Chen; Meng-Tse

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Meng-Tse.The latest application filed is for "3d package structure and methods of forming same".

Company Profile

46.100.112

Chen; Meng-Tse - Changzhi Township TW
Chen; Meng-Tse - Pingtung County TW
CHEN; MENG TSE - TAICHUNG CITY TW
Chen; Meng-Tse - Pingtung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer level transfer molding and apparatus for performing the same Grant 11,390,000 - Jang , et al. July 19, 2	2022-07-19
Package on package structure and method for forming the same Grant 11,264,342 - Yu , et al. March 1, 2	2022-03-01
Manufacturing method of semiconductor package Grant 11,177,237 - Chen , et al. November 16, 2	2021-11-16
Package-on-package structure having polymer-based material for warpage control Grant 11,133,285 - Chen , et al. September 28, 2	2021-09-28
Method for manufacturing interconnect structure Grant 11,121,104 - Chen , et al. September 14, 2	2021-09-14
3D Package Structure and Methods of Forming Same App 20210091047 - Chen; Meng-Tse ; et al.	2021-03-25
EMI shielding structure in InFO package Grant 10,950,556 - Wu , et al. March 16, 2	2021-03-16
Advanced INFO POP and Method of Forming Thereof App 20210020611 - Tsai; Yi-Da ; et al.	2021-01-21
Stud bump structure for semiconductor package assemblies Grant 10,879,203 - Chen , et al. December 29, 2	2020-12-29
Device package including molding compound having non-planar top surface around a die and method of forming same Grant 10,867,960 - Yu , et al. December 15, 2	2020-12-15
3D package structure and methods of forming same Grant 10,861,827 - Chen , et al. December 8, 2	2020-12-08
Chip package with fan-out structure Grant 10,840,111 - Chen , et al. November 17, 2	2020-11-17
Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates Grant 10,832,999 - Huang , et al. November 10, 2	2020-11-10
Package structure Grant 10,818,614 - Chen , et al. October 27, 2	2020-10-27
Semiconductor Device Having Antenna And Manufacturing Method Thereof App 20200335459 - Wan; Albert ; et al.	2020-10-22
Advanced INFO POP and method of forming thereof Grant 10,797,025 - Tsai , et al. October 6, 2	2020-10-06
Semiconductor device having antenna and manufacturing method thereof Grant 10,741,508 - Wan , et al. A	2020-08-11
Package On Package Structure And Method For Forming The Same App 20200152587 - Yu; Chen-Hua ; et al.	2020-05-14
Packaging Methods for Semiconductor Devices App 20200144171 - Huang; Kuei-Wei ; et al.	2020-05-07
Wafer Level Transfer Molding and Apparatus for Performing the Same App 20200114556 - Jang; Bor-Ping ; et al.	2020-04-16
Manufacturing Method Of Semiconductor Package App 20200118962 - Chen; Meng-Tse ; et al.	2020-04-16
Bump-on-trace packaging structure and method for forming the same Grant 10,600,709 - Chen , et al.	2020-03-24
Package Structure App 20200091090 - Chen; Meng-Tse ; et al.	2020-03-19
Device Package Including Molding Compound Having Non-Planar Top Surface Around A Die App 20200051951 - Yu; Chen-Hua ; et al.	2020-02-13
Package on package structure and method for forming the same Grant 10,559,546 - Yu , et al. Feb	2020-02-11
Semiconductor Bonding Structures and Methods App 20200035510 - Chen; Meng-Tse ; et al.	2020-01-30
Package-on-Package Structure Including a Thermal Isolation Material and Method of Forming the Same App 20200020677 - Chen; Meng-Tse ; et al.	2020-01-16
EMI Shielding Structure in InFO Package App 20200006249 - Wu; Kai-Chiang ; et al.	2020-01-02
Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates Grant 10,522,452 - Huang , et al. Dec	2019-12-31
Wafer level transfer molding and apparatus for performing the same Grant 10,513,070 - Jang , et al. Dec	2019-12-24
Methods of packaging semiconductor devices and packaged semiconductor devices Grant 10,510,719 - Yu , et al. Dec	2019-12-17
Semicondcutor package and manufacturing method thereof Grant 10,510,709 - Chen , et al. Dec	2019-12-17
