Chen; Shuo-Mao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Shuo-Mao.The latest application filed is for "semiconductor package and method of manufacturing the same".

Company Profile

71.82.103

Chen; Shuo-Mao - New Taipei TW
Chen; Shuo-Mao - New Taipei City TW
CHEN; Shuo-Mao - Hsinchu TW
Chen; Shuo-Mao - Hsin-Chu TW
Chen; Shuo-Mao - Hsin-Chuang N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package with dual sides of metal routing Grant 11,456,257 - Jeng , et al. September 27, 2	2022-09-27
Semiconductor Package And Method Of Manufacturing The Same App 20220302081 - Hsu; Chia-Kuei ; et al.	2022-09-22
Chip package structure with cavity in interposer Grant 11,443,993 - Jeng , et al. September 13, 2	2022-09-13
Semiconductor Structure And Manufacturing Method Thereof App 20220278034 - CHEN; SHUO-MAO ; et al.	2022-09-01
Semiconductor Structure And Manufacturing Method Thereof App 20220271024 - LU; HSIANG-TAI ; et al.	2022-08-25
Semiconductor device encapsulated by molding material attached to redestribution layer Grant 11,417,620 - Jeng , et al. August 16, 2	2022-08-16
Multi-chip Packages App 20220246579 - Chen; Shuo-Mao ; et al.	2022-08-04
Chip package structure with integrated device integrated beneath the semiconductor chip Grant 11,404,394 - Hsu , et al. August 2, 2	2022-08-02
Reinforcing package using reinforcing patches Grant 11,393,746 - Hsu , et al. July 19, 2	2022-07-19
Photonics Integrated Circuit Package App 20220223533 - Kuo; Feng Wei ; et al.	2022-07-14
Package Structure And Method Of Manufacturing The Same App 20220223424 - Hsu; Feng-Cheng ; et al.	2022-07-14
Semiconductor Packages And Methods Of Forming Same App 20220216192 - Jeng; Shin-Puu ; et al.	2022-07-07
Formation Method Of Chip Package App 20220189884 - CHUANG; Po-Yao ; et al.	2022-06-16
Semiconductor Packages Including Passive Devices And Methods Of Forming Same App 20220189919 - Jeng; Shin-Puu ; et al.	2022-06-16
Method For Forming Package Structure With Lid App 20220181232 - JENG; Shin-Puu ; et al.	2022-06-09
Integrated Passive Device Package And Methods Of Forming Same App 20220165587 - Hsu; Feng-Cheng ; et al.	2022-05-26
Semiconductor structure and manufacturing method thereof Grant 11,342,255 - Chen , et al. May 24, 2	2022-05-24
Multi-chip wafer level packages Grant 11,342,306 - Chen , et al. May 24, 2	2022-05-24
Semiconductor structure and manufacturing method thereof Grant 11,335,672 - Lu , et al. May 17, 2	2022-05-17
Photonics integrated circuit package Grant 11,315,878 - Kuo , et al. April 26, 2	2022-04-26
Chip Package Structure App 20220108967 - JENG; Shin-Puu ; et al.	2022-04-07
Package structure and method of manufacturing the same Grant 11,295,957 - Hsu , et al. April 5, 2	2022-04-05
Semiconductor packages and methods of forming same Grant 11,296,065 - Jeng , et al. April 5, 2	2022-04-05
Chip package structure having warpage control and method of forming the same Grant 11,282,759 - Hsu , et al. March 22, 2	2022-03-22
Structure and formation method of chip package with shielding structure Grant 11,270,953 - Chuang , et al. March 8, 2	2022-03-08
Semiconductor packages including passive devices and methods of forming same Grant 11,270,975 - Jeng , et al. March 8, 2	2022-03-08
Package structure with lid and method for forming the same Grant 11,264,300 - Jeng , et al. March 1, 2	2022-03-01
Integrated passive device package and methods of forming same Grant 11,251,054 - Hsu , et al. February 15, 2	2022-02-15
Method of fabricating package structure Grant 11,251,142 - Lin , et al. February 15, 2	2022-02-15
Package Structure With Reinforced Element And Formation Method Thereof App 20220045016 - JENG; Shin-Puu ; et al.	2022-02-10
Chip package structure Grant 11,239,194 - Jeng , et al. February 1, 2	2022-02-01
Semiconductor Packages Including Passive Devices And Methods Of Forming Same App 20220028825 - Jeng; Shin-Puu ; et al.	2022-01-27
