Choi; Kang Rim

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choi; Kang Rim.The latest application filed is for "discrete power transistor package having solderless dbc to leadframe attach".

Company Profile

0.18.18

Choi; Kang Rim - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Discrete power transistor package having solderless DBC to leadframe attach Grant 11,387,162 - Jeun , et al. July 12, 2	2022-07-12
Discrete Power Transistor Package Having Solderless Dbc To Leadframe Attach App 20200303281 - Jeun; Gi-Young ; et al.	2020-09-24
Lead and lead frame for power package Grant 10,763,201 - Zommer , et al. Sep	2020-09-01
Discrete power transistor package having solderless DBC to leadframe attach Grant 10,720,376 - Jeun , et al.	2020-07-21
Discrete Power Transistor Package Having Solderless Dbc To Leadframe Attach App 20190088571 - Jeun; Gi-Young ; et al.	2019-03-21
Lead And Lead Frame For Power Package App 20180096918 - Zommer; Nathan ; et al.	2018-04-05
Lead and lead frame for power package Grant 9,842,795 - Zommer , et al. December 12, 2	2017-12-12
Discrete Power Transistor Package Having Solderless DBC To Leadframe Attach App 20170178998 - Jeun; Gi-Young ; et al.	2017-06-22
Electrically isolated power semiconductor package with optimized layout Grant 9,177,888 - Spann , et al. November 3, 2	2015-11-03
Electrically Isolated Power Semiconductor Package With Optimized Layout App 20150087113 - Spann; Thomas ; et al.	2015-03-26
Electrically isolated power semiconductor package with optimized layout Grant 8,901,723 - Spann , et al. December 2, 2	2014-12-02
Lead And Lead Frame For Power Package App 20140312477 - Zommer; Nathan ; et al.	2014-10-23
Lead and lead frame for power package Grant 8,796,837 - Zommer , et al. August 5, 2	2014-08-05
Electrically Isolated Power Semiconductor Package With Optimized Layout App 20130252381 - Spann; Thomas ; et al.	2013-09-26
Discrete Power Transistor Package Having Solderless Dbc To Leadframe Attach App 20130175704 - Jeun; Gi-Young ; et al.	2013-07-11
Electrically isolated power semiconductor package with optimized layout Grant 8,455,987 - Spann , et al. June 4, 2	2013-06-04
Lead And Lead Frame For Power Package App 20100224982 - Zommer; Nathan ; et al.	2010-09-09
Induction heating circuit and winding method for heating coils Grant 7,459,659 - Seok , et al. December 2, 2	2008-12-02
Induction Heating Circuit And Winding Method For Heating Coils App 20070246458 - SEOK; Kyoung Wook ; et al.	2007-10-25
Double-sided cooling isolated packaged power semiconductor device Grant 7,005,734 - Choi , et al. February 28, 2	2006-02-28
Double-sided cooling isolated packaged power semiconductor device App 20040222515 - Choi, Kang Rim ; et al.	2004-11-11
High frequency power device with a plastic molded package and direct bonded substrate Grant 6,731,002 - Choi May 4, 2	2004-05-04
Power device with a plastic molded package and direct bonded substrate Grant 6,727,585 - Choi April 27, 2	2004-04-27
Electrically isolated power semiconductor package Grant 6,710,463 - Choi March 23, 2	2004-03-23
Electrically isolated power device package App 20030186483 - Choi, Kang Rim	2003-10-02
Electrically isolated power device package Grant 6,583,505 - Choi June 24, 2	2003-06-24
Method of making electrically isolated power semiconductor package Grant 6,534,343 - Choi March 18, 2	2003-03-18
Electrically isolated power device package App 20020171134 - Choi, Kang Rim	2002-11-21
Power device with a plastic molded package and direct bonded substrate App 20020163074 - Choi, Kang Rim	2002-11-07
High frequency power device with a plastic molded package and direct bonded substrate App 20020163070 - Choi, Kang Rim	2002-11-07
Electrically isolated power semiconductor package Grant 6,404,065 - Choi June 11, 2	2002-06-11
Electrically isolated power semiconductor package App 20020017714 - Choi, Kang Rim	2002-02-14
Electrically isolated power semiconductor package App 20010018235 - Choi, Kang Rim	2001-08-30

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