Package structure and method of fabricating the same Grant 10,504,858 - Chen , et al. Dec	2019-12-10
Package on-package structure including a thermal isolation material and method of forming the same Grant 10,490,539 - Chen , et al. Nov	2019-11-26
EMI Shielding structure in InFO package Grant 10,468,355 - Wu , et al. No	2019-11-05
Device package including molding compound having non-planar top surface around a die Grant 10,468,377 - Yu , et al. No	2019-11-05
Semiconductor Device And Manufacturing Method Thereof App 20190333877 - Wan; Albert ; et al.	2019-10-31
Package Structure And Method Of Fabricating The Same App 20190333870 - Chen; Meng-Tse ; et al.	2019-10-31
3D Package Structure and Methods of Forming Same App 20190273068 - Chen; Meng-Tse ; et al.	2019-09-05
Pre-applying supporting materials between bonded package components Grant 10,366,971 - Hsu , et al. July 30, 2	2019-07-30
Package-on-package Structure Having Polymer-based Material For Warpage Control App 20190221544 - Chen; Meng-Tse ; et al.	2019-07-18
Package-on-package structure and method Grant 10,325,883 - Chiu , et al.	2019-06-18
EMI Shielding Structure in InFO Package App 20190181096 - Wu; Kai-Chiang ; et al.	2019-06-13
Integrated Fan-out Package And Manufacturing Method Thereof App 20190139787 - Chen; Meng-Tse ; et al.	2019-05-09
Integrated fan-out package and manufacturing method thereof Grant 10,283,377 - Chen , et al.	2019-05-07
Semiconductor package and manufacturing method thereof Grant 10,283,470 - Lin , et al.	2019-05-07
Package On Package Structure And Method For Forming The Same App 20190131261 - Yu; Chen-Hua ; et al.	2019-05-02
3D package structure and methods of forming same Grant 10,276,541 - Chen , et al.	2019-04-30
Package-on-package structure having polymer-based material for warpage control Grant 10,269,763 - Chen , et al.	2019-04-23
Bump-on-trace packaging structure and method for forming the same Grant 10,192,804 - Chen , et al. Ja	2019-01-29
Package on package structure and method for forming the same Grant 10,177,104 - Yu , et al. J	2019-01-08
Semiconductor bonding structures and methods Grant 10,153,180 - Chen , et al. Dec	2018-12-11
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices App 20180342482 - Yu; Chen-Hua ; et al.	2018-11-29
Semicondcutor Package And Manufacturing Method Thereof App 20180337149 - Lin; Chih-Wei ; et al.	2018-11-22
Bump-on-trace Packaging Structure And Method For Forming The Same App 20180337106 - Chen; Meng-Tse ; et al.	2018-11-22
Package on-package process for applying molding compound Grant 10,134,703 - Chen , et al. November 20, 2	2018-11-20
Semiconductor Bonding Structures and Methods App 20180330970 - Chen; Meng-Tse ; et al.	2018-11-15
Semicondcutor Package And Manufacturing Method Thereof App 20180308787 - Chen; Meng-Tse ; et al.	2018-10-25
Chip Package With Fan-out Structure App 20180233382 - CHEN; Shing-Chao ; et al.	2018-08-16
Methods of packaging semiconductor devices and packaged semiconductor devices Grant 10,043,778 - Yu , et al. August 7, 2	2018-08-07
Wafer-level molding chase design Grant 10,020,211 - Yu , et al. July 10, 2	2018-07-10
Method For Manufacturing Interconnect Structure App 20180151523 - CHEN; MENG-TSE ; et al.	2018-05-31
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices App 20180108637 - Yu; Chen-Hua ; et al.	2018-04-19
Structure and formation method of chip package with fan-out structure Grant 9,947,552 - Chen , et al. April 17, 2	2018-04-17
Package-on-Package Structure and Method App 20180068985 - Chiu; Sheng-Hsiang ; et al.	2018-03-08
Wafer Level Transfer Molding and Apparatus for Performing the Same App 20180043593 - Jang; Bor-Ping ; et al.	2018-02-15
Device Package with Reduced Thickness and Method for Forming Same App 20180033767 - Yu; Chen-Hua ; et al.	2018-02-01
Manufacturing method of interconnect structure Grant 9,881,888 - Chen , et al. January 30, 2	2018-01-30