Semiconductor Packages And Methods Of Forming Same App 20210391314 - Jeng; Shin-Puu ; et al.	2021-12-16
Methods of forming multi-chip wafer level packages Grant 11,189,596 - Chen , et al. November 30, 2	2021-11-30
Reinforcing Package Using Reinforcing Patches App 20210296220 - Hsu; Chia-Kuei ; et al.	2021-09-23
Multi fan-out package structure and method for forming the same Grant 11,107,801 - Jeng , et al. August 31, 2	2021-08-31
Integrated Circuit Stack Verification Method And System For Performing The Same App 20210264094 - KUO; Feng Wei ; et al.	2021-08-26
Chip Package With Redistribution Structure App 20210242122 - JENG; Shin-Puu ; et al.	2021-08-05
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20210217691 - Chen; Shuo-Mao ; et al.	2021-07-15
Integrated Circuit Package and Method Forming Same App 20210193637 - Jeng; Shin-Puu ; et al.	2021-06-24
Interconnect structure for package-on-package devices Grant 11,037,861 - Hung , et al. June 15, 2	2021-06-15
Integrated circuit stack verification method and system for performing the same Grant 11,023,647 - Kuo , et al. June 1, 2	2021-06-01
Semiconductor Devices and Methods of Manufacture App 20210159182 - Jeng; Shin-Puu ; et al.	2021-05-27
Package with passive devices and method of forming the same Grant 11,004,818 - Chen , et al. May 11, 2	2021-05-11
Chip package with recessed interposer substrate Grant 10,985,100 - Jeng , et al. April 20, 2	2021-04-20
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,971,441 - Chen , et al. April 6, 2	2021-04-06
Method For Forming Chip Package Structure App 20210098379 - JENG; Shin-Puu ; et al.	2021-04-01
Chip Package Structure Having Warpage Control And Method Of Forming The Same App 20210074602 - HSU; Feng-Cheng ; et al.	2021-03-11
Chip Package Structure And Method Of Forming The Same App 20210074682 - CHEN; Shuo-Mao ; et al.	2021-03-11
Chip Package Structure With Integrated Device Integrated Beneath The Semiconductor Chip App 20210074678 - HSU; Feng-Cheng ; et al.	2021-03-11
Chip Package Structure With Cavity In Interposer App 20210074600 - JENG; Shin-Puu ; et al.	2021-03-11
Package Structure And Method Of Forming The Same App 20210005562 - JENG; Shin-Puu ; et al.	2021-01-07
Method Of Manufacturing Semiconductor Package Structure App 20200411474 - JENG; SHIN-PUU ; et al.	2020-12-31
Multi-chip Wafer Level Packages App 20200395335 - Chen; Shuo-Mao ; et al.	2020-12-17
Method for forming chip package structure Grant 10,867,925 - Jeng , et al. December 15, 2	2020-12-15
Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing Grant 10,867,924 - Jeng , et al. December 15, 2	2020-12-15
Semiconductor Structure And Manufacturing Method Thereof App 20200357785 - LU; HSIANG-TAI ; et al.	2020-11-12
Methods Of Forming Multi-chip Wafer Level Packages App 20200343220 - Chen; Shuo-Mao ; et al.	2020-10-29
Package Structure And Method Of Manufacturing The Same App 20200343096 - Hsu; Feng-Cheng ; et al.	2020-10-29
Package with Passive Devices and Method of Forming the Same App 20200328174 - Chen; Shuo-Mao ; et al.	2020-10-15
Semiconductor package structure and method of manufacturing the same Grant 10,804,244 - Jeng , et al. October 13, 2	2020-10-13
Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer Grant 10,784,220 - Jeng , et al. Sept	2020-09-22
Method Of Fabricating Package Structure App 20200286744 - Lin; Chia-Hsiang ; et al.	2020-09-10
Method Of Forming Semicondcutor Device Package App 20200286878 - Lin; Po-Yao ; et al.	2020-09-10
Semiconductor package and manufacturing method of the same Grant 10,770,437 - Hung , et al. Sep	2020-09-08
Multi-chip wafer level packages and methods of forming the same Grant 10,763,239 - Chen , et al. Sep	2020-09-01
Method For Manufacturing Semiconductor Package Structure App 20200258849 - A1	2020-08-13
