Patent | Date |
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Capacitor structure and semiconductor device including the same Grant 10,522,456 - Kim , et al. Dec | 2019-12-31 |
Capacitor Structure And Semiconductor Device Including The Same App 20190051597 - KIM; Jae-woo ;   et al. | 2019-02-14 |
Semiconductor Chips Having Through Silicon Vias And Related Fabrication Methods And Semiconductor Packages App 20170345713 - Chun; Jin-ho ;   et al. | 2017-11-30 |
Semiconductor device and method of fabricating the same Grant 9,831,164 - Moon , et al. November 28, 2 | 2017-11-28 |
Semiconductor device and method of fabricating the same Grant 9,793,347 - Lee , et al. October 17, 2 | 2017-10-17 |
Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages Grant 9,698,051 - Chun , et al. July 4, 2 | 2017-07-04 |
Semiconductor device and method of fabricating the same Grant 9,530,726 - Moon , et al. December 27, 2 | 2016-12-27 |
Integrated circuit device having through-silicon-via structure Grant 9,496,218 - Lee , et al. November 15, 2 | 2016-11-15 |
Semiconductor Device And Method Of Fabricating The Same App 20160056235 - LEE; WOO-JIN ;   et al. | 2016-02-25 |
Semiconductor device including through via structures and redistribution structures Grant 9,236,349 - Lee , et al. January 12, 2 | 2016-01-12 |
Method of manufacturing a semiconductor device having a porous, low-k dielectric layer Grant 9,224,593 - Ahn , et al. December 29, 2 | 2015-12-29 |
Semiconductor device and method of fabricating the same Grant 9,214,381 - Lee , et al. December 15, 2 | 2015-12-15 |
Semiconductor devices having optical transceiver Grant 9,103,974 - Kang , et al. August 11, 2 | 2015-08-11 |
Integrated circuit having through silicon via structure with minimized deterioration Grant 9,018,768 - Park , et al. April 28, 2 | 2015-04-28 |
Semiconductor Chips Having Through Silicon Vias And Related Fabrication Methods And Semiconductor Packages App 20150111346 - Chun; Jin-ho ;   et al. | 2015-04-23 |
Semiconductor devices and methods of manufacturing the same Grant 8,969,196 - Park , et al. March 3, 2 | 2015-03-03 |
Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages Grant 8,957,526 - Chun , et al. February 17, 2 | 2015-02-17 |
Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices Grant 8,952,543 - Lee , et al. February 10, 2 | 2015-02-10 |
Method For Fabricating Semiconductor Device App 20140377926 - KIM; Tae-Gon ;   et al. | 2014-12-25 |
Optical input/output device and method of fabricating the same Grant 8,901,694 - Kang , et al. December 2, 2 | 2014-12-02 |
Integrated circuit device including through-silicon via structure having offset interface Grant 8,884,440 - Kim , et al. November 11, 2 | 2014-11-11 |
Method Of Fabricating Semiconductor Device Having Bump App 20140329382 - HWANG; SON-KWAN ;   et al. | 2014-11-06 |
Buried-type optical input/output devices and methods of manufacturing the same Grant 8,873,901 - Kang , et al. October 28, 2 | 2014-10-28 |
Optical input/output device for photo-electric integrated circuit device and method of fabricating same Grant 8,867,882 - Kang , et al. October 21, 2 | 2014-10-21 |
Electrode connecting structures containing copper Grant 8,860,221 - Park , et al. October 14, 2 | 2014-10-14 |
Semiconductor device and method of fabricating the same Grant 8,847,399 - Park , et al. September 30, 2 | 2014-09-30 |
Semiconductor Device And Method Of Fabricating The Same App 20140264729 - LEE; WOO-JIN ;   et al. | 2014-09-18 |
Semiconductor Device and Method of Fabricating the Same App 20140217603 - Moon; Kwang-jin ;   et al. | 2014-08-07 |
Method Of Forming Micropattern, Method Of Forming Damascene Metallization, And Semiconductor Device And Semiconductor Memory Device Fabricated Using The Same App 20140210055 - PARK; In-sun ;   et al. | 2014-07-31 |
Methods for Forming Semiconductor Devices Using Sacrificial Layers App 20140199810 - Park; Jin-Ho ;   et al. | 2014-07-17 |
Semiconductor devices and methods of manufacturing semiconductor devices Grant 8,736,018 - Kim , et al. May 27, 2 | 2014-05-27 |
Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process Grant 8,735,265 - Kang , et al. May 27, 2 | 2014-05-27 |
Method of forming micropattern, method of forming damascene metallization, and semiconductor device and semiconductor memory device fabricated using the same Grant 8,709,937 - Park , et al. April 29, 2 | 2014-04-29 |
Oxidation-promoting compositions, methods of forming oxide layers, and methods of fabricating semiconductor devices Grant 8,697,583 - Oh , et al. April 15, 2 | 2014-04-15 |
Method of manufacturing a semiconductor device Grant 8,696,921 - Park , et al. April 15, 2 | 2014-04-15 |
Semiconductor Device Including Through Via Structures And Redistribution Structures App 20140048952 - Lee; Kyu-Ha ;   et al. | 2014-02-20 |
Semiconductor Device and Method of Fabricating the Same App 20140035164 - Moon; Kwang-jin ;   et al. | 2014-02-06 |
Integrated Circuit Device Having Through-Silicon-Via Structure and Method of Manufacturing the Same App 20140021633 - Lee; Do-Sun ;   et al. | 2014-01-23 |
Semiconductor devices including 3-D structures with support pad structures and related methods and systems Grant 8,624,354 - Kim , et al. January 7, 2 | 2014-01-07 |
Methods Of Forming A Semiconductor Device App 20130337647 - JUNG; Deok-Young ;   et al. | 2013-12-19 |
Through-silicon Via (tsv) Semiconductor Devices Having Via Pad Inlays App 20130313722 - Hwang; Son-Kwan ;   et al. | 2013-11-28 |
Methods of manufacturing a semiconductor device Grant 8,592,310 - Park , et al. November 26, 2 | 2013-11-26 |
Semiconductor device conductive pattern structures and methods of manufacturing the same Grant 8,592,979 - Kim , et al. November 26, 2 | 2013-11-26 |
Via structures and semiconductor devices having the via structures Grant 8,581,334 - Lim , et al. November 12, 2 | 2013-11-12 |
