loadpatents
name:-0.09719705581665
name:-0.068919897079468
name:-0.022133827209473
Chen; Chia-Cheng Patent Filings

Chen; Chia-Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Chia-Cheng.The latest application filed is for "wafer positioning method and apparatus".

Company Profile
33.84.98
  • Chen; Chia-Cheng - Hsinchu TW
  • Chen; Chia-Cheng - Chu City TW
  • Chen; Chia Cheng - San Francisco CA
  • CHEN; Chia-Cheng - Toufen Township TW
  • Chen; Chia-Cheng - Taichung TW
  • CHEN; Chia-Cheng - Jiaxing City CN
  • CHEN; Chia-Cheng - Hsin-Chu City TW
  • CHEN; Chia-Cheng - Hsinchu City TW
  • Chen; Chia-Cheng - Hsin-Chu TW
  • Chen; Chia-Cheng - Taichung City TW
  • Chen; Chia-Cheng - Taoyuan TW
  • CHEN; CHIA-CHENG - TAOYUAN CITY TW
  • CHEN; Chia-Cheng - Zhongli City TW
  • Chen; Chia-Cheng - Madou Township TW
  • Chen; Chia-Cheng - Zhongli TW
  • Chen; Chia-Cheng - Taichung County N/A TW
  • Chen; Chia-Cheng - Tayuan TW
  • Chen; Chia-Cheng - Sinjhuang TW
  • Chen; Chia-Cheng - Sinjhuang City TW
  • Chen; Chia-Cheng - Chia-Yi TW
  • Chen; Chia-Cheng - Taipei TW
  • Chen; Chia-Cheng - Taipei City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ion implant process for defect elimination in metal layer planarization
Grant 11,450,565 - Chen , et al. September 20, 2
2022-09-20
Doping for semiconductor device with conductive feature
Grant 11,450,741 - Liu , et al. September 20, 2
2022-09-20
Wafer Positioning Method and Apparatus
App 20220293448 - Chen; Chia-Cheng ;   et al.
2022-09-15
Ion exposure method and apparatus
Grant 11,393,695 - Chen , et al. July 19, 2
2022-07-19
Display screen or portion thereof with graphical user interface
Grant D956,099 - Gaunt , et al. June 28, 2
2022-06-28
System And Method For Multiple Step Directional Patterning
App 20220102139 - YANG; Chih-Kai ;   et al.
2022-03-31
Balanced Negative Bitline Voltage For A Write Assist Circuit
App 20220093153 - TSAI; Jui-Che ;   et al.
2022-03-24
High surface dopant concentration formation processes and structures formed thereby
Grant 11,257,906 - Chen , et al. February 22, 2
2022-02-22
Display screen or portion thereof with transitional computer graphical interface thereon
Grant D940,755 - Gaunt , et al. January 11, 2
2022-01-11
Method for fabricating electronic package
Grant 11,205,644 - Wu , et al. December 21, 2
2021-12-21
Method and associated system for circuit design
Grant 11,200,364 - Chen , et al. December 14, 2
2021-12-14
Balanced negative bitline voltage for a write assist circuit
Grant 11,195,567 - Tsai , et al. December 7, 2
2021-12-07
Ion Implant Process For Defect Elimination In Metal Layer Planarization
App 20210305092 - CHEN; Chia-Cheng ;   et al.
2021-09-30
Cleaning Tool
App 20210299846 - CHEN; Chia-Cheng
2021-09-30
Cleaning Tool
App 20210299847 - CHEN; CHIA-CHENG
2021-09-30
Display screen or portion thereof with transitional graphical user interface
Grant D929,461 - Matsui , et al. August 31, 2
2021-08-31
Doping for Semiconductor Device with Conductive Feature
App 20210226008 - Liu; Su-Hao ;   et al.
2021-07-22
Balanced Negative Bitline Voltage For A Write Assist Circuit
App 20210201977 - TSAI; Jui-Che ;   et al.
2021-07-01
Formation method of semiconductor device with low resistance contact
Grant 11,049,972 - Chen , et al. June 29, 2
2021-06-29
Semiconductor Device and Method of Manufacture
App 20210134660 - Wang; Yu Shih ;   et al.
