Chen; Shih-li

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Shih-li.The latest application filed is for "fan out type wafer level package structure and method of the same".

Company Profile

0.9.9

Chen; Shih-li - Jhudong Township TW
Chen; Shih-Li - Hsin-Chu TW
Chen; Shih-Li - Hsinchu County TW
Chen; Shih-Li - Hsinchu Hsien TW
Chen; Shih-Li - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing tool for wafer level package and method of placing dies Grant 7,985,626 - Yang , et al. July 26, 2	2011-07-26
Fan out type wafer level package structure and method of the same Grant 7,667,318 - Yang , et al. February 23, 2	2010-02-23
Fan out type wafer level package structure and method of the same Grant 7,557,437 - Yang , et al. July 7, 2	2009-07-07
Fan Out Type Wafer Level Package Structure And Method Of The Same App 20090051025 - Yang; Wen-Kun ; et al.	2009-02-26
Fan out type wafer level package structure and method of the same Grant 7,459,781 - Yang , et al. December 2, 2	2008-12-02
Fan Out Type Wafer Level Package Structure And Method Of The Same App 20080105967 - Yang; Wen-Kun ; et al.	2008-05-08
Fan out type wafer level package structure and method of the same Grant 7,262,081 - Yang , et al. August 28, 2	2007-08-28
Package structure Grant 7,224,061 - Yang , et al. May 29, 2	2007-05-29
Fan out type wafer level package structure and method of the same Grant 7,196,408 - Yang , et al. March 27, 2	2007-03-27
Fan out type wafer level package structure and method of the same App 20070059866 - Yang; Wen-Kun ; et al.	2007-03-15
Fan out type wafer level package structure and method of the same App 20060091514 - Yang; Wen-Kun ; et al.	2006-05-04
Package structure App 20060033196 - Yang; Wen-Kun ; et al.	2006-02-16
Manufacturing tool for wafer level package and method of placing dies App 20050247398 - Yang, Wen Kun ; et al.	2005-11-10
Manufacturing tool for wafer level package and method of placing dies App 20050249945 - Yang, Wen Kun ; et al.	2005-11-10
Fan out type wafer level package structure and method of the same App 20050236696 - Yang, Wen-Kun ; et al.	2005-10-27
Fan out type wafer level package structure and method of the same App 20050124093 - Yang, Wen-Kun ; et al.	2005-06-09
Chip scale package Grant 6,087,586 - Chen July 11, 2	2000-07-11
Method of connecting TEHS on PBGA and modified connecting structure Grant 5,851,337 - Chen December 22, 1	1998-12-22

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