Integrated circuit devices with crack-resistant fuse structures Grant 8,569,862 - Ahn , et al. October 29, 2 | 2013-10-29 |
Semiconductor Chips Having Through Silicon Vias and Related Fabrication Methods and Semiconductor Packages App 20130264720 - Chun; Jin-ho ;   et al. | 2013-10-10 |
Non-volatile memory device Grant 8,547,747 - Kim , et al. October 1, 2 | 2013-10-01 |
Method of forming semiconductor device Grant 8,546,256 - Jung , et al. October 1, 2 | 2013-10-01 |
Method for forming light guide layer in semiconductor substrate Grant 8,546,162 - Bae , et al. October 1, 2 | 2013-10-01 |
Methods of fabricating semiconductor devices having various isolation regions Grant 8,530,329 - Choi , et al. September 10, 2 | 2013-09-10 |
Method of forming hardened porous dielectric layer and method of fabricating semiconductor device having hardened porous dielectric layer Grant 8,524,615 - Ahn , et al. September 3, 2 | 2013-09-03 |
Semiconductor Devices Including Dummy Solder Bumps App 20130221519 - Hwang; Son-kwan ;   et al. | 2013-08-29 |
Optical Input/output Device For Photo-electric Integrated Circuit Device And Method Of Fabricating Same App 20130224935 - KANG; Pil-Kyu ;   et al. | 2013-08-29 |
Via Connection Structures, Semiconductor Devices Having The Same, And Methods Of Fabricating The Structures And Devices App 20130200525 - LEE; Ho-Jin ;   et al. | 2013-08-08 |
Methods of forming wiring structures Grant 8,501,606 - Lee , et al. August 6, 2 | 2013-08-06 |
Integrated Circuit Devices With Crack-resistant Fuse Structures App 20130193552 - Ahn; Sang-Hoon ;   et al. | 2013-08-01 |
Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same Grant 8,497,157 - Moon , et al. July 30, 2 | 2013-07-30 |
Methods of forming semiconductor devices including landing pads formed by electroless plating Grant 8,497,207 - Yun , et al. July 30, 2 | 2013-07-30 |
Semiconductor Device and Method of Fabricating the Same App 20130187287 - Park; Byung-lyul ;   et al. | 2013-07-25 |
Methods of manufacturing flash memory devices by selective removal of nitrogen atoms Grant 8,492,223 - Choi , et al. July 23, 2 | 2013-07-23 |
Semiconductor device and method of manufacturing the same Grant 8,486,783 - Sohn , et al. July 16, 2 | 2013-07-16 |
Semiconductor device conductive pattern structures including dummy conductive patterns Grant 8,476,763 - Kim , et al. July 2, 2 | 2013-07-02 |
Method of fabricating semiconductor device having buried wiring Grant 8,466,052 - Baek , et al. June 18, 2 | 2013-06-18 |
Semiconductor device and method of manufacturing the same Grant 8,466,556 - Park , et al. June 18, 2 | 2013-06-18 |
Electrode Connecting Structures Containing Copper App 20130140697 - Park; Kun-Sang ;   et al. | 2013-06-06 |
Integrated Circuit Device Including Through-silicon Via Structure Having Offset Interface App 20130119547 - Kim; Su-kyoung ;   et al. | 2013-05-16 |
Optical input/output device for photo-electric integrated circuit device and method of fabricating same Grant 8,422,845 - Kang , et al. April 16, 2 | 2013-04-16 |
Methods of forming integrated circuit devices with crack-resistant fuse structures Grant 8,404,579 - Ahn , et al. March 26, 2 | 2013-03-26 |
Methods of forming a gate structure Grant 8,404,576 - Cha , et al. March 26, 2 | 2013-03-26 |
Optical Input/output Device And Method Of Fabricating The Same App 20130062719 - KANG; Pil-Kyu ;   et al. | 2013-03-14 |
Semiconductor device and method of fabricating the same Grant 8,390,120 - Moon , et al. March 5, 2 | 2013-03-05 |
Method of fabricating semiconductor device Grant 8,367,535 - Choi , et al. February 5, 2 | 2013-02-05 |
Semiconductor devices including doped metal silicide patterns and related methods of forming such devices Grant 8,367,533 - Yun , et al. February 5, 2 | 2013-02-05 |
Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate Grant 8,354,308 - Kang , et al. January 15, 2 | 2013-01-15 |
Method Of Forming Micropattern, Method Of Forming Damascene Metallization, And Semiconductor Device And Semiconductor Memory Device Fabricated Using The Same App 20130012023 - Park; In-sun ;   et al. | 2013-01-10 |
Semiconductor Devices And Methods Of Manufacturing The Same App 20130005141 - Park; Jin-Ho ;   et al. | 2013-01-03 |
Semiconductor Devices Having Optical Transceiver App 20120314991 - Kang; Pil-Kyu ;   et al. | 2012-12-13 |
Buried-type Optical Input/output Devices And Methods Of Manufacturing The Same App 20120314993 - Kang; Pil-Kyu ;   et al. | 2012-12-13 |
Methods of manufacturing buried wiring type substrate and semiconductor device incorporating buried wiring type substrate Grant 8,324,055 - Kang , et al. December 4, 2 | 2012-12-04 |
Semiconductor Device Conductive Pattern Structures And Methods Of Manufacturing The Same App 20120280391 - KIM; HEI-SEUNG ;   et al. | 2012-11-08 |
Method Of Manufacturing A Semiconductor Device And Method Of Manufacturing A Semiconductor Package Including The Same App 20120282736 - MOON; Kwang-Jin ;   et al. | 2012-11-08 |
Method of manufacturing a metal wiring structure Grant 8,304,343 - Choi , et al. November 6, 2 | 2012-11-06 |
Method forming contact plug for semiconductor device using H2 remote plasma treatment Grant 8,288,275 - Park , et al. October 16, 2 | 2012-10-16 |
Methods of manufacturing semiconductor devices Grant 8,278,207 - Park , et al. October 2, 2 | 2012-10-02 |
Apparatus And Method For Fabricating Semiconductor Devices And Substrates App 20120216954 - PARK; Jin-ho ;   et al. | 2012-08-30 |
Semiconductor Device Conductive Pattern Structures Including Dummy Conductive Patterns, And Methods Of Manufacturing The Same App 20120193792 - Kim; Hei-Seung ;   et al. | 2012-08-02 |
Method of Manufacturing a Semiconductor Device Having a Porous, Low-K Dielectric Layer App 20120178253 - Ahn; Sang-Hoon ;   et al. | 2012-07-12 |
Structures electrically connecting aluminum and copper interconnections and methods of forming the same Grant 8,211,793 - Lee , et al. July 3, 2 | 2012-07-03 |
