Chiou; Wen-Chih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chiou; Wen-Chih.The latest application filed is for "singulation and bonding methods and structures formed thereby".
Company Profile
69.200.200
- Chiou; Wen-Chih - Zhunan Township TW
- Chiou; Wen-Chih - Miaoli County TW
- Chiou; Wen-Chih - Hsinchu TW
- CHIOU; Wen-Chih - Toufen TW
- Chiou; Wen-Chih - Hsin-Chu TW
- Chiou; Wen-Chih - Zhunan TW
- Chiou; Wen-Chih - Miaoli TW
- Chiou; Wen-Chih - Zhunan City TW
- Chiou; Wen-Chih - Maoli N/A TW
- CHIOU; Wen-Chih - Toufen Township TW
- - Miaoli TW
Patent Activity
| Patent | Date |
|---|---|
| Singulation and Bonding Methods and Structures Formed Thereby App 20220310565 - Yu; Chen-Hua ; et al. | 2022-09-29 |
| Semiconductor Device With Nanostructures Aligned With Grating Coupler And Manufacturing Method Thereof App 20220308284 - Liao; Yu-Kuang ; et al. | 2022-09-29 |
| Via for semiconductor device connection and methods of forming the same Grant 11,444,020 - Yu , et al. September 13, 2 | 2022-09-13 |
| Wafer bonding method Grant 11,437,344 - Lin , et al. September 6, 2 | 2022-09-06 |
| Chiplet Interposer App 20220262742 - Hou; Shang-Yun ; et al. | 2022-08-18 |
| Passivation Structure with Planar Top Surfaces App 20220262698 - Chen; Yi-Hsiu ; et al. | 2022-08-18 |
| Bonding Structures of Integrated Circuit Devices and Method Forming the Same App 20220238466 - Tsai; Chen-Yu ; et al. | 2022-07-28 |
| Apparatus And Method For Wafer Pre-wetting App 20220220624 - Tsai; Chen-Yu ; et al. | 2022-07-14 |
| Method Of Manufacturing Semiconductor Structure App 20220208725 - CHEN; MING-FA ; et al. | 2022-06-30 |
| Plating Apparatus For Plating Semiconductor Wafer And Plating Method App 20220205126 - Tsai; Chen-Yu ; et al. | 2022-06-30 |
| Singulation and bonding methods and structures formed thereby Grant 11,355,475 - Yu , et al. June 7, 2 | 2022-06-07 |
| 3d Integrated Circuit (3dic) Structure App 20220157785 - Yu; Chen-Hua ; et al. | 2022-05-19 |
| Semiconductor structures and methods Grant 11,304,290 - Yu , et al. April 12, 2 | 2022-04-12 |
| Semiconductor structure and manufacturing method thereof Grant 11,289,450 - Chen , et al. March 29, 2 | 2022-03-29 |
| TSV Structure and Method Forming Same App 20220093461 - Chung; Ming-Tsu ; et al. | 2022-03-24 |
| Integrated Circuit Package and Method App 20220068856 - Chiou; Wen-Chih ; et al. | 2022-03-03 |
| Wafer debonding and cleaning apparatus Grant 11,264,262 - Chiou , et al. March 1, 2 | 2022-03-01 |
| 3D integrated circuit (3DIC) structure Grant 11,239,201 - Yu , et al. February 1, 2 | 2022-02-01 |
| Methods Of Forming Integrated Circuit Packages App 20210391306 - Hsu; Chia-Hao ; et al. | 2021-12-16 |
| Isolation Bonding Film for Semiconductor Packages and Methods of Forming the Same App 20210384158 - Chung; Ming-Tsu ; et al. | 2021-12-09 |
| Giga Interposer Integration through Chip-On-Wafer-On-Substrate App 20210366814 - Hou; Shang-Yun ; et al. | 2021-11-25 |
| Method of Forming Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via App 20210335694 - Lin; Yung-Chi ; et al. | 2021-10-28 |
| Semiconductor Structure And Manufacturing Method Thereof App 20210327836 - Lin; Yung-Chi ; et al. | 2021-10-21 |
| Integrated Circuit Package And Method App 20210327866 - Yu; Chen-Hua ; et al. | 2021-10-21 |
| Integrated circuit packages and methods of forming the same Grant 11,145,623 - Hsu , et al. October 12, 2 | 2021-10-12 |
| Method Of Manufacturing Semiconductor Package Structure App 20210313309 - Chen; Yi-Hsiu ; et al. | 2021-10-07 |
| Wafer Bonding Method App 20210305200 - Lin; Yung-Chi ; et al. | 2021-09-30 |
| Stacked Image Sensor Device And Method Of Forming Same App 20210273013 - Chiou; Wen-Chih ; et al. | 2021-09-02 |
| Isolation bonding film for semiconductor packages and methods of forming the same Grant 11,101,240 - Chung , et al. August 24, 2 | 2021-08-24 |
| Semiconductor Device And Manufacturing Method Thereof App 20210257339 - Yu; Chen-Hua ; et al. | 2021-08-19 |
| Semiconductor structure and manufacturing method thereof Grant 11,063,008 - Lin , et al. July 13, 2 | 2021-07-13 |
| Semiconductor device having backside interconnect structure on through substrate via and method of forming the same Grant 11,056,419 - Lin , et al. July 6, 2 | 2021-07-06 |
| Method of manufacturing semiconductor package structure Grant 11,043,481 - Chen , et al. June 22, 2 | 2021-06-22 |
| Singulation and bonding methods and structures formed thereby Grant 11,037,904 - Yu , et al. June 15, 2 | 2021-06-15 |
| Profile of through via protrusion in 3DIC interconnect Grant 11,004,741 - Wu , et al. May 11, 2 | 2021-05-11 |
| System, structure, and method of manufacturing a semiconductor substrate stack Grant 11,004,832 - Chang , et al. May 11, 2 | 2021-05-11 |
| Semiconductor device and manufacturing method thereof Grant 10,978,424 - Yu , et al. April 13, 2 | 2021-04-13 |
| 3D stacked-chip package Grant 10,971,417 - Yu , et al. April 6, 2 | 2021-04-06 |
| Semiconductor Device and Method App 20210090906 - Tsai; Chen-Yu ; et al. | 2021-03-25 |
| Semiconductor Devices and Methods of Manufacture App 20210091084 - Yu; Chen-Hua ; et al. | 2021-03-25 |
