Choi; Jin-Won

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choi; Jin-Won.The latest application filed is for "communication device and method for controlling the same".

Company Profile

0.35.55

Choi; Jin-Won - Gyeonggi-do KR
Choi; Jin Won - Yongin KR
Choi; Jin Won - Changwon-si KR
CHOI; Jin Won - Suwon-Si KR
Choi; Jin Won - Suwon KR
Choi; Jin Won - Gyunggi-do N/A KR
CHOI; Jin Won - Jeollabuk-do KR
Choi; Jin-Won - Jeollanam-do KR
Choi; Jin Won - Yongin-si KR
Choi; Jin Won - Seoul KR
Choi; Jin-Won - Leytonstone GB

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Communication device and method for controlling the same Grant 9,720,070 - Choi , et al. August 1, 2	2017-08-01
Communication Device And Method For Controlling The Same App 20170102447 - CHOI; Jin-Won ; et al.	2017-04-13
Function execution method and apparatus thereof Grant 9,292,199 - Choi March 22, 2	2016-03-22
Hybrid substrate with high density and low density substrate areas, and method of manufacturing the same Grant 9,159,693 - Choi October 13, 2	2015-10-13
Lead pin for package substrate Grant 9,142,499 - Lee , et al. September 22, 2	2015-09-22
Rotary-Type Keyboard for Inputting Multiple Languages App 20150205369 - Choi; Jin Won	2015-07-23
Printed Circuit Board Using Solder Coating Ball App 20150102488 - CHOI; Jin Won ; et al.	2015-04-16
Keyboard for Inputting Multiple Languages Using Detachable Keypad App 20150042569 - Choi; Jin Won	2015-02-12
Packaging method using solder coating ball and package having solder pattern including metal pattern Grant 8,952,531 - Choi , et al. February 10, 2	2015-02-10
Lead Pin For Package Substrate App 20140291851 - LEE; Ki Taek ; et al.	2014-10-02
Method of fabricating a package substrate Grant 8,835,302 - Lee , et al. September 16, 2	2014-09-16
Package substrate and fabricating method thereof Grant 8,822,841 - Lee , et al. September 2, 2	2014-09-02
Printed circuit board and method for manufacturing the same Grant 8,785,789 - Oh , et al. July 22, 2	2014-07-22
Lead pin for package substrate Grant 8,766,450 - Lee , et al. July 1, 2	2014-07-01
Hybrid Substrate With High Density And Low Density Substrate Areas, And Method Of Manufacturing The Same App 20140175672 - CHOI; Jin Won	2014-06-26
Solder injection head Grant 8,740,040 - Choi , et al. June 3, 2	2014-06-03
Substrate For Flip Chip Bonding And Method Of Fabricating The Same App 20140138821 - OH; Hueng Jae ; et al.	2014-05-22
Solder ball supplying apparatus Grant 8,708,215 - Oh , et al. April 29, 2	2014-04-29
Mask For Bumping Solder Balls On Circuit Board And Solder Ball Bumping Method Using The Same App 20140103098 - Choi; Jin Won ; et al.	2014-04-17
Printed Circuit Board And Method Of Manufacturing The Same App 20140076611 - CHOI; Jin Won ; et al.	2014-03-20
Substrate for flip chip bonding and method of fabricating the same Grant 8,671,564 - Oh , et al. March 18, 2	2014-03-18
Solder bump forming apparatus and soldering facility including the same Grant 8,651,356 - Mukai , et al. February 18, 2	2014-02-18
Packaging Method Using Solder Coating Ball And Package Manufactured Thereby App 20140035130 - Choi; Jin Won ; et al.	2014-02-06
Solder Injection Head App 20140034707 - Choi; Jin Won ; et al.	2014-02-06
Solder Ball Supplying Apparatus App 20130306709 - Oh; Hueng Jae ; et al.	2013-11-21
Method Of Fabricating A Package Substrate App 20130237049 - Lee; Dong Gyu ; et al.	2013-09-12
Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same Grant 8,486,760 - Chung , et al. July 16, 2	2013-07-16
Printed Circuit Board And Method For Manufacturing The Same App 20130168144 - Jeong; Sung Won ; et al.	2013-07-04
Printed Circuit Board And Method For Manufacturing The Same App 20130161085 - Oh; Hueng Jae ; et al.	2013-06-27
Package substrate capable of controlling the degree of warpage Grant 8,456,003 - Lee , et al. June 4, 2	2013-06-04
Solder Bump Forming Apparatus And Soldering Facility Including The Same App 20130134208 - MUKAI; Noriaki ; et al.	2013-05-30
Solder Bump Forming Apparatus And Soldering Facility Including The Same App 20130134207 - MUKAI; Noriaki ; et al.	2013-05-30
Lead pin for package substrate Grant 8,420,955 - Choi , et al. April 16, 2	2013-04-16
Method of manufacturing printed circuit board having flow preventing dam Grant 8,336,201 - Choi , et al. December 25, 2	2012-12-25
Package Substrate And Fabricating Method Thereof App 20120267285 - LEE; Dong Gyu ; et al.	2012-10-25
Printed Circuit Board And Method For Manufacturing The Same App 20120118621 - CHOI; Jin Won ; et al.	2012-05-17
Hot-dip Galvanized Steel Sheet Having Excellent Plating Qualities, Plating Adhesion And Spot Weldability And Manufacturing Method Thereof App 20120100391 - Lee; Jung-Woo ; et al.	2012-04-26