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20120153500 - KIM; Kyoung-Hee ;   et al. | 2012-06-21 |
Methods Of Manufacturing A Semiconductor Device App 20120142185 - Park; Byung-Lyul ;   et al. | 2012-06-07 |
Semiconductor Devices And Methods Of Manufacturing The Same App 20120132986 - Kang; Pil-Kyu ;   et al. | 2012-05-31 |
Non-volatile Memory Device App 20120120728 - KIM; Su-Kyoung ;   et al. | 2012-05-17 |
Substrate Structure Having Buried Wiring And Method For Manufacturing The Same, And Semiconductor Device And Method For Manufacturing The Same Using The Substrate Structure App 20120108034 - Bae; Dae-Lok ;   et al. | 2012-05-03 |
Methods of Forming Integrated Circuit Devices Having Anisotropically-Oxidized Nitride Layers App 20120100708 - Park; Jae-Hwa ;   et al. | 2012-04-26 |
Method For Forming Light Guide Layer In Semiconductor Substrate App 20120088323 - BAE; DAE-LOK ;   et al. | 2012-04-12 |
Method Of Forming Hardened Porous Dielectric Layer And Method Of Fabricating Semiconductor Device Having Hardened Porous Dielectric Layer App 20120083117 - Ahn; Sang-Hoon ;   et al. | 2012-04-05 |
Oxidation-promoting Compositions, Methods Of Forming Oxide Layers, And Methods Of Fabricating Semiconductor Devices App 20120058647 - Oh; Kyung-seok ;   et al. | 2012-03-08 |
Conductive Layer Buried-type Substrate, Method Of Forming The Conductive Layer Buried-type Substrate, And Method Of Fabricating Semiconductor Device Using The Conductive Layer Buried-type Substrate App 20120052635 - Kang; Pil-kyu ;   et al. | 2012-03-01 |
Semiconductor Device and Method of Fabricating the Same App 20120043666 - Park; Byung-Lyul ;   et al. | 2012-02-23 |
Method of forming a metal layer and a method of fabricating a semiconductor device Grant 8,119,526 - Jung , et al. February 21, 2 | 2012-02-21 |
Methods Of Fabricating Semiconductor Devices Having Various Isolation Regions App 20120034757 - Choi; Yong-Soon ;   et al. | 2012-02-09 |
Semiconductor Device And Method Of Manufacturing The Same App 20120012969 - Park; Jin-Ho ;   et al. | 2012-01-19 |
Method Of Manufacturing A Metal Wiring Structure App 20120009781 - Choi; Kyung-In ;   et al. | 2012-01-12 |
Semiconductor Device And Method Of Fabricating The Same Including A Conductive Structure Is Formed Through At Least One Dielectric Layer After Forming A Via Structure App 20110318923 - Park; Byung-Lyul ;   et al. | 2011-12-29 |
Method Of Forming Semiconductor Device App 20110318922 - Jung; Deok-young ;   et al. | 2011-12-29 |
Semiconductor Device and Method of Fabricating the Same App 20110316168 - Moon; Kwang-Jin ;   et al. | 2011-12-29 |
Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure Grant 8,076,234 - Park , et al. December 13, 2 | 2011-12-13 |
Method Of Fabricating Semiconductor Device App 20110281427 - Choi; Yong-Soon ;   et al. | 2011-11-17 |
Method of manufacturing a metal wiring structure Grant 8,053,374 - Choi , et al. November 8, 2 | 2011-11-08 |
Semiconductor device including fuse Grant 8,044,490 - Shin , et al. October 25, 2 | 2011-10-25 |
Methods of Manufacturing Flash Memory Devices by Selective Removal of Nitrogen Atoms App 20110256708 - Choi; Jong-wan ;   et al. | 2011-10-20 |
Methods Of Selectively Forming Silicon-on-insulator Structures Using Selective Expitaxial Growth Process App 20110250738 - Kang; Pil-Kyu ;   et al. | 2011-10-13 |
Semiconductor device and method of manufacturing the same Grant 8,030,204 - Park , et al. October 4, 2 | 2011-10-04 |
Semiconductor Devices Including Doped Metal Silicide Patterns and Related Methods of Forming Such Devices App 20110237058 - Yun; Jung-Ho ;   et al. | 2011-09-29 |
Methods of manufacturing semiconductor devices including a copper-based conductive layer Grant 8,021,980 - Kim , et al. September 20, 2 | 2011-09-20 |
Methods Of Manufacturing Buried Wiring Type Substrate And Semiconductor Device Incorporating Buried Wiring Type Substrate App 20110223725 - KANG; Pil-Kyu ;   et al. | 2011-09-15 |
Method Of Manufacturing Semiconductor Device App 20110207334 - CHOI; Yong-soon ;   et al. | 2011-08-25 |
Method Forming Metal Film And Semiconductor Fabrication Device Having Metal Film App 20110201198 - JUNG; Eun-ji ;   et al. | 2011-08-18 |
Methods of forming integrated circuit devices having stacked gate electrodes Grant 7,998,810 - Kim , et al. August 16, 2 | 2011-08-16 |
Optical Input/output Device For Photo-electric Integrated Circuit Device And Method Of Fabricating Same App 20110188828 - KANG; Pil-Kyu ;   et al. | 2011-08-04 |
Gate structure, and semiconductor device having a gate structure Grant 7,989,892 - Cha , et al. August 2, 2 | 2011-08-02 |
Methods of forming integrated circuit devices having anisotropically-oxidized nitride layers Grant 7,989,333 - Park , et al. August 2, 2 | 2011-08-02 |
Methods Of Forming A Gate Structure App 20110171818 - Cha; Tae-Ho ;   et al. | 2011-07-14 |
Method of manufacturing a semiconductor device Grant 7,972,941 - Hong , et al. July 5, 2 | 2011-07-05 |
Method of fabricating a semiconductor device using a full silicidation process Grant 7,968,410 - Jung , et al. June 28, 2 | 2011-06-28 |
Methods Of Forming Integrated Circuit Devices With Crack-resistant Fuse Structures App 20110136332 - Ahn; Sang-Hoon ;   et al. | 2011-06-09 |
Semiconductor Devices Including 3-d Structures With Support Pad Structures And Related Methods And Systems App 20110115051 - Kim; Shin-hye ;   et al. | 2011-05-19 |
Via Structures And Semiconductor Devices Having The Via Structures App 20110108988 - LIM; Dong-Chan ;   et al. | 2011-05-12 |
Semiconductor devices having stacked structures Grant 7,936,024 - Kim , et al. May 3, 2 | 2011-05-03 |
Methods Of Forming Wiring Structures App 20110092060 - Lee; Eun-Ok ;   et al. | 2011-04-21 |
Gate structures in semiconductor devices Grant 7,928,498 - Cha , et al. April 19, 2 | 2011-04-19 |
Methods for forming silicide conductors using substrate masking Grant 7,897,500 - Jung , et al. March 1, 2 | 2011-03-01 |
