| Patent | Date |
|---|
Semiconductor Packages Having Conductive Pillars With Inclined Surfaces
App 20220310543 - Chu; Chiang-Jui ; et al. | 2022-09-29 |
Semiconductor Device And Methods Of Forming The Same
App 20220310492 - Lin; Yung-Sheng ; et al. | 2022-09-29 |
Bump structure and method of manufacturing bump structure
Grant 11,456,266 - Chang , et al. September 27, 2 | 2022-09-27 |
Fan-Out Interconnect Structure and Methods Forming the Same
App 20220301919 - HU; Yu-Hsiang ; et al. | 2022-09-22 |
Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
App 20220302079 - Huang; Kuei-Wei ; et al. | 2022-09-22 |
Package component with stepped passivation layer
Grant 11,450,567 - Cheng , et al. September 20, 2 | 2022-09-20 |
Organic Interposer Including A Dual-layer Inductor Structure And Methods Of Forming The Same
App 20220285295 - CHIANG; Wei-Han ; et al. | 2022-09-08 |
Micro-electro Mechanical System And Manufacturing Method Thereof
App 20220274827 - YANG; Ting-Li ; et al. | 2022-09-01 |
Package Structures and Methods for Forming the Same
App 20220278031 - Hsiao; Ching-Wen ; et al. | 2022-09-01 |
Apparatus And Method For Forming A Package Structure
App 20220278071 - ZHAN; Kai Jun ; et al. | 2022-09-01 |
Warpage control in the packaging of integrated circuits
Grant 11,432,372 - Cheng , et al. August 30, 2 | 2022-08-30 |
Arched Membrane Structure for MEMS Device
App 20220259037 - Wang; Jhao-Yi ; et al. | 2022-08-18 |
Packages with Multiple Encapsulated Substrate Blocks
App 20220262694 - Chen; Chen-Shien ; et al. | 2022-08-18 |
Bump structure and method of making the same
Grant 11,417,539 - Lu , et al. August 16, 2 | 2022-08-16 |
Method Of Manufacturing Semiconductor Structure
App 20220246435 - HU; YU-HSIANG ; et al. | 2022-08-04 |
Bump Integration with Redistribution Layer
App 20220246565 - Yang; Ting-Li ; et al. | 2022-08-04 |
Chip package with fan-out structure
Grant 11,404,381 - Chen , et al. August 2, 2 | 2022-08-02 |
Semiconductor Device Package And Methods Of Manufacture
App 20220238480 - Zhan; Kai Jun ; et al. | 2022-07-28 |
Heterogeneous Bonding Structure and Method Forming Same
App 20220238353 - Lii; Mirng-Ji ; et al. | 2022-07-28 |
Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same
Grant 11,398,444 - Chu , et al. July 26, 2 | 2022-07-26 |
Wafer level transfer molding and apparatus for performing the same
Grant 11,390,000 - Jang , et al. July 19, 2 | 2022-07-19 |
Semiconductor Device and Method
App 20220223550 - Chen; Chen-Shien ; et al. | 2022-07-14 |
Semiconductor Device and Method
App 20220223548 - Yang; Ting-Li ; et al. | 2022-07-14 |
Redistribution lines with protection layers and method forming same
Grant 11,387,143 - Cheng , et al. July 12, 2 | 2022-07-12 |
Method of packaging a semiconductor die
Grant 11,387,171 - Huang , et al. July 12, 2 | 2022-07-12 |
Semiconductor Device and Method
App 20220216133 - Liu; Hsu-Lun ; et al. | 2022-07-07 |
System for processing semiconductor devices
Grant 11,355,471 - Huang , et al. June 7, 2 | 2022-06-07 |
Fan-out interconnect structure and methods forming the same
Grant 11,355,378 - Hu , et al. June 7, 2 | 2022-06-07 |
Organic interposer including a dual-layer inductor structure and methods of forming the same
Grant 11,348,884 - Chiang , et al. May 31, 2 | 2022-05-31 |
Package Structure
App 20220165689 - TAI; Chih-Hsuan ; et al. | 2022-05-26 |
Package structures and methods for forming the same
Grant 11,342,253 - Hsiao , et al. May 24, 2 | 2022-05-24 |
Organic Interposer Including A Dual-layer Inductor Structure And Methods Of Forming The Same
App 20220157744 - CHIANG; Wei-Han ; et al. | 2022-05-19 |
Method for manufacturing semiconductor package for warpage control
Grant 11,329,008 - Chen , et al. May 10, 2 | 2022-05-10 |
Semiconductor Device And Manufacturing Method Thereof
App 20220140197 - Yen; Chen-En ; et al. | 2022-05-05 |
Method of manufacturing semiconductor structure
Grant 11,322,360 - Hu , et al. May 3, 2 | 2022-05-03 |
Semiconductor Device and Method
App 20220102269 - Yang; Ting-Li ; et al. | 2022-03-31 |
Semiconductor device and method
Grant 11,289,404 - Liu , et al. March 29, 2 | 2022-03-29 |
Semiconductor device package including embedded conductive elements
Grant 11,282,817 - Chen , et al. March 22, 2 | 2022-03-22 |
Package on package structure and method for forming the same
Grant 11,264,342 - Yu , et al. March 1, 2 | 2022-03-01 |
Package structure
Grant 11,251,141 - Tai , et al. February 15, 2 | 2022-02-15 |
Package-on-package structure
Grant 11,239,103 - Lin , et al. February 1, 2 | 2022-02-01 |
Semiconductor Device With Conductive Pad
App 20210384152 - YEN; Chen-En ; et al. | 2021-12-09 |
Redistribution Lines Having Nano Columns and Method Forming Same
App 20210375815 - Tsai; Po-Hao ; et al. | 2021-12-02 |
Redistribution Lines With Protection Layers and Method Forming Same
App 20210375674 - Cheng; Ming-Da ; et al. | 2021-12-02 |
Capacitor Between Two Passivation Layers With Different Etching Rates
App 20210375748 - HUANG; Chia-Ming ; et al. | 2021-12-02 |
Redistribution Lines Having Nano Columns and Method Forming Same
App 20210375672 - Cheng; Ming-Da ; et al. | 2021-12-02 |
Package Component with Stepped Passivation Layer
App 20210375675 - Cheng; Ming-Da ; et al. | 2021-12-02 |
Wafer etching process and methods thereof
Grant 11,177,137 - Lu , et al. November 16, 2 | 2021-11-16 |
Semiconductor Device and Method of Forming Same