Lead pin for package substrate, and method for manufacturing package substrate with the same Grant 8,159,064 - Oh , et al. April 17, 2	2012-04-17
Lead pin for package substrate Grant 8,142,240 - Oh , et al. March 27, 2	2012-03-27
Lead Pin For Package Substrate, And Method For Manufacturing Package Substrate With The Same App 20120043653 - Oh; Heung Jae ; et al.	2012-02-23
Method of manufacturing printed circuit board having flow preventing dam App 20120000067 - Choi; Jin Won ; et al.	2012-01-05
Method of manufacturing heat radiation substrate having metal core Grant 8,061,025 - Cho , et al. November 22, 2	2011-11-22
Spactial Modelling System Employing Bim App 20110264417 - Choi; Jin Won ; et al.	2011-10-27
Printed circuit board with solder bump on solder pad and flow preventing dam Grant 8,039,761 - Choi , et al. October 18, 2	2011-10-18
Package substrate and method of fabricating the same App 20110186991 - Lee; Dong Gyu ; et al.	2011-08-04
Storage System And Method Of Processing Data Using The Same App 20110185122 - Choi; Jin Won	2011-07-28
Package substrate and method of fabricating the same App 20110133332 - Mun; Seon Jae ; et al.	2011-06-09
Lead pin for semiconductor package and semiconductor package App 20110127676 - Choi; Jin Won ; et al.	2011-06-02
Method operating hard disk drive on the basis of predicted defect using hierarchical clustering and curve fit Grant 7,952,826 - Youlian , et al. May 31, 2	2011-05-31
Pharmaceutical Preparation Containing Non-dihydropyridine Calcium Channel Blocker And Angiotensin-2 Receptor Blocker App 20110123612 - Kim; Sung Wuk ; et al.	2011-05-26
Method of manufacturing heat radiation substrate having metal core App 20110115121 - Cho; Seung Hyun ; et al.	2011-05-19
Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same App 20110079926 - Chung; Tae Joon ; et al.	2011-04-07
Lead pin for package substrate App 20110067899 - Choi; Jin Won ; et al.	2011-03-24
Lead pin for package substrate App 20110068473 - Lee; Ki Taek ; et al.	2011-03-24
Lead pin for package boards Grant 7,893,355 - Oh , et al. February 22, 2	2011-02-22
Heat radiation substrate having metal core and method of manufacturing the same Grant 7,875,340 - Cho , et al. January 25, 2	2011-01-25
Lead pin for package substrate App 20110014826 - Lee; Ki Taek ; et al.	2011-01-20
Post bump and method of forming the same App 20110012261 - Choi; Jin-Won ; et al.	2011-01-20
Lead pin for package substrate App 20110014827 - Oh; Heung Jae ; et al.	2011-01-20
Substrate For Flip Chip Bonding And Method Of Fabricating The Same App 20100314161 - OH; Hueng Jae ; et al.	2010-12-16
Function Execution Method And Apparatus Thereof App 20100299638 - CHOI; Jin-Won	2010-11-25
Printed Circuit Board And Method Of Manufacturing The Same App 20100270067 - CHOI; Jin-Won ; et al.	2010-10-28
Electronic Component Package And Method Of Manufacturing The Same App 20100271792 - Choi; Jin-Won ; et al.	2010-10-28
Wafer packaging method Grant 7,736,952 - Cho , et al. June 15, 2	2010-06-15
Substrate having metal post and method of manufacturing the same App 20100132998 - Lee; Dong Gyu ; et al.	2010-06-03
Printed Circuit Board Having Flow Preventing Dam And Manufacturing Method Thereof App 20100116534 - Choi; Jin Won ; et al.	2010-05-13
Printed circuit board and method of manufacturing the same App 20100044084 - LEE; Dong Gyu ; et al.	2010-02-25
Method and apparatus for copying data from one disc drive to another disc drive Grant 7,663,826 - Choi February 16, 2	2010-02-16
Lead pin for package boards App 20100000761 - Oh; Hueng Jae ; et al.	2010-01-07
Heat radiation substrate having metal core and method of manufacturing the same App 20090297801 - Cho; Seung Hyun ; et al.	2009-12-03
Conjugated biological molecules and their preparation Grant 7,595,292 - Brocchini , et al. September 29, 2	2009-09-29
Printed circuit board for a package and manufacturing method thereof App 20090205854 - Lee; Dong-Gyu ; et al.	2009-08-20
Post bump and method of forming the same App 20090184420 - Choi; Jin-Won ; et al.	2009-07-23
Method Operating Hard Disk Drive On The Basis Of Predicted Defect Using Hierarchical Clustering And Curve Fit App 20090153997 - YOULIAN; Hristov Stoev ; et al.	2009-06-18
Wafer packaging method App 20090087950 - Cho; Soon-Jin ; et al.	2009-04-02
Mask for screen printing and screen printing method using the same App 20090025581 - Cho; Soon Jin ; et al.	2009-01-29
Conjugated biological molecules and their preparation App 20060210526 - Brocchini; Stephen James ; et al.	2006-09-21
Method and apparatus for copying data from one disc drive to another disc drive App 20060158761 - Choi; Jin-won	2006-07-20
Method for partitioning hard disc drive and hard disc drive adapted thereto App 20050182897 - Choi, Jin-won	2005-08-18