| Patent | Date |
|---|
Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20220301970 - Kao; Chin-Fu ; et al. | 2022-09-22 |
Package And Package-on-package Structure Having Elliptical Columns And Ellipsoid Joint Terminals
App 20220301964 - Chiu; Sheng-Huan ; et al. | 2022-09-22 |
Method Of Forming Semiconductor Device
App 20220293494 - Yang; Cheng-Lung ; et al. | 2022-09-15 |
LTHC as charging barrier in InFO package formation
Grant 11,437,361 - Lai , et al. September 6, 2 | 2022-09-06 |
Package Structures and Methods for Forming the Same
App 20220278031 - Hsiao; Ching-Wen ; et al. | 2022-09-01 |
Chip Package Structure With Metal-containing Layer
App 20220270963 - CHEN; Yu-Huan ; et al. | 2022-08-25 |
Packages with Multiple Encapsulated Substrate Blocks
App 20220262694 - Chen; Chen-Shien ; et al. | 2022-08-18 |
Semiconductor Device Structure With Magnetic Element
App 20220262892 - KU; Chin-Yu ; et al. | 2022-08-18 |
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
Grant 11,404,341 - Chiu , et al. August 2, 2 | 2022-08-02 |
Semiconductor Device Package And Methods Of Manufacture
App 20220238480 - Zhan; Kai Jun ; et al. | 2022-07-28 |
Chip Package Structure With Conductive Adhesive Layer
App 20220238352 - HSU; Kuo-Ching ; et al. | 2022-07-28 |
Heterogeneous Bonding Structure and Method Forming Same
App 20220238353 - Lii; Mirng-Ji ; et al. | 2022-07-28 |
Semiconductor Device and Method
App 20220223550 - Chen; Chen-Shien ; et al. | 2022-07-14 |
Semiconductor devices
Grant 11,387,168 - Yang , et al. July 12, 2 | 2022-07-12 |
Method of packaging a semiconductor die
Grant 11,387,171 - Huang , et al. July 12, 2 | 2022-07-12 |
Package On Package Structure
App 20220173083 - Shen; Dong-Han ; et al. | 2022-06-02 |
Package structures and methods for forming the same
Grant 11,342,253 - Hsiao , et al. May 24, 2 | 2022-05-24 |
Chip package structure and method for forming the same
Grant 11,335,634 - Chen , et al. May 17, 2 | 2022-05-17 |
Semiconductor device structure with magnetic element
Grant 11,329,124 - Ku , et al. May 10, 2 | 2022-05-10 |
Method for manufacturing semiconductor package for warpage control
Grant 11,329,008 - Chen , et al. May 10, 2 | 2022-05-10 |
Semiconductor Device Structure With Magnetic Element
App 20220140065 - CHEN; Chi-Cheng ; et al. | 2022-05-05 |
Conical-shaped or tier-shaped pillar connections
Grant 11,315,896 - Kuo , et al. April 26, 2 | 2022-04-26 |
Semiconductor Device with Discrete Blocks
App 20220122944 - Hsiao; Ching-Wen ; et al. | 2022-04-21 |
Chip package structure with conductive adhesive layer and method for forming the same
Grant 11,302,537 - Hsu , et al. April 12, 2 | 2022-04-12 |
Package on package structure
Grant 11,257,797 - Shen , et al. February 22, 2 | 2022-02-22 |
Stress reduction apparatus and method
Grant 11,244,940 - Chuang , et al. February 8, 2 | 2022-02-08 |
Package structure and method of fabricating the same
Grant 11,244,919 - Hsiao , et al. February 8, 2 | 2022-02-08 |
Semiconductor device structure with magnetic element
Grant 11,233,116 - Chen , et al. January 25, 2 | 2022-01-25 |
Semiconductor device with discrete blocks
Grant 11,217,562 - Hsiao , et al. January 4, 2 | 2022-01-04 |
Semiconductor Device Structure With Magnetic Element
App 20210376054 - CHEN; Chi-Cheng ; et al. | 2021-12-02 |
Micro-connection structure and manufacturing method thereof
Grant 11,152,319 - Lu , et al. October 19, 2 | 2021-10-19 |
Solderless Interconnection Structure and Method of Forming Same
App 20210313287 - Lin; Yu-Wei ; et al. | 2021-10-07 |
Chip Package Structure With Conductive Adhesive Layer And Method For Forming The Same
App 20210313195 - HSU; Kuo-Ching ; et al. | 2021-10-07 |