Methods for fabricating improved gate dielectrics Grant 7,879,737 - Sohn , et al. February 1, 2 | 2011-02-01 |
Semiconductor device including an ohmic layer Grant 7,875,939 - Park , et al. January 25, 2 | 2011-01-25 |
Methods of forming interlayer dielectrics having air gaps Grant 7,842,600 - Yun , et al. November 30, 2 | 2010-11-30 |
Method of forming semiconductor device having stacked transistors Grant 7,833,847 - Kim , et al. November 16, 2 | 2010-11-16 |
Methods of producing integrated circuit devices utilizing tantalum amine derivatives Grant 7,833,855 - Kang , et al. November 16, 2 | 2010-11-16 |
Methods of fabricating semiconductor devices including contact plugs having laterally extending portions Grant 7,816,257 - Cheong , et al. October 19, 2 | 2010-10-19 |
Methods of forming a semiconductor device including a diffusion barrier film Grant 7,816,255 - Choi , et al. October 19, 2 | 2010-10-19 |
Methods of Manufacturing Semiconductor Devices App 20100255676 - Kim; Youngseok ;   et al. | 2010-10-07 |
Semiconductor device and methods of forming the same Grant 7,807,571 - Choi , et al. October 5, 2 | 2010-10-05 |
Methods of Fabricating Semiconductor Devices Having Conductive Wirings and Related Flash Memory Devices App 20100237504 - Hong; Jong-Won ;   et al. | 2010-09-23 |
Semiconductor device and method of manufacturing the same App 20100240185 - Sohn; Woong-hee ;   et al. | 2010-09-23 |
Semiconductor devices and methods of fabricating the same Grant 7,781,849 - Baek , et al. August 24, 2 | 2010-08-24 |
Method Of Fabricating Semiconductor Device Having Buried Wiring App 20100210105 - Baek; Jong-min ;   et al. | 2010-08-19 |
Semiconductor devices including gate structures and leakage barrier oxides Grant 7,772,637 - Sohn , et al. August 10, 2 | 2010-08-10 |
Semiconductor Device Including Fuse App 20100193902 - SHIN; Seung-woo ;   et al. | 2010-08-05 |
Method of Manufacturing a Semiconductor Device App 20100184294 - Park; Jin-Ho ;   et al. | 2010-07-22 |
Semiconductor Devices And Methods Of Manufacturing The Same App 20100181671 - Park; Jin-Ho ;   et al. | 2010-07-22 |
Methods for fabricating improved gate dielectrics Grant 7,759,263 - Sohn , et al. July 20, 2 | 2010-07-20 |
Structures Electrically Connecting Aluminum and Copper Interconnections and Methods of Forming the Same App 20100151674 - Lee; Jong-Myeong ;   et al. | 2010-06-17 |
Methods of manufacturing Semiconductor Devices Including PMOS and NMOS Transistors Having Different Gate Structures App 20100120211 - Park; Jae-Hwa ;   et al. | 2010-05-13 |
Method of fabricating semiconductor device App 20100112772 - Jung; Eun-ji ;   et al. | 2010-05-06 |
Gate Electrode of semiconductor device and method of forming the same App 20100105198 - Lee; Sang-woo ;   et al. | 2010-04-29 |
Semiconductor devices including high-k dielectric materials Grant 7,696,552 - Youn , et al. April 13, 2 | 2010-04-13 |
Stacked semiconductor device and method of fabrication Grant 7,687,331 - Kim , et al. March 30, 2 | 2010-03-30 |
Methods of fabricating semiconductor devices having a double metal salicide layer Grant 7,666,786 - Yun , et al. February 23, 2 | 2010-02-23 |
Method of forming relatively continuous silicide layers for semiconductor devices Grant 7,662,707 - Jung , et al. February 16, 2 | 2010-02-16 |
Methods of Forming Integrated Circuit Devices Having Anisotropically-Oxidized Nitride Layers App 20100029073 - Park; Jae-Hwa ;   et al. | 2010-02-04 |
Method Of Manufacturing A Metal Wiring Structure App 20100022086 - Choi; Kyung-In ;   et al. | 2010-01-28 |
Methods of Forming Integrated Circuit Devices Having Stacked Gate Electrodes App 20090325371 - Kim; Byung-hee ;   et al. | 2009-12-31 |
Semiconductor device and method of fabricating the same Grant 7,638,433 - Yun , et al. December 29, 2 | 2009-12-29 |
Gate Structure, And Semiconductor Device Having A Gate Structure App 20090315091 - Cha; Tae-Ho ;   et al. | 2009-12-24 |
Methods of Forming Interlayer Dielectrics Having Air Gaps App 20090298282 - Yun; Jong-Ho ;   et al. | 2009-12-03 |
Method Of Forming Semiconductor Device Having Stacked Transistors App 20090280605 - Kim; Hyun-Su ;   et al. | 2009-11-12 |
Gate Structures In Semiconductor Devices App 20090267132 - Cha; Tae-Ho ;   et al. | 2009-10-29 |
Semiconductor device including an ohmic layer App 20090256177 - PARK; Hee-Sook ;   et al. | 2009-10-15 |
Methods of Forming an Oxide Layer and Methods of Forming a Gate Using the Same App 20090239368 - Park; Jae Hwa ;   et al. | 2009-09-24 |
Semiconductor memory device and method of manufacturing the same Grant 7,585,787 - Cha , et al. September 8, 2 | 2009-09-08 |
Semiconductor devices having polymetal gate electrodes Grant 7,582,924 - Lee , et al. September 1, 2 | 2009-09-01 |
Method of forming semiconductor device having stacked transistors Grant 7,579,225 - Kim , et al. August 25, 2 | 2009-08-25 |
Methods of forming metal silicide layers by annealing metal layers using inert heat transferring gases established in a convection apparatus Grant 7,569,483 - Jung , et al. August 4, 2 | 2009-08-04 |
Semiconductor devices and methods of fabricating the same App 20090189229 - Baek; Jong-min ;   et al. | 2009-07-30 |
Methods For Forming Silicide Conductors Using Substrate Masking App 20090191699 - Jung; Eun-ji ;   et al. | 2009-07-30 |
Semiconductor Devices Including Gate Structures and Leakage Barrier Oxides App 20090173986 - Sohn; Woong-Hee ;   et al. | 2009-07-09 |
Bonding pad structure and semiconductor device including the bonding pad structure App 20090176124 - Hong; Jong-Won ;   et al. | 2009-07-09 |
Semiconductor devices including metal interconnections and methods of fabricating the same App 20090166868 - Lee; Jong-Myeong ;   et al. | 2009-07-02 |
Method of forming semiconductor device Grant 7,550,353 - Lee , et al. June 23, 2 | 2009-06-23 |