App 20210351139 - Tseng; Chih-Hsiang ; et al. | 2021-11-11 |
Semiconductor device structure with protected bump and method of forming the same
Grant 11,171,100 - Huang , et al. November 9, 2 | 2021-11-09 |
Semiconductor packaging structure and method
Grant 11,158,605 - Lin , et al. October 26, 2 | 2021-10-26 |
Package Structure With Warpage-control Element
App 20210327840 - PEI; Hao-Jan ; et al. | 2021-10-21 |
Molded underfilling for package on package devices
Grant 11,139,281 - Yu , et al. October 5, 2 | 2021-10-05 |
Package-on-package structure having polymer-based material for warpage control
Grant 11,133,285 - Chen , et al. September 28, 2 | 2021-09-28 |
Semiconductor Package And Method Of Making
App 20210287966 - HUANG; Hui-Min ; et al. | 2021-09-16 |
Metal Bumps and Method Forming Same
App 20210288009 - Cheng; Ming-Da ; et al. | 2021-09-16 |
Substrate and Package Structure
App 20210288012 - Lin; Wei-Hung ; et al. | 2021-09-16 |
Method for manufacturing interconnect structure
Grant 11,121,104 - Chen , et al. September 14, 2 | 2021-09-14 |
Formation Method Of Chip Package With Fan-out Structure
App 20210280520 - CHEN; Shing-Chao ; et al. | 2021-09-09 |
Bump Structure And Method Of Making The Same
App 20210272819 - LU; Wen-Hsiung ; et al. | 2021-09-02 |
Multi-Layer Structures and Methods of Forming
App 20210265165 - Hsueh; Chang-Jung ; et al. | 2021-08-26 |
Package-on-package structures and methods for forming the same
Grant 11,101,261 - Huang , et al. August 24, 2 | 2021-08-24 |
Semiconductor device and method for forming the same
Grant 11,101,233 - Yen , et al. August 24, 2 | 2021-08-24 |
Semiconductor structure and method for forming the same
Grant 11,094,655 - Lu , et al. August 17, 2 | 2021-08-17 |
Semiconductor Package System and Method
App 20210242150 - Huang; Hui-Min ; et al. | 2021-08-05 |
Method of Forming Semiconductor Packages Having Through Package Vias
App 20210233854 - Yu; Chen-Hua ; et al. | 2021-07-29 |
Semiconductor device and method of forming same
Grant 11,075,173 - Tseng , et al. July 27, 2 | 2021-07-27 |
Wafer Etching Process And Methods Thereof
App 20210225658 - Lu; Wen-Hsiung ; et al. | 2021-07-22 |
Semiconductor Device and Method
App 20210225735 - Liu; Hsu-Lun ; et al. | 2021-07-22 |
Semiconductor Package Structure
App 20210217728 - HUNG; JENG-NAN ; et al. | 2021-07-15 |
Semiconductor package, semiconductor device and method of forming the same
Grant 11,056,474 - Yu , et al. July 6, 2 | 2021-07-06 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20210202335 - Yu; Chen-Hua ; et al. | 2021-07-01 |
Formation method of package structure with warpage-control element
Grant 11,049,832 - Pei , et al. June 29, 2 | 2021-06-29 |
Interconnect structures and methods of forming same
Grant 11,043,463 - Lu , et al. June 22, 2 | 2021-06-22 |
Metal bumps and method forming same
Grant 11,024,593 - Cheng , et al. June 1, 2 | 2021-06-01 |
Substrate and package structure
Grant 11,024,594 - Lin , et al. June 1, 2 | 2021-06-01 |
Semiconductor Device Structure With Protected Bump And Method Of Forming The Same
App 20210159197 - HUANG; Hui-Min ; et al. | 2021-05-27 |
Process for Tuning Via Profile in Dielectric Material
App 20210151550 - Tzeng; Chun Kai ; et al. | 2021-05-20 |
Multi-layer structures and methods of forming
Grant 11,004,685 - Hsueh , et al. May 11, 2 | 2021-05-11 |
Bump Structure And Method Of Manufacturing Bump Structure
App 20210134746 - CHANG; Ching-Yu ; et al. | 2021-05-06 |
Package Structure With Cavity Substrate And Method For Forming The Same
App 20210125961 - TSAI; Po-Hao ; et al. | 2021-04-29 |
Semiconductor package system and method
Grant 10,985,122 - Huang , et al. April 20, 2 | 2021-04-20 |
Semiconductor package structure
Grant 10,971,475 - Hung , et al. April 6, 2 | 2021-04-06 |
Package Structure And Method For Manufacturing The Same
App 20210098384 - TSAI; Yi-Da ; et al. | 2021-04-01 |
Die bonder and methods of using the same
Grant 10,964,663 - Yu , et al. March 30, 2 | 2021-03-30 |
Method of forming semiconductor packages having through package vias
Grant 10,964,641 - Yu , et al. March 30, 2 | 2021-03-30 |
3D Package Structure and Methods of Forming Same
App 20210091047 - Chen; Meng-Tse ; et al. | 2021-03-25 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,950,514 - Yu , et al. March 16, 2 | 2021-03-16 |
Die bonder and methods of using the same
Grant 10,950,572 - Yu , et al. March 16, 2 | 2021-03-16 |
Electrical Devices, Semiconductor Packages And Methods Of Forming The Same
App 20210066226 - Chu; Chiang-Jui ; et al. | 2021-03-04 |
Process for tuning via profile in dielectric material
Grant 10,910,466 - Tzeng , et al. February 2, 2 | 2021-02-02 |
Packaging Devices and Methods of Manufacture Thereof
App 20210028124 - Chen; Hsien-Wei ; et al. | 2021-01-28 |
Advanced INFO POP and Method of Forming Thereof
App 20210020611 - Tsai; Yi-Da ; et al. | 2021-01-21 |
Method For Manufacturing Semiconductor Package
App 20210013158 - CHEN; CHEN-SHIEN ; et al. | 2021-01-14 |
Stud bump structure for semiconductor package assemblies
Grant 10,879,203 - Chen , et al. December 29, 2 | 2020-12-29 |
Semiconductor Structure And Method For Forming The Same
App 20200395323 - LU; Wen-Hsiung ; et al. | 2020-12-17 |
Device package including molding compound having non-planar top surface around a die and method of forming same
Grant 10,867,960 - Yu , et al. December 15, 2 | 2020-12-15 |
