| Patent | Date |
|---|
Package structure and method of fabricating the same
Grant 11,456,287 - Hu , et al. September 27, 2 | 2022-09-27 |
Semiconductor device and method of forming the same
Grant 11,424,174 - Pan , et al. August 23, 2 | 2022-08-23 |
Method Of Forming Package Structure
App 20220231005 - Pan; Chih-Chien ; et al. | 2022-07-21 |
Jig For Manufacturing Semicondcutor Package And Manufacturing Method Of Semiconductor Package
App 20220230985 - Chen; Chih-Hao ; et al. | 2022-07-21 |
Dummy structure of stacked and bonded semiconductor device
Grant 11,393,783 - Cheng , et al. July 19, 2 | 2022-07-19 |
Semiconductor Packages
App 20220223567 - Kao; Chin-Fu ; et al. | 2022-07-14 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20220157695 - Cheng; Li-Hui ; et al. | 2022-05-19 |
Method Of Fabricating Package Structure
App 20220148940 - Chen; Chih-Hao ; et al. | 2022-05-12 |
Adhesive And Thermal Interface Material On A Plurality Of Dies Covered By A Lid
App 20220139802 - Chen; Chih-Hao ; et al. | 2022-05-05 |
Package Structure And Method Of Manufacturing The Same
App 20220122896 - Wang; Pu ; et al. | 2022-04-21 |
Semiconductor Devices and Methods of Manufacture
App 20220122922 - Chen; Chih-Hao ; et al. | 2022-04-21 |
Optical signal processing package structure
Grant 11,302,683 - Pan , et al. April 12, 2 | 2022-04-12 |
Semiconductor packages and forming method thereof
Grant 11,296,051 - Kao , et al. April 5, 2 | 2022-04-05 |
An Adhesive And Thermal Interface Material On A Plurality Of Dies Covered By A Lid
App 20220037229 - Chen; Chih-Hao ; et al. | 2022-02-03 |
Package structure and method of fabricating the same
Grant 11,239,134 - Chen , et al. February 1, 2 | 2022-02-01 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 11,239,138 - Cheng , et al. February 1, 2 | 2022-02-01 |
Adhesive and thermal interface material on a plurality of dies covered by a lid
Grant 11,239,136 - Chen , et al. February 1, 2 | 2022-02-01 |
Integrated circuit package and method
Grant 11,205,612 - Pan , et al. December 21, 2 | 2021-12-21 |
Package Structure And Manufacturing Method Thereof
App 20210358768 - Cheng; Li-Hui ; et al. | 2021-11-18 |
Method For Forming Package Structure
App 20210343611 - CHEN; Chih-Hao ; et al. | 2021-11-04 |
Package Structure And Method Of Forming The Same
App 20210313304 - Pan; Chih-Chien ; et al. | 2021-10-07 |
Semiconductor packages and method of manufacturing the same
Grant 11,121,051 - Cheng , et al. September 14, 2 | 2021-09-14 |
Package-on-package structure and manufacturing method thereof
Grant 11,101,252 - Lin , et al. August 24, 2 | 2021-08-24 |
Integrated Circuit Package and Method
App 20210249343 - Pan; Chih-Chien ; et al. | 2021-08-12 |
Package structure and manufacturing method thereof
Grant 11,081,369 - Cheng , et al. August 3, 2 | 2021-08-03 |
Package Structure And Method Of Fabricating The Same
App 20210225727 - Chen; Chih-Hao ; et al. | 2021-07-22 |
Semiconductor package and manufacturing method thereof
Grant 11,069,673 - Cheng , et al. July 20, 2 | 2021-07-20 |
Package structure and method for forming the same
Grant 11,062,968 - Chen , et al. July 13, 2 | 2021-07-13 |
Semiconductor device and method of manufacture
Grant 11,056,471 - Lin , et al. July 6, 2 | 2021-07-06 |
Optical transceiver and manufacturing method thereof
Grant 11,031,381 - Chen , et al. June 8, 2 | 2021-06-08 |
Semiconductor Packages And Method Of Manufacturing The Same
App 20210118758 - Cheng; Li-Hui ; et al. | 2021-04-22 |
Package Structure And Method Of Fabricating The Same
App 20210066151 - Hu; Hsien-Pin ; et al. | 2021-03-04 |
Semiconductor Packages And Forming Method Thereof
App 20210057384 - Kao; Chin-Fu ; et al. | 2021-02-25 |
Package Structure And Method For Forming The Same
App 20210057297 - CHEN; Chih-Hao ; et al. | 2021-02-25 |
Semiconductor Device and Method of Forming the Same
App 20210020534 - Pan; Chih-Chien ; et al. | 2021-01-21 |
Integrated Circuit Packages And Methods Of Forming Same
App 20210005464 - Lin; Jing-Cheng ; et al. | 2021-01-07 |
Semiconductor device package and method of manufacturing the same
