Chiu; Tz-Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiu; Tz-Cheng.The latest application filed is for "packaging method involving rearrangement of dice".

Company Profile

0.17.22

Chiu; Tz-Cheng - Hsinchu N/A TW
Chiu; Tz-Cheng - US
Chiu; Tz-Cheng - Hsinchu city TW
Chiu; Tz-Cheng - Plano TX
Chiu; Tz-Cheng - Tainan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaging method involving rearrangement of dice Grant 8,431,437 - Chen , et al. April 30, 2	2013-04-30
Packaging method involving rearrangement of dice Grant 8,426,245 - Chen , et al. April 23, 2	2013-04-23
Packaging Method Involving Rearrangement Of Dice App 20110183467 - CHEN; Yu-Ren ; et al.	2011-07-28
Packaging Method Involving Rearrangement Of Dice App 20110183466 - CHEN; Yu-Ren ; et al.	2011-07-28
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board Grant 7,679,190 - Chiu , et al. March 16, 2	2010-03-16
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support Grant 7,572,677 - Chiu , et al. August 11, 2	2009-08-11
Packaging Method Involving Rearrangement Of Dice App 20090047754 - Chen; Yu-Ren ; et al.	2009-02-19
Increased Stand-Off Height Integrated Circuit Assemblies, Systems, and Methods App 20080218986 - Odegard; Charles Anthony ; et al.	2008-09-11
Increased stand-off height integrated circuit assemblies, systems, and methods Grant 7,393,719 - Odegard , et al. July 1, 2	2008-07-01
Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate Electronic Circuit Board App 20080023834 - Chiu; Tz-Cheng ; et al.	2008-01-31
Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices Grant 7,323,362 - Odegard , et al. January 29, 2	2008-01-29
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board Grant 7,294,451 - Chiu , et al. November 13, 2	2007-11-13
Solder joints for copper metallization having reduced interfacial voids Grant 7,267,861 - Edwards , et al. September 11, 2	2007-09-11
Arrangement in Semiconductor Packages for Inhibiting Adhesion of Lid to Substrate While Providing Compression Support App 20070004083 - Chiu; Tz-Cheng ; et al.	2007-01-04
System and method for polymer encapsulated solder lid attach App 20060270106 - Chiu; Tz-Cheng ; et al.	2006-11-30
Solder joints for copper metallization having reduced interfacial voids App 20060267157 - Edwards; Darvin R. ; et al.	2006-11-30
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support Grant 7,126,217 - Chiu , et al. October 24, 2	2006-10-24
Increased stand-off height integrated circuit assemblies, systems, and methods App 20060234490 - Odegard; Charles Anthony ; et al.	2006-10-19
Board level solder joint support for BGA packages under heatsink compression App 20060043586 - Chiu; Tz-Cheng ; et al.	2006-03-02
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support App 20060027921 - Chiu; Tz-Cheng ; et al.	2006-02-09
Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices App 20060027907 - Odegard; Charles A. ; et al.	2006-02-09
Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices Grant 6,977,429 - Odegard , et al. December 20, 2	2005-12-20
Pre-doped reflow interconnections for copper pads App 20050275096 - Zeng, Kejun ; et al.	2005-12-15
System for improving thermal stability of copper damascene structure App 20050186788 - Lu, Jiong-Ping ; et al.	2005-08-25
Wire loop grid array package App 20050133928 - Howard, Gregory E. ; et al.	2005-06-23
Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices App 20050124090 - Odegard, Charles A. ; et al.	2005-06-09
System for improving thermal stability of copper damascene structure Grant 6,903,000 - Lu , et al. June 7, 2	2005-06-07
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board App 20050106505 - Chiu, Tz-Cheng ; et al.	2005-05-19
Composite lid for land grid array (LGA) flip-chip package assembly Grant 6,861,292 - Chiu March 1, 2	2005-03-01
Composite Lid For Land Grid Array (lga) Flip-chip Package Assembly App 20050026331 - Chiu, Tz-Cheng	2005-02-03
Composite lid for land grid array (LGA) flip-chip package assembly Grant 6,784,535 - Chiu August 31, 2	2004-08-31
Polymer-embedded solder bumps for reliable plastic package attachment App 20040149479 - Chiu, Tz-Cheng ; et al.	2004-08-05
Flip-chip device strengthened by substrate metal ring Grant 6,734,567 - Chiu , et al. May 11, 2	2004-05-11
Flip-chip device strengthened by substrate metal ring App 20040036179 - Chiu, Tz-Cheng ; et al.	2004-02-26
Polymer-embedded solder bumps for reliable plastic package attachment Grant 6,696,644 - Chiu , et al. February 24, 2	2004-02-24
Polymer-embedded Solder Bumps For Reliable Plastic Package Attachment App 20040027788 - Chiu, Tz-Cheng ; et al.	2004-02-12
System for improving thermal stability of copper damascene structure App 20030124828 - Lu, Jiong-Ping ; et al.	2003-07-03

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