Method for manufacturing package structure
Grant 10,867,932 - Tsai , et al. December 15, 2 | 2020-12-15 |
Semiconductor packages having dummy connectors and methods of forming same
Grant 10,867,976 - Chen , et al. December 15, 2 | 2020-12-15 |
3D package structure and methods of forming same
Grant 10,861,827 - Chen , et al. December 8, 2 | 2020-12-08 |
Chip package with fan-out structure
Grant 10,840,111 - Chen , et al. November 17, 2 | 2020-11-17 |
Methods of forming connector pad structures, interconnect structures, and structures thereof
Grant 10,840,199 - Chang , et al. November 17, 2 | 2020-11-17 |
Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates
Grant 10,832,999 - Huang , et al. November 10, 2 | 2020-11-10 |
Package-on-Package Structure
App 20200350197 - Lin; Chih-Wei ; et al. | 2020-11-05 |
Interconnect Structures and Methods of Forming Same
App 20200343209 - Lu; Wen-Hsiung ; et al. | 2020-10-29 |
Packaging devices and methods of manufacture thereof
Grant 10,811,369 - Chen , et al. October 20, 2 | 2020-10-20 |
Advanced INFO POP and method of forming thereof
Grant 10,797,025 - Tsai , et al. October 6, 2 | 2020-10-06 |
Semiconductor package and rework process for the same
Grant 10,797,038 - Yu , et al. October 6, 2 | 2020-10-06 |
Semiconductor package and method for manufacturing the same
Grant 10,797,005 - Chen , et al. October 6, 2 | 2020-10-06 |
Method Of Manufacturing Semiconductor Structure
App 20200303200 - HU; YU-HSIANG ; et al. | 2020-09-24 |
Method of processing solder bump by vacuum annealing
Grant 10,784,221 - Lin , et al. Sept | 2020-09-22 |
Package Structure
App 20200294944 - TAI; Chih-Hsuan ; et al. | 2020-09-17 |
Formation Method Of Package Structure With Warpage-control Element
App 20200279823 - PEI; Hao-Jan ; et al. | 2020-09-03 |
Semiconductor processing boat design with pressure sensor
Grant 10,734,263 - Ang , et al. | 2020-08-04 |
Package-on-Package Structure
App 20200243370 - Lin; Chih-Wei ; et al. | 2020-07-30 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20200227331 - Yu; Chen-Hua ; et al. | 2020-07-16 |
Interconnect structures and methods of forming same
Grant 10,714,442 - Lu , et al. | 2020-07-14 |
Method of manufacturing wafer level chip scale package
Grant 10,707,084 - Hu , et al. | 2020-07-07 |
Fan-out Interconnect Structure And Methods Forming The Same
App 20200211887 - Hu; Yu-Hsiang ; et al. | 2020-07-02 |
Packaging device and method of making the same
Grant 10,700,033 - Huang , et al. | 2020-06-30 |
Multi-layer Structures And Methods Of Forming
App 20200176254 - Hsueh; Chang-Jung ; et al. | 2020-06-04 |
Package structure and method of forming package structure
Grant 10,672,729 - Tai , et al. | 2020-06-02 |
Semiconductor Device Package Including Embedded Conductive Elements
App 20200168583 - CHEN; Yu-Feng ; et al. | 2020-05-28 |
Package assembly
Grant 10,665,565 - Lin , et al. | 2020-05-26 |
Package structure with warpage-control element
Grant 10,658,323 - Pei , et al. | 2020-05-19 |
Package On Package Structure And Method For Forming The Same
App 20200152587 - Yu; Chen-Hua ; et al. | 2020-05-14 |
Method For Manufacturing Package Structure
App 20200152576 - TSAI; Yi-Da ; et al. | 2020-05-14 |
Packaging Methods for Semiconductor Devices
App 20200144171 - Huang; Kuei-Wei ; et al. | 2020-05-07 |
Semiconductor Package System and Method
App 20200144206 - Huang; Hui-Min ; et al. | 2020-05-07 |
Semiconductor Device And Method Of Forming Same
App 20200135664 - Tseng; Chih-Hsiang ; et al. | 2020-04-30 |
Chip Package With Fan-out Structure
App 20200135652 - CHEN; Shing-Chao ; et al. | 2020-04-30 |
Process for Tuning Via Profile in Dielectric Material
App 20200127078 - Tzeng; Chun Kai ; et al. | 2020-04-23 |
Packaging Devices and Methods of Manufacture Thereof
App 20200126931 - Chen; Hsien-Wei ; et al. | 2020-04-23 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,629,508 - Yu , et al. | 2020-04-21 |
Wafer Level Transfer Molding and Apparatus for Performing the Same
App 20200114556 - Jang; Bor-Ping ; et al. | 2020-04-16 |
Semiconductor Packages Having Dummy Connectors and Methods of Forming Same
App 20200118984 - Chen; Chen-Shien ; et al. | 2020-04-16 |
Package on-package structure
Grant 10,622,240 - Lin , et al. | 2020-04-14 |
Methods Of Forming Connector Pad Structures, Interconnect Structures, And Structures Thereof
App 20200105693 - Chang; Chia-Lun ; et al. | 2020-04-02 |
Metal Bumps and Method Forming Same
App 20200105696 - Cheng; Ming-Da ; et al. | 2020-04-02 |
Bump-on-trace packaging structure and method for forming the same
Grant 10,600,709 - Chen , et al. | 2020-03-24 |
Package Structures and Methods for Forming the Same
App 20200083152 - Hsiao; Ching-Wen ; et al. | 2020-03-12 |
Fan-out interconnect structure and methods forming the same
Grant 10,586,724 - Hu , et al. | 2020-03-10 |
Die Bonder and Methods of Using the Same
App 20200066673 - Yu; Chen-Hua ; et al. | 2020-02-27 |
Die Bonder and Methods of Using the Same
App 20200066674 - Yu; Chen-Hua ; et al. | 2020-02-27 |
Device Package Including Molding Compound Having Non-Planar Top Surface Around A Die
App 20200051951 - Yu; Chen-Hua ; et al. | 2020-02-13 |
Package on package structure and method for forming the same
Grant 10,559,546 - Yu , et al. Feb | 2020-02-11 |
Warpage Control in the Packaging of Integrated Circuits
App 20200045777 - Cheng; Ming-Da ; et al. | 2020-02-06 |