Stud Bump Structure For Semiconductor Package Assemblies App 20180005973 - CHEN; Meng-Tse ; et al.	2018-01-04
Package structure and method for forming the same Grant 9,859,229 - Tsai , et al. January 2, 2	2018-01-02
Methods of packaging semiconductor devices and packaged semiconductor devices Grant 9,847,317 - Yu , et al. December 19, 2	2017-12-19
Advanced INFO POP and Method of Forming Thereof App 20170338202 - Tsai; Yi-Da ; et al.	2017-11-23
Package-on-package structure and method Grant 9,818,729 - Chiu , et al. November 14, 2	2017-11-14
Structure And Formation Method Of Chip Package With Fan-out Structure App 20170316957 - CHEN; Shing-Chao ; et al.	2017-11-02
Package Structure And Method For Forming The Same App 20170317038 - TSAI; Yu-Peng ; et al.	2017-11-02
Wafer level transfer molding and apparatus for performing the same Grant 9,802,349 - Jang , et al. October 31, 2	2017-10-31
Device package with reduced thickness and method for forming same Grant 9,786,631 - Yu , et al. October 10, 2	2017-10-10
Package On Package Structure And Method For Forming The Same App 20170287865 - Yu; Chen-Hua ; et al.	2017-10-05
Stud bump structure for semiconductor package assemblies Grant 9,768,137 - Chen , et al. September 19, 2	2017-09-19
Package on package structure and method for forming the same Grant 9,711,470 - Yu , et al. July 18, 2	2017-07-18
Package-on-package Structure Having Polymer-based Material For Warpage Control App 20170194289 - Chen; Meng-Tse ; et al.	2017-07-06
Methods for forming fan-out package structure Grant 9,691,726 - Cheng , et al. June 27, 2	2017-06-27
Singulation apparatus and method Grant 9,679,790 - Lin , et al. June 13, 2	2017-06-13
Package on package bonding structure and method for forming the same Grant 9,673,182 - Huang , et al. June 6, 2	2017-06-06
Process for forming package-on-package structures Grant 9,666,572 - Lin , et al. May 30, 2	2017-05-30
Packages and methods for forming the same Grant 9,627,369 - Chen , et al. April 18, 2	2017-04-18
Package-on-package structure having polymer-based material for warpage control Grant 9,627,355 - Chen , et al. April 18, 2	2017-04-18
Package on-package joint structure with molding open bumps Grant 9,576,888 - Chen , et al. February 21, 2	2017-02-21
3d Package Structure And Methods Of Forming Same App 20170005074 - Chen; Meng-Tse ; et al.	2017-01-05
Method And System For Managing Multiple Devices Within A Network System App 20160380830 - CHENG; WEI JEN ; et al.	2016-12-29
Stacked dies with wire bonds and method Grant 9,508,703 - Yu , et al. November 29, 2	2016-11-29
Package-on-Package Structure Including a Thermal Isolation Material and Method of Forming the Same App 20160343698 - Chen; Meng-Tse ; et al.	2016-11-24
Package on Package Bonding Structure and Method for Forming the Same App 20160322339 - Huang; Kuei-Wei ; et al.	2016-11-03
Interconnect structures for wafer level package and methods of forming same Grant 9,484,285 - Chen , et al. November 1, 2	2016-11-01
Process for Forming Package-on-Package Structures App 20160293588 - Lin; Chih-Wei ; et al.	2016-10-06
Package-on-package Structure Having Polymer-based Material For Warpage Control App 20160247782 - Chen; Meng-Tse ; et al.	2016-08-25
RDL-first packaging process Grant 9,425,178 - Lin , et al. August 23, 2	2016-08-23
Package-on-package structure including a thermal isolation material and method of forming the same Grant 9,418,971 - Chen , et al. August 16, 2	2016-08-16
Interconnect Structure And Manufacturing Method Thereof App 20160211234 - CHEN; MENG-TSE ; et al.	2016-07-21
Package on package bonding structure and method for forming the same Grant 9,397,062 - Huang , et al. July 19, 2	2016-07-19
Process for forming package-on-package structures Grant 9,373,610 - Lin , et al. June 21, 2	2016-06-21
Pre-Applying Supporting Materials Between Bonded Package Components App 20160172348 - Hsu; Yu-Chen ; et al.	2016-06-16