2021-05-06
Method Of Manufacturing Semiconductor Devices
App 20210096473 - LIU; Ru-Gun ;   et al.
2021-04-01
FinFET Devices and Methods of Forming
App 20210091209 - Chen; Chia-Cheng ;   et al.
2021-03-25
Method And Associated System For Circuit Design
App 20210089630 - CHEN; CHIA CHENG ;   et al.
2021-03-25
Doping for semiconductor device with conductive feature
Grant 10,950,694 - Liu , et al. March 16, 2
2021-03-16
Field effect transistor contact with reduced contact resistance using implantation process
Grant 10,868,178 - Liu , et al. December 15, 2
2020-12-15
FinFET devices and methods of forming
Grant 10,861,957 - Chen , et al. December 8, 2
2020-12-08
Method For Forming Semiconductor Structure
App 20200343242 - CHEN; Chia-Cheng ;   et al.
2020-10-29
Package Stack Structure, Method For Fabricating The Same, And Carrier Component
App 20200328142 - Jiang; Don-Son ;   et al.
2020-10-15
High Surface Dopant Concentration Formation Processes and Structures Formed Thereby
App 20200295135 - Chen; Chia-Cheng ;   et al.
2020-09-17
Fin field effect transistors having conformal oxide layers and methods of forming same
Grant 10,756,199 - Chen , et al. A
2020-08-25
Formation Method Of Semiconductor Device With Low Resistance Contact
App 20200266299 - CHEN; Chia-Cheng ;   et al.
2020-08-20
Semiconductor structure and method for forming the same
Grant 10,727,226 - Chen , et al.
2020-07-28
Method For Fabricating Electronic Package
App 20200212019 - Wu; Chi-Rui ;   et al.
2020-07-02
High surface dopant concentration formation processes and structures formed thereby
Grant 10,672,871 - Chen , et al.
2020-06-02
Structure and formation method of semiconductor device with low resistance contact
Grant 10,658,508 - Chen , et al.
2020-05-19
Electronic package and method for fabricating the same
Grant 10,629,572 - Wu , et al.
2020-04-21
Field Effect Transistor Contact with Reduced Contact Resistance Using Implantation Process
App 20200119195 - Liu; Su-Hao ;   et al.
2020-04-16
High Surface Dopant Concentration Formation Processes and Structures Formed Thereby
App 20200006486 - Chen; Chia-Cheng ;   et al.
2020-01-02
Field effect transistor contact with reduced contact resistance using implantation process
Grant 10,510,891 - Liu , et al. Dec
2019-12-17
High surface dopant concentration formation processes and structures formed thereby
Grant 10,510,838 - Chen , et al. Dec
2019-12-17
Field Effect Transistor Contact with Reduced Contact Resistance Using Implantation Process
App 20190378928 - Liu; Su-Hao ;   et al.
2019-12-12
Electronic package and method for fabricating the same
Grant 10,431,535 - Chen , et al. O
2019-10-01
Doping for Semiconductor Device with Conductive Feature
App 20190288068 - Liu; Su-Hao ;   et al.
2019-09-19
Fin Field Effect Transistors having Conformal Oxide Layers and Methods of Forming Same
App 20190245057 - Chen; Chia-Cheng ;   et al.
2019-08-08
Field effect transistor contact with reduced contact resistance using implantation process
Grant 10,347,762 - Liu , et al. July 9, 2
2019-07-09
Doping for semiconductor device with conductive feature
Grant 10,347,720 - Liu , et al. July 9, 2
2019-07-09
FinFET device and methods of forming
Grant 10,326,003 - Chen , et al.
2019-06-18
High Surface Dopant Concentration Formation Processes And Structures Formed Thereby
App 20190165099 - CHEN; Chia-Cheng ;   et al.
2019-05-30
Electronic Package And Method For Fabricating The Same
App 20190164941 - Wu; Chi-Rui ;   et al.
2019-05-30
Structure And Formation Method Of Semiconductor Device With Low Resistance Contact
App 20190157456 - CHEN; Chia-Cheng ;   et al.
2019-05-23
Doping for Semiconductor Device with Conductive Feature
App 20190131399 - LIU; Su-Hao ;   et al.
