098 - Chow; Seng Guan ; et al. | 2008-01-17 |
Integrated Circuit Package System With Edge Connection System
App 20070278660 - Han; Byung Joon ; et al. | 2007-12-06 |
Embedded Integrated Circuit Package System
App 20070246806 - Ong; You Yang ; et al. | 2007-10-25 |
Embedded Integrated Circuit Package-on-package System
App 20070246813 - Ong; You Yang ; et al. | 2007-10-25 |
Stacked Semiconductor Packages And Method Therefor
App 20070228545 - Ramakrishna; Kambhampati ; et al. | 2007-10-04 |
Integrated Circuit Die With Pedestal
App 20070228538 - Ararao; Virgil Cotoco ; et al. | 2007-10-04 |
Integrated Circuit Package System
App 20070210425 - Ramakrishna; Kambhampati ; et al. | 2007-09-13 |
Semiconductor Package System With Substrate Having Different Bondable Heights At Lead Finger Tips
App 20070210422 - Chow; Seng Guan ; et al. | 2007-09-13 |
Integrated Circuit Leaded Stacked Package System
App 20070209834 - Kuan; Heap Hoe ; et al. | 2007-09-13 |
Integrated Circuit Package On Package System
App 20070210443 - Merilo; Dioscoro A. ; et al. | 2007-09-13 |
Wafer Level Chip Scale Package System With A Thermal Dissipation Structure
App 20070212812 - Chow; Seng Guan ; et al. | 2007-09-13 |
Integrated Circuit Package In Package System
App 20070210424 - Ho; Tsz Yin ; et al. | 2007-09-13 |
Stackable Integrated Circuit Package System
App 20070200230 - Chow; Seng Guan ; et al. | 2007-08-30 |
Stackable Integrated Circuit Package System With Multiple Interconnect Interface
App 20070200257 - Chow; Seng Guan ; et al. | 2007-08-30 |
Integrated circuit package system with exposed interconnects
App 20070190690 - Chow; Seng Guan ; et al. | 2007-08-16 |
3-d Package Stacking System
App 20070187826 - Shim; Il Kwon ; et al. | 2007-08-16 |
Integrated circuit package system with image sensor system
App 20070166867 - Chow; Seng Guan ; et al. | 2007-07-19 |
Multi-chip package system
App 20070158809 - Chow; Seng Guan ; et al. | 2007-07-12 |
Pre-molded Leadframe And Method Therefor
App 20070111379 - Shim; Il Kwon ; et al. | 2007-05-17 |
Offset Integrated Circuit Package-on-package Stacking System
App 20070108581 - Shim; Il Kwon ; et al. | 2007-05-17 |
Integrated Circuit Package To Package Stacking System
App 20070108568 - Shim; Il Kwon ; et al. | 2007-05-17 |
Integrated Circuit Package-on-package Stacking System
App 20070108583 - Shim; Il Kwon ; et al. | 2007-05-17 |
Integrated Circuit Package System Including High-density Small Footprint System-in-package
App 20070096282 - Shim; IL Kwon ; et al. | 2007-05-03 |
Pre-molded Leadframe And Method Therefor
App 20070093000 - Shim; Il Kwon ; et al. | 2007-04-26 |
Integrated Circuit Protruding Pad Package System
App 20070063322 - Chow; Seng Guan ; et al. | 2007-03-22 |
Offset Integrated Circuit Package-on-package Stacking System
App 20060256525 - Shim; Il Kwon ; et al. | 2006-11-16 |
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