Chi; HeeJo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chi; HeeJo.The latest application filed is for "semiconductor device and method of forming interposer with opening to contain semiconductor die".

Company Profile

4.126.95

Chi; HeeJo - Kyoungki-do KR
Chi; HeeJo - Yeoju-gun KR
Chi; HeeJo - Daejeon-si KR
Chi; HeeJo - Kyonggi-Do KR
Chi; HeeJo - Ichon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die Grant 10,903,183 - Chi , et al. January 26, 2	2021-01-26
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP Grant 10,573,600 - Chi , et al. Feb	2020-02-25
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package Grant 10,510,703 - Chi , et al. Dec	2019-12-17
Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die Grant 9,966,335 - Cho , et al. May 8, 2	2018-05-08
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die App 20180108542 - Pagaila; Reza A. ; et al.	2018-04-19
Semiconductor device and method of forming interposer with opening to contain semiconductor die Grant 9,875,911 - Pagaila , et al. January 23, 2	2018-01-23
Integrated circuit packaging system with under bump metallization and method of manufacture thereof Grant 9,865,554 - Shim , et al. January 9, 2	2018-01-09
Methods of forming conductive and insulating layers Grant 9,865,575 - Chi , et al. January 9, 2	2018-01-09
Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof Grant 9,859,200 - Park , et al. January 2, 2	2018-01-02
Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die Grant 9,842,808 - Shin , et al. December 12, 2	2017-12-12
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP App 20170309572 - Chi; HeeJo ; et al.	2017-10-26
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package App 20170250154 - Chi; HeeJo ; et al.	2017-08-31
Integrated circuit packaging system with joint assembly and method of manufacture thereof Grant 9,748,157 - Chi , et al. August 29, 2	2017-08-29
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP Grant 9,735,113 - Chi , et al. August 15, 2	2017-08-15
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Grant 9,721,921 - Kim , et al. August 1, 2	2017-08-01
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package Grant 9,691,707 - Chi , et al. June 27, 2	2017-06-27
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof Grant 9,679,769 - Camacho , et al. June 13, 2	2017-06-13
Integrated circuit packaging system with coreless substrate and method of manufacture thereof Grant 9,673,171 - Chi , et al. June 6, 2	2017-06-06
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint Grant 9,558,965 - Chi , et al. January 31, 2	2017-01-31
Methods of forming conductive jumper traces Grant 9,508,635 - Shin , et al. November 29, 2	2016-11-29
Integrated circuit packaging system with support structure and method of manufacture thereof Grant 9,502,267 - Chi , et al. November 22, 2	2016-11-22
Carrier system with multi-tier conductive posts and method of manufacture thereof Grant 9,496,152 - Cho , et al. November 15, 2	2016-11-15
Methods of Forming Conductive and Insulating Layers App 20160329310 - Chi; HeeJo ; et al.	2016-11-10
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package App 20160233168 - Chi; HeeJo ; et al.	2016-08-11
Methods of forming conductive and insulating layers Grant 9,406,533 - Chi , et al. August 2, 2	2016-08-02
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof Grant 9,406,531 - Camacho , et al. August 2, 2	2016-08-02
Integrated circuit packaging system with insulated trace and method of manufacture thereof Grant 9,406,642 - Chi , et al. August 2, 2	2016-08-02
Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant Grant 9,397,050 - Shin , et al. July 19, 2	2016-07-19
Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer Grant 9,391,046 - Park , et al. July 12, 2	2016-07-12
Integrated circuit packaging system with surface treatment and method of manufacture thereof Grant 9,385,100 - Lee , et al. July 5, 2	2016-07-05
Integrated Circuit Packaging System With Interposer Support Structure Mechanism And Method Of Manufacture Thereof App 20160190054 - Park; SooSan ; et al.	2016-06-30
Integrated Circuit Packaging System With Package-on-package Mechanism And Method Of Manufacture Thereof App 20160190056 - Park; SooSan ; et al.	2016-06-30
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form App 20160163675 - Kim; KyungMoon ; et al.	2016-06-09
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package Grant 9,362,161 - Chi , et al. June 7, 2	2016-06-07