2019-05-02
FinFET Devices and Methods of Forming
App 20190123181 - Chen; Chia-Cheng ;   et al.
2019-04-25
Fin field effect transistors having conformal oxide layers and methods of forming same
Grant 10,269,921 - Chen , et al.
2019-04-23
Semiconductor Structure And Method For Forming The Same
App 20190027473 - CHEN; Chia-Cheng ;   et al.
2019-01-24
FinFET devices and methods of forming
Grant 10,164,066 - Chen , et al. Dec
2018-12-25
Method of fabricating semiconductor package structure
Grant 10,141,266 - Pai , et al. Nov
2018-11-27
Double gate trench power transistor and manufacturing method thereof
Grant 10,128,368 - Li , et al. November 13, 2
2018-11-13
Electronic Package And Method For Fabricating The Same
App 20180316083 - Chen; Jui-Feng ;   et al.
2018-11-01
Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
Grant 10,068,842 - Chiu , et al. September 4, 2
2018-09-04
Semiconductor package structure and method of fabricating the same
Grant 10,043,757 - Pai , et al. August 7, 2
2018-08-07
Method of fabricating package structure with an embedded electronic component
Grant 10,002,825 - Chiu , et al. June 19, 2
2018-06-19
Fabrication method of semiconductor package
Grant 9,991,197 - Chen , et al. June 5, 2
2018-06-05
FinFET Devices and Methods of Forming
App 20180151704 - CHEN; CHIA-CHENG ;   et al.
2018-05-31
FINFET Device and Methods of Forming
App 20180151701 - Chen; Chia-Cheng ;   et al.
2018-05-31
Fin Field Effect Transistors having Conformal Oxide Layers and Methods of Forming Same
App 20180145143 - Chen; Chia-Cheng ;   et al.
2018-05-24
Method of forming a semiconductor structure
Grant 9,922,827 - Yao , et al. March 20, 2
2018-03-20
Fabrication method of coreless packaging substrate
Grant 9,899,249 - Pai , et al. February 20, 2
2018-02-20
Methods of forming gate dielectric material
Grant 9,893,160 - Yao , et al. February 13, 2
2018-02-13
Method Of Fabricating Package Structure With An Embedded Electronic Component
App 20170352615 - Chiu; Shih-Chao ;   et al.
2017-12-07
Single-layer Wiring Package Substrate, Single-layer Wiring Package Structure Having The Package Substrate, And Method Of Fabricating The Same
App 20170309537 - Chiu; Shih-Chao ;   et al.
2017-10-26
Fabrication Method Of Package Structure
App 20170301658 - Pai; Yu-Cheng ;   et al.
2017-10-19
Fabrication Method Of Semiconductor Package
App 20170294372 - Chen; Chia-Cheng ;   et al.
2017-10-12
Semiconductor Package Structure And Method Of Fabricating The Same
App 20170287840 - Pai; Yu-Cheng ;   et al.
2017-10-05
Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
Grant 9,735,080 - Chiu , et al. August 15, 2
2017-08-15
Package structure with an embedded electronic component and method of fabricating the package structure
Grant 9,716,060 - Chiu , et al. July 25, 2
2017-07-25
Double Gate Trench Power Transistor And Manufacturing Method Thereof
App 20170200822 - LI; PO-HSIEN ;   et al.
2017-07-13
Method Of Fabricating Substrate Structure
App 20170171981 - Lin; Chun-Hsien ;   et al.
2017-06-15
Package structure having a laminated release layer and method for fabricating the same
Grant 9,673,140 - Chen , et al. June 6, 2
2017-06-06
System and method for memory scan design-for-test
Grant 9,666,302 - Chang , et al. May 30, 2
2017-05-30
Fabrication Method Of Coreless Packaging Substrate
App 20170047240 - Pai; Yu-Cheng ;   et al.
2017-02-16
Fin field effect transistors having conformal oxide layers and methods of forming same
Grant 9,515,188 - Chen , et al. December 6, 2
2016-12-06
Coreless packaging substrate and fabrication method thereof
Grant 9,510,463 - Pai , et al. November 29, 2
2016-11-29
Static random access memory and method of controlling the same
Grant 9,455,025 - Wu , et al. September 27, 2
2016-09-27
Package Carrier, Semiconductor Package, And Process For Fabricating Same
App 20160218019 - SU; Yuan-Chang ;   et al.
