| Patent | Date |
|---|
Thermal assemblies for multi-chip packages
Grant 11,456,232 - Wan , et al. September 27, 2 | 2022-09-27 |
Method To Couple Light Using Integrated Heat Spreader
App 20220291462 - PRATAP; Divya ; et al. | 2022-09-15 |
Integrated heat spreader with multiple channels for multichip packages
Grant 11,444,003 - Wan , et al. September 13, 2 | 2022-09-13 |
Sloped metal features for cooling hotspots in stacked-die packages
Grant 11,398,414 - Wan , et al. July 26, 2 | 2022-07-26 |
Tec-embedded Dummy Die To Cool The Bottom Die Edge Hotspot
App 20220199482 - CHIU; Chia-Pin ; et al. | 2022-06-23 |
Package System And Package
App 20220199556 - ZHOU; Zhen ; et al. | 2022-06-23 |
Completely Encapsulated Optical Multi Chip Package
App 20220196941 - TODA; Asako ; et al. | 2022-06-23 |
High Density Substrate Routing In Package
App 20220130789 - TEH; Weng Hong ; et al. | 2022-04-28 |
Novel Package Designs To Enable Dual-sided Cooling On A Laser Chip
App 20220123521 - CHIU; Chia-Pin | 2022-04-21 |
High density substrate routing in package
Grant 11,251,150 - Teh , et al. February 15, 2 | 2022-02-15 |
Compound parabolic concentrator including protrusion
Grant 11,156,815 - Chiu , et al. October 26, 2 | 2021-10-26 |
Boiling Enhancement Structures For Immersion Cooled Electronic Systems
App 20210327787 - YANG; Jin ; et al. | 2021-10-21 |
Printed circuit board assembly
Grant 11,140,770 - Chiu October 5, 2 | 2021-10-05 |
Heatsink Cutout And Insulating Through Silicon Vias To Cut Thermal Cross-talk
App 20210249324 - WAN; Zhimin ; et al. | 2021-08-12 |
Stim/liquid Metal Filled Laser Drill Trench To Improve Cooling Of Stacked Bottom Die
App 20210193548 - WAN; Zhimin ; et al. | 2021-06-24 |
3d Buildup Of Thermally Conductive Layers To Resolve Die Height Differences
App 20210193547 - WAN; Zhimin ; et al. | 2021-06-24 |
Thermally Conductive Slugs/active Dies To Improve Cooling Of Stacked Bottom Dies
App 20210193552 - WAN; Zhimin ; et al. | 2021-06-24 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20210134726 - BRAUNISCH; Henning ; et al. | 2021-05-06 |
Hybrid Interposer Of Glass And Silicon To Reduce Thermal Crosstalk
App 20210118756 - WAN; Zhimin ; et al. | 2021-04-22 |
Integrated circuit packages with patterned protective material
Grant 10,957,656 - Yazzie , et al. March 23, 2 | 2021-03-23 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,923,429 - Braunisch , et al. February 16, 2 | 2021-02-16 |
High Density Substrate Routing In Package
App 20210043596 - TEH; Weng Hong ; et al. | 2021-02-11 |
Socket Loading Mechanism For Passive Or Active Socket And Package Cooling
App 20200411410 - Klein; Steven A. ; et al. | 2020-12-31 |
Localized High Density Substrate Routing
App 20200395297 - STARKSTON; Robert ; et al. | 2020-12-17 |
High density substrate routing in package
Grant 10,861,815 - Teh , et al. December 8, 2 | 2020-12-08 |
Thermal Solutions For Multi-package Assemblies
App 20200381330 - Chiu; Chia-Pin ; et al. | 2020-12-03 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200357747 - BRAUNISCH; Henning ; et al. | 2020-11-12 |
Integrated Circuit Packages With Patterned Protective Material
App 20200357752 - Yazzie; Kyle ; et al. | 2020-11-12 |
Dual Collimating Lens Configuration For Optical Devices
App 20200348498 - Chiu; Chia-Pin ; et al. | 2020-11-05 |
Liquid Cooling Through Conductive Interconnect
App 20200328139 - CHIU; Chia-Pin ; et al. | 2020-10-15 |
Localized high density substrate routing
Grant 10,796,988 - Starkston , et al. October 6, 2 | 2020-10-06 |
Integrated Circuit Package Socket Housing To Enhance Package Cooling
App 20200303852 - Wan; Zhimin ; et al. | 2020-09-24 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,763,216 - Braunisch , et al. Sep | 2020-09-01 |