Grant 10,879,194 - Lin , et al. December 29, 2 | 2020-12-29 |
Release Film as Isolation Film in Package
App 20200402816 - Lin; Jing-Cheng ; et al. | 2020-12-24 |
Package structure and method of forming thereof
Grant 10,872,850 - Cheng , et al. December 22, 2 | 2020-12-22 |
Package structure having adhesive layer surrounded dam structure
Grant 10,867,955 - Cheng , et al. December 15, 2 | 2020-12-15 |
Package-on-package structure
Grant 10,867,849 - Cheng , et al. December 15, 2 | 2020-12-15 |
Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system
Grant 10,852,476 - Chen , et al. December 1, 2 | 2020-12-01 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20200350279 - Tsai; Po-Hao ; et al. | 2020-11-05 |
Semiconductor device and method of forming the same
Grant 10,796,976 - Pan , et al. October 6, 2 | 2020-10-06 |
Integrated circuit packages and methods of forming same
Grant 10,784,123 - Lin , et al. Sept | 2020-09-22 |
Semiconductor Package And Manufacturing Method Thereof
App 20200294983 - Cheng; Li-Hui ; et al. | 2020-09-17 |
Release film as isolation film in package
Grant 10,763,132 - Lin , et al. Sep | 2020-09-01 |
Semiconductor Package, Integrated Optical Communication System And Manufacturing Method Of Integrated Optical Communication Syst
App 20200271860 - Chen; Chih-Hao ; et al. | 2020-08-27 |
Package Structure And Manufacturing Method Thereof
App 20200273718 - Cheng; Li-Hui ; et al. | 2020-08-27 |
Integrated fan-out package structures with recesses in molding compound
Grant 10,720,403 - Tsai , et al. | 2020-07-21 |
Package structure and manufacturing method thereof
Grant 10,679,915 - Hsieh , et al. | 2020-06-09 |
Semiconductor package and manufacturing method thereof
Grant 10,672,752 - Cheng , et al. | 2020-06-02 |
Semiconductor Device And Method Of Manufacturing The Same
App 20200152560 - LIN; JING-CHENG ; et al. | 2020-05-14 |
Stacked and Bonded Semiconductor Device
App 20200144212 - Cheng; Li-Hui ; et al. | 2020-05-07 |
Package-on-package Structure
App 20200144110 - Cheng; Li-Hui ; et al. | 2020-05-07 |
Semiconductor Device And Method Of Forming The Same
App 20200135606 - Pan; Chih-Chien ; et al. | 2020-04-30 |
Package Structure And Manufacturing Method Thereof
App 20200135601 - Hsieh; Ping-Yin ; et al. | 2020-04-30 |
Optical Transceiver And Manufacturing Method Thereof
App 20200135707 - Chen; Chih-Hao ; et al. | 2020-04-30 |
Semiconductor Device and Method of Manufacture
App 20200126959 - Lin; Jing-Cheng ; et al. | 2020-04-23 |
Integrated Circuit Package and Method
App 20200111729 - Pan; Chih-Chien ; et al. | 2020-04-09 |
Package Structure And Manufacturing Method Thereof
App 20200105705 - Cheng; Li-Hui ; et al. | 2020-04-02 |
Multi-die structure and method for forming same
Grant 10,553,569 - Yu , et al. Fe | 2020-02-04 |
Semiconductor device and method of manufacturing the same
Grant 10,535,591 - Lin , et al. Ja | 2020-01-14 |
Printing module, printing method and system of forming a printed structure
Grant 10,535,627 - Lin , et al. Ja | 2020-01-14 |
Package-on-package Structure And Method Of Manufacturing Package
App 20200006133 - Cheng; Li-Hui ; et al. | 2020-01-02 |
Method for a stacked and bonded semiconductor device
Grant 10,522,496 - Cheng , et al. Dec | 2019-12-31 |
Package structure, integrated fan-out package and method of fabricating the same
Grant 10,522,476 - Cheng , et al. Dec | 2019-12-31 |
Semiconductor device and method of manufacture
Grant 10,515,937 - Lin , et al. Dec | 2019-12-24 |
Package-on-package structure and method of manufacturing package
Grant 10,510,591 - Cheng , et al. Dec | 2019-12-17 |
Package-on-package Structure And Manufacturing Method Thereof
App 20190378827 - Lin; Shih-Ting ; et al. | 2019-12-12 |
Integrated circuit package and method
Grant 10,504,824 - Pan , et al. Dec | 2019-12-10 |
Package-on-package structure and manufacturing method thereof
Grant 10,438,934 - Lin , et al. O | 2019-10-08 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 10,354,982 - Tsai , et al. July 16, 2 | 2019-07-16 |