| Semiconductor Structure And Manufacturing Method Thereof App 20210082846 - Lin; Yung-Chi ; et al. | 2021-03-18 |
| Interconnect Structure and Method of Forming Same App 20210050316 - Lo; Hsiao Yun ; et al. | 2021-02-18 |
| Package structure and manufacturing method thereof Grant 10,914,895 - Liao , et al. February 9, 2 | 2021-02-09 |
| Alignment marks in substrate having through-substrate via (TSV) Grant 10,910,267 - Chang , et al. February 2, 2 | 2021-02-02 |
| Semiconductor Package App 20210005591 - Liao; Yu-Kuang ; et al. | 2021-01-07 |
| Semiconductor Component Having Through-silicon Vias App 20210005515 - YU; Chen-Hua ; et al. | 2021-01-07 |
| Isolation Bonding Film for Semiconductor Packages and Methods of Forming the Same App 20200411472 - Chung; Ming-Tsu ; et al. | 2020-12-31 |
| Die stack structure and method of fabricating the same Grant 10,879,214 - Chen , et al. December 29, 2 | 2020-12-29 |
| Bonding apparatus and method of bonding substrates Grant 10,872,874 - Yu , et al. December 22, 2 | 2020-12-22 |
| Integrated Circuit Packages And Methods Of Forming The Same App 20200395338 - Hsu; Chia-Hao ; et al. | 2020-12-17 |
| Die structure, die stack structure and method of fabricating the same Grant 10,867,943 - Chen , et al. December 15, 2 | 2020-12-15 |
| Method and apparatus for bonding semiconductor devices Grant 10,867,831 - Tsai , et al. December 15, 2 | 2020-12-15 |
| Method and structure of three-dimensional chip stacking Grant 10,867,985 - Yu , et al. December 15, 2 | 2020-12-15 |
| Die stack structure and method of fabricating the same Grant 10,867,963 - Hsu , et al. December 15, 2 | 2020-12-15 |
| 3D packages and methods for forming the same Grant 10,854,567 - Hou , et al. December 1, 2 | 2020-12-01 |
| Forming metal bonds with recesses Grant 10,854,574 - Chen , et al. December 1, 2 | 2020-12-01 |
| Method and Apparatus for Bonding Semiconductor Devices App 20200373185 - Tsai; Yan-Zuo ; et al. | 2020-11-26 |
| Embedded 3D interposer structure Grant 10,847,414 - Shih , et al. November 24, 2 | 2020-11-24 |
| Through Via Structure and Method App 20200343176 - Lin; Yung-Chi ; et al. | 2020-10-29 |
| Interconnect structure and method of forming same Grant 10,811,374 - Lo , et al. October 20, 2 | 2020-10-20 |
| Alignment Marks in Substrate Having Through-Substrate Via (TSV) App 20200321249 - Chang; Hsin ; et al. | 2020-10-08 |
| Semiconductor package Grant 10,797,031 - Liao , et al. October 6, 2 | 2020-10-06 |
| Method of making a semiconductor component having through-silicon vias Grant 10,784,162 - Yu , et al. Sept | 2020-09-22 |
| Package Structure And Method Of Forming The Same App 20200294966 - Chen; Yi-Hsiu ; et al. | 2020-09-17 |
| Die Stack Structure And Method Of Fabricating The Same App 20200294965 - Hsu; Chia-Hao ; et al. | 2020-09-17 |
| Method Of Manufacturing Semiconductor Package Structure App 20200286879 - Chen; Yi-Hsiu ; et al. | 2020-09-10 |
| Method and apparatus for bonding semiconductor devices Grant 10,748,803 - Tsai , et al. A | 2020-08-18 |
| Via for Semiconductor Device Connection and Methods of Forming the Same App 20200243442 - Yu; Chen-Hua ; et al. | 2020-07-30 |
| Semiconductor devices, methods of manufacture thereof, and capacitors Grant 10,727,294 - Chiou , et al. | 2020-07-28 |
| Through via structure and method Grant 10,714,423 - Lin , et al. | 2020-07-14 |
| Alignment marks in substrate having through-substrate via (TSV) Grant 10,692,764 - Chang , et al. | 2020-06-23 |
| Forming metal bonds with recesses Grant 10,685,935 - Chen , et al. | 2020-06-16 |
| Three-dimensional integrated circuit structure and method of manufacturing the same Grant 10,672,737 - Chen , et al. | 2020-06-02 |
| Method of manufacturing semiconductor package structure Grant 10,665,582 - Chen , et al. | 2020-05-26 |
| Profile of Through Via Protrusion in 3DIC Interconnect App 20200144119 - Wu; Jiung ; et al. | 2020-05-07 |
| 3D Packages and Methods for Forming the Same App 20200126938 - Hou; Shang-Yun ; et al. | 2020-04-23 |
| System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack App 20200126953 - Chang; Hung-Pin ; et al. | 2020-04-23 |
| Semiconductor Structure And Manufacturing Method Thereof App 20200118975 - CHEN; MING-FA ; et al. | 2020-04-16 |
| Semiconductor Device and Method App 20200118879 - Yu; Chen-Hua ; et al. | 2020-04-16 |
| Via for semiconductor device connection and methods of forming the same Grant 10,622,302 - Yu , et al. | 2020-04-14 |
| Semiconductor Device and Method App 20200111682 - Tsai; Chen-Yu ; et al. | 2020-04-09 |
| Semiconductor Package App 20200098736 - Liao; Yu-Kuang ; et al. | 2020-03-26 |
| Package Structure And Manufacturing Method Thereof App 20200091124 - Liao; Yu-Kuang ; et al. | 2020-03-19 |
| Profile of through via protrusion in 3DIC interconnect Grant 10,566,237 - Wu , et al. Feb | 2020-02-18 |
| Method and Structure of Three-Dimensional Chip Stacking App 20200043909 - Yu; Chen-Hua ; et al. | 2020-02-06 |
| Semiconductor Device And Manifacturing Method Thereof App 20200043896 - Yu; Chen-Hua ; et al. | 2020-02-06 |
| Embedded 3D Interposer Structure App 20200035554 - Shih; Ying-Ching ; et al. | 2020-01-30 |
| Robust through-silicon-via structure Grant 10,535,586 - Lin , et al. Ja | 2020-01-14 |
