Chopra; Dinesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chopra; Dinesh.The latest application filed is for "method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates".

Company Profile

0.73.77

Chopra; Dinesh - Boise ID

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Patent Activity

Patent	Date
Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates Grant 9,214,359 - Chopra December 15, 2	2015-12-15
Method And Apparatus For Simultaneously Removing Multiple Conductive Materials From Microelectronic Substrates App 20140377953 - Chopra; Dinesh	2014-12-25
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning Grant 8,557,132 - Chopra , et al. October 15, 2	2013-10-15
Methods of forming electrical contacts to structures that are at different heights over a substrate relative to one another Grant 8,232,206 - Sinha , et al. July 31, 2	2012-07-31
Methods Of Forming Semiconductor Structures App 20100190314 - Sinha; Nishant ; et al.	2010-07-29
Methods of forming semiconductor structures Grant 7,713,817 - Sinha , et al. May 11, 2	2010-05-11
Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods Grant 7,662,719 - Sinha , et al. February 16, 2	2010-02-16
Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device Grant 7,573,116 - Howard , et al. August 11, 2	2009-08-11
Recovery system for platinum plating bath Grant 7,476,305 - Chopra January 13, 2	2009-01-13
Method and apparatus for cleaning a web-based chemical mechanical planarization system Grant 7,438,632 - Moore , et al. October 21, 2	2008-10-21
Fixed-abrasive chemical-mechanical planarization of titanium nitride Grant 7,402,094 - Chopra , et al. July 22, 2	2008-07-22
Electrochemical reaction cell for a combined barrier layer and seed layer Grant 7,385,290 - Chopra June 10, 2	2008-06-10
Methods of Forming Semiconductor Structures App 20080102596 - Sinha; Nishant ; et al.	2008-05-01
Semiconductor structures Grant 7,335,935 - Sinha , et al. February 26, 2	2008-02-26
Method And Apparatus For Simultaneously Removing Multiple Conductive Materials From Microelectronic Substrates App 20080045009 - Chopra; Dinesh	2008-02-21
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 7,329,607 - Chopra , et al. February 12, 2	2008-02-12
Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation Grant 7,278,905 - Chopra , et al. October 9, 2	2007-10-09
Polishing apparatus Grant 7,273,411 - Chopra , et al. September 25, 2	2007-09-25
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 7,220,663 - Chopra , et al. May 22, 2	2007-05-22
System for controlling metal formation processes using ion implantation Grant 7,214,614 - Chopra May 8, 2	2007-05-08
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 7,176,576 - Chopra , et al. February 13, 2	2007-02-13
Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device App 20060281319 - Howard; Bradley J. ; et al.	2006-12-14
Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation App 20060276115 - Chopra; Dinesh ; et al.	2006-12-07
Combined barrier layer and seed layer App 20060261485 - Chopra; Dinesh	2006-11-23
Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods App 20060252268 - Chopra; Dinesh ; et al.	2006-11-09
Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods App 20060249252 - Chopra; Dinesh ; et al.	2006-11-09
Method for simultaneously removing multiple conductive materials from microelectronic substrates Grant 7,129,160 - Chopra October 31, 2	2006-10-31
Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods Grant 7,118,686 - Sinha , et al. October 10, 2	2006-10-10
Apparatuses for forming a planarizing pad for planarization of microlectronic substrates Grant 7,112,245 - Agarwal , et al. September 26, 2	2006-09-26
Method of providing a structure using self-aligned features Grant 7,109,112 - Chopra , et al. September 19, 2	2006-09-19
Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation App 20060189264 - Chopra; Dinesh ; et al.	2006-08-24
Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device Grant 7,094,699 - Howard , et al. August 22, 2	2006-08-22
Method Of Providing A Structure Using Self-aligned Features App 20060154483 - Chopra; Dinesh ; et al.	2006-07-13
Method and apparatus for cleaning a web-based chemical mechanical planarization system Grant 7,063,603 - Moore , et al. June 20, 2	2006-06-20
Method and apparatus for cleaning a web-based chemical mechanical planarization system App 20060116057 - Moore; Scott E. ; et al.	2006-06-01