Mechanisms of forming connectors for package on package
Grant 10,553,561 - Chen , et al. Fe | 2020-02-04 |
Semiconductor Processing Boat Design With Pressure Sensor
App 20200035529 - Ang; Ai-Tee ; et al. | 2020-01-30 |
Semiconductor Bonding Structures and Methods
App 20200035510 - Chen; Meng-Tse ; et al. | 2020-01-30 |
Package-on-Package Structure Including a Thermal Isolation Material and Method of Forming the Same
App 20200020677 - Chen; Meng-Tse ; et al. | 2020-01-16 |
Package structure and method for forming the same
Grant 10,535,609 - Tsai , et al. Ja | 2020-01-14 |
Warpage control in package-on-package structures
Grant 10,535,616 - Chen , et al. Ja | 2020-01-14 |
Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates
Grant 10,522,452 - Huang , et al. Dec | 2019-12-31 |
Packaging devices and methods of manufacture thereof
Grant 10,522,480 - Chen , et al. Dec | 2019-12-31 |
Wafer level transfer molding and apparatus for performing the same
Grant 10,513,070 - Jang , et al. Dec | 2019-12-24 |
Chip package with fan-out structure
Grant 10,515,900 - Chen , et al. Dec | 2019-12-24 |
Methods of forming connector pad structures, interconnect structures, and structures thereof
Grant 10,515,915 - Chang , et al. Dec | 2019-12-24 |
Warpage control in the packaging of integrated circuits
Grant 10,512,124 - Cheng , et al. Dec | 2019-12-17 |
Package structures and methods for forming the same
Grant 10,510,644 - Hsiao , et al. Dec | 2019-12-17 |
Semiconductor packages having dummy connectors and methods of forming same
Grant 10,510,734 - Chen , et al. Dec | 2019-12-17 |
Semiconductor package system and method
Grant 10,510,697 - Huang , et al. Dec | 2019-12-17 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,510,716 - Yu , et al. Dec | 2019-12-17 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 10,510,719 - Yu , et al. Dec | 2019-12-17 |
Molding structure for wafer level package
Grant 10,510,630 - Yu , et al. Dec | 2019-12-17 |
Package-on-package (PoP) structure including stud bulbs
Grant 10,510,731 - Yu , et al. Dec | 2019-12-17 |
Semiconductor Package Structure
App 20190363066 - HUNG; JENG-NAN ; et al. | 2019-11-28 |
Package on-package structure including a thermal isolation material and method of forming the same
Grant 10,490,539 - Chen , et al. Nov | 2019-11-26 |
Package-on-Package Structures and Methods for Forming the Same
App 20190355710 - Huang; Kuei-Wei ; et al. | 2019-11-21 |
Semiconductor processing boat design with pressure sensor
Grant 10,475,679 - Ang , et al. Nov | 2019-11-12 |
Die bonder and methods of using the same
Grant 10,475,764 - Yu , et al. Nov | 2019-11-12 |
Device package including molding compound having non-planar top surface around a die
Grant 10,468,377 - Yu , et al. No | 2019-11-05 |
Method of Forming Semiconductor Packages Having Through Package Vias
App 20190311988 - Yu; Chen-Hua ; et al. | 2019-10-10 |
3D Package Structure and Methods of Forming Same
App 20190273068 - Chen; Meng-Tse ; et al. | 2019-09-05 |
Molding Structure for Wafer Level Package
App 20190259678 - Yu; Chen-Hua ; et al. | 2019-08-22 |
Package Structure With Warpage-control Element
App 20190252340 - PEI; Hao-Jan ; et al. | 2019-08-15 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20190252280 - Yu; Chen-Hua ; et al. | 2019-08-15 |
Methods Of Forming Connector Pad Structures, Interconnect Structures, And Structures Thereof
App 20190244918 - Chang; Chia-Lun ; et al. | 2019-08-08 |
Interconnect Structures and Methods of Forming Same
App 20190244920 - Lu; Wen-Hsiung ; et al. | 2019-08-08 |
Semiconductor package structure and method of manufacturing the same
Grant 10,373,931 - Hung , et al. | 2019-08-06 |
Package-on-package structures and methods for forming the same
Grant 10,373,941 - Huang , et al. | 2019-08-06 |
Package-on-package Structure Having Polymer-based Material For Warpage Control
App 20190221544 - Chen; Meng-Tse ; et al. | 2019-07-18 |
Method of forming semiconductor packages having through package vias
Grant 10,325,853 - Yu , et al. | 2019-06-18 |
Package-on-package structure and method
Grant 10,325,883 - Chiu , et al. | 2019-06-18 |
Semiconductor Package And Method For Manufacturing The Same
App 20190164907 - CHEN; CHEN-SHIEN ; et al. | 2019-05-30 |
Package on-package structure with epoxy flux residue
Grant 10,297,579 - Yu , et al. | 2019-05-21 |
Molding structure for wafer level package
Grant 10,283,427 - Yu , et al. | 2019-05-07 |
Warpage Control in Package-on-Package Structures
App 20190131254 - Chen; Wei-Yu ; et al. | 2019-05-02 |
Package On Package Structure And Method For Forming The Same
App 20190131261 - Yu; Chen-Hua ; et al. | 2019-05-02 |
3D package structure and methods of forming same
Grant 10,276,541 - Chen , et al. | 2019-04-30 |
Semiconductor packages having dummy connectors and methods of forming same
Grant 10,276,548 - Chen , et al. | 2019-04-30 |
Structure and formation method of chip package with fan-out structure
Grant 10,276,536 - Pei , et al. | 2019-04-30 |
Chip Package With Fan-out Structure
App 20190122989 - CHEN; Shing-Chao ; et al. | 2019-04-25 |
Package Assembly
App 20190123016 - Lin; Hung-Jen ; et al. | 2019-04-25 |
Package-On-Package (PoP) Structure Including Stud Bulbs
App 20190123027 - Yu; Chen-Hua ; et al. | 2019-04-25 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,269,673 - Yu , et al. | 2019-04-23 |
Methods of forming connector pad structures, interconnect structures, and structures thereof