Microelectronic Assemblies Having A Cooling Channel
App 20200211927 - Wan; Zhimin ; et al. | 2020-07-02 |
Dual Side Die Packaging For Enhanced Heat Dissipation
App 20200111720 - Wan; Zhimin ; et al. | 2020-04-09 |
Integrated Heat Spreader With Multiple Channels For Multichip Packages
App 20200105643 - WAN; ZHIMIN ; et al. | 2020-04-02 |
Sloped Metal Features For Cooling Hotspots In Stacked-die Packages
App 20200098666 - WAN; ZHIMIN ; et al. | 2020-03-26 |
Liquid Metal Tim With Stim-like Performance With No Bsm And Bga Compatible
App 20200098661 - LOFGREEN; Kelly ; et al. | 2020-03-26 |
Compound Parabolic Concentrator Including Protrusion
App 20200073099 - Chiu; Chia-Pin ; et al. | 2020-03-05 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200075493 - BRAUNISCH; Henning ; et al. | 2020-03-05 |
Thermal Assemblies For Multi-chip Packages
App 20200051894 - Wan; Zhimin ; et al. | 2020-02-13 |
High Density Substrate Routing In Package
App 20190393180 - Teh; Weng Hong ; et al. | 2019-12-26 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,510,669 - Braunisch , et al. Dec | 2019-12-17 |
High density substrate routing in package
Grant 10,438,915 - Teh , et al. O | 2019-10-08 |
Printed Circuit Board Assembly
App 20190297724 - Chiu; Chia-Pin | 2019-09-26 |
Localized high density substrate routing
Grant 10,366,951 - Starkston , et al. July 30, 2 | 2019-07-30 |
Heat sink for 5G massive antenna array and methods of assembling same
Grant 10,320,051 - Chiu | 2019-06-11 |
High Density Substrate Routing In Package
App 20190139926 - Teh; Weng Hong ; et al. | 2019-05-09 |
Multi-chip-module semiconductor chip package having dense package wiring
Grant 10,256,211 - Hu , et al. | 2019-04-09 |
High density substrate routing in package
Grant 10,199,346 - Teh , et al. Fe | 2019-02-05 |
Heat Sink For 5g Massive Antenna Array And Methods Of Assembling Same
App 20190006731 - Chiu; Chia-Pin | 2019-01-03 |
Stacked-die Including A Die In A Package Substrate
App 20180366444 - Chiu; Chia-Pin | 2018-12-20 |
Localized High Density Substrate Routing
App 20180350737 - Starkston; Robert ; et al. | 2018-12-06 |
Enhanced fiducial visibility and recognition
Grant 10,049,987 - Chiu , et al. August 14, 2 | 2018-08-14 |
Enhanced Fiducial Visibility And Recognition
App 20180182712 - Chiu; Chia-Pin ; et al. | 2018-06-28 |
Bridge interconnect with air gap in package assembly
Grant 10,008,451 - Chiu , et al. June 26, 2 | 2018-06-26 |
Stacked-die including a die in a package substrate
Grant 10,008,475 - Chiu June 26, 2 | 2018-06-26 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20180145031 - BRAUNISCH; Henning ; et al. | 2018-05-24 |
High Density Substrate Routing In Package
App 20180145047 - Teh; Weng Hong ; et al. | 2018-05-24 |
Package on Package Structure Having Package To Package Interconnect Composed of Packed Wires Having A Polygon Cross Section
App 20180090471 - CHIU; Chia-Pin ; et al. | 2018-03-29 |
High density substrate routing in BBUL package
Grant 9,929,119 - Teh , et al. March 27, 2 | 2018-03-27 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 9,875,969 - Braunisch , et al. January 23, 2 | 2018-01-23 |
Localized High Density Substrate Routing
App 20170287831 - Starkston; Robert ; et al. | 2017-10-05 |
High density substrate interconnect formed through inkjet printing
Grant 9,741,664 - Chiu , et al. August 22, 2 | 2017-08-22 |
Bridge Interconnect With Air Gap In Package Assembly
App 20170221828 - Chiu; Chia-Pin ; et al. | 2017-08-03 |
Localized high density substrate routing
Grant 9,679,843 - Starkston , et al. June 13, 2 | 2017-06-13 |
Integrated circuit package assemblies including a glass solder mask layer
Grant 9,673,131 - Hu , et al. June 6, 2 | 2017-06-06 |