| 3D packages and methods for forming the same Grant 10,529,679 - Hou , et al. J | 2020-01-07 |
| Forming Metal Bonds with Recesses App 20200006288 - Chen; Ming-Fa ; et al. | 2020-01-02 |
| Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via and Method of Forming the Same App 20200006201 - Lin; Yung-Chi ; et al. | 2020-01-02 |
| System, structure, and method of manufacturing a semiconductor substrate stack Grant 10,515,933 - Chang , et al. Dec | 2019-12-24 |
| Method and structure of three-dimensional chip stacking Grant 10,515,940 - Yu , et al. Dec | 2019-12-24 |
| Die Structure, Die Stack Structure And Method Of Fabricating The Same App 20190385963 - Chen; Yi-Hsiu ; et al. | 2019-12-19 |
| Semiconductor structure and manufacturing method thereof Grant 10,510,718 - Chen , et al. Dec | 2019-12-17 |
| Semiconductor device having backside interconnect structure on through substrate via and method of forming the same Grant 10,510,641 - Lin , et al. Dec | 2019-12-17 |
| Bond structures and the methods of forming the same Grant 10,510,699 - Yu , et al. Dec | 2019-12-17 |
| Semiconductor device package including conformal metal cap contacting each semiconductor die Grant 10,510,561 - Tsai , et al. Dec | 2019-12-17 |
| Semiconductor device and method Grant 10,510,604 - Yu , et al. Dec | 2019-12-17 |
| Embedded 3D interposer structure Grant 10,497,616 - Shih , et al. De | 2019-12-03 |
| 3d Stacked-chip Package App 20190355640 - Yu; Chen-Hua ; et al. | 2019-11-21 |
| Via For Component Electrode Connection App 20190341306 - Yu; Chen-Hua ; et al. | 2019-11-07 |
| Wafer Debonding And Cleaning Apparatus App 20190304828 - Chiou; Wen-Chih ; et al. | 2019-10-03 |
| 3d Integrated Circuit (3dic) Structure And Method Of Making Same App 20190295989 - Yu; Chen-Hua ; et al. | 2019-09-26 |
| Bonding Apparatus And Method Of Bonding Substrates App 20190267347 - Yu; Chen-Hua ; et al. | 2019-08-29 |
| Robust through-silicon-via structure Grant 10,396,014 - Lin , et al. A | 2019-08-27 |
| Robust Through-Silicon-Via Structure App 20190259684 - Lin; Yung-Chi ; et al. | 2019-08-22 |
| Via for Semiconductor Device Connection and Methods of Forming the Same App 20190252312 - Yu; Chen-Hua ; et al. | 2019-08-15 |
| Bond Structures and the Methods of Forming the Same App 20190252335 - Yu; Chen-Hua ; et al. | 2019-08-15 |
| Wafer debonding and cleaning apparatus and method Grant 10,381,254 - Chiou , et al. A | 2019-08-13 |
| Method and Apparatus for Bonding Semiconductor Devices App 20190244851 - Tsai; Yan-Zuo ; et al. | 2019-08-08 |
| 3D stacked-chip package Grant 10,373,885 - Yu , et al. | 2019-08-06 |
| Optical transceiver Grant 10,333,623 - Liao , et al. | 2019-06-25 |
| Bonded 3D integrated circuit (3DIC) structure Grant 10,319,701 - Yu , et al. | 2019-06-11 |
| Forming Metal Bonds with Recesses App 20190148336 - Chen; Ming-Fa ; et al. | 2019-05-16 |
| Three-dimensional Integrated Circuit Structure And Method Of Manufacturing The Same App 20190139935 - Chen; Yi-Hsiu ; et al. | 2019-05-09 |
| Alignment Marks in Substrate Having Through-Substrate Via (TSV) App 20190131172 - Chang; Hsin ; et al. | 2019-05-02 |
| Die Stack Structure And Method Of Fabricating The Same App 20190131276 - Chen; Yi-Hsiu ; et al. | 2019-05-02 |
| Method Of Manufacturing Semiconductor Package Structure App 20190131289 - Chen; Yi-Hsiu ; et al. | 2019-05-02 |
| Profile of Through Via Protrusion in 3DIC Interconnect App 20190122927 - Wu; Jiung ; et al. | 2019-04-25 |
| Semiconductor Device and Method App 20190122930 - Yu; Chen-Hua ; et al. | 2019-04-25 |
| Method and apparatus for bonding semiconductor devices Grant 10,269,611 - Tsai , et al. | 2019-04-23 |
| Semiconductor device and method Grant 10,269,761 - Tsai , et al. | 2019-04-23 |
| Bond structures and the methods of forming the same Grant 10,269,741 - Yu , et al. | 2019-04-23 |
| Structure and formation method for chip package Grant 10,269,717 - Yu , et al. | 2019-04-23 |
| Method Of Making A Semiconductor Component Having Through-silicon Vias App 20190067107 - YU; Chen-Hua ; et al. | 2019-02-28 |
| Semiconductor Structure And Manufacturing Method Thereof App 20190067244 - CHEN; MING-FA ; et al. | 2019-02-28 |
| Through via structure extending to metallization layer Grant 10,170,396 - Chen , et al. J | 2019-01-01 |
| Profile of through via protrusion in 3DIC interconnect Grant 10,163,705 - Wu , et al. Dec | 2018-12-25 |
| Alignment marks in substrate having through-substrate via (TSV) Grant 10,163,706 - Chang , et al. Dec | 2018-12-25 |
| Isolation structure for stacked dies Grant 10,163,756 - Chang , et al. Dec | 2018-12-25 |
| Semiconductor device and method Grant 10,163,709 - Yu , et al. Dec | 2018-12-25 |
| Interconnect structure and method of forming same Grant 10,157,866 - Lo , et al. Dec | 2018-12-18 |
| Semiconductor packages and methods of forming the same Grant 10,157,892 - Chen , et al. Dec | 2018-12-18 |
| Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,153,205 - Yu , et al. Dec | 2018-12-11 |
| Method of manufacturing a capacitor Grant 10,153,338 - Chang , et al. Dec | 2018-12-11 |
| Singulation and Bonding Methods and Structures Formed Thereby App 20180350778 - Yu; Chen-Hua ; et al. | 2018-12-06 |