Method of forming a barrier seed layer with graded nitrogen composition Grant 7,041,595 - Chopra May 9, 2	2006-05-09
Semiconductor processing methods for forming electrical contacts Grant 7,005,379 - Sinha , et al. February 28, 2	2006-02-28
Fixed-abrasive chemical-mechanical planarization of titanium nitride Grant 6,997,781 - Chopra , et al. February 14, 2	2006-02-14
Fixed-abrasive chemical-mechanical planarization of titanium nitride App 20060009136 - Chopra; Dinesh ; et al.	2006-01-12
Fixed-abrasive chemical-mechanical planarization of titanium nitride App 20060003675 - Chopra; Dinesh ; et al.	2006-01-05
Semiconductor structures App 20060003583 - Sinha; Nishant ; et al.	2006-01-05
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,964,602 - Chopra , et al. November 15, 2	2005-11-15
Semiconductor processing methods for forming electrical contacts App 20050224981 - Sinha, Nishant ; et al.	2005-10-13
Method and apparatus for cleaning a web-based chemical mechanical planarization system Grant 6,949,011 - Moore , et al. September 27, 2	2005-09-27
Method and apparatus for cleaning a web-based chemical mechanical planarization system Grant 6,945,855 - Moore , et al. September 20, 2	2005-09-20
Fixed-abrasive chemical-mechanical planarization of titanium nitride App 20050199588 - Chopra, Dinesh ; et al.	2005-09-15
Method of reducing oxidation of metal structures by selectively implanting ions through a mask positioned above and not in contact with the substrate Grant 6,933,232 - Chopra August 23, 2	2005-08-23
Planarizing pads for planarization of microelectronic substrates Grant 6,932,687 - Agarwal , et al. August 23, 2	2005-08-23
Methods for polishing copper features of semiconductor devices structures App 20050153556 - Chopra, Dinesh ; et al.	2005-07-14
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning Grant 6,911,111 - Chopra , et al. June 28, 2	2005-06-28
Fixed-abrasive chemical-mechanical planarization of titanium nitride Grant 6,881,129 - Chopra , et al. April 19, 2	2005-04-19
Combined barrier layer and seed layer Grant 6,852,618 - Chopra February 8, 2	2005-02-08
Combined barrier layer and seed layer App 20050023516 - Chopra, Dinesh	2005-02-03
Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates App 20050020004 - Chopra, Dinesh	2005-01-27
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby App 20050009318 - Chopra, Dinesh ; et al.	2005-01-13
Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods Grant 6,830,500 - Chopra , et al. December 14, 2	2004-12-14
Method of providing a structure using self-aligned features App 20040219738 - Chopra, Dinesh ; et al.	2004-11-04
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby App 20040212093 - Chopra, Dinesh ; et al.	2004-10-28
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning App 20040206454 - Chopra, Dinesh ; et al.	2004-10-21
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning App 20040206374 - Chopra, Dinesh ; et al.	2004-10-21
Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device App 20040203240 - Howard, Bradley J. ; et al.	2004-10-14
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20040192176 - Chopra, Dinesh ; et al.	2004-09-30
Planarizing pads for planarization of microelectronic substrates App 20040166792 - Agarwal, Vishnu K. ; et al.	2004-08-26
Apparatuses for forming a planarizing pad for planarization of microlectronic substrates App 20040154533 - Agarwal, Vishnu K. ; et al.	2004-08-12
Plating metal caps on conductive interconnect for wirebonding App 20040157433 - Sinha, Nishant ; et al.	2004-08-12
Method of providing a structure using self-aligned features Grant 6,759,330 - Chopra , et al. July 6, 2	2004-07-06
Method of forming a metal seed layer for subsequent plating Grant 6,756,301 - Gilton , et al. June 29, 2	2004-06-29
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 6,756,678 - Chopra , et al. June 29, 2	2004-06-29
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,746,316 - Chopra , et al. June 8, 2	2004-06-08
Polishing apparatus App 20040102045 - Chopra, Dinesh ; et al.	2004-05-27
Method for forming a planarizing pad for planarization of microelectronic substrates Grant 6,736,869 - Agarwal , et al. May 18, 2	2004-05-18
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning Grant 6,736,926 - Chopra , et al. May 18, 2	2004-05-18
Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device Grant 6,730,609 - Howard , et al. May 4, 2	2004-05-04
Method of controlling metal formation processes using ion implantation, and system for performing same Grant 6,727,175 - Chopra April 27, 2	2004-04-27
Method of reducing oxidation of metal structures using ion implantation, and device formed by such method App 20040075173 - Chopra, Dinesh	2004-04-22
Method of controlling metal formation processes using ion implantation, and system for performing same App 20040072424 - Chopra, Dinesh	2004-04-15
Composition compatible with aluminum planarization and methods therefore Grant 6,720,265 - Chopra April 13, 2	2004-04-13
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,716,090 - Chopra , et al. April 6, 2	2004-04-06
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,712,676 - Chopra , et al. March 30, 2	2004-03-30
Method and apparatus for cleaning a web-based chemical mechanical planarization system Grant 6,706,139 - Moore , et al. March 16, 2	2004-03-16
Method of reducing oxidation of metal structures using ion implantation, and device formed by such method Grant 6,703,309 - Chopra March 9, 2	2004-03-09
Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates App 20040043582 - Chopra, Dinesh	2004-03-04
Method Of Reducing Oxidation Of Metal Structures Using Ion Implantation, And Device Formed By Such Method App 20040043605 - Chopra, Dinesh	2004-03-04
Method of controlling metal formation processes using ion implantation, and system for performing same App 20040023489 - Chopra, Dinesh	2004-02-05
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby App 20040011554 - Chopra, Dinesh ; et al.	2004-01-22
Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten App 20040014318 - Chopra, Dinesh ; et al.	2004-01-22
Copper Chemical-mechanical Polishing Process Using A Fixed Abrasive Polishing Pad And A Copper Layer Chemical-mechanical Polishing Solution Specifically Adapted For Chemical-mechanical Polishing With A Fixed Abrasive Pad Grant 6,676,484 - Chopra January 13, 2	2004-01-13
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,672,946 - Chopra , et al. January 6, 2	2004-01-06
Polishing apparatus Grant 6,672,949 - Chopra , et al. January 6, 2	2004-01-06
Plating metal caps on conductive interconnect for wirebonding App 20030227091 - Sinha, Nishant ; et al.	2003-12-11
Plating metal caps on conductive interconnect for wirebonding App 20030228749 - Sinha, Nishant ; et al.	2003-12-11
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,652,364 - Chopra , et al. November 25, 2	2003-11-25
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,652,365 - Chopra , et al. November 25, 2	2003-11-25
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,648,736 - Chopra , et al. November 18, 2	2003-11-18
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,638,148 - Chopra , et al. October 28, 2	2003-10-28
Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies Grant 6,620,032 - Chopra September 16, 2	2003-09-16
Recovery method for platinum plating bath Grant 6,616,828 - Chopra September 9, 2	2003-09-09
Recovery system for platinum plating bath App 20030164291 - Chopra, Dinesh	2003-09-04
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 6,613,671 - Chopra , et al. September 2, 2	2003-09-02
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,609,957 - Chopra , et al. August 26, 2	2003-08-26
Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods Grant 6,602,117 - Chopra , et al. August 5, 2	2003-08-05
Method of providing a structure using self-aligned features App 20030096498 - Chopra, Dinesh ; et al.	2003-05-22
Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods App 20030087525 - Sinha, Nishant ; et al.	2003-05-08
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies of planarizing pads App 20030073390 - Chopra, Dinesh ; et al.	2003-04-17
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030073387 - Chopra, Dinesh ; et al.	2003-04-17
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030073389 - Chopra, Dinesh ; et al.	2003-04-17
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030073388 - Chopra, Dinesh ; et al.	2003-04-17
Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning App 20030066548 - Chopra, Dinesh ; et al.	2003-04-10
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030068962 - Chopra, Dinesh ; et al.	2003-04-10
Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device App 20030068896 - Howard, Bradley J. ; et al.	2003-04-10
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20030068961 - Chopra, Dinesh ; et al.	2003-04-10
Method of forming a metal seed layer for subsequent plating App 20030054632 - Gilton, Terry L. ; et al.	2003-03-20
Recovery system for platinum plating bath App 20030024821 - Chopra, Dinesh	2003-02-06
Method of forming a non-conformal layer over and exposing a trench Grant 6,511,912 - Chopra , et al. January 28, 2	2003-01-28
Method and apparatus for cleaning a web-based chemical mechanical planarization system App 20030017706 - Moore, Scott E. ; et al.	2003-01-23
Method and apparatus for cleaning a web-based chemical mechanical planarization system App 20030015289 - Moore, Scott E. ; et al.	2003-01-23
Method and apparatus for cleaning a web-based chemical mechanical planarization system App 20030003743 - Moore, Scott E. ; et al.	2003-01-02
Composition compatible with aluminum planarization and methods therefore App 20020187642 - Chopra, Dinesh	2002-12-12
Combined barrier layer and seed layer App 20020173137 - Chopra, Dinesh	2002-11-21
Barrier and electroplating seed layer App 20020142583 - Chopra, Dinesh	2002-10-03
Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structurs that include copper and tungsten and polishing methods App 20020123299 - Chopra, Dinesh ; et al.	2002-09-05
Fixed-abrasive chemical-mechanical planarization of titanium nitride App 20020115384 - Chopra, Dinesh ; et al.	2002-08-22
Fixed-abrasive chemical-mechanical planarization of titanium nitride App 20020109122 - Chopra, Dinesh ; et al.	2002-08-15
Fixed-abrasive chemical-mechanical planarization of titanium nitride App 20020106977 - Chopra, Dinesh ; et al.	2002-08-08
Fixed-abrasive chemical-mechanical planarization of titanium nitride App 20020106975 - Chopra, Dinesh ; et al.	2002-08-08
Fixed abrasive chemical-mechanical planarization of titanium nitride Grant 6,419,554 - Chopra , et al. July 16, 2	2002-07-16
Method for conditioning polishing surface Grant 6,361,411 - Chopra , et al. March 26, 2	2002-03-26
Barrier and electroplating seed layer App 20020030274 - Chopra, Dinesh	2002-03-14
Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies Grant 6,354,919 - Chopra March 12, 2	2002-03-12
Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates App 20020009886 - Chopra, Dinesh ; et al.	2002-01-24
Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies Grant 6,328,632 - Chopra December 11, 2	2001-12-11
Fixed Abrasive Chemical-mechanical Planarization Of Titanium Nitride App 20010048161 - CHOPRA, DINESH ; et al.	2001-12-06
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20010031550 - Chopra, Dinesh ; et al.	2001-10-18
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby App 20010030363 - Chopra, Dinesh ; et al.	2001-10-18
Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies App 20010029157 - Chopra, Dinesh	2001-10-11
Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies App 20010029151 - Chopra, Dinesh	2001-10-11
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20010024935 - Chopra, Dinesh ; et al.	2001-09-27
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20010021628 - Chopra, Dinesh ; et al.	2001-09-13
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads App 20010018318 - Chopra, Dinesh ; et al.	2001-08-30
Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad App 20010016469 - Chopra, Dinesh	2001-08-23
Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad Grant 6,276,996 - Chopra August 21, 2	2001-08-21
Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad Grant 6,273,786 - Chopra , et al. August 14, 2	2001-08-14
Method of forming a metal seed layer for subsequent plating App 20010011638 - Gilton, Terry L. ; et al.	2001-08-09
Polishing apparatus App 20010006881 - Chopra, Dinesh ; et al.	2001-07-05
Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Grant 6,250,994 - Chopra , et al. June 26, 2	2001-06-26
Method of forming a metal seed layer for subsequent plating Grant 6,221,763 - Gilton , et al. April 24, 2	2001-04-24
Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad Grant 6,206,756 - Chopra , et al. March 27, 2	2001-03-27
Polishing apparatus Grant 6,196,899 - Chopra , et al. March 6, 2	2001-03-06
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies Grant 6,039,633 - Chopra March 21, 2	2000-03-21