Methods of forming metal layers in the fabrication of semiconductor devices Grant 7,547,632 - Seo , et al. June 16, 2 | 2009-06-16 |
Methods of fabricating integrated circuit capacitors using a dry etching process Grant 7,547,607 - Moon , et al. June 16, 2 | 2009-06-16 |
Method of forming a semiconductor device including an ohmic layer Grant 7,544,597 - Park , et al. June 9, 2 | 2009-06-09 |
Methods of forming metal-nitride layers in contact holes Grant 7,541,282 - Han , et al. June 2, 2 | 2009-06-02 |
Method Forming Contact Plug for Semiconductor Device Using H2 Remote Plasma Treatment App 20090137117 - Park; Jin-ho ;   et al. | 2009-05-28 |
Semiconductor device and method of manufacturing the same Grant 7,534,709 - Park , et al. May 19, 2 | 2009-05-19 |
Methods of forming self-aligned silicide layers using multiple thermal processes Grant 7,531,459 - Jung , et al. May 12, 2 | 2009-05-12 |
Semiconductor device having gate electrode including metal layer and method of manufacturing the same App 20090101984 - Lee; Byung-hak ;   et al. | 2009-04-23 |
Methods of forming gate structures for semiconductor devices Grant 7,521,316 - Sohn , et al. April 21, 2 | 2009-04-21 |
Methods of forming metal wiring in semiconductor devices using etch stop layers Grant 7,521,357 - Lee , et al. April 21, 2 | 2009-04-21 |
Methods And Apparatus For Manufacturing A Semiconductor Device In A Processing Chamber App 20090035941 - Park; Jin-Ho ;   et al. | 2009-02-05 |
Semiconductor device and method of manufacturing the same App 20090014879 - Park; Jin-Ho ;   et al. | 2009-01-15 |
Method of manufacturing a semiconductor device App 20090011583 - Hong; Jong-Won ;   et al. | 2009-01-08 |
Method Of Forming Semiconductor Device Having Stacked Transistors App 20090004789 - Kim; Hyun-Su ;   et al. | 2009-01-01 |
Semiconductor Devices Having Stacked Structures App 20080315312 - Kim; Hyun-Su ;   et al. | 2008-12-25 |
Methods Of Forming Films Of A Semiconductor Device App 20080318421 - Yun; Jong-Ho ;   et al. | 2008-12-25 |
Semiconductor Devices Including Doped Metal Silicide Patterns and Related Methods of Forming Such Devices App 20080296696 - Yun; Jung-Ho ;   et al. | 2008-12-04 |
Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the same Grant 7,452,811 - Choi , et al. November 18, 2 | 2008-11-18 |
Methods Of Forming A Semiconductor Device Including A Diffusion Barrier Film App 20080274610 - Choi; Kyung-In ;   et al. | 2008-11-06 |
Methods of forming semiconductor devices having stacked transistors Grant 7,435,634 - Kim , et al. October 14, 2 | 2008-10-14 |
Method of forming semiconductor device having stacked transistors Grant 7,432,185 - Kim , et al. October 7, 2 | 2008-10-07 |
Apparatus and method for fabricating semiconductor devices and substrates App 20080214012 - Park; Jin-ho ;   et al. | 2008-09-04 |
Semiconductor Device And Method Of Fabricating The Same App 20080211038 - Yun; Jong-Ho ;   et al. | 2008-09-04 |
Methods of forming field effect transistors having metal silicide gate electrodes Grant 7,416,968 - Kim , et al. August 26, 2 | 2008-08-26 |
Stacked Semiconductor Device And Method Of Fabrication App 20080199991 - Kim; Hyun-Su ;   et al. | 2008-08-21 |
Method of fabricating gate electrode having polysilicon film and wiring metal film App 20080200031 - Lee; Jang-hee ;   et al. | 2008-08-21 |
Methods of fabricating integrated circuit devices having self-aligned contact structures Grant 7,410,892 - Park , et al. August 12, 2 | 2008-08-12 |
Semiconductor Devices Having Metal Interconnections, Semiconductor Cluster Tools Used In Fabrication Thereof And Methods Of Fabricating The Same App 20080174021 - Choi; Kyung-In ;   et al. | 2008-07-24 |
Methods of Forming Electrical Interconnects Using Non-Uniformly Nitrified Metal Layers and Interconnects Formed Thereby App 20080136040 - Park; Jin-Ho ;   et al. | 2008-06-12 |
Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer Grant 7,384,866 - Yun , et al. June 10, 2 | 2008-06-10 |
Semiconductor device including upper and lower transistors and interconnection between upper and lower transistors Grant 7,381,989 - Kim , et al. June 3, 2 | 2008-06-03 |
Gate and method of forming the same, and memory device and method of manufacturing the same App 20080121983 - Seong; Geum-Jung ;   et al. | 2008-05-29 |
Conductive Wiring for Semiconductor Devices App 20080122076 - Hong; Jong-Won ;   et al. | 2008-05-29 |
Method of forming a gate of a semiconductor device Grant 7,371,669 - Youn , et al. May 13, 2 | 2008-05-13 |
Method Of Forming Semiconductor Device App 20080102615 - LEE; Byung-Hak ;   et al. | 2008-05-01 |
Nonvolatile memory device and method for forming the same App 20080093663 - Lee; Jang-hee ;   et al. | 2008-04-24 |
Semiconductor memory device and method of manufacturing the same App 20080079056 - Cha; Tae-Ho ;   et al. | 2008-04-03 |
Methods of forming metal wiring layers for semiconductor devices App 20080070405 - Park; Jae-hwa ;   et al. | 2008-03-20 |
Semiconductor device and methods of forming the same App 20080054468 - Choi; Kyung-In ;   et al. | 2008-03-06 |
Structures Electrically Connecting Aluminum and Copper Interconnections and Methods of Forming the Same App 20080042290 - Lee; Jong-Myeong ;   et al. | 2008-02-21 |
Methods for fabricating improved gate dielectrics App 20080014700 - Sohn; Woong-Hee ;   et al. | 2008-01-17 |
Method of forming cobalt disilicide layer and method of manufacturing semiconductor device using the same Grant 7,312,150 - Yun , et al. December 25, 2 | 2007-12-25 |
Methods of forming metal nitride layers, and methods of forming semiconductor structures having metal nitride layers Grant 7,300,887 - Park , et al. November 27, 2 | 2007-11-27 |
Methods For Forming A Metal Contact In A Semiconductor Device In Which An Ohmic Layer Is Formed While Forming A Barrier Metal Layer App 20070269974 - Park; Hee-sook ;   et al. | 2007-11-22 |
Methods of forming a metal layer using transition metal precursors Grant 7,285,493 - Kang , et al. October 23, 2 | 2007-10-23 |
