| Patent | Date |
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Multi-touch remote control method
Grant 9,880,733 - Wang , et al. January 30, 2 | 2018-01-30 |
Multi-touch Remote Control Method
App 20160239201 - WANG; Yu Albert ; et al. | 2016-08-18 |
Equipment And Method Of Manufacturing For Liquid Processing In A Controlled Atmospheric Ambient
App 20140087073 - Ivanov; Igor Constantin ; et al. | 2014-03-27 |
Device fabrication
Grant 8,569,160 - Rinerson , et al. October 29, 2 | 2013-10-29 |
Device Fabrication
App 20130059436 - Rinerson; Darrell ; et al. | 2013-03-07 |
Immersion platinum plating solution
Grant 8,361,560 - Cheung , et al. January 29, 2 | 2013-01-29 |
Immersion Platinum Plating Solution
App 20120315503 - Cheung; Robin ; et al. | 2012-12-13 |
Immersion platinum plating solution
Grant 8,317,910 - Cheung , et al. November 27, 2 | 2012-11-27 |
Continuous Plane Of Thin-film Materials For A Two-terminal Cross-point Memory
App 20120292585 - Cheung; Robin ; et al. | 2012-11-22 |
Device fabrication
Grant 8,314,024 - Rinerson , et al. November 20, 2 | 2012-11-20 |
Memory device using ion implant isolated conductive metal oxide
Grant 8,268,667 - Rinerson , et al. September 18, 2 | 2012-09-18 |
Continuous plane of thin-film materials for a two-terminal cross-point memory
Grant 8,237,142 - Cheung , et al. August 7, 2 | 2012-08-07 |
Vertically Fabricated BEOL Non-Volatile Two-Terminal Cross-Trench Memory Array with Two-Terminal Memory Elements and Method of Fabricating the Same
App 20120012897 - BESSER; PAUL ; et al. | 2012-01-19 |
Memory Device Using A Dual Layer Conductive Metal Oxide Structure
App 20110315943 - RINERSON; DARRELL ; et al. | 2011-12-29 |
Memory Device Using Ion Implant Isolated Conductive Metal Oxide
App 20110315948 - RINERSON; DARRELL ; et al. | 2011-12-29 |
Immersion platinum plating solution
App 20110229734 - Cheung; Robin ; et al. | 2011-09-22 |
Memory cell formation using ion implant isolated conductive metal oxide
Grant 8,003,511 - Rinerson , et al. August 23, 2 | 2011-08-23 |
Continuous plane of thin-film materials for a two-terminal cross-point memory
App 20110155990 - Cheung; Robin ; et al. | 2011-06-30 |
Continuous plane of thin-film materials for a two-terminal cross-point memory
App 20110133147 - Cheung; Robin ; et al. | 2011-06-09 |
Continuous plane of thin-film materials for a two-terminal cross-point memory
Grant 7,897,951 - Rinerson , et al. March 1, 2 | 2011-03-01 |
Continuous plane of thin-film materials for a two-terminal cross-point memory
Grant 7,888,711 - Cheung , et al. February 15, 2 | 2011-02-15 |
Continuous plane of thin-film materials for a two-terminal cross-point memory
App 20100265762 - Cheung; Robin ; et al. | 2010-10-21 |
Device fabrication
App 20100159688 - Rinerson; Darrell ; et al. | 2010-06-24 |
Memory cell formation using ion implant isolated conductive metal oxide
App 20100159641 - Rinerson; Darrell ; et al. | 2010-06-24 |
Continuous plane of thin-film materials for a two-terminal cross-point memory
Grant 7,742,323 - Rinerson , et al. June 22, 2 | 2010-06-22 |
Method For Fabricating Low K Dielectric Dual Damascene Structures
App 20090156012 - HSIEH; CHANG-LIN ; et al. | 2009-06-18 |
Self-aware Semiconductor Equipment
App 20090112520 - LYMBEROPOULOS; DIMITRIS ; et al. | 2009-04-30 |
Electro-chemical deposition system
Grant 7,497,932 - Dordi , et al. March 3, 2 | 2009-03-03 |
Continuous plane of thin-film materials for a two-terminal cross-point memory
App 20090026442 - Cheung; Robin ; et al. | 2009-01-29 |
