Chiang; Yi-Che

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiang; Yi-Che.The latest application filed is for "method of forming semiconductor packages having thermal through vias (ttv)".

Company Profile

5.8.11

Chiang; Yi-Che - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device Grant 11,444,023 - Hsu , et al. September 13, 2	2022-09-13
Method Of Forming Semiconductor Packages Having Thermal Through Vias (ttv) App 20220285241 - Hsu; Sen-Kuei ; et al.	2022-09-08
Semiconductor packages having thermal through vias (TTV) Grant 11,373,922 - Hsu , et al. June 28, 2	2022-06-28
Chip Package With Antenna Element App 20210265289 - CHIANG; Yung-Ping ; et al.	2021-08-26
Semiconductor Package And Manufacturing Method Thereof App 20210249372 - Hsu; Sen-Kuei ; et al.	2021-08-12
Memory module, semiconductor package including the same, and manufacturing method thereof Grant 11,018,113 - Chuang , et al. May 25, 2	2021-05-25
Chip package with antenna element Grant 11,004,809 - Chiang , et al. May 11, 2	2021-05-11
Memory Module, Semiconductor Package Including The Same, And Manufacturing Method Thereof App 20210118847 - Chuang; Lipu Kris ; et al.	2021-04-22
Package structure and method of fabricating the same Grant 10,937,719 - Chiang , et al. March 2, 2	2021-03-02
Semiconductor Device, Package Structure And Method Of Fabricating The Same App 20210043564 - Hsu; Sen-Kuei ; et al.	2021-02-11
Semiconductor Packages Having Thermal Through Vias (ttv) App 20200373219 - Hsu; Sen-Kuei ; et al.	2020-11-26
Semiconductor device, package structure and method of fabricating the same Grant 10,818,588 - Hsu , et al. October 27, 2	2020-10-27
Semiconductor packages having thermal through vias (TTV) Grant 10,748,831 - Hsu , et al. A	2020-08-18
Semiconductor Device, Package Structure And Method Of Fabricating The Same App 20200251414 - Kind Code	2020-08-06
Semiconductor Packages And Methods Of Forming The Same App 20190371694 - Hsu; Sen-Kuei ; et al.	2019-12-05
Chip Package With Antenna Element App 20190279951 - CHIANG; Yung-Ping ; et al.	2019-09-12
Structure and formation method of chip package with antenna element Grant 10,312,203 - Chiang , et al.	2019-06-04
Package Structure And Method Of Fabricating The Same App 20180269139 - Chiang; Yung-Ping ; et al.	2018-09-20
Structure And Formation Method Of Chip Package With Antenna Element App 20180166405 - CHIANG; Yung-Ping ; et al.	2018-06-14

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