Methods of forming a conductive structure in an integrated circuit device Grant 7,279,416 - Seo , et al. October 9, 2 | 2007-10-09 |
Methods Of Fabricating Semiconductor Devices Having A Double Metal Salicide Layer App 20070224765 - Yun; Jong-ho ;   et al. | 2007-09-27 |
Methods for forming a metal contact in a semiconductor device in which an ohmic layer is formed while forming a barrier metal layer App 20070197015 - Park; Hee-sook ;   et al. | 2007-08-23 |
Methods of forming electronic devices including high-k dielectric layers and electrode barrier layers and related structures Grant 7,244,645 - Kim , et al. July 17, 2 | 2007-07-17 |
Methods of forming a double metal salicide layer and methods of fabricating semiconductor devices incorporating the same Grant 7,238,612 - Yun , et al. July 3, 2 | 2007-07-03 |
Methods Of Forming Metal Layers In The Fabrication Of Semiconductor Devices App 20070134932 - Seo; Jung-Hun ;   et al. | 2007-06-14 |
Apparatus For Fabricating Tungsten Contacts With Tungsten Nitride Barrier Layers In Semiconductor Devices App 20070128866 - Lee; Sang-Woo ;   et al. | 2007-06-07 |
Methods for forming a metal contact in a semiconductor device in which an ohmic layer is formed while forming a barrier metal layer Grant 7,223,689 - Park , et al. May 29, 2 | 2007-05-29 |
Methods of forming silicide films with metal films in semiconductor devices and contacts including the same Grant 7,214,620 - Kim , et al. May 8, 2 | 2007-05-08 |
Methods For Forming Cobalt Layers Including Introducing Vaporized Cobalt Precursors And Methods For Manufacturing Semiconductor Devices Using The Same App 20070099421 - Kim; Hyun-Su ;   et al. | 2007-05-03 |
Heating chamber and method of heating a wafer Grant 7,211,769 - Kim , et al. May 1, 2 | 2007-05-01 |
Methods of forming cobalt layers for semiconductor devices Grant 7,211,506 - Moon , et al. May 1, 2 | 2007-05-01 |
Methods of fabricating tungsten contacts with tungsten nitride barrier layers in semiconductor devices, tungsten contacts with tungsten nitride barrier layers Grant 7,189,641 - Lee , et al. March 13, 2 | 2007-03-13 |
Methods for forming cobalt layers including introducing vaporized cobalt precursors and methods for manufacturing semiconductor devices using the same Grant 7,172,967 - Kim , et al. February 6, 2 | 2007-02-06 |
Methods of Forming Integrated Circuit Devices Including Memory Cell Gates and High Voltage Transistor Gates Using Plasma Re-Oxidation App 20060292784 - Sohn; Woong hee ;   et al. | 2006-12-28 |
Methods of forming self-aligned silicide layers using multiple thermal processes App 20060281305 - Jung; Sug-woo ;   et al. | 2006-12-14 |
Apparatus and method for depositing tungsten nitride App 20060280867 - Park; Jin-Ho ;   et al. | 2006-12-14 |
Methods of forming electronic devices including high-k dielectric layers and electrode barrier layers Grant 7,148,100 - Kim , et al. December 12, 2 | 2006-12-12 |
Methods of forming electronic devices including high-K dielectric layers and electrode barrier layers and related structures App 20060263966 - Kim; Byung-Hee ;   et al. | 2006-11-23 |
Methods for forming atomic layers and thin films including a tantalum amine derivative and devices including the same App 20060251812 - Kang; Sang-Bom ;   et al. | 2006-11-09 |
Semiconductor devices having polymetal gate electrodes and methods of manufacturing the same App 20060244084 - Lee; Byung-Hak ;   et al. | 2006-11-02 |
Methods of forming semiconductor devices having stacked transistors and related devices App 20060246709 - Kim; Hyun-Su ;   et al. | 2006-11-02 |
Methods of fabricating semiconductor devices including contact plugs having laterally extending portions and related devices App 20060246710 - Cheong; Seong-Hwee ;   et al. | 2006-11-02 |
Methods of producing integrated circuit devices utilizing tantalum amine derivatives App 20060240665 - Kang; Sang-Bom ;   et al. | 2006-10-26 |
Method For Forming A Wiring Of A Semiconductor Device, Method For Forming A Metal Layer Of A Semiconductor Device And Apparatus For Performing The Same App 20060234494 - CHOI; Kyung-In ;   et al. | 2006-10-19 |
Method of forming semiconductor device having stacked transistors App 20060234487 - Kim; Hyun-Su ;   et al. | 2006-10-19 |
Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the same Grant 7,105,444 - Choi , et al. September 12, 2 | 2006-09-12 |
Stacked semiconductor device and method of fabrication App 20060197117 - Kim; Hyun-Su ;   et al. | 2006-09-07 |
Method of forming MOS transistor having fully silicided metal gate electrode App 20060199343 - Jung; Sug-Woo ;   et al. | 2006-09-07 |
Methods of fabricating integrated circuit devices having self-aligned contact structures App 20060194432 - Park; Hee-Sook ;   et al. | 2006-08-31 |
Methods for forming atomic layers and thin films including tantalum nitride and devices including the same Grant 7,098,131 - Kang , et al. August 29, 2 | 2006-08-29 |
Methods of forming a semiconductor device having a metal gate electrode and associated devices Grant 7,098,123 - Heo , et al. August 29, 2 | 2006-08-29 |
Ohmic layer, semiconductor device including an ohmic layer, method of forming an ohmic layer and method of forming a semiconductor device including an ohmic layer App 20060180875 - Park; Hee-Sook ;   et al. | 2006-08-17 |
Methods of forming a semiconductor device having a metal gate electrode and associated devices App 20060163677 - Heo; Seong-Jun ;   et al. | 2006-07-27 |
Methods of producing integrated circuit devices utilizing tantalum amine derivatives Grant 7,081,409 - Kang , et al. July 25, 2 | 2006-07-25 |
Nickel salicide process and method of fabricating a semiconductor device using the same App 20060160361 - Jung; Sug-Woo ;   et al. | 2006-07-20 |
Methods for forming a metal layer on a semiconductor Grant 7,067,420 - Choi , et al. June 27, 2 | 2006-06-27 |