Fan-out interconnect structure and method for forming same
Grant 11,133,274 - Yu , et al. September 28, 2 | 2021-09-28 |
Semiconductor device with bump structure and method of making semiconductor device
Grant 11,127,704 - Tsao , et al. September 21, 2 | 2021-09-21 |
Semiconductor devices
Grant 11,127,703 - Ku , et al. September 21, 2 | 2021-09-21 |
Semiconductor Package And Method Of Making
App 20210287966 - HUANG; Hui-Min ; et al. | 2021-09-16 |
Substrate and Package Structure
App 20210288012 - Lin; Wei-Hung ; et al. | 2021-09-16 |
Structure and formation method of semiconductor device with magnetic element covered by polymer material
Grant 11,094,776 - Chen , et al. August 17, 2 | 2021-08-17 |
Bonded structures for package and substrate
Grant 11,088,102 - Cha , et al. August 10, 2 | 2021-08-10 |
Semiconductor device
Grant 11,081,459 - Ku , et al. August 3, 2 | 2021-08-03 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20210217672 - Chen; Chih-Hua ; et al. | 2021-07-15 |
Solderless interconnection structure and method of forming same
Grant 11,043,462 - Lin , et al. June 22, 2 | 2021-06-22 |
Substrate and package structure
Grant 11,024,594 - Lin , et al. June 1, 2 | 2021-06-01 |
Passive devices in package-on-package structures and methods for forming the same
Grant 11,018,086 - Chen , et al. May 25, 2 | 2021-05-25 |
Passive Devices in Package-on-Package Structures and Methods for Forming the Same
App 20210125923 - Chen; Chih-Hua ; et al. | 2021-04-29 |
Connector Structure and Method of Forming Same
App 20210118833 - Chen; Chen-Shien ; et al. | 2021-04-22 |
Scheme for connector site spacing and resulting structures
Grant 10,985,114 - Chen , et al. April 20, 2 | 2021-04-20 |
Package-on-package (PoP) device with integrated passive device in a via
Grant 10,978,433 - Hsiao , et al. April 13, 2 | 2021-04-13 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,964,610 - Chen , et al. March 30, 2 | 2021-03-30 |
Bump-on-Trace Interconnect
App 20210074673 - Yu; Chen-Hua ; et al. | 2021-03-11 |
Chip Package Structure And Method For Forming The Same
App 20210066181 - CHEN; Yu-Huan ; et al. | 2021-03-04 |
Method For Forming Package Structure With A Barrier Layer
App 20210035937 - CHEN; Cheng-Hung ; et al. | 2021-02-04 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20210035938 - Chang; Chih-Horng ; et al. | 2021-02-04 |
Method For Manufacturing Semiconductor Package
App 20210013158 - CHEN; CHEN-SHIEN ; et al. | 2021-01-14 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,879,228 - Chen , et al. December 29, 2 | 2020-12-29 |
Semiconductor packages having dummy connectors and methods of forming same
Grant 10,867,976 - Chen , et al. December 15, 2 | 2020-12-15 |
Substrate pad structure
Grant 10,867,810 - Liu , et al. December 15, 2 | 2020-12-15 |
Semiconductor structure and method
Grant 10,868,106 - Huang , et al. December 15, 2 | 2020-12-15 |
Connector structure and method of forming same
Grant 10,861,811 - Chen , et al. December 8, 2 | 2020-12-08 |
Semiconductor Device Structure With Protection Cap
App 20200381293 - YANG; Ting-Li ; et al. | 2020-12-03 |
3D die stacking structure with fine pitches
Grant 10,854,577 - Yu , et al. December 1, 2 | 2020-12-01 |
Bump-on-trace interconnect
Grant 10,847,493 - Yu , et al. November 24, 2 | 2020-11-24 |
Bump structure having a side recess and semiconductor structure including the same
Grant 10,833,033 - Chang , et al. November 10, 2 | 2020-11-10 |
Semiconductor Device Structure With Magnetic Element
App 20200350395 - CHEN; Chi-Cheng ; et al. | 2020-11-05 |
Wireless Charging Devices Having Wireless Charging Coils and Methods of Manufacture Thereof