Continuous plane of thin-film materials for a two-terminal cross-point memory
App 20090026441 - Cheung; Robin ; et al. | 2009-01-29 |
Methods for post-etch deposition of a dielectric film
Grant 7,393,795 - Cheung , et al. July 1, 2 | 2008-07-01 |
Protective layer for a low k dielectric film and methods of forming the same
App 20070254491 - Cheung; Robin | 2007-11-01 |
Methods for post-etch deposition of a dielectric film
App 20070175858 - Cheung; Robin ; et al. | 2007-08-02 |
Method And Apparatus For Annealing Copper Films
App 20070128869 - Chen; B. Michelle ; et al. | 2007-06-07 |
Method and apparatus for annealing copper films
Grant 7,192,494 - Chen , et al. March 20, 2 | 2007-03-20 |
Electro-chemical deposition system
App 20060246690 - Dordi; Yezdi ; et al. | 2006-11-02 |
Method And Apparatus For Providing Intra-tool Monitoring And Control
App 20060235563 - Parikh; Suketu ; et al. | 2006-10-19 |
Method and apparatus for providing intra-tool monitoring and control
Grant 7,074,626 - Parikh , et al. July 11, 2 | 2006-07-11 |
Method and apparatus for heating and cooling substrates
Grant 6,929,774 - Morad , et al. August 16, 2 | 2005-08-16 |
Method of conditioning electrochemical baths in plating technology
Grant 6,893,548 - Cheung , et al. May 17, 2 | 2005-05-17 |
Method and apparatus for providing intra-tool monitoring and control
Grant 6,842,659 - Parikh , et al. January 11, 2 | 2005-01-11 |
Electroless deposition method over sub-micron apertures
Grant 6,824,666 - Gandikota , et al. November 30, 2 | 2004-11-30 |
Method and apparatus for treating a substrate
Grant 6,818,066 - Cheung November 16, 2 | 2004-11-16 |
Method and apparatus for improved electroplating fill of an aperture
Grant 6,797,620 - Lewis , et al. September 28, 2 | 2004-09-28 |
Method and apparatus for providing intra-tool monitoring and control
App 20040173464 - Parikh, Suketu ; et al. | 2004-09-09 |
Method and apparatus for heating and cooling substrates
App 20040154185 - Morad, Ratson ; et al. | 2004-08-12 |
Post metal barrier/adhesion film
Grant 6,753,248 - Wood , et al. June 22, 2 | 2004-06-22 |
Method of forming copper interconnects
Grant 6,740,221 - Cheung , et al. May 25, 2 | 2004-05-25 |
Electro-chemical deposition system
App 20040084301 - Dordi, Yezdi ; et al. | 2004-05-06 |
Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
App 20040079633 - Cheung, Robin ; et al. | 2004-04-29 |
Method and apparatus for annealing copper films
App 20040003873 - Chen, B. Michelle ; et al. | 2004-01-08 |
Method for heating and cooling substrates
Grant 6,658,763 - Morad , et al. December 9, 2 | 2003-12-09 |
Method of treating a substrate
Grant 6,645,550 - Cheung , et al. November 11, 2 | 2003-11-11 |
Electro-chemical deposition system
Grant 6,635,157 - Dordi , et al. October 21, 2 | 2003-10-21 |
Method and apparatus for improved electroplating fill of an aperture
App 20030194850 - Lewis, John S. ; et al. | 2003-10-16 |
Copper interconnect with sidewall copper-copper contact between metal and via
App 20030194872 - Parikh, Suketu A. ; et al. | 2003-10-16 |
Method for forming copper interconnects
App 20030146102 - Ramanathan, Sivakami ; et al. | 2003-08-07 |
Method of depositing a catalytic layer
App 20030143837 - Gandikota, Srinivas ; et al. | 2003-07-31 |
Electroless deposition method over sub-micron apertures
App 20030140988 - Gandikota, Srinivas ; et al. | 2003-07-31 |
Method and apparatus for heating and colling substrates
App 20030131495 - Morad, Ratson ; et al. | 2003-07-17 |