Device Package with Reduced Thickness and Method for Forming Same App 20160148887 - Yu; Chen-Hua ; et al.	2016-05-26
Package-on-package structure having polymer-based material for warpage control Grant 9,349,663 - Chen , et al. May 24, 2	2016-05-24
Singulation Apparatus And Method App 20160126116 - LIN; CHUN-CHENG ; et al.	2016-05-05
Semiconductor interconnect structure Grant 9,331,038 - Chen , et al. May 3, 2	2016-05-03
Package On Package Structure And Method For Forming The Same App 20160111385 - Yu; Chen-Hua ; et al.	2016-04-21
Semiconductor packages Grant 9,312,243 - Chen , et al. April 12, 2	2016-04-12
Semiconductor packages having polymer-containing substrates and methods of forming same Grant 9,312,214 - Chen , et al. April 12, 2	2016-04-12
Pre-applying supporting materials between bonded package components Grant 9,293,404 - Hsu , et al. March 22, 2	2016-03-22
Interconnect Structures for Wafer Level Package and Methods of Forming Same App 20160056056 - Chen; Meng-Tse ; et al.	2016-02-25
Packaging methods and packaged semiconductor devices Grant 9,269,687 - Chen , et al. February 23, 2	2016-02-23
Singulation apparatus and method Grant 9,257,321 - Lin , et al. February 9, 2	2016-02-09
Rdl-first Packaging Process App 20160013172 - Lin; Chih-Wei ; et al.	2016-01-14
Methods For Forming Fan-out Package Structure App 20160013147 - Cheng; Ming-Da ; et al.	2016-01-14
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices App 20160013152 - Yu; Chen-Hua ; et al.	2016-01-14
Package on package structures and methods for forming the same Grant 9,219,030 - Yu , et al. December 22, 2	2015-12-22
Wafer-level Molding Chase Design App 20150364456 - Yu; Chen-Hua ; et al.	2015-12-17
Process for Forming Package-on-Package Structures App 20150348957 - Lin; Chih-Wei ; et al.	2015-12-03
Stacked Dies With Wire Bonds and Method App 20150318264 - Yu; Chen-Hua ; et al.	2015-11-05
Packages and Methods for Forming the Same App 20150243642 - Chen; Meng-Tse ; et al.	2015-08-27
Process for forming package-on-package structures Grant 9,117,816 - Lin , et al. August 25, 2	2015-08-25
Packaging methods and structures for semiconductor devices Grant 9,082,636 - Lin , et al. July 14, 2	2015-07-14
Methods for forming 3DIC package Grant 9,073,158 - Chen , et al. July 7, 2	2015-07-07
Package on Package Bonding Structure and Method for Forming the Same App 20150187723 - Huang; Kuei-Wei ; et al.	2015-07-02
Process for Forming Package-on-Package Structures App 20150179624 - Lin; Chih-Wei ; et al.	2015-06-25
Contact structure Grant 9,059,148 - Chen , et al. June 16, 2	2015-06-16
Exposing connectors in packages through selective treatment Grant 9,054,047 - Yu , et al. June 9, 2	2015-06-09
Packages and methods for forming the same Grant 9,030,022 - Chen , et al. May 12, 2	2015-05-12
Semiconductor Bonding Structures and Methods App 20150091193 - Chen; Meng-Tse ; et al.	2015-04-02
Process for forming package-on-package structures Grant 8,975,741 - Lin , et al. March 10, 2	2015-03-10
Interconnect Structure And Manufacturing Method Thereof App 20150061115 - CHEN; MENG-TSE ; et al.	2015-03-05
Packaging Methods and Structures for Semiconductor Devices App 20150044819 - Lin; Chih-Wei ; et al.	2015-02-12
Semiconductor Packages App 20150008594 - Chen; Meng-Tse ; et al.	2015-01-08
Package-on-Package Process for Applying Molding Compound App 20150008581 - Chen; Meng-Tse ; et al.	2015-01-08
Package-on-package process for applying molding compound Grant 8,927,391 - Chen , et al. January 6, 2	2015-01-06
Package on package bonding structure and method for forming the same Grant 8,928,134 - Huang , et al. January 6, 2	2015-01-06
Singulation Apparatus And Method App 20140370659 - LIN; CHUN-CHENG ; et al.	2014-12-18
Methods and apparatus for package on package structures Grant 8,889,486 - Chen , et al. November 18, 2	2014-11-18