Grant 10,269,739 - Chang , et al. | 2019-04-23 |
Package-on-package structure having polymer-based material for warpage control
Grant 10,269,763 - Chen , et al. | 2019-04-23 |
Semiconductor Packages having Dummy Connectors and Methods of Forming Same
App 20190115326 - Chen; Chen-Shien ; et al. | 2019-04-18 |
Interconnect structures and methods of forming same
Grant 10,262,964 - Lu , et al. | 2019-04-16 |
Substrate and Package Structure
App 20190096839 - Lin; Wei-Hung ; et al. | 2019-03-28 |
Semiconductor Package, Semiconductor Device and Method of Forming the Same
App 20190088635 - Yu; Chen-Hua ; et al. | 2019-03-21 |
Bump-on-trace packaging structure and method for forming the same
Grant 10,192,804 - Chen , et al. Ja | 2019-01-29 |
Package assembly
Grant 10,192,848 - Lin , et al. Ja | 2019-01-29 |
Packaging Devices and Methods of Manufacture Thereof
App 20190019765 - Chen; Hsien-Wei ; et al. | 2019-01-17 |
Package on package structure and method for forming the same
Grant 10,177,104 - Yu , et al. J | 2019-01-08 |
Warpage control in package-on-package structures
Grant 10,170,434 - Chen , et al. J | 2019-01-01 |
Molding structure for wafer level package
Grant 10,163,804 - Yu , et al. Dec | 2018-12-25 |
Method for manufacturing semiconductor structure
Grant 10,163,734 - Yu , et al. Dec | 2018-12-25 |
Method for forming chip package involving cutting process
Grant 10,157,846 - Chen , et al. Dec | 2018-12-18 |
Packages with molding structures and methods of forming the same
Grant 10,157,849 - Huang , et al. Dec | 2018-12-18 |
Package-on-package (PoP) structure including stud bulbs
Grant 10,157,893 - Yu , et al. Dec | 2018-12-18 |
Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
App 20180358325 - Huang; Kuei-Wei ; et al. | 2018-12-13 |
Semiconductor bonding structures and methods
Grant 10,153,180 - Chen , et al. Dec | 2018-12-11 |
Packaging Device And Method Of Making The Same
App 20180350764 - Huang; Chang-Chia ; et al. | 2018-12-06 |
Methods for stud bump formation
Grant 10,147,693 - Hwang , et al. De | 2018-12-04 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20180342482 - Yu; Chen-Hua ; et al. | 2018-11-29 |
Substrate and package structure
Grant 10,141,281 - Lin , et al. Nov | 2018-11-27 |
Bump-on-trace Packaging Structure And Method For Forming The Same
App 20180337106 - Chen; Meng-Tse ; et al. | 2018-11-22 |
Semiconductor package, semiconductor device and method of forming the same
Grant 10,134,717 - Yu , et al. November 20, 2 | 2018-11-20 |
Packages with solder ball revealed through layer
Grant 10,134,699 - Hu , et al. November 20, 2 | 2018-11-20 |
Package on-package process for applying molding compound
Grant 10,134,703 - Chen , et al. November 20, 2 | 2018-11-20 |
Semiconductor Bonding Structures and Methods
App 20180330970 - Chen; Meng-Tse ; et al. | 2018-11-15 |
Semiconductor Package System and Method
App 20180331055 - Huang; Hui-Min ; et al. | 2018-11-15 |
Package structure and method for forming the same
Grant 10,128,193 - Chen , et al. November 13, 2 | 2018-11-13 |
Conductive pillar structure
Grant 10,128,206 - Lin , et al. November 13, 2 | 2018-11-13 |
Structure And Formation Method Of Chip Package With Fan-out Structure
App 20180315728 - PEI; Hao-Jan ; et al. | 2018-11-01 |
Package Structure And Method For Forming The Same
App 20180308800 - TSAI; Yi-Da ; et al. | 2018-10-25 |
Bonding structure between semiconductor device package
Grant 10,109,618 - Hu , et al. October 23, 2 | 2018-10-23 |
Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
Grant 10,109,612 - Huang , et al. October 23, 2 | 2018-10-23 |
Package Structure And Method Of Forming Package Structure
App 20180286823 - TAI; Chih-Hsuan ; et al. | 2018-10-04 |
Method Of Packaging A Semiconductor Die
App 20180286787 - HUANG; Hui-Min ; et al. | 2018-10-04 |
Wafer alignment methods in die sawing process
Grant 10,090,254 - Hu , et al. October 2, 2 | 2018-10-02 |
Packaging devices and methods of manufacture thereof
Grant 10,079,213 - Chen , et al. September 18, 2 | 2018-09-18 |
System and method for an improved fine pitch joint
Grant 10,062,659 - Chen , et al. August 28, 2 | 2018-08-28 |
Chip Package With Fan-out Structure
App 20180233382 - CHEN; Shing-Chao ; et al. | 2018-08-16 |
Packaging device and method of making the same
Grant 10,050,001 - Huang , et al. August 14, 2 | 2018-08-14 |
Bump-on-trace structures with high assembly yield
Grant 10,050,000 - Huang , et al. August 14, 2 | 2018-08-14 |
Warpage Control in Package-on-Package Structures
App 20180226363 - Chen; Wei-Yu ; et al. | 2018-08-09 |
Interconnect Structures and Methods of Forming Same
App 20180226373 - Lu; Wen-Hsiung ; et al. | 2018-08-09 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 10,043,778 - Yu , et al. August 7, 2 | 2018-08-07 |
Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof
App 20180211928 - Chang; Chia-Lun ; et al. | 2018-07-26 |
Semiconductor package system and method
Grant 10,032,734 - Huang , et al. July 24, 2 | 2018-07-24 |
Package-on-Package Structures and Methods for Forming the Same
App 20180197847 - Huang; Kuei-Wei ; et al. | 2018-07-12 |
Wafer-level molding chase design
Grant 10,020,211 - Yu , et al. July 10, 2 | 2018-07-10 |
Package on package devices and methods of packaging semiconductor dies
Grant 10,020,286 - Chen , et al. July 10, 2 | 2018-07-10 |
Molding Structure for Wafer Level Package
