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Chen; Man-Lin Patent Filings

Chen; Man-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Man-Lin.The latest application filed is for "wood adhesive".

Company Profile
3.8.10
  • Chen; Man-Lin - Miaoli County TW
  • Chen; Man-Lin - Miaoli Hsien TW
  • Chen; Man-Lin - Houlong Township TW
  • Chen; Man-Lin - Mieo-Li Hsien TW
  • Chen; Man-Lin - Miau-Li Hsien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wood adhesive, method for adhering wood materials using the same, and composite wood structure using the same
Grant 10,759,148 - Chen , et al. Sep
2020-09-01
Wood adhesive
Grant 10,351,737 - Chen , et al. July 16, 2
2019-07-16
Wood adhesive
Grant 10,190,026 - Chen , et al. Ja
2019-01-29
Wood Adhesive
App 20180355225 - CHEN; Man-Lin ;   et al.
2018-12-13
Wood Adhesive, Method For Adhering Wood Materials Using The Same, And Composite Wood Structure Using The Same
App 20180345632 - Chen; Man-Lin ;   et al.
2018-12-06
Wood Adhesive
App 20170081563 - CHEN; Man-Lin ;   et al.
2017-03-23
Biomass photosensitive material and method for manufacturing the same, and printed circuit board
Grant 9,392,688 - Chen , et al. July 12, 2
2016-07-12
Biomass Photosensitive Material And Method For Manufacturing The Same, And Printed Circuit Board
App 20160004158 - CHEN; Man-Lin ;   et al.
2016-01-07
Wood Adhesive, Method For Adhering Wood Materials Using The Same, And Composite Wood Structure Using The Same
App 20150232724 - Chen; Man-Lin ;   et al.
2015-08-20
Resin Composition, Resin And Method For Manufacturing The Same
App 20130084454 - Lin; Hsien-Kuang ;   et al.
2013-04-04
Sealant composition
Grant 8,193,258 - Jeng , et al. June 5, 2
2012-06-05
Sealant Composition
App 20100280143 - Jeng; Jauder ;   et al.
2010-11-04
Photosensitive insulating film of organic light emitting diode (OLED)
Grant 6,841,266 - Chen , et al. January 11, 2
2005-01-11
Method of forming via-holes in multilayer circuit boards
Grant 6,632,372 - Chen , et al. October 14, 2
2003-10-14
Photosensitive insulating film of organic light emitting diode (OLED)
App 20030170493 - Chen, Man-Lin ;   et al.
2003-09-11
Photosensitive composition
App 20020086239 - Chen, Man-Lin ;   et al.
2002-07-04
Method for manufacturing high-density multilayer printed circuit boards
Grant 6,119,338 - Wang , et al. September 19, 2
2000-09-19

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