Integrated circuit package stacking system with shielding and method of manufacture thereof Grant 9,355,939 - Cho , et al. May 31, 2	2016-05-31
Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof Grant 9,331,003 - Camacho , et al. May 3, 2	2016-05-03
Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring Grant 9,330,994 - Camacho , et al. May 3, 2	2016-05-03
Integrated Circuit Packaging System With Under Bump Metallization And Method Of Manufacture Thereof App 20160099222 - Shim; Il Kwon ; et al.	2016-04-07
Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof Grant 9,299,650 - Chi , et al. March 29, 2	2016-03-29
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Grant 9,287,204 - Kim , et al. March 15, 2	2016-03-15
Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer Grant 9,269,691 - Chi , et al. February 23, 2	2016-02-23
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint Grant 9,269,595 - Chi , et al. February 23, 2	2016-02-23
Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP Grant 9,263,332 - Chi , et al. February 16, 2	2016-02-16
Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding Grant 9,252,130 - Kim , et al. February 2, 2	2016-02-02
Semiconductor device and method of simultaneous molding and thermalcompression bonding Grant 9,245,770 - Kim , et al. January 26, 2	2016-01-26
Semiconductor device and method of making bumpless flipchip interconnect structures Grant 9,240,331 - Kim , et al. January 19, 2	2016-01-19
Integrated circuit packaging system with under bump metallization and method of manufacture thereof Grant 9,202,793 - Shim , et al. December 1, 2	2015-12-01
Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die Grant 9,153,476 - Chi , et al. October 6, 2	2015-10-06
Semiconductor Device and Method of Forming RDL and Vertical Interconnect by Laser Direct Structuring App 20150279778 - Camacho; Zigmund R. ; et al.	2015-10-01
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package App 20150270237 - Chi; HeeJo ; et al.	2015-09-24
Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe Grant 9,064,859 - Chi , et al. June 23, 2	2015-06-23
Integrated circuit packaging system with redistribution layer and method of manufacture thereof Grant 9,054,098 - Cho , et al. June 9, 2	2015-06-09
Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP Grant 9,048,306 - Chi , et al. June 2, 2	2015-06-02
Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die App 20150123273 - Cho; NamJu ; et al.	2015-05-07
Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer App 20150091157 - Chi; HeeJo ; et al.	2015-04-02
Methods of forming solder balls in semiconductor packages Grant 8,951,834 - Kim , et al. February 10, 2	2015-02-10
Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die Grant 8,932,907 - Cho , et al. January 13, 2	2015-01-13
Methods of Forming Conductive Materials on Contact Pads App 20150004750 - Chi; HeeJo ; et al.	2015-01-01
Methods of Forming Conductive Jumper Traces App 20150004748 - Shin; HanGil ; et al.	2015-01-01
Methods of Forming Conductive and Insulating Layers App 20150004756 - Chi; HeeJo ; et al.	2015-01-01
Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer App 20140367848 - Chi; HeeJo ; et al.	2014-12-18
Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die App 20140361423 - Chi; HeeJo ; et al.	2014-12-11
Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die Grant 8,901,755 - Chi , et al. December 2, 2	2014-12-02
Methods of Manufacturing Flip Chip Semiconductor Packages Using Double-Sided Thermal Compression Bonding App 20140295618 - Kim; KyungMoon ; et al.	2014-10-02
Semiconductor Device and Method of Simultaneous Molding and Thermalcompression Bonding App 20140175639 - Kim; KyungMoon ; et al.	2014-06-26
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form App 20140175640 - Kim; KyungMoon ; et al.	2014-06-26
Semiconductor Device and Method of Making Bumpless Flipchip Interconnect Structures App 20140175661 - Kim; KyungMoon ; et al.	2014-06-26
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,749,040 - Chi , et al. June 10, 2	2014-06-10
Integrated circuit packaging system with through silicon via and method of manufacture thereof Grant 8,723,309 - Shin , et al. May 13, 2	2014-05-13
Integrated circuit packaging system with encapsulation and method of manufacture thereof Grant 8,716,065 - Chi , et al. May 6, 2	2014-05-06
Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof Grant 8,710,634 - Chi , et al. April 29, 2	2014-04-29
Integrated circuit packaging system with laser hole and method of manufacture thereof Grant 8,710,668 - Lee , et al. April 29, 2	2014-04-29
Integrated circuit packaging system with an interposer and method of manufacture thereof Grant 8,624,370 - Chi , et al. January 7, 2	2014-01-07
Integrated Circuit Packaging System With Through Silicon Via And Method Of Manufacture Thereof App 20130334697 - Shin; HanGil ; et al.	2013-12-19
Integrated circuit packaging system with through silicon via base and method of manufacture thereof Grant 8,587,129 - Chi , et al. November 19, 2	2013-11-19
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die App 20130299982 - Pagaila; Reza A. ; et al.	2013-11-14
Semiconductor Device and Method of Forming Open Cavity in TSV Interposer to Contain Semiconductor Die in WLCSMP App 20130299974 - Chi; HeeJo ; et al.	2013-11-14
Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof Grant 8,564,125 - Cho , et al. October 22, 2	2013-10-22
Semiconductor Device and Method of Forming Conductive Layer Over Metal Substrate for Electrical Interconnect of Semiconductor Die App 20130249104 - Chi; HeeJo ; et al.	2013-09-26
Integrated circuit package system with package stacking and method of manufacture thereof Grant 8,541,872 - Cho , et al. September 24, 2	2013-09-24
Integrated circuit packaging system with stiffener and method of manufacture thereof Grant 8,492,888 - Chi , et al. July 23, 2	2013-07-23
Integrated circuit packaging system with intra substrate die and method of manufacture thereof Grant 8,476,111 - Cho , et al. July 2, 2	2013-07-02
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,471,394 - Jang , et al. June 25, 2	2013-06-25
Integrated circuit packaging system with post and method of manufacture thereof Grant 8,460,968 - Park , et al. June 11, 2	2013-06-11
Integrated circuit package system with embedded die superstructure and method of manufacture thereof Grant 8,455,300 - Chi , et al. June 4, 2	2013-06-04
Semiconductor Device and Method of Forming Conductive Posts and Heat Sink Over Semiconductor Die Using Leadframe App 20130105970 - Chi; HeeJo ; et al.	2013-05-02
Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die App 20130099378 - Cho; NamJu ; et al.	2013-04-25
Integrated circuit packaging system with a stack package and method of manufacture thereof Grant 8,426,955 - Chi , et al. April 23, 2	2013-04-23
Integrated circuit packaging system with foldable substrate and method of manufacture thereof Grant 8,421,203 - Chi , et al. April 16, 2	2013-04-16
Integrated circuit packaging system with dual side connection and method of manufacture thereof Grant 8,421,210 - Chi , et al. April 16, 2	2013-04-16
Semiconductor Device and Method of Forming Prefabricated Multi-Die Leadframe for Electrical Interconnect of Stacked Semiconductor Die App 20130087898 - Chi; HeeJo ; et al.	2013-04-11
Integrated circuit packaging system with an interposer substrate and method of manufacture thereof Grant 8,409,917 - Yoon , et al. April 2, 2	2013-04-02
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof App 20130075927 - Chi; HeeJo ; et al.	2013-03-28
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof App 20130075923 - Park; YeongIm ; et al.	2013-03-28
Integrated Circuit Packaging System With Embedded Thermal Heat Shield And Method Of Manufacture Thereof App 20130056864 - Cho; NamJu ; et al.	2013-03-07
Integrated Circuit Packaging System With Stiffener And Method Of Manufacture Thereof App 20130056863 - Chi; HeeJo ; et al.	2013-03-07
Integrated circuit packaging system with stacking interconnect and method of manufacture thereof Grant 8,390,108 - Cho , et al. March 5, 2	2013-03-05
Integrated circuit packaging system with package stacking and method of manufacture thereof Grant 8,389,329 - Cho , et al. March 5, 2	2013-03-05
Integrated Circuit Packaging System With Redistribution Layer And Method Of Manufacture Thereof App 20130049208 - Cho; NamJu ; et al.	2013-02-28
Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die Grant 8,384,227 - Cho , et al. February 26, 2	2013-02-26
Semiconductor Device and Method of Forming Vertical Interconnect in FO-WLCSP Using Leadframe Disposed Between Semiconductor Die App 20130026654 - Shin; HanGil ; et al.	2013-01-31
Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die Grant 8,357,564 - Chi , et al. January 22, 2	2013-01-22
Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe Grant 8,349,658 - Chi , et al. January 8, 2	2013-01-08
Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure Grant 8,350,368 - Chi , et al. January 8, 2	2013-01-08
Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die App 20130001762 - Chi; HeeJo ; et al.	2013-01-03
Integrated Circuit Packaging System With Package Stacking And Method Of Manufacture Thereof App 20120326324 - Lee; HyungMin ; et al.	2012-12-27
Integrated Circuit Packaging System With Intra Substrate Die And Method Of Manufacture Thereof App 20120319263 - Cho; NamJu ; et al.	2012-12-20
Integrated Circuit Packaging System With Pads And Method Of Manufacture Thereof App 20120319295 - Chi; HeeJo ; et al.	2012-12-20
Integrated Circuit Packaging System With Laser Hole And Method Of Manufacture Thereof App 20120319294 - Lee; HyungMin ; et al.	2012-12-20
Integrated Circuit Packaging System With Package Stacking And Method Of Manufacture Thereof App 20120306102 - Cho; NamJu ; et al.	2012-12-06
Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects Grant 8,318,539 - Cho , et al. November 27, 2	2012-11-27
Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die Grant 8,318,541 - Shin , et al. November 27, 2	2012-11-27
Semiconductor Device and Method of Forming 3D Semiconductor Package with Semiconductor Die Stacked Over Semiconductor Wafer App 20120292745 - Park; YeongIm ; et al.	2012-11-22
Integrated circuit packaging system with shield and method of manufacture thereof Grant 8,314,486 - Chi , et al. November 20, 2	2012-11-20
Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die Grant 8,288,209 - Chi , et al. October 16, 2	2012-10-16
Integrated Circuit Packaging System With An Interposer Substrate And Method Of Manufacture Thereof App 20120241925 - Yoon; In Sang ; et al.	2012-09-27
Integrated Circuit Packaging System Using B-stage Polymer And Method Of Manufacture Thereof App 20120228768 - Pagaila; Reza Argenty ; et al.	2012-09-13
Integrated circuit packaging system with encapsulated via and method of manufacture thereof Grant 8,264,091 - Cho , et al. September 11, 2	2012-09-11
Semiconductor Device and Method of Forming Open Cavity in TSV Interposer to Contain Semiconductor Die in WLCSMP App 20120168916 - Chi; HeeJo ; et al.	2012-07-05
Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint App 20120153505 - Chi; HeeJo ; et al.	2012-06-21
Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint App 20120153467 - Chi; HeeJo ; et al.	2012-06-21
Integrated circuit system with recessed through silicon via pads and method of manufacture thereof Grant 8,202,797 - Chi , et al. June 19, 2	2012-06-19
Integrated Circuit Packaging System With Flexible Substrate And Method Of Manufacture Thereof App 20120119393 - Chi; HeeJo ; et al.	2012-05-17
Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die App 20120119388 - Cho; NamJu ; et al.	2012-05-17
Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP Grant 8,143,097 - Chi , et al. March 27, 2	2012-03-27
Integrated Circuit Packaging System With Post And Method Of Manufacture Thereof App 20120068332 - Park; DongSam ; et al.	2012-03-22
Method of forming thin profile WLCSP with vertical interconnect over package footprint Grant 8,138,014 - Chi , et al. March 20, 2	2012-03-20
Semiconductor Device and Method of Forming Vertical Interconnect in FO-WLCSP Using Leadframe Disposed Between Semiconductor Die App 20120038034 - Shin; HanGil ; et al.	2012-02-16
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20120025398 - Jang; Ki Youn ; et al.	2012-02-02
Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof Grant 8,106,498 - Shin , et al. January 31, 2	2012-01-31
Integrated Circuit System With Recessed Through Silicon Via Pads And Method Of Manufacture Thereof App 20110309492 - Chi; HeeJo ; et al.	2011-12-22
Integrated Circuit Package System With Package Stacking And Method Of Manufacture Thereof App 20110298119 - Cho; NamJu ; et al.	2011-12-08
Semiconductor Device and Method of Forming Shielding Layer After Encapsulation and Grounded Through Interconnect Structure App 20110298105 - Chi; HeeJo ; et al.	2011-12-08
Integrated Circuit Package System With Embedded Die Superstructure And Method Of Manufacture Thereof App 20110291283 - Chi; HeeJo ; et al.	2011-12-01
Semiconductor Device and Method of Forming Conductive Posts and Heat Sink Over Semiconductor Die Using Leadframe App 20110291249 - Chi; HeeJo ; et al.	2011-12-01