PoP device and method of forming the same
Grant 10,290,610 - Huang , et al. | 2019-05-14 |
Printing Module, Printing Method And System Of Forming A Printed Structure
App 20190123015 - Lin; Jing-Cheng ; et al. | 2019-04-25 |
Release Film as Isolation Film in Package
App 20190122901 - Lin; Jing-Cheng ; et al. | 2019-04-25 |
Integrated circuit packages and methods of forming same
Grant 10,269,587 - Lin , et al. | 2019-04-23 |
Integrated Circuit Packages and Methods of Forming Same
App 20190109020 - Lin; Jing-Cheng ; et al. | 2019-04-11 |
Pop Device And Method Of Forming The Same
App 20190067249 - Huang; Li-Hsien ; et al. | 2019-02-28 |
Semiconductor Device And Method Of Manufacturing The Same
App 20190051589 - LIN; JING-CHENG ; et al. | 2019-02-14 |
Semicondcutor Package And Manufacturing Method Thereof
App 20190043849 - Cheng; Li-Hui ; et al. | 2019-02-07 |
Package Structure, Integrated Fan-out Package And Method Of Fabricating The Same
App 20190027446 - Cheng; Li-Hui ; et al. | 2019-01-24 |
Integrated Circuit Packages and Methods of Forming Same
App 20190006194 - Lin; Jing-Cheng ; et al. | 2019-01-03 |
Release Film as Isolation Film in Package
App 20190006200 - Lin; Jing-Cheng ; et al. | 2019-01-03 |
Release film as isolation film in package
Grant 10,170,341 - Lin , et al. J | 2019-01-01 |
Semiconductor package
Grant 10,163,848 - Lin , et al. Dec | 2018-12-25 |
Method for forming chip package structure with adhesive layer
Grant 10,163,875 - Cheng , et al. Dec | 2018-12-25 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20180350770 - Tsai; Po-Hao ; et al. | 2018-12-06 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20180342466 - LIN; JING-CHENG ; et al. | 2018-11-29 |
Semiconductor package and manufacturing method thereof
Grant 10,134,719 - Cheng , et al. November 20, 2 | 2018-11-20 |
Semicondcutor Package
App 20180315733 - Lin; Jing-Cheng ; et al. | 2018-11-01 |
Packaged semiconductor device and method of fabricating a packaged semiconductor device
Grant 10,115,675 - Lin , et al. October 30, 2 | 2018-10-30 |
Method For Forming Chip Package Structure With Adhesive Layer
App 20180308825 - CHENG; Li-Hui ; et al. | 2018-10-25 |
Semiconductor Device and Method of Manufacture
App 20180308828 - Lin; Jing-Cheng ; et al. | 2018-10-25 |
Semiconductor device and method of manufactures
Grant 10,103,132 - Lin , et al. October 16, 2 | 2018-10-16 |
Package Structure And Method Of Forming Thereof
App 20180286793 - CHENG; Li-Hui ; et al. | 2018-10-04 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20180286839 - Tsai; Po-Hao ; et al. | 2018-10-04 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 10,083,946 - Tsai , et al. September 25, 2 | 2018-09-25 |
Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
Grant 10,079,225 - Lin , et al. September 18, 2 | 2018-09-18 |
Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
Grant 10,079,159 - Lin , et al. September 18, 2 | 2018-09-18 |
Integrated fan-out package structures with recesses in molding compound
Grant 10,062,662 - Tsai , et al. August 28, 2 | 2018-08-28 |
Semiconductor device and method of manufacture
Grant 10,008,485 - Lin , et al. June 26, 2 | 2018-06-26 |
Integrated fan-out package structures with recesses in molding compound
Grant 9,953,955 - Tsai , et al. April 24, 2 | 2018-04-24 |
Chip package structure with adhesive layer
Grant 9,929,128 - Cheng , et al. March 27, 2 | 2018-03-27 |
Method For Manufacturing Sintered And Carburized Porous Stainless Steel Parts
App 20180065184 - HWANG; Kuen-Shyang ; et al. | 2018-03-08 |
Semicondcutor Package And Manufacturing Method Thereof
App 20180006005 - Cheng; Li-Hui ; et al. | 2018-01-04 |
Packaged Semiconductor Device And Method Of Fabricating A Packaged Semiconductor Device
App 20170373016 - Lin; Jing-Cheng ; et al. | 2017-12-28 |
Multi-Die Structure and Method for Forming Same
App 20170373048 - Yu; Chen-Hua ; et al. | 2017-12-28 |
Integrated fan-out structure with openings in buffer layer
Grant 9,799,581 - Chiu , et al. October 24, 2 | 2017-10-24 |
Multi-die structure and method of forming same