2016-07-28
Fin Field Effect Transistors Having Conformal Oxide Layers and Methods of Forming Same
App 20160181428 - Chen; Chia-Cheng ;   et al.
2016-06-23
Single-layer Wiring Package Substrate, Single-layer Wiring Package Structure Having The Package Substrate, And Method Of Fabricating The Same
App 20160163621 - Chiu; Shih-Chao ;   et al.
2016-06-09
Package Substrate, Package Structure, And Methods Of Fabricating The Same
App 20160099204 - Lin; Chang-Fu ;   et al.
2016-04-07
Package Structure With An Embedded Electronic Component And Method Of Fabricating The Package Structure
App 20160079151 - Chiu; Shih-Chao ;   et al.
2016-03-17
Semiconductor Package Structure And Method Of Fabricating The Same
App 20160079170 - Pai; Yu-Cheng ;   et al.
2016-03-17
Substrate Structure And Method Of Fabricating The Same
App 20160081186 - Lin; Chun-Hsien ;   et al.
2016-03-17
Memory cell array including a write-assist circuit and embedded coupling capacitor and method of forming same
Grant 9,281,311 - Wu , et al. March 8, 2
2016-03-08
Coreless Packaging Substrate And Fabrication Method Thereof
App 20160021743 - Pai; Yu-Cheng ;   et al.
2016-01-21
Package Structure And Fabrication Method Thereof
App 20160013123 - Pai; Yu-Cheng ;   et al.
2016-01-14
Simultaneous two/dual port access on 6T SRAM
Grant 9,230,622 - Wu , et al. January 5, 2
2016-01-05
Static Random Access Memory And Method Of Controlling The Same
App 20150380077 - WU; Ching-Wei ;   et al.
2015-12-31
Semiconductor package with single sided substrate design and manufacturing methods thereof
Grant 9,196,597 - Su , et al. November 24, 2
2015-11-24
Package Substrate And Method For Fabricating The Same
App 20150333029 - Pai; Yu-cheng ;   et al.
2015-11-19
Vccmin for a dual port synchronous random access memory (DPSRAM) cell utilized as a single port synchronous random access memory (SPSRAM) cell
Grant 9,183,907 - Wu , et al. November 10, 2
2015-11-10
Semiconductor package and process for fabricating same
Grant 9,165,900 - Su , et al. October 20, 2
2015-10-20
Package Structure And Method For Fabricating The Same
App 20150287671 - Chen; Chia-Cheng ;   et al.
2015-10-08
Method Of Forming A Semiconductor Structure
App 20150249011 - YAO; Liang-Gi ;   et al.
2015-09-03
Semiconductor package and fabrication method thereof
Grant 9,082,723 - Chen , et al. July 14, 2
2015-07-14
Timing logic for memory array
Grant 9,064,604 - Yang , et al. June 23, 2
2015-06-23
Semiconductor Package And Fabrication Method Thereof
App 20150155250 - Chen; Tzu-Chieh ;   et al.
2015-06-04
Method of forming semiconductor structure
Grant 9,040,393 - Yao , et al. May 26, 2
2015-05-26
Package Structure And Fabrication Method Thereof
App 20150102484 - Chen; Chia-Cheng ;   et al.
2015-04-16
Method And Apparatus For Forming An Integrated Circuit With A Metalized Coupling Capacitor
App 20150076575 - WU; Ching-Wei ;   et al.
2015-03-19
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof
App 20140346670 - Su; Yuan-Chang ;   et al.
2014-11-27
Semiconductor package with single sided substrate design and manufacturing methods thereof
Grant 8,884,424 - Su , et al. November 11, 2
2014-11-11
Timing Logic For Memory Array
App 20140269021 - Yang; Harn-Bor ;   et al.
2014-09-18
Semiconductor package and process for fabricating same
Grant 8,786,062 - Su , et al. July 22, 2
2014-07-22
Simultaneous Two/Dual Port Access on 6T SRAM
App 20140153349 - Wu; Ching-Wei ;   et al.