App 20200350782 - Yu; Chen-Hua ; et al. | 2020-11-05 |
Semiconductor Devices
App 20200343162 - Yang; Cheng-Lung ; et al. | 2020-10-29 |
Package structure with a barrier layer and method for forming the same
Grant 10,811,377 - Chen , et al. October 20, 2 | 2020-10-20 |
Fan-Out Interconnect Structure and Method for Forming Same
App 20200328169 - Yu; Chen-Hua ; et al. | 2020-10-15 |
Semiconductor Device Structure With Magnetic Element
App 20200321431 - KU; Chin-Yu ; et al. | 2020-10-08 |
Stress Reduction Apparatus and Method
App 20200321326 - Chuang; Yao-Chun ; et al. | 2020-10-08 |
Semiconductor package and method for manufacturing the same
Grant 10,797,005 - Chen , et al. October 6, 2 | 2020-10-06 |
Elongated bump structures in package structure
Grant 10,784,223 - Chuang , et al. Sept | 2020-09-22 |
Micro-connection Structure And Manufacturing Method Thereof
App 20200273827 - Lu; Wen-Hsiung ; et al. | 2020-08-27 |
Structure and formation method of semiconductor device with magnetic element
Grant 10,756,162 - Chen , et al. A | 2020-08-25 |
Methods for Making Multi-Die Package With Bridge Layer
App 20200266074 - Chang; Wei Sen ; et al. | 2020-08-20 |
Method of manufacturing an integrated inductor with protections caps on conductive lines
Grant 10,748,810 - Yang , et al. A | 2020-08-18 |
Substrate pad structure
Grant 10,748,785 - Liu , et al. A | 2020-08-18 |
Semiconductor devices and methods of forming the same
Grant 10,741,477 - Yang , et al. A | 2020-08-11 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20200251463 - Kind Code | 2020-08-06 |
Dummy flip chip bumps for reducing stress
Grant 10,734,347 - Wu , et al. | 2020-08-04 |
Structure and formation method of semiconductor device with magnetic element
Grant 10,720,487 - Ku , et al. | 2020-07-21 |
Wireless charging devices having wireless charging coils and methods of manufacture thereof
Grant 10,720,788 - Yu , et al. | 2020-07-21 |
Fan-out interconnect structure and method for forming same
Grant 10,700,025 - Yu , et al. | 2020-06-30 |
Package structure with protrusion structure
Grant 10,692,828 - Tsao , et al. | 2020-06-23 |
Stress reduction apparatus and method
Grant 10,692,848 - Chuang , et al. | 2020-06-23 |
Package, Package-on-package Structure, And Method Of Manufacturing Package-on-package Structure
App 20200194326 - Chiu; Sheng-Huan ; et al. | 2020-06-18 |
Micro-connection structure and manufacturing method thereof
Grant 10,651,142 - Lu , et al. | 2020-05-12 |
Methods for making multi-die package with bridge layer
Grant 10,643,861 - Chang , et al. | 2020-05-05 |
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
App 20200126939 - Wu; Sheng-Yu ; et al. | 2020-04-23 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,629,580 - Chen , et al. | 2020-04-21 |
Semiconductor Device with Discrete Blocks
App 20200118978 - Hsiao; Ching-Wen ; et al. | 2020-04-16 |
Semiconductor Packages Having Dummy Connectors and Methods of Forming Same
App 20200118984 - Chen; Chen-Shien ; et al. | 2020-04-16 |
Bump-on-trace Interconnect
App 20200118966 - Yu; Chen-Hua ; et al. | 2020-04-16 |
Package-on-Package (PoP) Device with Integrated Passive Device in a Via
App 20200105728 - Hsiao; Ching-Wen ; et al. | 2020-04-02 |
Semiconductor Device And Package Assembly Including The Same
App 20200098712 - CHUANG; Chita ; et al. | 2020-03-26 |
Bonded Structures for Package and Substrate
App 20200098714 - Cha; Ming-Hong ; et al. | 2020-03-26 |
Package On Package Structure
App 20200091122 - Shen; Dong-Han ; et al. | 2020-03-19 |
Package Structures and Methods for Forming the Same
App 20200083152 - Hsiao; Ching-Wen ; et al. | 2020-03-12 |