| Semiconductor component having through-silicon vias and method of manufacture Grant 10,115,634 - Yu , et al. October 30, 2 | 2018-10-30 |
| Embedded 3D Interposer Structure App 20180301376 - Shih; Ying-Ching ; et al. | 2018-10-18 |
| Semiconductor Structures And Methods App 20180295717 - Yu; Chen-Hua ; et al. | 2018-10-11 |
| Self-alignment for redistribution layer Grant 10,074,595 - Yang , et al. September 11, 2 | 2018-09-11 |
| Method of using a wafer cassette to charge an electrostatic carrier Grant 10,068,789 - Chiou , et al. September 4, 2 | 2018-09-04 |
| Light-emitting device Grant 10,062,821 - Chen , et al. August 28, 2 | 2018-08-28 |
| Embedded 3D interposer structure Grant 10,049,928 - Shih , et al. August 14, 2 | 2018-08-14 |
| Interconnection structure with confinement layer Grant 10,032,698 - Lo , et al. July 24, 2 | 2018-07-24 |
| CIS chips and methods for forming the same Grant 10,020,344 - Yu , et al. July 10, 2 | 2018-07-10 |
| Semiconductor Devices, Methods of Manufacture Thereof, and Capacitors App 20180175137 - Chiou; Wen-Chih ; et al. | 2018-06-21 |
| Bond Structures and the Methods of Forming the Same App 20180166408 - Yu; Chen-Hua ; et al. | 2018-06-14 |
| Through silicon via structure Grant 9,997,497 - Yu , et al. June 12, 2 | 2018-06-12 |
| Protection layer for adhesive material at wafer edge Grant 9,997,440 - Chiou , et al. June 12, 2 | 2018-06-12 |
| Interconnect Structure and Method of Forming Same App 20180145046 - Lo; Hsiao Yun ; et al. | 2018-05-24 |
| Through Via Structure and Method App 20180145022 - Lin; Yung-Chi ; et al. | 2018-05-24 |
| Robust Through-Silicon-Via Structure App 20180145012 - Lin; Yung-Chi ; et al. | 2018-05-24 |
| Through via structure and method Grant 9,978,607 - Lin , et al. May 22, 2 | 2018-05-22 |
| Wafer backside interconnect structure connected to TSVs Grant 9,978,708 - Chen , et al. May 22, 2 | 2018-05-22 |
| Interconnect structure and method Grant 9,953,920 - Chen , et al. April 24, 2 | 2018-04-24 |
| Semiconductor manufacturing process and package carrier Grant 9,922,934 - Wang , et al. March 20, 2 | 2018-03-20 |
| Semiconductor devices, methods of manufacture thereof, and capacitors Grant 9,899,467 - Chiou , et al. February 20, 2 | 2018-02-20 |
| Bond structures and the methods of forming the same Grant 9,893,028 - Yu , et al. February 13, 2 | 2018-02-13 |
| Method and Structure of Three-Dimensional Chip Stacking App 20180019236 - Yu; Chen-Hua ; et al. | 2018-01-18 |
| Self-Alignment for Redistribution Layer App 20180012825 - Yang; Ku-Feng ; et al. | 2018-01-11 |
| Robust through-silicon-via structure Grant 9,865,523 - Lin , et al. January 9, 2 | 2018-01-09 |
| Methods for forming a device having a capped through-substrate via structure Grant 9,847,256 - Lin , et al. December 19, 2 | 2017-12-19 |
| Chip-stacking apparatus having a transport device configured to transport a chip onto a substrate Grant 9,842,823 - Yu , et al. December 12, 2 | 2017-12-12 |
| Through via structure Grant 9,831,177 - Lin , et al. November 28, 2 | 2017-11-28 |
| Semiconductor Manufacturing Process And Package Carrier App 20170317033 - Wang; Shih-Hui ; et al. | 2017-11-02 |
| Structure and Formation Method for Chip Package App 20170317030 - Yu; Chen-Hua ; et al. | 2017-11-02 |
| Methods of packaging semiconductor devices and packaged semiconductor devices Grant 9,806,062 - Jeng , et al. October 31, 2 | 2017-10-31 |
| Backside through vias in a bonded structure Grant 9,799,694 - Wu , et al. October 24, 2 | 2017-10-24 |
| Formation of through via before contact processing Grant 9,793,192 - Yu , et al. October 17, 2 | 2017-10-17 |
| Self-alignment for redistribution layer Grant 9,786,580 - Yang , et al. October 10, 2 | 2017-10-10 |
| Methods of making integrated circuits including conductive structures through substrates Grant 9,773,701 - Liu , et al. September 26, 2 | 2017-09-26 |
| Method and structure of three-dimensional chip stacking Grant 9,773,768 - Yu , et al. September 26, 2 | 2017-09-26 |
| Interconnection Structure with Confinement Layer App 20170271242 - Lo; Hsiao Yun ; et al. | 2017-09-21 |
| Light-emitting Device App 20170271568 - CHEN; Ding-Yuan ; et al. | 2017-09-21 |
| Interconnect Structure and Method of Forming Same App 20170271287 - Lo; Hsiao Yun ; et al. | 2017-09-21 |
| 3d Stacked-chip Package App 20170263519 - Yu; Chen-Hua ; et al. | 2017-09-14 |
| Dummy structure for chip-on-wafer-on-substrate Grant 9,754,831 - Kuo , et al. September 5, 2 | 2017-09-05 |
| Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation Grant 9,748,190 - Chen , et al. August 29, 2 | 2017-08-29 |
| Method Of Manufacturing A Capacitor App 20170229534 - CHANG; Chun Hua ; et al. | 2017-08-10 |
| System, structure, and method of manufacturing a semiconductor substrate stack Grant 9,728,457 - Chang , et al. August 8, 2 | 2017-08-08 |
| Method for Through Silicon via Structure App 20170221861 - Yu; Chen-Hua ; et al. | 2017-08-03 |
| Wafer backside interconnect structure connected to TSVs Grant 9,716,074 - Chen , et al. July 25, 2 | 2017-07-25 |
| Structure and formation method for chip package Grant 9,711,458 - Yu , et al. July 18, 2 | 2017-07-18 |