Methods for solder for through-mold interconnect
Grant 9,666,549 - Chiu , et al. May 30, 2 | 2017-05-30 |
Bridge interconnect with air gap in package assembly
Grant 9,589,866 - Chiu , et al. March 7, 2 | 2017-03-07 |
High Density Substrate Routing In Bbul Package
App 20170053887 - Teh; Weng Hong ; et al. | 2017-02-23 |
Bumpless build-up layer package including an integrated heat spreader
Grant 9,520,376 - Teh , et al. December 13, 2 | 2016-12-13 |
Multi-chip-module Semiconductor Chip Package Having Dense Package Wiring
App 20160293578 - Hu; Chuan ; et al. | 2016-10-06 |
High density substrate routing in BBUL package
Grant 9,437,569 - Teh , et al. September 6, 2 | 2016-09-06 |
Method For Making High Density Substrate Interconnect Using Inkjet Printing
App 20160247763 - Chiu; Chia-Pin ; et al. | 2016-08-25 |
Bridge Interconnect With Air Gap In Package Assembly
App 20160204049 - Chiu; Chia-Pin ; et al. | 2016-07-14 |
Localized High Density Substrate Routing
App 20160197037 - Starkston; Robert ; et al. | 2016-07-07 |
Method for making high density substrate interconnect using inkjet printing
Grant 9,349,703 - Chiu , et al. May 24, 2 | 2016-05-24 |
High Density Substrate Routing In Bbul Package
App 20160079196 - Teh; Weng Hong ; et al. | 2016-03-17 |
Bridge interconnect with air gap in package assembly
Grant 9,275,971 - Chiu , et al. March 1, 2 | 2016-03-01 |
Localized high density substrate routing
Grant 9,269,701 - Starkston , et al. February 23, 2 | 2016-02-23 |
Methods of connecting a first electronic package to a second electronic package
Grant 9,263,329 - Chiu , et al. February 16, 2 | 2016-02-16 |
Tall Solders For Through-mold Interconnect
App 20160043049 - Chiu; Chia-Pin ; et al. | 2016-02-11 |
Die Assembly On Thin Dielectric Sheet
App 20160043056 - Chiu; Chia-Pin ; et al. | 2016-02-11 |
Bumpless Build-up Layer Package Including An Integrated Heat Spreader
App 20160027757 - Teh; Weng Hong ; et al. | 2016-01-28 |
Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
Grant 9,244,487 - Aoki , et al. January 26, 2 | 2016-01-26 |
Fluid-cooled heat dissipation device
Grant 9,241,423 - Chiu January 19, 2 | 2016-01-19 |
Localized High Density Substrate Routing
App 20150340353 - Starkston; Robert ; et al. | 2015-11-26 |
High density substrate routing in BBUL package
Grant 9,190,380 - Teh , et al. November 17, 2 | 2015-11-17 |
Die assembly on thin dielectric sheet
Grant 9,177,831 - Chiu , et al. November 3, 2 | 2015-11-03 |
High density substrate routing in BBUL package
Grant 9,171,816 - Teh , et al. October 27, 2 | 2015-10-27 |
Tall solders for through-mold interconnect
Grant 9,159,690 - Chiu , et al. October 13, 2 | 2015-10-13 |
Bumpless build-up layer package including an integrated heat spreader
Grant 9,153,552 - Teh , et al. October 6, 2 | 2015-10-06 |
Methods Of Connecting A First Electronic Package To A Second Electronic Package
App 20150270169 - Chiu; Chia-Pin ; et al. | 2015-09-24 |
Localized high density substrate routing
Grant 9,136,236 - Starkston , et al. September 15, 2 | 2015-09-15 |
High Density Substrate Routing In Bbul Package
App 20150194406 - Teh; Weng Hong ; et al. | 2015-07-09 |
Bumpless Build-up Layer Package Including An Integrated Heat Spreader
App 20150104907 - Teh; Weng Hong ; et al. | 2015-04-16 |
Die Assembly On Thin Dielectric Sheet
App 20150091182 - Chiu; Chia-Pin ; et al. | 2015-04-02 |
Tall Solders For Through-mold Interconnect
App 20150084192 - Chiu; Chia-Pin ; et al. | 2015-03-26 |
High Density Substrate Interconnect Using Inkjet Printing
App 20150084210 - Chiu; Chia-Pin ; et al. | 2015-03-26 |
Bridge Interconnect With Air Gap In Package Assembly
App 20150011050 - Chiu; Chia-Pin ; et al. | 2015-01-08 |