Semiconductor structure and manufacturing method thereof Grant 10,741,537 - Lu , et al. A	2020-08-11
Package structure and method of manufacturing the same Grant 10,741,404 - Hsu , et al. A	2020-08-11
Method of forming semicondcutor device package Grant 10,714,463 - Lin , et al.	2020-07-14
Package with passive devices and method of forming the same Grant 10,700,032 - Chen , et al.	2020-06-30
Package structure and method of fabricating the same Grant 10,665,473 - Lin , et al.	2020-05-26
Chip Package Structure App 20200161267 - JENG; Shin-Puu ; et al.	2020-05-21
Semiconductor Package Structure And Method Of Manufacturing The Same App 20200152603 - JENG; SHIN-PUU ; et al.	2020-05-14
Semiconductor Structure And Manufacturing Method Thereof App 20200152563 - CHEN; SHUO-MAO ; et al.	2020-05-14
Semiconductor package structure Grant 10,636,747 - Hung , et al.	2020-04-28
Chip Package With Interposer Substrate App 20200126812 - JENG; Shin-Puu ; et al.	2020-04-23
Method Of Forming Semicondcutor Device Package App 20200098739 - Lin; Po-Yao ; et al.	2020-03-26
Integrated Passive Device Package And Methods Of Forming Same App 20200090955 - Hsu; Feng-Cheng ; et al.	2020-03-19
Package Structure With Lid And Method For Forming The Same App 20200091029 - JENG; Shin-Puu ; et al.	2020-03-19
Interconnect Structure for Package-on-Package Devices App 20200083145 - Hung; Jui-Pin ; et al.	2020-03-12
Structure And Formation Method Of Chip Package With Shielding Structure App 20200075503 - CHUANG; Po-Yao ; et al.	2020-03-05
Package Structure And Method For Forming The Same App 20200075569 - JENG; Shin-Puu ; et al.	2020-03-05
Chip package structure Grant 10,546,830 - Jeng , et al. Ja	2020-01-28
Method For Forming Chip Package Structure App 20200027837 - JENG; Shin-Puu ; et al.	2020-01-23
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20200020623 - Chen; Shuo-Mao ; et al.	2020-01-16
Semiconductor structure and manufacturing method thereof Grant 10,535,597 - Chen , et al. Ja	2020-01-14
Semiconductor package structure and method of manufacturing the same Grant 10,535,632 - Jeng , et al. Ja	2020-01-14
Semiconductor Package With Dual Sides Of Metal Routing App 20200006234 - Jeng; Shin-Puu ; et al.	2020-01-02
Interconnect structure for package-on-package devices Grant 10,515,875 - Hung , et al. Dec	2019-12-24
Method for forming chip package with recessed interposer substrate Grant 10,515,827 - Jeng , et al. Dec	2019-12-24
Integrated passive device package and methods of forming same Grant 10,504,752 - Hsu , et al. Dec	2019-12-10
Method of forming semicondcutor device package Grant 10,504,880 - Lin , et al. Dec	2019-12-10
Package with Passive Devices and Method of Forming the Same App 20190363062 - Chen; Shuo-Mao ; et al.	2019-11-28
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,475,731 - Chen , et al. Nov	2019-11-12
Chip Package Structure App 20190259726 - JENG; Shin-Puu ; et al.	2019-08-22
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating App 20190252296 - Hung; Jui-Pin ; et al.	2019-08-15
Method Of Forming Semicondcutor Device Package App 20190252363 - Lin; Po-Yao ; et al.	2019-08-15
Package with passive devices and method of forming the same Grant 10,373,923 - Chen , et al.	2019-08-06
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20190229048 - Chen; Shuo-Mao ; et al.	2019-07-25
Package Structure And Method Of Manufacturing The Same App 20190139896 - Hsu; Feng-Cheng ; et al.	2019-05-09
Package Structure And Method Of Fabricating The Same App 20190139784 - Lin; Chia-Hsiang ; et al.	2019-05-09
Chip package structure and method for forming the same Grant 10,283,474 - Jeng , et al.	2019-05-07
Multi-chip Wafer Level Packages And Methods Of Forming The Same App 20190131273 - Chen; Shuo-Mao ; et al.	2019-05-02