| System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack App 20170194295 - Chang; Hung-Pin ; et al. | 2017-07-06 |
| Semiconductor Device and Method App 20170194286 - Tsai; Cheng-Chun ; et al. | 2017-07-06 |
| Conductor structure for three-dimensional semiconductor device Grant 9,698,080 - Chiou , et al. July 4, 2 | 2017-07-04 |
| Light-emitting device including reflective layer Grant 9,698,325 - Chen , et al. July 4, 2 | 2017-07-04 |
| Bond Structures and the Methods of Forming the Same App 20170186715 - Yu; Chen-Hua ; et al. | 2017-06-29 |
| Cylindrical embedded capacitors Grant 9,691,840 - Su , et al. June 27, 2 | 2017-06-27 |
| Interconnect structure and method of forming same Grant 9,679,859 - Lo , et al. June 13, 2 | 2017-06-13 |
| Interconnection structure with confinement layer Grant 9,673,132 - Lo , et al. June 6, 2 | 2017-06-06 |
| 3D stacked-chip package Grant 9,666,520 - Yu , et al. May 30, 2 | 2017-05-30 |
| Singulation and Bonding Methods and Structures Formed Thereby App 20170148765 - Yu; Chen-Hua ; et al. | 2017-05-25 |
| Method of manufacturing a capacitor Grant 9,660,016 - Chang , et al. May 23, 2 | 2017-05-23 |
| Semiconductor Device and Method App 20170140947 - Tsai; Chen-Yu ; et al. | 2017-05-18 |
| Structure And Formation Method For Chip Package App 20170141040 - YU; Chen-Hua ; et al. | 2017-05-18 |
| Integrated circuit package with probe pad structure Grant 9,653,427 - Wu , et al. May 16, 2 | 2017-05-16 |
| Method for through silicon via structure Grant 9,633,900 - Yu , et al. April 25, 2 | 2017-04-25 |
| TSV formation Grant 9,633,929 - Yang , et al. April 25, 2 | 2017-04-25 |
| Method and Structure of Three-Dimensional Chip Stacking App 20170103973 - Yu; Chen-Hua ; et al. | 2017-04-13 |
| Method Of Using A Wafer Cassette To Charge An Electrostatic Carrier App 20170103910 - Chiou; Wen-Chih ; et al. | 2017-04-13 |
| Device with Through-Substrate Via Structure and Method for Forming the Same App 20170084489 - Lin; Yung-Chi ; et al. | 2017-03-23 |
| Semiconductor device and method Grant 9,601,410 - Tsai , et al. March 21, 2 | 2017-03-21 |
| Three Dimensional Integrated Circuit Structure And Manufacturing Method Of The Same App 20170062392 - Cheng; Kuang-Wei ; et al. | 2017-03-02 |
| Three dimensional integrated circuit structure and manufacturing method of the same Grant 9,583,465 - Cheng , et al. February 28, 2 | 2017-02-28 |
| Wafer cassette with electrostatic carrier charging scheme Grant 9,570,331 - Chiou , et al. February 14, 2 | 2017-02-14 |
| Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via and Method of Forming the Same App 20170011988 - Lin; Yung-Chi ; et al. | 2017-01-12 |
| Wafer Backside Interconnect Structure Connected to TSVs App 20170005069 - Chen; Ming-Fa ; et al. | 2017-01-05 |
| Dummy Structure for Chip-on-Wafer-on-Substrate App 20160358818 - Kuo; Pei-Ching ; et al. | 2016-12-08 |
| Device with capped through-substrate via structure Grant 9,514,986 - Lin , et al. December 6, 2 | 2016-12-06 |
| Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices App 20160329302 - Jeng; Shin-Puu ; et al. | 2016-11-10 |
| Semiconductor Component Having Through-silicon Vias And Method Of Manufacture App 20160329245 - YU; Chen-Hua ; et al. | 2016-11-10 |
| Alignment mark and method of formation Grant 9,478,480 - Tsai , et al. October 25, 2 | 2016-10-25 |
| Wafer backside interconnect structure connected to TSVs Grant 9,449,875 - Chen , et al. September 20, 2 | 2016-09-20 |
| Semiconductor device having backside interconnect structure through substrate via and method of forming the same Grant 9,449,898 - Lin , et al. September 20, 2 | 2016-09-20 |
| Dummy structure for chip-on-wafer-on-substrate Grant 9,425,126 - Kuo , et al. August 23, 2 | 2016-08-23 |
| Semiconductor Device and Method App 20160240439 - Yu; Chen-Hua ; et al. | 2016-08-18 |
| CIS Chips and Methods for Forming the Same App 20160240583 - Yu; Chen-Hua ; et al. | 2016-08-18 |
| Through-substrate via formation with improved topography control Grant 9,418,933 - Lin , et al. August 16, 2 | 2016-08-16 |
| Semiconductor component having through-silicon vias and method of manufacture Grant 9,418,923 - Yu , et al. August 16, 2 | 2016-08-16 |
| Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects Grant 9,418,961 - Yu , et al. August 16, 2 | 2016-08-16 |
| Methods of packaging semiconductor devices and packaged semiconductor devices Grant 9,406,650 - Jeng , et al. August 2, 2 | 2016-08-02 |
| Wafer debonding and cleaning apparatus and method of use Grant 9,390,949 - Chiou , et al. July 12, 2 | 2016-07-12 |
| 3d Integrated Circuit (3dic) Structure And Method Of Making Same App 20160197055 - Yu; Chen-Hua ; et al. | 2016-07-07 |
| Semiconductor Device and Method App 20160197029 - Tsai; Cheng-Chun ; et al. | 2016-07-07 |
| Chip-stacking Apparatus App 20160190087 - YU; Chen-Hua ; et al. | 2016-06-30 |
| Through Silicon Via Structure and Method App 20160181157 - Yu; Chen-Hua ; et al. | 2016-06-23 |
| Light-emitting diodes on concave texture substrate Grant 9,373,755 - Yu , et al. June 21, 2 | 2016-06-21 |
| TSV structures and methods for forming the same Grant 9,373,575 - Lin , et al. June 21, 2 | 2016-06-21 |