Structure And Formation Method Of Semiconductor Device With Magnetic Element
App 20200075448 - CHEN; Chi-Cheng ; et al. | 2020-03-05 |
Structure And Formation Method Of Semiconductor Device With Magnetic Element
App 20200075708 - CHEN; Chi-Cheng ; et al. | 2020-03-05 |
Package and package-on-package structure having elliptical conductive columns
Grant 10,573,573 - Chiu , et al. Feb | 2020-02-25 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20200058601 - Chen; Yu-Feng ; et al. | 2020-02-20 |
Semiconductor Device
App 20200035634 - Ku; Chin-Yu ; et al. | 2020-01-30 |
Package on package structure
Grant 10,546,845 - Shen , et al. Ja | 2020-01-28 |
Package structure having a plurality of conductive balls with narrow width for ball waist
Grant 10,535,593 - Chang , et al. Ja | 2020-01-14 |
Substrate Pad Structure
App 20200013710 - Liu; Hao-Juin ; et al. | 2020-01-09 |
LTHC as Charging Barrier in InFO Package Formation
App 20200006312 - Lai; Yi-Jen ; et al. | 2020-01-02 |
Stress Reduction Apparatus and Method
App 20200006311 - Chuang; Yao-Chun ; et al. | 2020-01-02 |
Structure And Formation Method Of Semiconductor Device With Magnetic Element
App 20200006465 - KU; Chin-Yu ; et al. | 2020-01-02 |
LTHC as charging barrier in InFO package formation
Grant 10,522,526 - Lai , et al. Dec | 2019-12-31 |
Method of manufacturing a semiconductor device
Grant 10,522,382 - Lu , et al. Dec | 2019-12-31 |
Package on-package (PoP) device with integrated passive device in a via
Grant 10,515,938 - Hsiao , et al. Dec | 2019-12-24 |
Bump on pad (BOP) bonding structure in semiconductor packaged device
Grant 10,515,917 - Chuang , et al. Dec | 2019-12-24 |
Bump-on-trace design for enlarge bump-to-trace distance
Grant 10,515,919 - Wu , et al. Dec | 2019-12-24 |
Semiconductor devices and methods of forming the same
Grant 10,510,661 - Huang , et al. Dec | 2019-12-17 |
Package structures and methods for forming the same
Grant 10,510,644 - Hsiao , et al. Dec | 2019-12-17 |
Semiconductor packages having dummy connectors and methods of forming same
Grant 10,510,734 - Chen , et al. Dec | 2019-12-17 |
Bump-on-trace interconnect
Grant 10,510,710 - Yu , et al. Dec | 2019-12-17 |
Semiconductor device with discrete blocks
Grant 10,510,727 - Hsiao , et al. Dec | 2019-12-17 |
Scheme for connector site spacing and resulting structures
Grant 10,504,856 - Chen , et al. Dec | 2019-12-10 |
Package Structure And Method Of Fabricating The Same
App 20190371754 - Hsiao; Ching-Wen ; et al. | 2019-12-05 |
Method For Manufacturing Semiconductor Device
App 20190371718 - TSENG; HUA-WEI ; et al. | 2019-12-05 |
Semiconductor Device Structure With Protection Cap And Method For Forming The Same
App 20190371653 - YANG; Ting-Li ; et al. | 2019-12-05 |
Semiconductor device and method of forming the same
Grant 10,483,226 - Ku , et al. Nov | 2019-11-19 |
Packaging assembly and method of making the same
Grant 10,483,225 - Chuang , et al. Nov | 2019-11-19 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20190341319 - Chen; Chih-Hua ; et al. | 2019-11-07 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20190341379 - Chen; Chih-Hua ; et al. | 2019-11-07 |
Bonded structures for package and substrate
Grant 10,468,366 - Cha , et al. No | 2019-11-05 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20190326240 - Chang; Chih-Horng ; et al. | 2019-10-24 |
Semiconductor Device And Method Of Forming The Same
App 20190326239 - Ku; Chin-Yu ; et al. | 2019-10-24 |
Package On Package Structure
App 20190326264 - Shen; Dong-Han ; et al. | 2019-10-24 |
Solderless Interconnection Structure and Method of Forming Same
App 20190295971 - Lin; Yu-Wei ; et al. | 2019-09-26 |