Bumpless build-up layer package including an integrated heat spreader
Grant 8,912,670 - Teh , et al. December 16, 2 | 2014-12-16 |
Bridge interconnect with air gap in package assembly
Grant 8,872,349 - Chiu , et al. October 28, 2 | 2014-10-28 |
Fluid-cooled Heat Dissipation Device
App 20140307388 - Chiu; Chia-Pin | 2014-10-16 |
Integrated Circuit Package Assemblies Including A Glass Solder Mask Layer
App 20140299999 - Hu; Chuan ; et al. | 2014-10-09 |
Vertical contact for shielded sockets
Grant 8,777,675 - Chiu July 15, 2 | 2014-07-15 |
High Density Substrate Routing In Bbul Package
App 20140159228 - Teh; Weng Hong ; et al. | 2014-06-12 |
Localized High Density Substrate Routing
App 20140091474 - Starkston; Robert ; et al. | 2014-04-03 |
Bumpless Build-up Layer Package Including An Integrated Heat Spreader
App 20140091445 - Teh; Weng Hong ; et al. | 2014-04-03 |
Integrated Translational Land-grid Array Sockets And Loading Mechanisms For Semiconductive Devices
App 20140082915 - Aoki; Russell S. ; et al. | 2014-03-27 |
Stacked-die Package Including Die In Package Substrate
App 20140084441 - Chiu; Chia-Pin | 2014-03-27 |
Vertical Contact for Shielded Sockets
App 20140087590 - Chiu; Chia-Pin | 2014-03-27 |
Bridge Interconnect With Air Gap In Package Assembly
App 20140070380 - Chiu; Chia-Pin ; et al. | 2014-03-13 |
Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
Grant 8,622,764 - Aoki , et al. January 7, 2 | 2014-01-07 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20120261838 - Braunisch; Henning ; et al. | 2012-10-18 |
Integrated Translational Land-grid Array Sockets And Loading Mechanisms For Semiconductive Devices
App 20120200993 - Aoki; Russell S. ; et al. | 2012-08-09 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 8,227,904 - Braunisch , et al. July 24, 2 | 2012-07-24 |
Package substrate including surface mount component mounted on a peripheral surface thereof and microelectronic package including same
Grant 7,875,973 - Chiu January 25, 2 | 2011-01-25 |
Multi-chip package and method of providing die-to-die interconnects in same
App 20100327424 - Braunisch; Henning ; et al. | 2010-12-30 |
Microelectronic package and method of cooling an interconnect feature in same
Grant 7,851,905 - Chrysler , et al. December 14, 2 | 2010-12-14 |
Cooling solutions for die-down integrated circuit packages
Grant 7,755,186 - Chiu , et al. July 13, 2 | 2010-07-13 |
Microelectronic package including temperature sensor connected to the package substrate and method of forming same
Grant 7,638,874 - Chiu , et al. December 29, 2 | 2009-12-29 |
Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving
Grant 7,637,751 - Chiu December 29, 2 | 2009-12-29 |
Skived Electrical Contact For Connecting An Ic Device To A Circuit Board And Method Of Making A Contact By Skiving
App 20090317986 - Chiu; Chia-Pin | 2009-12-24 |
Thermal interface material with hotspot heat remover
Grant 7,579,686 - Hu , et al. August 25, 2 | 2009-08-25 |
Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving
Grant 7,566,228 - Chiu July 28, 2 | 2009-07-28 |
Cooling solutions for die-down integrated circuit packages
App 20090166855 - Chiu; Chia-Pin ; et al. | 2009-07-02 |
Microelectronic die cooling device including bonding posts and method of forming same
Grant 7,511,372 - Chiu March 31, 2 | 2009-03-31 |
Microelectronic Package And Method Of Cooling An Interconnect Feature In Same
App 20090079063 - Chrysler; Gregory M. ; et al. | 2009-03-26 |
Package Substrate Including Surface Mount Component Mounted on a Peripheral Surface thereof and Microelectronic Package Including Same
App 20090065930 - Chiu; Chia-Pin | 2009-03-12 |
Skived Electrical Contact For Connecting An Ic Device To A Circuit Board And Method Of Making A Contact By Skiving