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP App 20110285007 - Chi; HeeJo ; et al.	2011-11-24
Integrated Circuit Packaging System With Dual Side Connection And Method Of Manufacture Thereof App 20110285009 - Chi; HeeJo ; et al.	2011-11-24
Semiconductor Device and Method of Forming Prefabricated Multi-Die Leadframe for Electrical Interconnect of Stacked Semiconductor Die App 20110278707 - Chi; HeeJo ; et al.	2011-11-17
Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof Grant 8,039,316 - Chi , et al. October 18, 2	2011-10-18
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,035,235 - Jang , et al. October 11, 2	2011-10-11
Method Of Manufacture Of Integrated Circuit Packaging System With Multi-tier Conductive Interconnects App 20110223721 - Cho; NamJu ; et al.	2011-09-15
Carrier System With Multi-tier Conductive Posts And Method Of Manufacture Thereof App 20110220395 - Cho; NamJu ; et al.	2011-09-15
Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure Grant 8,018,034 - Chi , et al. September 13, 2	2011-09-13
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof App 20110215450 - Chi; HeeJo ; et al.	2011-09-08
Integrated Circuit Package System With Package Stacking And Method Of Manufacture Thereof App 20110215448 - Cho; NamJu ; et al.	2011-09-08
Integrated Circuit Packaging System With Shield And Method Of Manufacture Thereof App 20110204494 - Chi; HeeJo ; et al.	2011-08-25
Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint App 20110186977 - Chi; HeeJo ; et al.	2011-08-04
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 7,968,995 - Ko , et al. June 28, 2	2011-06-28
Integrated Circuit Packaging System With Stacking Interconnect And Method Of Manufacture Thereof App 20110140259 - Cho; NamJu ; et al.	2011-06-16
Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof Grant 7,928,552 - Cho , et al. April 19, 2	2011-04-19
Integrated Circuit Packaging System With Encapsulated Via And Method Of Manufacture Thereof App 20110068453 - Cho; NamJu ; et al.	2011-03-24
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die App 20110068459 - Pagaila; Reza A. ; et al.	2011-03-24
Semiconductor Device and Method of Forming Open Cavity in TSV Interposer to Contain Semiconductor Die in WLCSMP App 20110068444 - Chi; HeeJo ; et al.	2011-03-24
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20110068464 - Chi; HeeJo ; et al.	2011-03-24
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20110062574 - Jang; Ki Youn ; et al.	2011-03-17
Semiconductor Device and Method of Forming Pre-Molded Semiconductor Die Having Bumps Embedded in Encapsulant App 20110049695 - Shin; HanGil ; et al.	2011-03-03
Integrated Circuit Packaging System With Through Silicon Via Base And Method Of Manufacture Thereof App 20110024887 - Chi; HeeJo ; et al.	2011-02-03
Integrated circuit packaging system with a tiered substrate package and method of manufacture thereof Grant 7,863,735 - Cho , et al. January 4, 2	2011-01-04
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20100314736 - Ko; Chan Hoon ; et al.	2010-12-16
Integrated Circuit Packaging System With A Stack Package And Method Of Manufacture Thereof App 20100314738 - Chi; HeeJo ; et al.	2010-12-16
Semiconductor Device and Method of Forming Shielding Layer After Encapsulation and Grounded Through Interconnect Structure App 20100276792 - Chi; HeeJo ; et al.	2010-11-04
Integrated Circuit Packaging System With Stacked Integrated Circuit And Method Of Manufacture Thereof App 20100258928 - Chi; HeeJo ; et al.	2010-10-14
Integrated Circuit Packaging System With An Integral-interposer-structure And Method Of Manufacture Thereof App 20100244222 - Chi; HeeJo ; et al.	2010-09-30
Integrated Circuit Packaging System With An Integral-interposer-structure And Method Of Manufacture Thereof App 20100244223 - Cho; NamJu ; et al.	2010-09-30
Integrated Circuit Packaging System With An Interposer And Method Of Manufacture Thereof App 20100237483 - Chi; HeeJo ; et al.	2010-09-23
Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site App 20100237500 - Kwon; ChoongHwan ; et al.	2010-09-23
Integrated Circuit Packaging System With Dual Sided Connection And Method Of Manufacture Thereof App 20100237481 - Chi; HeeJo ; et al.	2010-09-23
Integrated Circuit Packaging System With A Dual Board-on-chip Structure And Method Of Manufacture Thereof App 20100224975 - Shin; HanGil ; et al.	2010-09-09
Integrated Circuit Package System With Cavity Substrate App 20080315406 - Chung; Jae Han ; et al.	2008-12-25