App 20180190555 - Yu; Chen-Hua ; et al. | 2018-07-05 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20180190559 - Yu; Chen-Hua ; et al. | 2018-07-05 |
Package structure and method for forming the same
Grant 10,014,260 - Tsai , et al. July 3, 2 | 2018-07-03 |
Interconnect joint protective layer apparatus and method
Grant 10,015,888 - Chen , et al. July 3, 2 | 2018-07-03 |
Semiconductor Processing Boat Design With Pressure Sensor
App 20180166308 - Ang; Ai-Tee ; et al. | 2018-06-14 |
Package-on-Package Structure with Epoxy Flux Residue
App 20180166421 - Yu; Chen-Hua ; et al. | 2018-06-14 |
Ball amount process in the manufacturing of integrated circuit
Grant 9,997,483 - Chen , et al. June 12, 2 | 2018-06-12 |
Molding Structure For Wafer Level Package
App 20180158780 - Yu; Chen-Hua ; et al. | 2018-06-07 |
Packaging with interposer frame
Grant 9,991,190 - Huang , et al. June 5, 2 | 2018-06-05 |
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20180151538 - HUNG; JENG-NAN ; et al. | 2018-05-31 |
Method For Manufacturing Interconnect Structure
App 20180151523 - CHEN; MENG-TSE ; et al. | 2018-05-31 |
Package Structure And Method For Forming The Same
App 20180151500 - CHEN; Shing-Chao ; et al. | 2018-05-31 |
Package structure and method for manufacturing the same
Grant 9,978,716 - Tsao , et al. May 22, 2 | 2018-05-22 |
Mechanisms for forming fine-pitch copper bump structures
Grant 9,978,656 - Lin , et al. May 22, 2 | 2018-05-22 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20180138147 - Yu; Chen-Hua ; et al. | 2018-05-17 |
Package Structure And Method For Forming The Same
App 20180130749 - TSAI; Yi-Da ; et al. | 2018-05-10 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20180108637 - Yu; Chen-Hua ; et al. | 2018-04-19 |
Structure And Formation Method Of Chip Package With Fan-out Structure
App 20180108613 - CHEN; Shing-Chao ; et al. | 2018-04-19 |
Structure and formation method of chip package with fan-out structure
Grant 9,947,552 - Chen , et al. April 17, 2 | 2018-04-17 |
Warpage control in package-on-package structures
Grant 9,941,221 - Chen , et al. April 10, 2 | 2018-04-10 |
Package-on-package structures and methods for forming the same
Grant 9,935,091 - Huang , et al. April 3, 2 | 2018-04-03 |
Interconnect structures and methods of forming same
Grant 9,935,070 - Lu , et al. April 3, 2 | 2018-04-03 |
Methods of forming connector pad structures, interconnect structures, and structures thereof
Grant 9,935,067 - Chang , et al. April 3, 2 | 2018-04-03 |
Semiconductor packaging and manufacturing method thereof
Grant 9,935,044 - Lin , et al. April 3, 2 | 2018-04-03 |
Method Of Manufacturing Wafer Level Chip Scale Package
App 20180090331 - Hu; Yu-Hsiang ; et al. | 2018-03-29 |
Dicing in wafer level package
Grant 9,929,071 - Cheng , et al. March 27, 2 | 2018-03-27 |
Semiconductor Packages having Dummy Connectors and Methods of Forming Same
App 20180076184 - Chen; Chen-Shien ; et al. | 2018-03-15 |
Package-on-Package Structure and Method
App 20180068985 - Chiu; Sheng-Hsiang ; et al. | 2018-03-08 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 9,911,675 - Yu , et al. March 6, 2 | 2018-03-06 |
Semiconductor processing boat design with pressure sensor
Grant 9,911,633 - Ang , et al. March 6, 2 | 2018-03-06 |
Molding structure for wafer level package
Grant 9,911,674 - Yu , et al. March 6, 2 | 2018-03-06 |
Method of forming semiconductor packages having through package vias
Grant 9,899,248 - Yu , et al. February 20, 2 | 2018-02-20 |
Package-On-Package (PoP) Structure Including Stud Bulbs
App 20180047709 - Yu; Chen-Hua ; et al. | 2018-02-15 |
Wafer Level Transfer Molding and Apparatus for Performing the Same
App 20180043593 - Jang; Bor-Ping ; et al. | 2018-02-15 |
Semiconductor Packaging Structure and Method
App 20180047708 - Lin; Chun-Cheng ; et al. | 2018-02-15 |
Wafer level chip scale package interconnects and methods of manufacture thereof
Grant 9,892,962 - Wu , et al. February 13, 2 | 2018-02-13 |
Molding structure for wafer level package
Grant 9,887,162 - Yu , et al. February 6, 2 | 2018-02-06 |
Systems for processing semiconductor devices, and methods of processing semiconductor devices
Grant 9,888,527 - Lin , et al. February 6, 2 | 2018-02-06 |
Device Package with Reduced Thickness and Method for Forming Same
App 20180033767 - Yu; Chen-Hua ; et al. | 2018-02-01 |
Manufacturing method of interconnect structure
Grant 9,881,888 - Chen , et al. January 30, 2 | 2018-01-30 |
Package-on-package structure with epoxy flux residue
Grant 9,881,903 - Yu , et al. January 30, 2 | 2018-01-30 |
Package-on-Package Structure
App 20180019151 - Lin; Chih-Wei ; et al. | 2018-01-18 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 9,871,018 - Yu , et al. January 16, 2 | 2018-01-16 |
Package Assembly
App 20180012860 - Lin; Hung-Jen ; et al. | 2018-01-11 |
Alignment in the packaging of integrated circuits
Grant 9,865,574 - Huang , et al. January 9, 2 | 2018-01-09 |
Stud Bump Structure For Semiconductor Package Assemblies
App 20180005973 - CHEN; Meng-Tse ; et al. | 2018-01-04 |
Package structure and method for forming the same
Grant 9,859,229 - Tsai , et al. January 2, 2 | 2018-01-02 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 9,847,317 - Yu , et al. December 19, 2 | 2017-12-19 |
Wafer level chip scale package and method of manufacturing the same
Grant 9,837,278 - Hu , et al. December 5, 2 | 2017-12-05 |