2014-06-05
Semiconductor Package And Process For Fabricating Same
App 20140151876 - Su; Yuan-Chang ;   et al.
2014-06-05
Vccmin For A Dual Port Synchronous Random Access Memory (dpsram) Cell Utilized As A Single Port Synchronous Random Access Memory (spsram) Cell
App 20140146631 - Wu; Ching-Wei ;   et al.
2014-05-29
Semiconductor Package And Fabrication Method Thereof
App 20140091462 - Chen; Chia-Cheng ;   et al.
2014-04-03
Methods Of Forming Gate Dielectric Material
App 20140080316 - YAO; Liang-Gi ;   et al.
2014-03-20
Low power static random access memory
Grant 8,659,936 - Chuang , et al. February 25, 2
2014-02-25
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof
App 20140021636 - Su; Yuan-Chang ;   et al.
2014-01-23
Methods of forming gate dielectric material
Grant 8,603,924 - Yao , et al. December 10, 2
2013-12-10
Semiconductor package with single sided substrate design and manufacturing methods thereof
Grant 8,569,894 - Su , et al. October 29, 2
2013-10-29
Locking device for a display mounting assembly
Grant 8,556,220 - Chen October 15, 2
2013-10-15
Locking device for a display mounting assembly
App 20130256244 - CHEN; Chia-Cheng
2013-10-03
Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
Grant 8,399,776 - Appelt , et al. March 19, 2
2013-03-19
A Mounting Kit
App 20130048811 - TSENG; Yi-Chen ;   et al.
2013-02-28
Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof
Grant 8,367,473 - Huang , et al. February 5, 2
2013-02-05
Data-aware dynamic supply random access memory
Grant 8,345,504 - Chuang , et al. January 1, 2
2013-01-01
Static random access memory with data controlled power supply
Grant 8,320,164 - Chuang , et al. November 27, 2
2012-11-27
Circuit substrate for mounting electronic component and circuit substrate assembly having same
Grant 8,300,420 - Tsai , et al. October 30, 2
2012-10-30
Semiconductor package with substrate having single metal layer and manufacturing methods thereof
Grant 8,288,869 - Huang , et al. October 16, 2
2012-10-16
Supporting frame of a table
Grant D666,029 - Chen August 28, 2
2012-08-28
Memory circuit and method for controlling memory circuit
Grant 8,228,752 - Li , et al. July 24, 2
2012-07-24
Variation-tolerant word-line under-drive scheme for random access memory
Grant 8,213,257 - Chuang , et al. July 3, 2
2012-07-03
Methods Of Forming Gate Dielectric Material
App 20120094504 - YAO; Liang-Gi ;   et al.
2012-04-19
Data-aware Dynamic Supply Random Access Memory
App 20120044779 - Chuang; Ching-Te ;   et al.
2012-02-23
Variation-tolerant Word-line Under-drive Scheme For Random Access Memory
App 20120033522 - Chuang; Ching-Te ;   et al.
2012-02-09
Method Of Forming Semiconductor Structure
App 20120015503 - YAO; Liang-Gi ;   et al.
2012-01-19
Static Random Access Memory With Data Controlled Power Supply
App 20120008377 - Chuang; Ching-Te ;   et al.
2012-01-12
Low Power Static Random Access Memory
App 20120008449 - Chuang; Ching-Te ;   et al.
2012-01-12
Stand
Grant D651,826 - Tseng , et al. January 10, 2
2012-01-10
Method for manufacturing printed circuit boards
Grant 8,088,294 - Yeh , et al. January 3, 2
2012-01-03
Printed circuit board and method for manufacturing same
Grant 8,067,696 - Tsai , et al. November 29, 2
2011-11-29
Memory Circuit And Method For Controlling Memory Circuit
App 20110273951 - Li; Hung-Yu ;   et al.