Chip Package With Interposer Substrate And Method For Forming The Same App 20190131284 - JENG; Shin-Puu ; et al.	2019-05-02
Semiconductor device package and method of forming semiconductor device package Grant 10,276,551 - Lin , et al.	2019-04-30
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,276,484 - Chen , et al.	2019-04-30
Interconnect structure for package-on-package devices Grant 10,269,685 - Hung , et al.	2019-04-23
Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad Grant 10,269,736 - Chen , et al.	2019-04-23
Semiconductor Package With Dual Sides Of Metal Routing App 20190013273 - Jeng; Shin-Puu ; et al.	2019-01-10
Semicondcutor Device Package And Method Of Forming Semicondcutor Device Package App 20190006341 - Lin; Po-Yao ; et al.	2019-01-03
Chip Package Structure And Method For Forming The Same App 20190006309 - JENG; Shin-Puu ; et al.	2019-01-03
Semiconductor package structure Grant 10,163,860 - Hsu , et al. Dec	2018-12-25
Semiconductor Package And Manufacturing Method Of The Same App 20180350786 - HUNG; JUI-PIN ; et al.	2018-12-06
Semiconductor Package Structure App 20180294237 - HUNG; JUI-PIN ; et al.	2018-10-11
Package Structure And Method Of Forming Package Structure App 20180286824 - JENG; Shin-Puu ; et al.	2018-10-04
Semiconductor package and manufacturing method of the same Grant 10,050,024 - Hung , et al. August 14, 2	2018-08-14
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20180211908 - Chen; Shuo-Mao ; et al.	2018-07-26
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating App 20180211901 - Hung; Jui-Pin ; et al.	2018-07-26
Semiconductor Structure And Manufacturing Method Thereof App 20180204828 - LU; HSIANG-TAI ; et al.	2018-07-19
Semiconductor Structure And Manufacturing Method Thereof App 20180204791 - CHEN; SHUO-MAO ; et al.	2018-07-19
Integrated Circuit Stack Verification Method And System For Performing The Same App 20180203972 - KUO; Feng Wei ; et al.	2018-07-19
Integrated Passive Device Package and Methods of Forming Same App 20180197755 - Hsu; Feng-Cheng ; et al.	2018-07-12
Semiconductor package structure and manufacturing method thereof Grant 9,997,471 - Hung , et al. June 12, 2	2018-06-12
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 9,960,106 - Chen , et al. May 1, 2	2018-05-01
Package with Passive Devices and Method of Forming the Same App 20180082966 - Chen; Shuo-Mao ; et al.	2018-03-22
Interconnect structure for package-on-package devices and a method of fabricating Grant 9,922,903 - Hung , et al. March 20, 2	2018-03-20
Integrated circuit stack verification method and system for performing the same Grant 9,922,160 - Kuo , et al. March 20, 2	2018-03-20
Semiconductor Package Structure And Method Of Manufacturing The Same App 20180068978 - JENG; SHIN-PUU ; et al.	2018-03-08
Integrated passive device package and methods of forming same Grant 9,911,629 - Hsu , et al. March 6, 2	2018-03-06
Semiconductor Package Structure And Method For Manufacturing The Same App 20180033770 - HSU; FENG-CHENG ; et al.	2018-02-01
Semiconductor Package Structure And Manufacturing Method Thereof App 20180025992 - HUNG; JUI-PIN ; et al.	2018-01-25
Semiconductor Package And Manufacturing Method Of The Same App 20170365587 - HUNG; JUI-PIN ; et al.	2017-12-21
Package with passive devices and method of forming the same Grant 9,831,200 - Chen , et al. November 28, 2	2017-11-28
Integrated Passive Device Package And Methods Of Forming Same App 20170229322 - Hsu; Feng-Cheng ; et al.	2017-08-10
Method of Forming Metal Pads with Openings in Integrated Circuits Including Forming a Polymer Extending into a Metal Pad App 20170179052 - Chen; Shuo-Mao ; et al.	2017-06-22
Method of forming metal pads with openings in integrated circuits including forming a polymer plug extending into a metal pad Grant 9,601,372 - Chen , et al. March 21, 2	2017-03-21