Grant 9,761,566 - Yu , et al. September 12, 2 | 2017-09-12 |
Semiconductor Device and Method of Manufacture
App 20170229434 - Lin; Jing-Cheng ; et al. | 2017-08-10 |
Die package with Openings Surrounding End-portions of Through Package Vias (TPVs) and Package on Package (PoP) Using the Die Package
App 20170229432 - Lin; Jing-Cheng ; et al. | 2017-08-10 |
Semiconductor Device and Method
App 20170229414 - Cheng; Li-Hui ; et al. | 2017-08-10 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20170229433 - Tsai; Po-Hao ; et al. | 2017-08-10 |
Semiconductor Device and Method of Manufactures
App 20170162551 - Lin; Jing-Cheng ; et al. | 2017-06-08 |
Semiconductor device and method
Grant 9,646,918 - Cheng , et al. May 9, 2 | 2017-05-09 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 9,633,895 - Tsai , et al. April 25, 2 | 2017-04-25 |
Semicondutor device and method of manufacture
Grant 9,633,934 - Lin , et al. April 25, 2 | 2017-04-25 |
Semiconductor device and method of manufactures
Grant 9,583,420 - Lin , et al. February 28, 2 | 2017-02-28 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20170040288 - Tsai; Po-Hao ; et al. | 2017-02-09 |
Integrated Fan-Out Structure with Openings in Buffer Layer
App 20170012024 - Chiu; Wu Sen ; et al. | 2017-01-12 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20160329307 - Tsai; Po-Hao ; et al. | 2016-11-10 |
Die package with Openings Surrounding End-portions of Through Package Vias (TPVs) and Package on Package (PoP) Using the Die Package
App 20160307778 - Lin; Jing-Cheng ; et al. | 2016-10-20 |
Integrated fan-out structure with openings in buffer layer
Grant 9,455,211 - Chiu , et al. September 27, 2 | 2016-09-27 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 9,425,121 - Tsai , et al. August 23, 2 | 2016-08-23 |
Semiconductor Device and Method of Manufactures
App 20160218049 - Lin; Jing-Cheng ; et al. | 2016-07-28 |
Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
Grant 9,378,982 - Lin , et al. June 28, 2 | 2016-06-28 |
Semicondutor Device and Method of Manufacture
App 20160148857 - Lin; Jing-Cheng ; et al. | 2016-05-26 |
Semiconductor Device and Method
App 20160049363 - Cheng; Li-Hui ; et al. | 2016-02-18 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20160013150 - Tsai; Po-Hao ; et al. | 2016-01-14 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20150380340 - Cheng; Li-Hui ; et al. | 2015-12-31 |
Semiconductor device and manufacturing method thereof
Grant 9,159,678 - Cheng , et al. October 13, 2 | 2015-10-13 |
Integrated fan-out package structures with recesses in molding compound
Grant 9,142,432 - Tsai , et al. September 22, 2 | 2015-09-22 |
Sintered And Carburized Porous Stainless Steel Part And Method Thereof
App 20150196956 - HWANG; Kuen-Shyang ; et al. | 2015-07-16 |
Semiconductor Device And Manufacturing Method Thereof
App 20150137351 - CHENG; LI-HUI ; et al. | 2015-05-21 |
Integrated Fan-Out Structure with Openings in Buffer Layer
App 20150102502 - Chiu; Wu Sen ; et al. | 2015-04-16 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20150076713 - Tsai; Po-Hao ; et al. | 2015-03-19 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20150069623 - Tsai; Po-Hao ; et al. | 2015-03-12 |
Die package with Openings Surrounding End-portions of Through Package Vias (TPVs) and Package on Package (PoP) Using the Die Package
App 20140210101 - Lin; Jing-Cheng ; et al. | 2014-07-31 |
Method for improving surface mechanical properties of non-austenitic stainless steels
Grant 8,608,868 - Hwang , et al. December 17, 2 | 2013-12-17 |
Low-temperature stainless steel carburization method
Grant 8,540,825 - Hwang , et al. September 24, 2 | 2013-09-24 |
Method For Improving Surface Mechanical Properties Of Non-austenitic Stainless Steels
App 20120255652 - HWANG; Kuen-Shyang ; et al. | 2012-10-11 |
Low-temperature Stainless Steel Carburization Method
App 20120247620 - Hwang; Kuen-Shyang ; et al. | 2012-10-04 |
Method For Enhancing Strength And Hardness Of Powder Metallurgy Stainless Steel
App 20120251377 - Hwang; Kuen-Shyang ; et al. | 2012-10-04 |
| 