| Backside Through Vias in a Bonded Structure App 20160172403 - Wu; Weng-Jin ; et al. | 2016-06-16 |
| Integrated Circuit Package and Methods of Forming Same App 20160172333 - Wu; Chi-Hsi ; et al. | 2016-06-16 |
| Interconnect Structure and Method of Forming Same App 20160118356 - Lo; Hsiao Yun ; et al. | 2016-04-28 |
| Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20160118301 - Yu; Chen-Hua ; et al. | 2016-04-28 |
| CIS chips and methods for forming the same Grant 9,324,756 - Yu , et al. April 26, 2 | 2016-04-26 |
| Bump structure for stacked dies Grant 9,312,225 - Chang , et al. April 12, 2 | 2016-04-12 |
| Formation of Through Via Before Contact Processing App 20160099196 - Yu; Chen-Hua ; et al. | 2016-04-07 |
| Thin wafer handling method Grant 9,305,769 - Yu , et al. April 5, 2 | 2016-04-05 |
| Through silicon via structure Grant 9,299,676 - Yu , et al. March 29, 2 | 2016-03-29 |
| Stacked structures and methods of forming stacked structures Grant 9,299,612 - Wu , et al. March 29, 2 | 2016-03-29 |
| Backside through vias in a bonded structure Grant 9,293,418 - Wu , et al. March 22, 2 | 2016-03-22 |
| Barrier for through-silicon via Grant 9,287,166 - Yu , et al. March 15, 2 | 2016-03-15 |
| Through Via Structure and Method App 20160071765 - Lin; Yung-Chi ; et al. | 2016-03-10 |
| Methods of forming integrated circuit package Grant 9,281,254 - Yu , et al. March 8, 2 | 2016-03-08 |
| Light-emitting Device App 20160064632 - CHEN; Ding-Yuan ; et al. | 2016-03-03 |
| TSV Formation App 20160056090 - Yang; Ku-Feng ; et al. | 2016-02-25 |
| Through substrate via structures and methods of forming the same Grant 9,263,382 - Yang , et al. February 16, 2 | 2016-02-16 |
| Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 9,263,511 - Yu , et al. February 16, 2 | 2016-02-16 |
| Wafer Cassette with Electrostatic Carrier Charging Scheme App 20160035609 - Chiou; Wen-Chih ; et al. | 2016-02-04 |
| Interconnect structure and method of forming same Grant 9,252,110 - Lo , et al. February 2, 2 | 2016-02-02 |
| Interconnect structures for substrate Grant 9,240,349 - Yu , et al. January 19, 2 | 2016-01-19 |
| Three-Dimensional Semiconductor Device App 20150380341 - Chiou; Wen-Chih ; et al. | 2015-12-31 |
| Method of forming light-generating device including reflective layer Grant 9,214,613 - Chen , et al. December 15, 2 | 2015-12-15 |
| Through Via Structure App 20150357263 - Lin; Yung-Chi ; et al. | 2015-12-10 |
| Formation of through via before contact processing Grant 9,209,157 - Chiou , et al. December 8, 2 | 2015-12-08 |
| Dummy Structure for Chip-on-Wafer-on-Substrate App 20150348872 - Kuo; Pei-Ching ; et al. | 2015-12-03 |
| TSV formation Grant 9,190,325 - Jeng , et al. November 17, 2 | 2015-11-17 |
| 3d Stacked-chip Package App 20150318263 - Yu; Chen-Hua ; et al. | 2015-11-05 |
| Profile of Through Via Protrusion in 3DIC Interconnect App 20150311141 - Wu; Jiung ; et al. | 2015-10-29 |
| Forming interconnect structures using pre-ink-printed sheets Grant 9,159,673 - Ko , et al. October 13, 2 | 2015-10-13 |
| Semiconductor Device and Method App 20150287697 - Tsai; Chen-Yu ; et al. | 2015-10-08 |
| Spin chuck for thin wafer cleaning Grant 9,153,462 - Lin , et al. October 6, 2 | 2015-10-06 |
| 3D Packages and Methods for Forming the Same App 20150262958 - Hou; Shang-Yun ; et al. | 2015-09-17 |
| Three-dimensional semiconductor device Grant 9,130,024 - Chiou , et al. September 8, 2 | 2015-09-08 |
| Light-emitting diode with textured substrate Grant 9,130,115 - Yu , et al. September 8, 2 | 2015-09-08 |
| Through-Substrate via Formation with Improved Topography Control App 20150249049 - Lin; Yung-Chi ; et al. | 2015-09-03 |
| Method of handling a thin wafer Grant 9,117,828 - Wu , et al. August 25, 2 | 2015-08-25 |
| Semiconductor package with through silicon vias Grant 9,117,943 - Chen , et al. August 25, 2 | 2015-08-25 |
| Interconnect Structure and Method App 20150235940 - Chen; Hsin-Yu ; et al. | 2015-08-20 |
| Through Via Structure Extending to Metallization Layer App 20150235922 - Chen; Yi-Hsiu ; et al. | 2015-08-20 |
| Through via structure and method Grant 9,112,007 - Lin , et al. August 18, 2 | 2015-08-18 |
| Methods Of Making Integrated Circuits Including Conductive Structures Through Substrates App 20150228541 - LIU; Yuan-Hung ; et al. | 2015-08-13 |
| Integrated Circuit Package and Methods of Forming Same App 20150228550 - Yu; Chen-Hua ; et al. | 2015-08-13 |
| Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices App 20150221611 - Jeng; Shin-Puu ; et al. | 2015-08-06 |
| Reconfigurable guide pin design for centering wafers having different sizes Grant 9,099,515 - Chang , et al. August 4, 2 | 2015-08-04 |
| Selective curing method of adhesive on substrate Grant 9,093,489 - Yu , et al. July 28, 2 | 2015-07-28 |
| Copper bump structures having sidewall protection layers Grant 9,093,314 - Lin , et al. July 28, 2 | 2015-07-28 |
| Chip on wafer bonder Grant 9,093,447 - Yu , et al. July 28, 2 | 2015-07-28 |
| Interconnect Structures for Substrate App 20150206799 - Yu; Chen-Hua ; et al. | 2015-07-23 |
| Robust Through-Silicon-Via Structure App 20150206823 - Lin; Yung-Chi ; et al. | 2015-07-23 |
| Interconnect Structure and Method of Forming Same App 20150206846 - Lo; Hsiao Yun ; et al. | 2015-07-23 |