App 20090004890 - Chiu; Chia-Pin | 2009-01-01 |
Microelectronic package including thermally conductive sealant between heat spreader and substrate
App 20080237843 - Gupta; Ashish ; et al. | 2008-10-02 |
Thermal Interface Material With Hotspot Heat Remover
App 20080157348 - HU; Xuejiao ; et al. | 2008-07-03 |
Copper-elastomer hybrid thermal interface material to cool under-substrate silicon
App 20080160330 - Song; David ; et al. | 2008-07-03 |
Soldering a die to a substrate
Grant 7,332,423 - Starkston , et al. February 19, 2 | 2008-02-19 |
Embedded heat spreader for folded stacked chip-scale package
Grant 7,327,028 - Chiu February 5, 2 | 2008-02-05 |
Microelectronic package including temperature sensor connected to the package substrate and method of forming same
App 20070296071 - Chiu; Chia-Pin ; et al. | 2007-12-27 |
Low temperature phase change thermal interface material dam
Grant 7,312,527 - Sane , et al. December 25, 2 | 2007-12-25 |
Integrated Circuit Coolant Microchannel With Compliant Cover
App 20070230116 - Myers; Alan M. ; et al. | 2007-10-04 |
Integrated Circuit Coolant Microchannel Assembly With Targeted Channel Configuration
App 20070217147 - Chang; Je-Young ; et al. | 2007-09-20 |
Integrated circuit coolant microchannel assembly with targeted channel configuration
Grant 7,259,965 - Chang , et al. August 21, 2 | 2007-08-21 |
Thermal management arrangement for standardized peripherals
Grant 7,251,139 - Bhattacharya , et al. July 31, 2 | 2007-07-31 |
Integrated circuit coolant microchannel with compliant cover
Grant 7,243,705 - Myers , et al. July 17, 2 | 2007-07-17 |
Low temperature phase change thermal interface material dam
App 20070138621 - Sane; Sandeep B. ; et al. | 2007-06-21 |
Stacked die package with thermally conductive block embedded in substrate
App 20070090517 - Moon; Sung-won ; et al. | 2007-04-26 |
Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device
Grant 7,202,111 - Chiu April 10, 2 | 2007-04-10 |
Package design using thermal linkage from die to printed circuit board
Grant 7,199,466 - Chiu April 3, 2 | 2007-04-03 |
Soldering a die to a substrate
App 20070001318 - Starkston; Robert ; et al. | 2007-01-04 |
Microelectronic die cooling device including bonding posts and method of forming same
App 20060289987 - Chiu; Chia-Pin | 2006-12-28 |
Integrated circuit coolant microchannel assembly with targeted channel configuration
App 20060226539 - Chang; Je-Young ; et al. | 2006-10-12 |
Integrated circuit coolant microchannel with compliant cover
App 20060196646 - Myers; Alan M. ; et al. | 2006-09-07 |
Adhesive to attach a cooling device to a thermal interface
Grant 7,025,129 - Chiu April 11, 2 | 2006-04-11 |
Thermal management arrangement with channels structurally adapted for varying heat flux areas
App 20050285261 - Prasher, Ravi S. ; et al. | 2005-12-29 |
Substrate-less microelectronic package
Grant 6,965,163 - Chiu November 15, 2 | 2005-11-15 |
Package design using thermal linkage from die to printed circuit board
App 20050245060 - Chiu, Chia-Pin | 2005-11-03 |
Aerodynamic memory module cover
App 20050196904 - Bhattacharya, Anandaroop ; et al. | 2005-09-08 |
Embedded heat spreader for folded stacked chip-scale package
App 20050184370 - Chiu, Chia-Pin | 2005-08-25 |
Thermal management arrangement for standardized peripherals
App 20050111185 - Bhattacharya, Anandaroop ; et al. | 2005-05-26 |
Integrated socket for microprocessor package and cache memory
Grant 6,890,217 - Chiu May 10, 2 | 2005-05-10 |
Folded BGA package design with shortened communication paths and more electrical routing flexibility
Grant 6,869,825 - Chiu March 22, 2 | 2005-03-22 |
Substrate-less microelectronic package