2011-11-10
Lamp holder with a fixing element fixed to a contact plate on one side of an insulating base and to a wiring element on other side of the base
Grant 8,033,858 - Chen October 11, 2
2011-10-11
Method for manufacturing flexible printed circuit boards
Grant 8,001,684 - Chen , et al. August 23, 2
2011-08-23
Flexible base for manufacturing flexible printed circuit boards
Grant 7,989,048 - Yeh , et al. August 2, 2
2011-08-02
Semiconductor Package with Single Sided Substrate Design and Manufacturing Methods Thereof
App 20110169150 - Su; Yuan-Chang ;   et al.
2011-07-14
Package Carrier, Semiconductor Package, And Process For Fabricating Same
App 20110084372 - SU; YUAN-CHANG ;   et al.
2011-04-14
Semiconductor Package And Process For Fabricating Same
App 20110084370 - SU; YUAN-CHANG ;   et al.
2011-04-14
Semiconductor Package With Substrate Having Single Metal Layer And Manufacturing Methods Thereof
App 20100320610 - HUANG; SHIH-FU ;   et al.
2010-12-23
Substrate Having Single Patterned Metal Layer Exposing Patterned Dielectric Layer, Chip Package Structure Including The Substrate, And Manufacturing Methods Thereof
App 20100314744 - Huang; Shih-Fu ;   et al.
2010-12-16
Substrate Having Embedded Single Patterned Metal Layer, And Package Applied With The Same, And Methods Of Manufacturing Of The Substrate And Package
App 20100289132 - Huang; Shih-Fu ;   et al.
2010-11-18
Substrate Having Single Patterned Metal Layer, And Package Applied With The Substrate , And Methods Of Manufacturing Of The Substrate And Package
App 20100288541 - APPELT; Bernd Karl ;   et al.
2010-11-18
Method for mounting electronic component on printed circuit board
Grant 7,799,603 - Tsai , et al. September 21, 2
2010-09-21
Labor-saving pivotal shaft structure
Grant 7,743,466 - Tu , et al. June 29, 2
2010-06-29
Circuit Substrate For Mounting Electronic Component And Circuit Substrate Assembly Having Same
App 20100051331 - TSAI; CHUNG-JEN ;   et al.
2010-03-04
Circuit Substrate For Mounting Electronic Component And Circuit Substrate Assembly Having Same
App 20100051332 - TSAI; CHUNG-JEN ;   et al.
2010-03-04
Printed Circuit Board And Method For Manufacturing Same
App 20100038116 - TSAI; CHUNG-JEN ;   et al.
2010-02-18
Method For Mounting Electronic Component On Printed Circuit Board
App 20100003784 - TSAI; CHUNG-JEN ;   et al.
2010-01-07
Sliding module and its axle structure
Grant 7,613,485 - Chen , et al. November 3, 2
2009-11-03
Method For Manufacturing Printed Circuit Board
App 20090139086 - YEH; TSO-HUNG ;   et al.
2009-06-04
Method For Manufacturing Printed Circuit Boards
App 20090050600 - YEH; TSO-HUNG ;   et al.
2009-02-26
Method For Manufacturing Flexible Printed Circuit Boards
App 20090007421 - CHEN; CHIA-CHENG ;   et al.
2009-01-08
Flexible Base For Manufacturing Flexible Printed Circuit Boards
App 20090011186 - YEH; TSO-HUNG ;   et al.
2009-01-08
Magnetic switch with auto-release function
App 20080061565 - Lee; Yung-Ta ;   et al.
2008-03-13
Hinge structure
App 20080022492 - Lee; Yung-Ta ;   et al.
2008-01-31
Laborsaving cam wheel structure
App 20070221011 - Wang; Chih-Yuen ;   et al.
2007-09-27
AND type match circuit structure for content-addressable memories
App 20070182455 - Wang; Jinn-Shyan ;   et al.
2007-08-09
Rotating shaft structure
App 20070169314 - Lee; Wang-Jui ;   et al.
2007-07-26
Labor-saving pivotal shaft structure
App 20070163373 - Tu; Chung-Ho ;   et al.
2007-07-19
Wireless identification security activation device
Grant 7,184,752 - Chen , et al. February 27, 2
2007-02-27
Sliding module and its axle structure
App 20070030590 - Chen; Chia-Cheng ;   et al.
2007-02-08
Wireless Identification Security Activation Device
App 20060111096 - Chen; Chia-Cheng ;   et al.
2006-05-25

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