Package, Package-on-package Structure, And Method Of Manufacturing Package-on-package Structure
App 20190295913 - Chiu; Sheng-Huan ; et al. | 2019-09-26 |
Semiconductor Devices And Methods Of Forming The Same
App 20190295925 - Yang; Cheng-Lung ; et al. | 2019-09-26 |
Connector Structure and Method of Forming Same
App 20190279953 - Chen; Chen-Shien ; et al. | 2019-09-12 |
Semiconductor Structure and Method
App 20190267445 - Huang; Wei-Li ; et al. | 2019-08-29 |
Micro-connection Structure And Manufacturing Method Thereof
App 20190259719 - Lu; Wen-Hsiung ; et al. | 2019-08-22 |
Dummy Flip Chip Bumps for Reducing Stress
App 20190259724 - Wu; Sheng-Yu ; et al. | 2019-08-22 |
Bump structure having a side recess and semiconductor structure including the same
Grant 10,388,622 - Chang , et al. A | 2019-08-20 |
Connector structure and method of forming same
Grant 10,388,620 - Chen , et al. A | 2019-08-20 |
Package Structure And Method Of Fabricating The Same
App 20190252304 - Chang; Pi-Lan ; et al. | 2019-08-15 |
Trace Design for Bump-on-Trace (BOT) Assembly
App 20190252347 - Lin; Yen-Liang ; et al. | 2019-08-15 |
Semiconductor Devices
App 20190229081 - Ku; Chin-Yu ; et al. | 2019-07-25 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,361,181 - Chen , et al. | 2019-07-23 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,354,931 - Chen , et al. July 16, 2 | 2019-07-16 |
Package Structure And Method For Forming The Same
App 20190189577 - CHEN; Cheng-Hung ; et al. | 2019-06-20 |
Solderless interconnection structure and method of forming same
Grant 10,319,691 - Lin , et al. | 2019-06-11 |
POP structures with dams encircling air gaps and methods for forming the same
Grant 10,319,655 - Yu , et al. | 2019-06-11 |
Semiconductor Device With Bump Structure And Method Of Making Semiconductor Device
App 20190164920 - TSAO; Pei-Haw ; et al. | 2019-05-30 |
Semiconductor Package And Method For Manufacturing The Same
App 20190164907 - CHEN; CHEN-SHIEN ; et al. | 2019-05-30 |
Package Structure With Protrusion Structure
App 20190148317 - TSAO; Pei-Haw ; et al. | 2019-05-16 |
Magnetic core inductor semiconductor structure and method
Grant 10,290,697 - Huang , et al. | 2019-05-14 |
Dummy flip chip bumps for reducing stress
Grant 10,290,600 - Wu , et al. | 2019-05-14 |
Micro-connection Structure And Manufacturing Method Thereof
App 20190139917 - Lu; Wen-Hsiung ; et al. | 2019-05-09 |
Micro-connection structure and manufacturing method thereof
Grant 10,283,471 - Lu , et al. | 2019-05-07 |
Semiconductor packages having dummy connectors and methods of forming same
Grant 10,276,548 - Chen , et al. | 2019-04-30 |
Semicondcutor device and manufacturing method thereof
Grant 10,276,528 - Ku , et al. | 2019-04-30 |
Package structure and method of fabricating the same
Grant 10,276,525 - Hsiao , et al. | 2019-04-30 |
Package structure having a plurality of conductive balls having narrow width for the ball waist
Grant 10,276,481 - Chang , et al. | 2019-04-30 |
Package-on-Package (PoP) Device with Integrated Passive Device in a Via
App 20190123029 - Hsiao; Ching-Wen ; et al. | 2019-04-25 |
Bump on Pad (BOP) Bonding Structure in Semiconductor Packaged Device
App 20190123008 - Chuang; Yao-Chun ; et al. | 2019-04-25 |
3D Die Stacking Structure with Fine Pitches
App 20190123028 - Yu; Chen-Hua ; et al. | 2019-04-25 |
Thermally enhanced package-on-package (PoP)
Grant 10,269,676 - Chiang , et al. | 2019-04-23 |
Trace design for bump-on-trace (BOT) assembly
Grant 10,269,759 - Lin , et al. | 2019-04-23 |
Semiconductor device and method of forming the same
Grant 10,269,703 - Ku , et al. | 2019-04-23 |
Passive Devices in Package-on-Package Structures and Methods for Forming the Same
