| Patent | Date |
|---|
Semiconductor Device Package And Method Of Manufacturing The Same
App 20220140467 - CHEN; Ting Ruei ; et al. | 2022-05-05 |
Semiconductor device package
Grant 11,316,249 - Cheng April 26, 2 | 2022-04-26 |
Germanium nanosheets and methods of forming the same
Grant 11,239,074 - Cheng February 1, 2 | 2022-02-01 |
Semiconductor device package
Grant 11,228,088 - Cheng January 18, 2 | 2022-01-18 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210273315 - CHENG; Hung-Hsiang | 2021-09-02 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210249756 - CHENG; Hung-Hsiang | 2021-08-12 |
Germanium nanosheets and methods of forming the same
Grant 11,031,239 - Cheng June 8, 2 | 2021-06-08 |
Method For Reducing Schottky Barrier Height And Semiconductor Device With Reduced Schottky Barrier Height
App 20210036111 - CHENG; Hung-Hsiang ; et al. | 2021-02-04 |
Method for reducing Schottky barrier height and semiconductor device with reduced Schottky barrier height
Grant 10,797,137 - Cheng , et al. October 6, 2 | 2020-10-06 |
Germanium Nanosheets and Methods of Forming the Same
App 20200051814 - Cheng; Hung-Hsiang | 2020-02-13 |
Germanium Nanosheets And Methods Of Forming The Same
App 20200006067 - Cheng; Hung-Hsiang | 2020-01-02 |
Method For Reducing Schottky Barrier Height And Semiconductor Device With Reduced Schottky Barrier Height
App 20190006470 - CHENG; Hung-Hsiang ; et al. | 2019-01-03 |
Network Camera That Connects A Plurality Of Extensible Imagers
App 20160044249 - SYU; CI-FANG ; et al. | 2016-02-11 |
Semiconductor device having shielded conductive vias
Grant 8,541,883 - Cheng , et al. September 24, 2 | 2013-09-24 |
Semiconductor Device Having Shielded Conductive Vias And Method For Manufacturing The Same
App 20130134601 - Cheng; Hung-Hsiang ; et al. | 2013-05-30 |
Method of making semiconductor package having redistribution layer
Grant 8,389,394 - Huang , et al. March 5, 2 | 2013-03-05 |
Circuit substrate having power/ground plane with grid holes
Grant 8,193,454 - Cheng , et al. June 5, 2 | 2012-06-05 |
Semiconductor Package and Method for Making the Same
App 20110237032 - Huang; Chih-Yi ; et al. | 2011-09-29 |
Semiconductor package having redistribution layer
Grant 7,977,784 - Huang , et al. July 12, 2 | 2011-07-12 |
Multi-layer circuit board having ground shielding walls
Grant 7,851,709 - Cheng December 14, 2 | 2010-12-14 |
Semiconductor Device Package Having Chip With Conductive Layer
App 20100283139 - CHENG; Hung-Hsiang ; et al. | 2010-11-11 |
Carrier with solid antenna structure and manufacturing method thereof
Grant 7,755,549 - Cheng July 13, 2 | 2010-07-13 |
Substrate of window ball grid array package and method for making the same
App 20100102447 - Huang; Chih-Yi ; et al. | 2010-04-29 |
Substrate of window ball grid array package
App 20100071939 - Cheng; Hung-Hsiang ; et al. | 2010-03-25 |
Substrate for window ball grid array package
App 20100065312 - Cheng; Hung-Hsiang ; et al. | 2010-03-18 |
Circuit substrate having power/ground plane with grid holes
App 20100051341 - Cheng; Hung-Hsiang ; et al. | 2010-03-04 |
Semiconductor Package And Method For Making The Same
App 20090152721 - Huang; Chih-Yi ; et al. | 2009-06-18 |
Method Of Cutting Signal Wire Preserved On Circuit Board And Circuit Layout Thereof
App 20090019692 - Huang; Chih-Yi ; et al. | 2009-01-22 |
Carrier With Solid Antenna Structure And Manufacturing Method Thereof
App 20080158080 - Cheng; Hung-Hsiang | 2008-07-03 |
Semiconductor Device Having A Passive Device
App 20080093702 - Cheng; Hung-Hsiang ; et al. | 2008-04-24 |
Multi-layer Circuit Board Having Ground Shielding Walls
App 20070221405 - Cheng; Hung-Hsiang | 2007-09-27 |
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