Chiu; Sheng-Hsiang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiu; Sheng-Hsiang.The latest application filed is for "three-dimensional integrated circuit structures and methods of forming the same".

Company Profile

10.12.15

Chiu; Sheng-Hsiang - Tainan TW
Chiu; Sheng-Hsiang - Tainan City TW
Chiu; Sheng-Hsiang - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device Grant 11,446,851 - Weng , et al. September 20, 2	2022-09-20
Three-dimensional Integrated Circuit Structures And Methods Of Forming The Same App 20220238407 - Lin; Chia-Min ; et al.	2022-07-28
Three-dimensional integrated circuit structures and methods of forming the same Grant 11,309,226 - Lin , et al. April 19, 2	2022-04-19
Three-dimensional Integrated Circuit Structures And Methods Of Forming The Same App 20210193544 - Lin; Chia-Min ; et al.	2021-06-24
Advanced INFO POP and Method of Forming Thereof App 20210020611 - Tsai; Yi-Da ; et al.	2021-01-21
Molding Apparatus, Manufacturing Method Of Molded Semiconductor Device And Molded Semiconductor Device App 20200338796 - Weng; Sheng-Feng ; et al.	2020-10-29
Semiconductor Device Having Antenna And Manufacturing Method Thereof App 20200335459 - Wan; Albert ; et al.	2020-10-22
Advanced INFO POP and method of forming thereof Grant 10,797,025 - Tsai , et al. October 6, 2	2020-10-06
Miniature image pickup module and manufacturing method thereof Grant 10,757,310 - Chang , et al. A	2020-08-25
Semiconductor device having antenna and manufacturing method thereof Grant 10,741,508 - Wan , et al. A	2020-08-11
Package And Method Of Manufacturing The Same App 20200020634 - Tsai; Tsai-Tsung ; et al.	2020-01-16
Semiconductor Device And Manufacturing Method Thereof App 20190333877 - Wan; Albert ; et al.	2019-10-31
Package-on-package structure and method Grant 10,325,883 - Chiu , et al.	2019-06-18
Integrated Fan-out Package And Manufacturing Method Thereof App 20190139787 - Chen; Meng-Tse ; et al.	2019-05-09
Semiconductor package and manufacturing method thereof Grant 10,283,470 - Lin , et al.	2019-05-07
Integrated fan-out package and manufacturing method thereof Grant 10,283,377 - Chen , et al.	2019-05-07
Lid design for heat dissipation enhancement of die package Grant 10,163,754 - Ho , et al. Dec	2018-12-25
Semicondcutor Package And Manufacturing Method Thereof App 20180337149 - Lin; Chih-Wei ; et al.	2018-11-22
Package-on-Package Structure and Method App 20180068985 - Chiu; Sheng-Hsiang ; et al.	2018-03-08
Package structure and method for forming the same Grant 9,859,229 - Tsai , et al. January 2, 2	2018-01-02
Advanced INFO POP and Method of Forming Thereof App 20170338202 - Tsai; Yi-Da ; et al.	2017-11-23
Package-on-package structure and method Grant 9,818,729 - Chiu , et al. November 14, 2	2017-11-14
Package Structure And Method For Forming The Same App 20170317038 - TSAI; Yu-Peng ; et al.	2017-11-02
Lid Design for Heat Dissipation Enhancement of Die Package App 20150187679 - Ho; Kuan-Lin ; et al.	2015-07-02
Methods and Apparatus for bump-on-trace Chip Packaging App 20130277828 - Huang; Chang-Chia ; et al.	2013-10-24
Methods of dicing a semiconductor structure Grant 8,048,778 - Ku , et al. November 1, 2	2011-11-01

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