| Device with through-silicon via (TSV) and method of forming the same Grant 9,087,878 - Yu , et al. July 21, 2 | 2015-07-21 |
| Through-substrate via formation with improved topography control Grant 9,064,850 - Lin , et al. June 23, 2 | 2015-06-23 |
| Integrated circuits including conductive structures through a substrate and methods of making the same Grant 9,059,262 - Liu , et al. June 16, 2 | 2015-06-16 |
| Semiconductor Devices, Methods of Manufacture Thereof, and Capacitors App 20150162397 - Chiou; Wen-Chih ; et al. | 2015-06-11 |
| 3D packages and methods for forming the same Grant 9,048,231 - Hou , et al. June 2, 2 | 2015-06-02 |
| Through Silicon Via Structure and Method App 20150137361 - Yu; Chen-Hua ; et al. | 2015-05-21 |
| TSV Structures and Methods for Forming the Same App 20150137360 - Lin; Yung-Chi ; et al. | 2015-05-21 |
| Self-alignment For Redistribution Layer App 20150137382 - Yang; Ku-Feng ; et al. | 2015-05-21 |
| Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation App 20150130058 - Chen; Hsin-Yu ; et al. | 2015-05-14 |
| Semiconductor molding chamber Grant 9,023,266 - Lin , et al. May 5, 2 | 2015-05-05 |
| Alignment Marks in Substrate Having Through-Substrate Via (TSV) App 20150118840 - Chang; Hsin ; et al. | 2015-04-30 |
| Copper Bump Structures Having Sidewall Protection Layers App 20150111342 - Lin; Jing-Cheng ; et al. | 2015-04-23 |
| Interconnect structure and method Grant 9,006,101 - Chen , et al. April 14, 2 | 2015-04-14 |
| Interconnect structures for substrate Grant 8,994,188 - Yu , et al. March 31, 2 | 2015-03-31 |
| Through silicon via with embedded barrier pad Grant 8,980,741 - Lin , et al. March 17, 2 | 2015-03-17 |
| Alignment Mark and Method of Formation App 20150069580 - Tsai; Chen-Yu ; et al. | 2015-03-12 |
| Device with Through-Substrate Via Structure and Method for Forming the Same App 20150061147 - Lin; Yung-Chi ; et al. | 2015-03-05 |
| Light-emitting Diode With Current-spreading Region App 20150053918 - Chen; Ding-Yuan ; et al. | 2015-02-26 |
| Interconnection Structure with Confinement Layer App 20150054174 - Lo; Hsiao Yun ; et al. | 2015-02-26 |
| TSV structures and methods for forming the same Grant 8,956,966 - Lin , et al. February 17, 2 | 2015-02-17 |
| Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation Grant 8,951,838 - Chen , et al. February 10, 2 | 2015-02-10 |
| Surface metal wiring structure for an IC substrate Grant 8,953,336 - Kao , et al. February 10, 2 | 2015-02-10 |
| Through silicon via structure Grant 8,952,506 - Yu , et al. February 10, 2 | 2015-02-10 |
| Semiconductor Device Having Backside Interconnect Structure On Through Substrate Via And Method Of Forming The Same App 20150035159 - Lin; Yung-Chi ; et al. | 2015-02-05 |
| Method Of Manufacturing A Capacitor App 20150037960 - CHANG; Chun Hua ; et al. | 2015-02-05 |
| System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack App 20150024546 - Chang; Hung-Pin ; et al. | 2015-01-22 |
| Alignment marks in substrate having through-substrate via (TSV) Grant 8,928,159 - Chang , et al. January 6, 2 | 2015-01-06 |
| Copper bump structures having sidewall protection layers Grant 8,922,004 - Lin , et al. December 30, 2 | 2014-12-30 |
| Wafer Debonding And Cleaning Apparatus And Method App 20140374031 - CHIOU; Wen-Chih ; et al. | 2014-12-25 |
| Novel Semiconductor Package With Through Silicon Vias App 20140363910 - Chen; Ding-Yuan ; et al. | 2014-12-11 |
| Method for producing a protective structure Grant 8,900,994 - Yu , et al. December 2, 2 | 2014-12-02 |
| Alignment mark and method of formation Grant 8,896,136 - Tsai , et al. November 25, 2 | 2014-11-25 |
| Via structure and via etching process of forming the same Grant 8,896,127 - Chang , et al. November 25, 2 | 2014-11-25 |
| TSV Structures and Methods for Forming the Same App 20140342547 - Lin; Yung-Chi ; et al. | 2014-11-20 |
| Through Substrate Via Structures And Methods Of Forming The Same App 20140327151 - YANG; Ku-Feng ; et al. | 2014-11-06 |
| Capacitor for interposers and methods of manufacture thereof Grant 8,878,338 - Chang , et al. November 4, 2 | 2014-11-04 |
| III-V compound semiconductor epitaxy from a non-III-V substrate Grant 8,878,252 - Yu , et al. November 4, 2 | 2014-11-04 |
| Wafer Backside Interconnect Structure Connected to TSVs App 20140322909 - Chen; Ming-Fa ; et al. | 2014-10-30 |
| Wafer Backside Interconnect Structure Connected to TSVs App 20140312494 - Chen; Ming-Fa ; et al. | 2014-10-23 |
| 3D Packages and Methods for Forming the Same App 20140306341 - Hou; Shang-Yun ; et al. | 2014-10-16 |
| System, structure, and method of manufacturing a semiconductor substrate stack Grant 8,853,830 - Chang , et al. October 7, 2 | 2014-10-07 |
| Process of forming through-silicon via structure Grant 8,846,523 - Wu , et al. September 30, 2 | 2014-09-30 |
| Bump with protection structure Grant 8,847,388 - Yu , et al. September 30, 2 | 2014-09-30 |
| Composite carrier structure Grant 8,846,499 - Shih , et al. September 30, 2 | 2014-09-30 |
| Through Silicon Via with Embedded Barrier Pad App 20140287581 - Lin; Yung-Chi ; et al. | 2014-09-25 |