Integrated solder bump deposition apparatus and method
Grant 6,572,010 - Dordi , et al. June 3, 2 | 2003-06-03 |
Method and apparatus for providing intra-tool monitoring and control
App 20030040830 - Parikh, Suketu ; et al. | 2003-02-27 |
Method for achieving copper fill of high aspect ratio interconnect features
App 20030000844 - Carl, Daniel A. ; et al. | 2003-01-02 |
Integrated solder bump deposition apparatus and method
App 20020185523 - Dordi, Yezdi N. ; et al. | 2002-12-12 |
Method of forming copper interconnects
App 20020130046 - Cheung, Robin ; et al. | 2002-09-19 |
Method and apparatus for heating and cooling substrates
App 20020116836 - Morad, Ratson ; et al. | 2002-08-29 |
Method for achieving copper fill of high aspect ratio interconnect features
Grant 6,436,267 - Carl , et al. August 20, 2 | 2002-08-20 |
Method and apparatus for conditioning electrochemical baths in plating technology
App 20020033340 - Cheung, Robin ; et al. | 2002-03-21 |
Electro-chemical deposition system
App 20020029961 - Dordi, Yezdi ; et al. | 2002-03-14 |
Method and apparatus for heating and cooling substrates
App 20020007567 - Morad, Raston ; et al. | 2002-01-24 |
Method and apparatus for treating a substrate
App 20010055934 - Cheung, Robin | 2001-12-27 |
Method and apparatus for heating and cooling substrates
Grant 6,276,072 - Morad , et al. August 21, 2 | 2001-08-21 |
In-situ electroless copper seed layer enhancement in an electroplating system
Grant 6,258,223 - Cheung , et al. July 10, 2 | 2001-07-10 |
Electro-chemical deposition system
Grant 6,258,220 - Dordi , et al. July 10, 2 | 2001-07-10 |
Method for filling a dual damascene opening having high aspect ratio to minimize electromigration failure
Grant 6,245,670 - Cheung , et al. June 12, 2 | 2001-06-12 |
Apparatus for electro-chemical deposition with thermal anneal chamber
Grant 6,136,163 - Cheung , et al. October 24, 2 | 2000-10-24 |
Fabrication of a via plug having high aspect ratio with a diffusion barrier layer effectively surrounding the via plug
Grant 6,083,842 - Cheung , et al. July 4, 2 | 2000-07-04 |
Selective nonconformal deposition for forming low dielectric insulation between certain conductive lines
Grant 6,048,802 - Avanzino , et al. April 11, 2 | 2000-04-11 |
Scaled interconnect anodization for high frequency applications
Grant 6,033,982 - Lopatin , et al. March 7, 2 | 2000-03-07 |
Bias plasma deposition for selective low dielectric insulation
Grant 5,990,557 - Avanzino , et al. November 23, 1 | 1999-11-23 |
Method of electroplating a copper or copper alloy interconnect
Grant 5,968,333 - Nogami , et al. October 19, 1 | 1999-10-19 |
Uniform nonconformal deposition for forming low dielectric constant insulation between certain conductive lines
Grant 5,837,618 - Avanzino , et al. November 17, 1 | 1998-11-17 |
Bias plasma deposition for selective low dielectric insulation
Grant 5,776,834 - Avanzino , et al. July 7, 1 | 1998-07-07 |
Copper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor device
Grant 5,770,519 - Klein , et al. June 23, 1 | 1998-06-23 |
Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device
Grant 5,646,448 - Klein , et al. July 8, 1 | 1997-07-08 |
Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device
Grant 5,639,691 - Klein , et al. June 17, 1 | 1997-06-17 |
Simplified dual damascene process for multi-level metallization and interconnection structure
Grant 5,635,423 - Huang , et al. June 3, 1 | 1997-06-03 |
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