App 20050006787 - Chiu, Chia-Pin | 2005-01-13 |
Apparatus and methods for cooling a processor socket
Grant 6,840,794 - Chiu January 11, 2 | 2005-01-11 |
Electronic package having a flexible substrate with ends connected to one another
Grant 6,841,855 - Jaeck , et al. January 11, 2 | 2005-01-11 |
Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device
App 20040241912 - Chiu, Chia-Pin | 2004-12-02 |
Electronic package having a flexible substrate with ends connected to one another
App 20040212063 - Jaeck, Edward W. ; et al. | 2004-10-28 |
Apparatus and methods for cooling a processor socket
App 20040192104 - Chiu, Chia-Pin | 2004-09-30 |
Substrate-less microelectronic package
Grant 6,794,748 - Chiu September 21, 2 | 2004-09-21 |
Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device
Grant 6,767,765 - Chiu July 27, 2 | 2004-07-27 |
Thermal management for telecommunication devices
App 20040132503 - Chiu, Chia-Pin | 2004-07-08 |
Folded BGA package design with shortened communication paths and more electrical routing flexibility
App 20040124527 - Chiu, Chia-Pin | 2004-07-01 |
Heat transfer composite with anisotropic heat flow structure
App 20040118501 - Chiu, Chia-Pin ; et al. | 2004-06-24 |
Short carbon fiber enhanced thermal grease
App 20040060691 - Chiu, Chia-Pin ; et al. | 2004-04-01 |
Integrated socket for microprocessor package and cache memory
App 20040029414 - Chiu, Chia-Pin | 2004-02-12 |
Socketless package to circuit board assemblies and methods of using same
App 20040000428 - Lii, Mirng-Ji ; et al. | 2004-01-01 |
Short carbon fiber enhanced thermal grease
Grant 6,651,736 - Chiu , et al. November 25, 2 | 2003-11-25 |
Adhesive to attach a cooling device to a thermal interface
App 20030205368 - Chiu, Chia-Pin | 2003-11-06 |
Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device
App 20030183909 - Chiu, Chia-Pin | 2003-10-02 |
Integrated socket for microprocessor package and cache memory
Grant 6,626,681 - Chiu September 30, 2 | 2003-09-30 |
Integrated socket for microprocessor package and cache memory
App 20030157817 - Chiu, Chia-Pin | 2003-08-21 |
Method and apparatus for coupling a microelectronic device package to a circuit board
App 20030150645 - Chiu, Chia-Pin | 2003-08-14 |
Dual-sided heat removal system
Grant 6,580,611 - Vandentop , et al. June 17, 2 | 2003-06-17 |
Thermal interface material on a mesh carrier
Grant 6,523,608 - Solbrekken , et al. February 25, 2 | 2003-02-25 |
Thermal Bus Design To Cool A Microelectronic Die
App 20030035269 - Chiu, Chia-Pin | 2003-02-20 |
Thermal bus design to cool a microelectronic die
Grant 6,519,154 - Chiu February 11, 2 | 2003-02-11 |
Short carbon fiber enhanced thermal grease
App 20030000690 - Chiu, Chia-Pin ; et al. | 2003-01-02 |
Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device
Grant 6,315,038 - Chiu November 13, 2 | 2001-11-13 |
Spring fixture that attaches a heat sink to a substrate for multiple cycle assembly/disassembly
Grant 6,154,365 - Pollard, II , et al. November 28, 2 | 2000-11-28 |
Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
Grant 6,121,680 - Chiu , et al. September 19, 2 | 2000-09-19 |
Thermal bus bar design for an electronic cartridge
Grant 5,990,549 - Chiu , et al. November 23, 1 | 1999-11-23 |
Thermal interface attach mechanism for electrical packages
Grant 5,965,937 - Chiu , et al. October 12, 1 | 1999-10-12 |
Push and pull dual-fan heat sink design
Grant 5,953,209 - Chiu September 14, 1 | 1999-09-14 |
MPC module with exposed C4 die and removal thermal plate design
Grant 5,936,838 - Lii , et al. August 10, 1 | 1999-08-10 |
Dissipation of heat through keyboard using a heat pipe
Grant 5,513,070 - Xie , et al. April 30, 1 | 1996-04-30 |
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