App 20190115298 - Chen; Chih-Hua ; et al. | 2019-04-18 |
Semiconductor Packages having Dummy Connectors and Methods of Forming Same
App 20190115326 - Chen; Chen-Shien ; et al. | 2019-04-18 |
Semiconductor devices and methods of forming the same
Grant 10,263,064 - Ku , et al. | 2019-04-16 |
Substrate and Package Structure
App 20190096839 - Lin; Wei-Hung ; et al. | 2019-03-28 |
Semiconductor Devices And Methods Of Forming The Same
App 20190096804 - Huang; Hon-Lin ; et al. | 2019-03-28 |
LTHC as Charging Barrier in InFO Package Formation
App 20190035774 - Lai; Yi-Jen ; et al. | 2019-01-31 |
Semiconductor Structure and Method
App 20190027553 - Huang; Wei-Li ; et al. | 2019-01-24 |
Semicondcutor Device And Manufacturing Method Thereof
App 20190027452 - Ku; Chin-Yu ; et al. | 2019-01-24 |
Semiconductor Devices And Methods Of Forming The Same
App 20190006455 - Ku; Chin-Yu ; et al. | 2019-01-03 |
Package Structure And Method Of Fabricating The Same
App 20180374785 - Chang; Pi-Lan ; et al. | 2018-12-27 |
Semiconductor device having conductive bumps of varying heights
Grant 10,163,844 - Lin , et al. Dec | 2018-12-25 |
Package structure with protrusion structure
Grant 10,163,827 - Tsao , et al. Dec | 2018-12-25 |
Semiconductor devices and methods of forming the same
Grant 10,163,781 - Huang , et al. Dec | 2018-12-25 |
Bump on pad (BOP) bonding structure in semiconductor packaged device
Grant 10,163,839 - Chuang , et al. Dec | 2018-12-25 |
Isolation structure for stacked dies
Grant 10,163,756 - Chang , et al. Dec | 2018-12-25 |
Package-on-package (PoP) device with integrated passive device in a via
Grant 10,163,873 - Hsiao , et al. Dec | 2018-12-25 |
Contact area design for solder bonding
Grant 10,157,874 - Tsai , et al. Dec | 2018-12-18 |
Method for forming a passive device on a package-on-package structure
Grant 10,157,829 - Chen , et al. Dec | 2018-12-18 |
3D die stacking structure with fine pitches
Grant 10,157,884 - Yu , et al. Dec | 2018-12-18 |
Conical-Shaped or Tier-Shaped Pillar Connections
App 20180358316 - Kuo; Tin-Hao ; et al. | 2018-12-13 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 10,153,243 - Tseng , et al. Dec | 2018-12-11 |
Semiconductor Devices And Methods Of Forming The Same
App 20180350739 - Huang; Hon-Lin ; et al. | 2018-12-06 |
Substrate and package structure
Grant 10,141,281 - Lin , et al. Nov | 2018-11-27 |
Warpage control of semiconductor die package
Grant 10,134,706 - Pan , et al. November 20, 2 | 2018-11-20 |
Substrate design with balanced metal and solder resist density
Grant 10,128,195 - Lin , et al. November 13, 2 | 2018-11-13 |
Semiconductor structure and fabricating method thereof
Grant 10,115,686 - Huang , et al. October 30, 2 | 2018-10-30 |
Semiconductor Device with Discrete Blocks
App 20180308824 - Hsiao; Ching-Wen ; et al. | 2018-10-25 |
Bump-on-trace Interconnect
App 20180286830 - Yu; Chen-Hua ; et al. | 2018-10-04 |
Method Of Packaging A Semiconductor Die
App 20180286787 - HUANG; Hui-Min ; et al. | 2018-10-04 |
Semiconductor structure and method
Grant 10,084,032 - Huang , et al. September 25, 2 | 2018-09-25 |
Conical-shaped or tier-shaped pillar connections
Grant 10,056,345 - Kuo , et al. August 21, 2 | 2018-08-21 |
Bump-on-trace structures with high assembly yield
Grant 10,050,000 - Huang , et al. August 14, 2 | 2018-08-14 |
Integrated circuit packaging substrate, semiconductor package, and manufacturing method
Grant 10,043,774 - Lin , et al. August 7, 2 | 2018-08-07 |
Method for manufacturing semiconductor package structure
Grant 10,037,973 - Tseng , et al. July 31, 2 | 2018-07-31 |
Semiconductor Structure and Method