Packaging methods and structures for semiconductor devices Grant 8,884,431 - Lin , et al. November 11, 2	2014-11-11
Wafer Level Transfer Molding And Apparatus For Performing The Same App 20140291881 - Jang; Bor-Ping ; et al.	2014-10-02
Warpage control in a package-on-package structure Grant 8,846,448 - Chen , et al. September 30, 2	2014-09-30
Package-on-Package Joint Structure with Molding Open Bumps App 20140264858 - Chen; Meng-Tse ; et al.	2014-09-18
Packaging Methods and Packaged Semiconductor Devices App 20140231988 - Chen; Meng-Tse ; et al.	2014-08-21
Pre-Applying Supporting Materials between Bonded Package Components App 20140203456 - Hsu; Yu-Chen ; et al.	2014-07-24
Package On Package Bonding Structure And Method For Forming The Same App 20140183732 - Huang; Kuei-Wei ; et al.	2014-07-03
Exposing Connectors in Packages Through Selective Treatment App 20140131896 - Yu; Chen-Hua ; et al.	2014-05-15
Package-on-package Structure Including A Thermal Isolation Material And Method Of Forming The Same App 20140124955 - CHEN; Meng-Tse ; et al.	2014-05-08
Methods for Forming 3DIC Package App 20140091509 - Chen; Meng-Tse ; et al.	2014-04-03
Methods and Apparatus for Package on Package Structures App 20140061932 - Chen; Meng-Tse ; et al.	2014-03-06
Exposing connectors in packages through selective treatment Grant 8,664,040 - Yu , et al. March 4, 2	2014-03-04
Method To Control Underfill Fillet Width App 20140048934 - Chen; Meng-Tse ; et al.	2014-02-20
Warpage Control In A Package-on-package Structure App 20140045300 - Chen; Meng-Tse ; et al.	2014-02-13
Method and apparatus for reducing package warpage Grant 8,642,445 - Chen , et al. February 4, 2	2014-02-04
Bump-on-trace Packaging Structure And Method For Forming The Same App 20140008786 - Chen; Meng-Tse ; et al.	2014-01-09
Package-on-package Structure Having Polymer-based Material For Warpage Control App 20140001652 - CHEN; Meng-Tse ; et al.	2014-01-02
Contact and Method of Formation App 20130334710 - Chen; Meng-Tse ; et al.	2013-12-19
Methods for forming 3DIC package Grant 8,609,462 - Chen , et al. December 17, 2	2013-12-17
Process for forming packages Grant 8,603,860 - Chen , et al. December 10, 2	2013-12-10
Contact and method of formation Grant 8,586,408 - Chen , et al. November 19, 2	2013-11-19
Stud Bump Structure For Semiconductor Package Assemblies App 20130285238 - CHEN; Meng-Tse ; et al.	2013-10-31
Package On Package Structures And Methods For Forming The Same App 20130270700 - YU; Chen-Hua ; et al.	2013-10-17
Method And Apparatus For Reducing Package Warpage App 20130260535 - CHEN; Meng-Tse ; et al.	2013-10-03
Packaging Methods and Packaged Semiconductor Devices App 20130234317 - Chen; Meng-Tse ; et al.	2013-09-12
Exposing Connectors in Packages Through Selective Treatment App 20130154086 - Yu; Chen-Hua ; et al.	2013-06-20
Contact and Method of Formation App 20130113116 - Chen; Meng-Tse ; et al.	2013-05-09
Apparatus and Methods for Molded Underfills in Flip Chip Packaging App 20130115735 - Chen; Meng-Tse ; et al.	2013-05-09
Packages and Methods for Forming the Same App 20130099385 - Chen; Meng-Tse ; et al.	2013-04-25
Process for Forming Packages App 20130102112 - Chen; Meng-Tse ; et al.	2013-04-25
Methods for Forming 3DIC Package App 20130095608 - Chen; Meng-Tse ; et al.	2013-04-18
Process for Forming Package-on-Package Structures App 20130093078 - Lin; Chih-Wei ; et al.	2013-04-18
Packaging Methods for Semiconductor Devices App 20130095611 - Huang; Kuei-Wei ; et al.	2013-04-18
Forming Packages Having Polymer-Based Substrates App 20130075921 - Chen; Meng-Tse ; et al.	2013-03-28
Packaging Methods and Structures for Semiconductor Devices App 20130062761 - Lin; Chih-Wei ; et al.	2013-03-14
Package-on-Package Process for Applying Molding Compound App 20120299181 - Chen; Meng-Tse ; et al.	2012-11-29
Methods and Apparatus for Thin Die Processing App 20120267423 - Huang; Kuei-Wei ; et al.	2012-10-25