Package-on-package Structure With Epoxy Flux Residue
App 20170345794 - Yu; Chen-Hua ; et al. | 2017-11-30 |
Advanced INFO POP and Method of Forming Thereof
App 20170338202 - Tsai; Yi-Da ; et al. | 2017-11-23 |
Package-on-package structure and method
Grant 9,818,729 - Chiu , et al. November 14, 2 | 2017-11-14 |
Package on-package (PoP) structure including stud bulbs
Grant 9,812,427 - Yu , et al. November 7, 2 | 2017-11-07 |
Method For Manufacturing Semiconductor Structure
App 20170316987 - YU; CHEN-HUA ; et al. | 2017-11-02 |
Package Structure And Method For Manufacturing The Same
App 20170317054 - TSAO; Chih-Chiang ; et al. | 2017-11-02 |
Package Structure And Method For Forming The Same
App 20170317038 - TSAI; Yu-Peng ; et al. | 2017-11-02 |
Structure And Formation Method Of Chip Package With Fan-out Structure
App 20170316957 - CHEN; Shing-Chao ; et al. | 2017-11-02 |
Wafer level transfer molding and apparatus for performing the same
Grant 9,802,349 - Jang , et al. October 31, 2 | 2017-10-31 |
Semiconductor packaging structure and method
Grant 9,799,631 - Lin , et al. October 24, 2 | 2017-10-24 |
Device package with reduced thickness and method for forming same
Grant 9,786,631 - Yu , et al. October 10, 2 | 2017-10-10 |
Semiconductor package
Grant 9,786,622 - Cheng , et al. October 10, 2 | 2017-10-10 |
Semiconductor Package Structure
App 20170287890 - HU; James ; et al. | 2017-10-05 |
Package On Package Structure And Method For Forming The Same
App 20170287865 - Yu; Chen-Hua ; et al. | 2017-10-05 |
Method of forming package assembly
Grant 9,780,064 - Lin , et al. October 3, 2 | 2017-10-03 |
Package Structures and Methods for Forming the Same
App 20170278777 - Hsiao; Ching-Wen ; et al. | 2017-09-28 |
Stud bump structure for semiconductor package assemblies
Grant 9,768,137 - Chen , et al. September 19, 2 | 2017-09-19 |
Interconnect structure and method of fabricating same
Grant 9,768,136 - Lu , et al. September 19, 2 | 2017-09-19 |
Package on-package structure
Grant 9,768,048 - Lin , et al. September 19, 2 | 2017-09-19 |
Fan-Out Interconnect Structure and Methods Forming the Same
App 20170263489 - Hu; Yu-Hsiang ; et al. | 2017-09-14 |
Solder joint structure for ball grid array in wafer level package
Grant 9,761,551 - Hu , et al. September 12, 2 | 2017-09-12 |
Wafer with liquid molding compound and post-passivation interconnect
Grant 9,754,908 - Liu , et al. September 5, 2 | 2017-09-05 |
Packaging method and structure
Grant 9,754,805 - Yu , et al. September 5, 2 | 2017-09-05 |
Packaging Method and Structure
App 20170250091 - Yu; Chen-Hua ; et al. | 2017-08-31 |
Semiconductor Package And Rework Process For The Same
App 20170250171 - Yu; Chen-Hua ; et al. | 2017-08-31 |
Method for manufacturing semiconductor structure
Grant 9,728,427 - Yu , et al. August 8, 2 | 2017-08-08 |
Package on package structure and method for forming the same
Grant 9,711,470 - Yu , et al. July 18, 2 | 2017-07-18 |
Package-on-package Structure Having Polymer-based Material For Warpage Control
App 20170194289 - Chen; Meng-Tse ; et al. | 2017-07-06 |
Semiconductor package and method of manufacturing the same
Grant 9,698,028 - Lu , et al. July 4, 2 | 2017-07-04 |
Bonding structure for forming a package on package (PoP) structure and method for forming the same
Grant 9,691,745 - Hu , et al. June 27, 2 | 2017-06-27 |
Methods for forming fan-out package structure
Grant 9,691,726 - Cheng , et al. June 27, 2 | 2017-06-27 |
Semiconductor Packaging Structure and Method
App 20170179083 - Lin; Chun-Cheng ; et al. | 2017-06-22 |
Packages with Molding Structures and Methods of Forming the Same
App 20170170124 - Huang; Chih-Fan ; et al. | 2017-06-15 |
Singulation apparatus and method
Grant 9,679,790 - Lin , et al. June 13, 2 | 2017-06-13 |
Package structures and methods for forming the same
Grant 9,679,836 - Hsiao , et al. June 13, 2 | 2017-06-13 |
Package on package bonding structure and method for forming the same
Grant 9,673,182 - Huang , et al. June 6, 2 | 2017-06-06 |
Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof
App 20170154862 - Chang; Chia-Lun ; et al. | 2017-06-01 |
Wafer Level Chip Scale Package Interconnects and Methods of Manufacture Thereof
App 20170154811 - Wu; Cheng-Tar ; et al. | 2017-06-01 |
Process for forming package-on-package structures
Grant 9,666,572 - Lin , et al. May 30, 2 | 2017-05-30 |
Fan-out interconnect structure and methods forming the same
Grant 9,659,805 - Hu , et al. May 23, 2 | 2017-05-23 |
Packages with Solder Ball Revealed Through Layer
App 20170125367 - Hu; Yu-Hsiang ; et al. | 2017-05-04 |
Package-on-package structure having polymer-based material for warpage control
Grant 9,627,355 - Chen , et al. April 18, 2 | 2017-04-18 |
Packages and methods for forming the same
Grant 9,627,369 - Chen , et al. April 18, 2 | 2017-04-18 |
Method and apparatus for localized and controlled removal of material from a substrate
Grant 9,627,234 - Huang , et al. April 18, 2 | 2017-04-18 |
Warpage Control in the Packaging of Integrated Circuits
App 20170098571 - Cheng; Ming-Da ; et al. | 2017-04-06 |
Semiconductor Package, Semiconductor Device and Method of Forming the Same
App 20170092634 - YU; CHEN-HUA ; et al. | 2017-03-30 |
Package on package interconnect structure
Grant 9,607,921 - Lu , et al. March 28, 2 | 2017-03-28 |
Warpage Control in Package-on-Package Structures