App 20180204902 - Huang; Wei-Li ; et al. | 2018-07-19 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20180197846 - Chen; Chih-Hua ; et al. | 2018-07-12 |
Protrusion bump pads for bond-on-trace processing
Grant 10,020,276 - Chen , et al. July 10, 2 | 2018-07-10 |
Packaging Assembly And Method Of Making The Same
App 20180182724 - CHUANG; Chita ; et al. | 2018-06-28 |
Structures having a tapering curved profile and methods of making same
Grant 10,008,459 - Tsai , et al. June 26, 2 | 2018-06-26 |
Semiconductor device with discrete blocks
Grant 10,008,479 - Hsiao , et al. June 26, 2 | 2018-06-26 |
Connector structures of integrated circuits
Grant 9,991,218 - Tu , et al. June 5, 2 | 2018-06-05 |
Bump-on-trace interconnect having varying widths and methods of forming same
Grant 9,991,224 - Yu , et al. June 5, 2 | 2018-06-05 |
Packaging with interposer frame
Grant 9,991,190 - Huang , et al. June 5, 2 | 2018-06-05 |
Package Structure And Method Of Fabricating The Same
App 20180151524 - Hsiao; Ching-Wen ; et al. | 2018-05-31 |
Semiconductor Device And Method Of Forming The Same
App 20180151493 - KU; CHIN-YU ; et al. | 2018-05-31 |
Bump structure and method of forming same
Grant 9,966,346 - Chen , et al. May 8, 2 | 2018-05-08 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,953,939 - Lin , et al. April 24, 2 | 2018-04-24 |
Semiconductor structure and manufacturing method of the same
Grant 9,935,073 - Lin , et al. April 3, 2 | 2018-04-03 |
Hybrid interconnect for chip stacking
Grant 9,935,081 - Pan , et al. April 3, 2 | 2018-04-03 |
Semiconductor Packages having Dummy Connectors and Methods of Forming Same
App 20180076184 - Chen; Chen-Shien ; et al. | 2018-03-15 |
Bump-on-trace interconnection structure for flip-chip packages
Grant 9,917,035 - Tseng , et al. March 13, 2 | 2018-03-13 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,911,725 - Chen , et al. March 6, 2 | 2018-03-06 |
Bump structures in semiconductor device and packaging assembly
Grant 9,905,524 - Chuang , et al. February 27, 2 | 2018-02-27 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20180053741 - Chang; Chih-Horng ; et al. | 2018-02-22 |
Elongated Bump Structures in Package Structure
App 20180047690 - Chuang; Yao-Chun ; et al. | 2018-02-15 |
Metal routing architecture for integrated circuits
Grant 9,881,885 - Kuo , et al. January 30, 2 | 2018-01-30 |
Method of Manufacturing a Semiconductor Device
App 20180019149 - Lu; Yung-Jean ; et al. | 2018-01-18 |
Contact area design for solder bonding
Grant 9,871,013 - Tsai , et al. January 16, 2 | 2018-01-16 |
Cooling channels in 3DIC stacks
Grant 9,859,252 - Ching , et al. January 2, 2 | 2018-01-02 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20170372976 - Chen; Chih-Hua ; et al. | 2017-12-28 |
Packaging device having plural microstructures disposed proximate to die mounting region
Grant 9,837,346 - Pan , et al. December 5, 2 | 2017-12-05 |
Methods for forming package-on-package structures having buffer dams
Grant 9,837,289 - Hu , et al. December 5, 2 | 2017-12-05 |
Contact Area Design for Solder Bonding
App 20170345785 - Tsai; Pei-Chun ; et al. | 2017-11-30 |
Substrate Pad Structure
App 20170345677 - Liu; Hao-Juin ; et al. | 2017-11-30 |
Warpage Control of Semiconductor Die Package
App 20170345788 - Pan; Kuo Lung ; et al. | 2017-11-30 |
Bump On Pad (bop) Bonding Structure In Semiconductor Packaged Device
App 20170345783 - Chuang; Yao-Chun ; et al. | 2017-11-30 |
Bump structure having a side recess and semiconductor structure including the same
Grant 9,824,992 - Chang , et al. November 21, 2 | 2017-11-21 |
Semiconductor package and manufacturing method of the same
Grant 9,812,405 - Chen , et al. November 7, 2 | 2017-11-07 |