Methods of removing resistive remnants from contact holes using silicidation Grant 7,067,417 - Park , et al. June 27, 2 | 2006-06-27 |
Semiconductor devices having metal containing N-type and P-type gate electrodes and methods of forming the same Grant 7,056,776 - Park , et al. June 6, 2 | 2006-06-06 |
Methods of manufacturing a semiconductor device App 20060115967 - Park; Hee-Sook ;   et al. | 2006-06-01 |
Methods of forming metal nitride layers, and methods of forming semiconductor structures having metal nitride layers App 20060115984 - Park; Jae-Hwa ;   et al. | 2006-06-01 |
Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses Grant 7,051,934 - Lee , et al. May 30, 2 | 2006-05-30 |
Method of forming a gate of a semiconductor device App 20060110900 - Youn; Sun-Pil ;   et al. | 2006-05-25 |
Integrated circuit devices having self-aligned contact structures Grant 7,045,842 - Park , et al. May 16, 2 | 2006-05-16 |
Methods of forming field effect transistors having metal silicide gate electrodes App 20060091436 - Kim; Hyun-Su ;   et al. | 2006-05-04 |
Methods of forming gate structures for semiconductor devices and related structures App 20060081916 - Sohn; Woong-Hee ;   et al. | 2006-04-20 |
Gate structures with silicide sidewall barriers and methods of manufacturing the same App 20060079075 - Lee; Chang-Won ;   et al. | 2006-04-13 |
Method of forming relatively continuous silicide layers for semiconductor devices App 20060079074 - Jung; Sug-Woo ;   et al. | 2006-04-13 |
Methods of fabricating semiconductor devices App 20060068535 - Youn; Sun-Pil ;   et al. | 2006-03-30 |
Salicide process and method of fabricating semiconductor device using the same App 20060063380 - Jung; Sug-Woo ;   et al. | 2006-03-23 |
Semiconductor devices including high-k dielectric materials and methods of forming the same App 20060057794 - Youn; Sun-Pil ;   et al. | 2006-03-16 |
Methods of manufacturing semiconductor device gate structures by performing a surface treatment on a gate oxide layer App 20060051921 - Youn; Sun-Pil ;   et al. | 2006-03-09 |
Methods of fabricating integrated circuit capacitors using a dry etching process App 20060030116 - Moon; Kwang-jin ;   et al. | 2006-02-09 |
Semiconductor device and method of manufacturing the same App 20060014355 - Park; Jae-Hwa ;   et al. | 2006-01-19 |
Methods of forming gate patterns using isotropic etching of gate insulating layers App 20050282338 - Yoo, Jong-Ryeol ;   et al. | 2005-12-22 |
Methods of manufacturing semiconductor devices with gate structures having an oxide layer on the sidewalls thereof and related processing apparatus App 20050266665 - Youn, Sun-Pil ;   et al. | 2005-12-01 |
Methods of fabricating tungsten contacts with tungsten nitride barrier layers in semiconductor devices, tungsten contacts with tungsten nitride barrier layers, and apparatus for fabricating the same App 20050266684 - Lee, Sang-Woo ;   et al. | 2005-12-01 |
Methods of forming metal-nitride layers in contact holes and layers so formed App 20050263890 - Han, Sung-ho ;   et al. | 2005-12-01 |
Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer Grant 6,955,983 - Yun , et al. October 18, 2 | 2005-10-18 |
Methods for forming a metal wiring layer on an integrated circuit device at reduced temperatures Grant 6,951,814 - Kim , et al. October 4, 2 | 2005-10-04 |
Methods of forming a double metal salicide layer and methods of fabricating semiconductor devices incorporating the same App 20050196945 - Yun, Jong-ho ;   et al. | 2005-09-08 |
Methods for forming a metal contact in a semiconductor device in which an ohmic layer is formed while forming a barrier metal layer App 20050186784 - Park, Hee-sook ;   et al. | 2005-08-25 |
Methods of forming a metal wiring in semiconductor devices using etch stop layers and devices so formed App 20050184394 - Lee, Sang-woo ;   et al. | 2005-08-25 |
Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer App 20050179141 - Yun, Ju-young ;   et al. | 2005-08-18 |
Methods of forming metal wiring layers for semiconductor devices App 20050158990 - Park, Jae-hwa ;   et al. | 2005-07-21 |
Method of forming cobalt disilicide layer and method of manufacturing semiconductor device using the same App 20050136659 - Yun, Jong-ho ;   et al. | 2005-06-23 |
Semiconductor interconnection structure with TaN and method of forming the same App 20050136652 - Kim, Byung-Hee ;   et al. | 2005-06-23 |
Methods of forming silicide films with metal films in semiconductor devices and contacts including the same App 20050106859 - Kim, Hyun-su ;   et al. | 2005-05-19 |
Semiconductor device having barrier layer between ruthenium layer and metal layer and method for manufacturing the same Grant 6,893,915 - Park , et al. May 17, 2 | 2005-05-17 |
Methods of forming electronic devices including high-k dielectric layers and electrode barrier layers App 20050082625 - Kim, Byung-Hee ;   et al. | 2005-04-21 |
Semiconductor interconnection structure with TaN and method of forming the same Grant 6,876,078 - Kim , et al. April 5, 2 | 2005-04-05 |
Semiconductor devices having metal containing N-type and P-type gate electrodes and methods of forming the same App 20050064653 - Park, Seong-Geon ;   et al. | 2005-03-24 |
Methods for forming cobalt layers including introducing vaporized cobalt precursors and methods for manufacturing semiconductor devices using the same App 20050064706 - Kim, Hyun-Su ;   et al. | 2005-03-24 |
Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the same App 20050059240 - Choi, Kyung-In ;   et al. | 2005-03-17 |
Wafer processing apparatus and wafer processing method using the same Grant 6,849,555 - Lee , et al. February 1, 2 | 2005-02-01 |
Methods of forming a semiconductor device having a metal gate electrode and associated devices App 20050020042 - Heo, Seong-Jun ;   et al. | 2005-01-27 |
Methods of forming cobalt layers for semiconductor devices App 20050014365 - Moon, Kwang-Jin ;   et al. | 2005-01-20 |
Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses App 20050009333 - Lee, Hyo-jong ;   et al. | 2005-01-13 |
Methods of removing resistive remnants from contact holes using silicidation App 20050009328 - Park, Hee-sook ;   et al. | 2005-01-13 |
Metal deposition apparatus used in fabrication of semiconductor devices and methods of forming metal layers using the same App 20050009336 - Seo, Jung-Hun ;   et al. | 2005-01-13 |
Methods for forming contacts in semiconductor devices having local silicide regions and semiconductor devices formed thereby App 20040245635 - Lee, Jong-myeong ;   et al. | 2004-12-09 |
Methods of forming a conductive structure in an integrated circuit device App 20040248397 - Seo, Jung-hun ;   et al. | 2004-12-09 |
Methods of producing integrated circuit devices utilizing tantalum amine derivatives App 20040235285 - Kang, Sang-Bom ;   et al. | 2004-11-25 |
Method of cleaning a chemical vapor deposition chamber Grant 6,821,572 - Moon , et al. November 23, 2 | 2004-11-23 |
Methods of forming metal layers using metallic precursors App 20040224506 - Choi, Kyung-In ;   et al. | 2004-11-11 |
Methods of forming dual gate semiconductor devices having a metal nitride layer Grant 6,815,285 - Choi , et al. November 9, 2 | 2004-11-09 |
Methods for forming atomic layers and thin films including tantalum nitride and devices including the same App 20040219784 - Kang, Sang-Bom ;   et al. | 2004-11-04 |
Compositions for depositing a metal layer and methods of forming a metal layer using the same App 20040203233 - Kang, Sang-Bom ;   et al. | 2004-10-14 |
Methods of forming conductive patterns using barrier layers App 20040192023 - Lee, Jong-myeong ;   et al. | 2004-09-30 |
Integrated circuit devices having self-aligned contact structures and methods of fabricating same App 20040178505 - Park, Hee-Sook ;   et al. | 2004-09-16 |
Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed Grant 6,787,460 - Lee , et al. September 7, 2 | 2004-09-07 |
Method of fabricating metal lines in a semiconductor device Grant 6,787,468 - Kim , et al. September 7, 2 | 2004-09-07 |
Methods for forming a metal wiring layer on an integrated circuit device at reduced temperatures App 20040096571 - Kim, Byung-Hee ;   et al. | 2004-05-20 |
Method for forming metal wiring layer of semiconductor device App 20040094838 - Seo, Jung-Hun ;   et al. | 2004-05-20 |
Methods of forming aluminum structures in microelectronic articles and articles fabricated thereby App 20040082167 - Seo, Jung-Hun ;   et al. | 2004-04-29 |
Methods for forming a metal contact in a semiconductor device in which an ohmic layer is formed while forming a barrier metal layer App 20040043601 - Park, Hee-Sook ;   et al. | 2004-03-04 |
Semiconductor device fabrication method for filling high aspect ratio openings in insulators with aluminum Grant 6,699,790 - Kim , et al. March 2, 2 | 2004-03-02 |
Method of cleaning a chemical vapor deposition chamber App 20040013818 - Moon, Kwang-Jin ;   et al. | 2004-01-22 |
Methods of forming dual gate semiconductor devices having a metal nitride layer App 20040005749 - Choi, Gil-Heyun ;   et al. | 2004-01-08 |
Semiconductor interconnection structure with TaN and method of forming the same App 20030230812 - Kim, Byung-Hee ;   et al. | 2003-12-18 |
Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer, and semiconductor devices including an oxide of a barrier layer App 20030222346 - Yun, Ju-Young ;   et al. | 2003-12-04 |
Methods and apparatus for forming a metal layer on an integrated circuit device using a tantalum precursor App 20030219979 - Choi, Kyung-In ;   et al. | 2003-11-27 |
Methods of forming capacitors and integrated circuit devices including tantalum nitride App 20030219942 - Choi, Kyung-In ;   et al. | 2003-11-27 |
Wafer processing apparatus and wafer processing method using the same App 20030207522 - Lee, Jong-Myeong ;   et al. | 2003-11-06 |
Methods for forming metal wiring layers and metal interconnects and metal interconnects formed thereby Grant 6,602,782 - Lee , et al. August 5, 2 | 2003-08-05 |
Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed App 20030134510 - Lee, Hyo-Jong ;   et al. | 2003-07-17 |
Semiconductor devices having metal layers as barrier layers on upper or lower electrodes of capacitors Grant 6,590,251 - Kang , et al. July 8, 2 | 2003-07-08 |
Wafer processing apparatus and wafer processing method using the same Grant 6,586,340 - Lee , et al. July 1, 2 | 2003-07-01 |
Semiconductor device having barrier layer between ruthenium layer and metal layer and method for manufacturing the same App 20030060042 - Park, Hee-sook ;   et al. | 2003-03-27 |
Methods of forming metal layers using metallic precursors App 20030017697 - Choi, Kyung-In ;   et al. | 2003-01-23 |
Method for forming metal layer of semiconductor device using metal halide gas Grant 6,458,701 - Chae , et al. October 1, 2 | 2002-10-01 |
Method of manufacturing a barrier metal layer using atomic layer deposition Grant 6,399,491 - Jeon , et al. June 4, 2 | 2002-06-04 |
Method for forming metal interconnection in semiconductor device and interconnection structure fabricated thereby Grant 6,391,769 - Lee , et al. May 21, 2 | 2002-05-21 |
Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact and capacitor of semiconductor device using the same Grant 6,348,376 - Lim , et al. February 19, 2 | 2002-02-19 |
Method of forming metal layer using atomic layer deposition and semiconductor device having the metal layer as barrier metal layer or upper or lower electrode of capacitor Grant 6,287,965 - Kang , et al. September 11, 2 | 2001-09-11 |
Method for forming a wiring layer a semiconductor device Grant 5,843,843 - Lee , et al. December 1, 1 | 1998-12-01 |
Method for forming metal layer of a semiconductor device Grant 5,665,659 - Lee , et al. September 9, 1 | 1997-09-09 |
Method for manufacturing a collimator Grant 5,544,771 - Lee , et al. August 13, 1 | 1996-08-13 |