App 20170084549 - Chen; Wei-Yu ; et al. | 2017-03-23 |
Packages with molding structures and methods of forming the same
Grant 9,601,353 - Huang , et al. March 21, 2 | 2017-03-21 |
Method for fabricating bump structure without UBM undercut
Grant 9,598,772 - Lin , et al. March 21, 2 | 2017-03-21 |
Interconnect structures and methods of forming same
Grant 9,589,862 - Kuo , et al. March 7, 2 | 2017-03-07 |
Dicing in Wafer Level Package
App 20170062300 - Cheng; Chia-Shen ; et al. | 2017-03-02 |
Semiconductor packaging structure and method
Grant 9,583,464 - Lin , et al. February 28, 2 | 2017-02-28 |
Semiconductor packaging structure and manufacturing method thereof
Grant 9,576,910 - Yu , et al. February 21, 2 | 2017-02-21 |
Method and apparatus for adjusting wafer warpage
Grant 9,576,830 - Huang , et al. February 21, 2 | 2017-02-21 |
Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof
App 20170033065 - Chang; Chia-Lun ; et al. | 2017-02-02 |
Package-On-Package (PoP) Structure Including Stud Bulbs and Method
App 20170025391 - Yu; Chen-Hua ; et al. | 2017-01-26 |
Interconnection Joints Having Variable Volumes In Package Structures And Methods Of Formation Thereof
App 20170025382 - Kuo; Hsuan-Ting ; et al. | 2017-01-26 |
Semiconductor Package System and Method
App 20170005049 - Huang; Hui-Min ; et al. | 2017-01-05 |
Packaging Device And Method Of Making The Same
App 20170005060 - Huang; Chang-Chia ; et al. | 2017-01-05 |
3d Package Structure And Methods Of Forming Same
App 20170005074 - Chen; Meng-Tse ; et al. | 2017-01-05 |
Bump-on-Trace Structures with High Assembly Yield
App 20170005059 - Huang; Chih-Fan ; et al. | 2017-01-05 |
Semiconductor Processing Boat Design with Pressure Sensor
App 20160358797 - Ang; Ai-Tee ; et al. | 2016-12-08 |
Substrate and Package Structure
App 20160358878 - LIN; WEI-HUNG ; et al. | 2016-12-08 |
Package-on-Package Structures and Methods for Forming the Same
App 20160351554 - Huang; Kuei-Wei ; et al. | 2016-12-01 |
Mechanisms Of Forming Connectors For Package On Package
App 20160343691 - CHEN; Yu-Feng ; et al. | 2016-11-24 |
Semiconductor Packaging Structure and Method
App 20160343692 - Lin; Chun-Cheng ; et al. | 2016-11-24 |
Package-on-Package Structure Including a Thermal Isolation Material and Method of Forming the Same
App 20160343698 - Chen; Meng-Tse ; et al. | 2016-11-24 |
Molding Structure for Wafer Level Package
App 20160336247 - Yu; Chen-Hua ; et al. | 2016-11-17 |
Package on Package Bonding Structure and Method for Forming the Same
App 20160322339 - Huang; Kuei-Wei ; et al. | 2016-11-03 |
Fan-Out Interconnect Structure and Methods Forming the Same
App 20160307788 - Hu; Yu-Hsiang (James) ; et al. | 2016-10-20 |
Process for Forming Package-on-Package Structures
App 20160293588 - Lin; Chih-Wei ; et al. | 2016-10-06 |
Interconnect Structure And Method Of Fabricating Same
App 20160284658 - Lu; Wen-Hsiung ; et al. | 2016-09-29 |
Molded Underfilling for Package on Package Devices
App 20160284676 - Yu; Chen-Hua ; et al. | 2016-09-29 |
Packaging Devices and Methods of Manufacture Thereof
App 20160276295 - Chen; Hsien-Wei ; et al. | 2016-09-22 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160268214 - YU; CHEN-HUA ; et al. | 2016-09-15 |
Alignment in the Packaging of Integrated Circuits
App 20160247790 - Huang; Kuei-Wei ; et al. | 2016-08-25 |
Package-on-package Structure Having Polymer-based Material For Warpage Control
App 20160247782 - Chen; Meng-Tse ; et al. | 2016-08-25 |
Wafer Alignment Methods in Die Sawing Process
App 20160233172 - Hu; Yu-Hsiang ; et al. | 2016-08-11 |
Semiconductor Packaging And Manufacturing Method Thereof
App 20160218055 - LIN; HSIU-JEN ; et al. | 2016-07-28 |
Interconnect Structure And Manufacturing Method Thereof
App 20160211234 - CHEN; MENG-TSE ; et al. | 2016-07-21 |
Method For Manufacturing Semiconductor Structure
App 20160204042 - YU; CHEN-HUA ; et al. | 2016-07-14 |
Die Bonder and Methods of Using the Same
App 20160190088 - Yu; Chen-Hua ; et al. | 2016-06-30 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20160190096 - Yu; Chen-Hua ; et al. | 2016-06-30 |
Solder Joint Structure for Ball Grid Array in Wafer Level Package
App 20160181219 - Hu; Yu-Hsiang ; et al. | 2016-06-23 |
Semiconductor Packages and Methods of Forming the Same
App 20160163564 - Yu; Chen-Hua ; et al. | 2016-06-09 |
Semiconductor Packages and Methods of Forming the Same
App 20160163578 - Yu; Chen-Hua ; et al. | 2016-06-09 |
Device Package with Reduced Thickness and Method for Forming Same
App 20160148887 - Yu; Chen-Hua ; et al. | 2016-05-26 |
System and Method for an Improved Fine Pitch Joint
App 20160148889 - Chen; Cheng-Ting ; et al. | 2016-05-26 |
Ball Amount Process in the Manufacturing of Integrated Circuit
App 20160141261 - Chen; Hsien-Wei ; et al. | 2016-05-19 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20160133538 - Yu; Chen-Hua ; et al. | 2016-05-12 |
Integrated Fan-Out Structure and Method
App 20160126226 - Pei; Hao-Jan ; et al. | 2016-05-05 |
Singulation Apparatus And Method
App 20160126116 - LIN; CHUN-CHENG ; et al. | 2016-05-05 |
Interconnect Structures and Methods of Forming Same
App 20160118359 - Lu; Wen-Hsiung ; et al. | 2016-04-28 |
Forming low stress joints using thermal compress bonding
Grant 08616433 - | 2013-12-31 |
Reflow System and Method for Conductive Connections
App 20120329264A1 - | 2012-12-27 |
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