| Selective Curing Method of Adhesive on Substrate App 20140261997 - Yu; Tu-Hao ; et al. | 2014-09-18 |
| Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation App 20140264834 - Chen; Hsin-Yu ; et al. | 2014-09-18 |
| Interconnect barrier structure and method Grant 8,835,313 - Yu, I , et al. September 16, 2 | 2014-09-16 |
| Cost-effective TSV formation Grant 8,836,085 - Yang , et al. September 16, 2 | 2014-09-16 |
| Light-emitting diode with current-spreading region Grant 8,823,049 - Chen , et al. September 2, 2 | 2014-09-02 |
| Light-emitting diode on a conductive substrate Grant 8,815,618 - Chen , et al. August 26, 2 | 2014-08-26 |
| Reflective Layer for Light-Emitting Diodes App 20140235001 - Chen; Ding-Yuan ; et al. | 2014-08-21 |
| Backside Through Vias in a Bonded Structure App 20140232013 - Wu; Weng-Jin ; et al. | 2014-08-21 |
| Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20140225222 - YU; Chen-Hua ; et al. | 2014-08-14 |
| Isolation Structure for Stacked Dies App 20140225277 - Chang; Hung-Pin ; et al. | 2014-08-14 |
| 3D packages and methods for forming the same Grant 8,802,504 - Hou , et al. August 12, 2 | 2014-08-12 |
| Through substrate via structures and methods of forming the same Grant 8,803,322 - Yang , et al. August 12, 2 | 2014-08-12 |
| TSV structures and methods for forming the same Grant 8,803,316 - Lin , et al. August 12, 2 | 2014-08-12 |
| III-V compound semiconductor epitaxy using lateral overgrowth Grant 8,803,189 - Yu , et al. August 12, 2 | 2014-08-12 |
| Stacked Structures And Methods Of Forming Stacked Structures App 20140220741 - WU; Weng-Jin ; et al. | 2014-08-07 |
| Through Silicon Via Structure and Method App 20140203439 - Yu; Chen-Hua ; et al. | 2014-07-24 |
| Forming Interconnect Structures Using Pre-Ink-Printed Sheets App 20140191395 - Ko; Jung Cheng ; et al. | 2014-07-10 |
| Barrier for Through-Silicon Via App 20140175652 - Yu; Chen-Hua ; et al. | 2014-06-26 |
| Light-Emitting Diode with Textured Substrate App 20140166979 - Yu; Chen-Hua ; et al. | 2014-06-19 |
| III-V Compound Semiconductor Epitaxy From a Non-III-V Substrate App 20140159208 - Yu; Chia-Lin ; et al. | 2014-06-12 |
| Through-Substrate via Formation with Improved Topography Control App 20140131884 - Lin; Yung-Chi ; et al. | 2014-05-15 |
| Thin Wafer Handling Method App 20140130962 - YU; Chen-Hua ; et al. | 2014-05-15 |
| Interconnect Structures for Substrate App 20140117564 - Yu; Chen-Hua ; et al. | 2014-05-01 |
| TSV Formation App 20140110862 - Jeng; Shin-Puu ; et al. | 2014-04-24 |
| Cylindrical Embedded Capacitors App 20140106536 - Su; An-Jhih ; et al. | 2014-04-17 |
| Light-Emitting Diodes on Concave Texture Substrate App 20140087505 - Yu; Chen-Hua ; et al. | 2014-03-27 |
| Through Via Structure and Method App 20140077374 - Lin; Yung-Chi ; et al. | 2014-03-20 |
| Interconnect Structure and Method App 20140061924 - Chen; Hsin-Yu ; et al. | 2014-03-06 |
| Omnidirectional Reflector App 20140054637 - Chen; Ding-Yuan ; et al. | 2014-02-27 |
| CIS Chips and Methods for Forming the Same App 20140027872 - Yu; Chen-Hua ; et al. | 2014-01-30 |
| Semiconductor Component Having Through-silicon Vias And Method Of Manufacture App 20140015146 - YU; Chen-Hua ; et al. | 2014-01-16 |
| Cost-Effective TSV Formation App 20140008802 - Yang; Ku-Feng ; et al. | 2014-01-09 |
| Reconfigurable Guide Pin Design for Centering Wafers Having Different Sizes App 20130334832 - Chang; Hsin ; et al. | 2013-12-19 |
| Capacitor For Interposers And Methods Of Manufacture Thereof App 20130320493 - CHANG; Chun Hua ; et al. | 2013-12-05 |
| Semiconductor Molding Chamber App 20130323886 - Lin; Jing-Cheng ; et al. | 2013-12-05 |
| Apparatus and Method of Substrate to Substrate Bonding for Three Dimensional (3D) IC Interconnects App 20130320071 - Yu; Chen-Hua ; et al. | 2013-12-05 |
| Device With Through-silicon Via (tsv) And Method Of Forming The Same App 20130323883 - YU; Chen-Hua ; et al. | 2013-12-05 |
| Interconnect Barrier Structure and Method App 20130316528 - Yu, I; Chen-Hua ; et al. | 2013-11-28 |
| Embedded 3D Interposer Structure App 20130309813 - Shih; Ying-Ching ; et al. | 2013-11-21 |
| Bump Structure for Stacked Dies App 20130299992 - Chang; Hung-Pin ; et al. | 2013-11-14 |
| Capacitor for Interposers and Methods of Manufacture Thereof App 20130285200 - Chang; Chun Hua ; et al. | 2013-10-31 |
| Through Silicon Via with Embedded Barrier Pad App 20130285244 - Lin; Yung-Chi ; et al. | 2013-10-31 |
| Through Via Process App 20130277844 - CHIOU; Wen-Chih ; et al. | 2013-10-24 |
| Light-Emitting Diode with Current-Spreading Region App 20130264539 - Chen; Ding-Yuan ; et al. | 2013-10-10 |
| Methods Of Forming Semiconductor Structures App 20130252422 - CHIOU; Wen-Chih ; et al. | 2013-09-26 |
| Methods and Apparatus for Direct Connections to Through Vias App 20130241057 - Yu; Chen-Hua ; et al. | 2013-09-19 |
| Surface Metal Wiring Structure For An Ic Substrate App 20130233601 - KAO; Chin-Fu ; et al. | 2013-09-12 |
| Three-Dimensional Integrated Circuits with Protection Layers App 20100330743A1 - | 2010-12-30 |
| Stacked Structures And Methods Of Fabricating Stacked Structures App 20100327463A1 - | 2010-12-30 |
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