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating App 20170025397 - Hung; Jui-Pin ; et al.	2017-01-26
Interconnect structure for package-on-package devices and a method of fabricating Grant 9,460,987 - Hung , et al. October 4, 2	2016-10-04
Integrated Circuit Stack Verification Method And System For Performing The Same App 20160239598 - KUO; Feng Wei ; et al.	2016-08-18
Semiconductor arrangement comprising transmission line surrounded by magnetic layer Grant 9,379,069 - Chen , et al. June 28, 2	2016-06-28
Metal Pads with Openings in Integrated Circuits App 20160118297 - Chen; Shuo-Mao ; et al.	2016-04-28
Band pass filter for 2.5D/3D integrated circuit applications Grant 9,275,923 - Kuo , et al. March 1, 2	2016-03-01
Metal pads with openings in integrated circuits Grant 9,245,833 - Chen , et al. January 26, 2	2016-01-26
Semiconductor Arrangement And Formation Thereof App 20150311160 - Chen; Huan-Neng ; et al.	2015-10-29
Interconnect Structure for Package-on-Package Devices App 20150255447 - Hung; Jui-Pin ; et al.	2015-09-10
Method of fabricating interconnect structure for package-on-package devices Grant 9,048,222 - Hung , et al. June 2, 2	2015-06-02
Packages with passive devices and methods of forming the same Grant 9,040,381 - Yu , et al. May 26, 2	2015-05-26
Semiconductor devices comprising GSG interconnect structures Grant 8,937,389 - Liu , et al. January 20, 2	2015-01-20
Low power/high speed TSV interface design Grant 8,878,369 - Chen , et al. November 4, 2	2014-11-04
Package with Passive Devices and Method of Forming the Same App 20140295624 - Chen; Shuo-Mao ; et al.	2014-10-02
Interconnect Structure for Package-on-Package Devices App 20140252646 - Hung; Jui-Pin ; et al.	2014-09-11
Package with passive devices and method of forming the same Grant 8,809,996 - Chen , et al. August 19, 2	2014-08-19
Packages with passive devices and methods of forming the same Grant 8,680,647 - Yu , et al. March 25, 2	2014-03-25
Packages with Passive Devices and Methods of Forming the Same App 20140073091 - Yu; Chen-Hua ; et al.	2014-03-13
Metal Pads with Openings in Integrated Circuits App 20140061898 - Chen; Shuo-Mao ; et al.	2014-03-06
Semiconductor Devices and Methods of Manufacture Thereof App 20140042612 - Liu; Christianto Chih-Ching ; et al.	2014-02-13
Band Pass Filter for 2.5D/3D Integrated Circuit Applications App 20140029205 - Kuo; Feng Wei ; et al.	2014-01-30
Package with Passive Devices and Method of Forming the Same App 20140001635 - Chen; Shuo-Mao ; et al.	2014-01-02
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20130307119 - CHEN; Shuo-Mao ; et al.	2013-11-21
Packages with Passive Devices and Methods of Forming the Same App 20130168805 - Yu; Chen-Hua ; et al.	2013-07-04
Quadrangle MOS transistors Grant 8,390,078 - Chen , et al. March 5, 2	2013-03-05
Low Power/high Speed Tsv Interface Design App 20130043541 - CHEN; Chung-Hui ; et al.	2013-02-21
Profile design for lateral-vertical bipolar junction transistor Grant 8,324,713 - Chen , et al. December 4, 2	2012-12-04
Four-terminal gate-controlled LVBJTs Grant 8,115,280 - Chen , et al. February 14, 2	2012-02-14
Quadrangle MOS Transistors App 20110303984 - Chen; Shuo-Mao ; et al.	2011-12-15
Four-Terminal Gate-Controlled LVBJTs App 20100219504 - Chen; Chia-Chung ; et al.	2010-09-02
Profile Design for Lateral-Vertical Bipolar Junction Transistor App 20100213575 - Chen; Shuo-Mao ; et al.	2010-08-26
High-gain vertex lateral bipolar junction transistor Grant 7,701,038 - Chen , et al. April 20, 2	2010-04-20
High-gain vertex lateral bipolar junction transistor App 20070105301 - Chen; Shuo-Mao ; et al.	2007-05-10
Inductor device having improved quality factor Grant 6,903,644 - Wang , et al. June 7, 2	2005-06-07
Inductor device having improved quality factor App 20050024176 - Wang, Sung-Hsiung ; et al.	2005-02-03

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