Dummy Flip Chip Bumps for Reducing Stress
App 20170309588 - Wu; Sheng-Yu ; et al. | 2017-10-26 |
Warpage reduction and adhesion improvement of semiconductor die package
Grant 9,799,620 - Huang , et al. October 24, 2 | 2017-10-24 |
Method of manufacturing a semiconductor device
Grant 9,786,540 - Lu , et al. October 10, 2 | 2017-10-10 |
Elongated bump structures in package structure
Grant 9,786,621 - Chuang , et al. October 10, 2 | 2017-10-10 |
Semiconductor Structure And Fabricating Method Thereof
App 20170278809 - HUANG; WEI-LI ; et al. | 2017-09-28 |
Package Structures and Methods for Forming the Same
App 20170278777 - Hsiao; Ching-Wen ; et al. | 2017-09-28 |
Substrate interconnections having different sizes
Grant 9,773,755 - Shen , et al. September 26, 2 | 2017-09-26 |
Warpage control of semiconductor die package
Grant 9,773,749 - Pan , et al. September 26, 2 | 2017-09-26 |
Bonded Structures for Package and Substrate
App 20170271291 - Cha; Ming-Hong ; et al. | 2017-09-21 |
Improving the strength of micro-bump joints
Grant 9,768,138 - Shen , et al. September 19, 2 | 2017-09-19 |
Semiconductor Device Having Conductive Bumps Of Varying Heights
App 20170263583 - LIN; YEN-LIANG ; et al. | 2017-09-14 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,761,503 - Chen , et al. September 12, 2 | 2017-09-12 |
Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device
Grant 9,748,188 - Kuo , et al. August 29, 2 | 2017-08-29 |
Apparatus and method for a component package
Grant 9,748,216 - Chen , et al. August 29, 2 | 2017-08-29 |
Connector Structure and Method of Forming Same
App 20170243846 - Chen; Chen-Shien ; et al. | 2017-08-24 |
Substrate pad structure
Grant 9,741,589 - Liu , et al. August 22, 2 | 2017-08-22 |
Methods For Making Multi-die Package With Bridge Layer
App 20170236724 - Chang; Wei Sen ; et al. | 2017-08-17 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20170236813 - Chen; Chih-Hua ; et al. | 2017-08-17 |
POP Structures with Dams Encircling Air Gaps and Methods for Forming the Same
App 20170236763 - Yu; Chen-Hua ; et al. | 2017-08-17 |
Chip packages and methods of manufacture thereof
Grant 9,735,130 - Pan , et al. August 15, 2 | 2017-08-15 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20170229421 - Tseng; Yu-Jen ; et al. | 2017-08-10 |
Method of Manufacturing Connector Structures of Integrated Circuits
App 20170229413 - Tu; Shang-Yun ; et al. | 2017-08-10 |
Semiconductor Structure And Manufacturing Method Of The Same
App 20170213804 - LIN; YEN-LIANG ; et al. | 2017-07-27 |
Package-on-Package (PoP) Device with Integrated Passive Device in a Via
App 20170207207 - Hsiao; Ching-Wen ; et al. | 2017-07-20 |
Dummy flip chip bumps for reducing stress
Grant 9,711,477 - Wu , et al. July 18, 2 | 2017-07-18 |
Trace Design for Bump-on-Trace (BOT) Assembly
App 20170186723 - Lin; Yen-Liang ; et al. | 2017-06-29 |
Packaging Device Having Plural Microstructures Disposed Proximate to Die Mounting Region
App 20170186681 - Pan; Kuo Lung ; et al. | 2017-06-29 |
Package structures and methods for forming the same
Grant 9,679,836 - Hsiao , et al. June 13, 2 | 2017-06-13 |
Semiconductor device having conductive bumps of varying heights
Grant 9,679,862 - Lin , et al. June 13, 2 | 2017-06-13 |
Bonded structures for package and substrate
Grant 9,673,161 - Cha , et al. June 6, 2 | 2017-06-06 |
Interconnection structure
Grant 9,673,125 - Liu , et al. June 6, 2 | 2017-06-06 |
Through silicon via bonding structure
Grant 9,673,174 - Wang , et al. June 6, 2 | 2017-06-06 |
Semiconductor device
Grant 9,666,530 - Chen , et al. May 30, 2 | 2017-05-30 |
Method of manufacturing connector structures of integrated circuits
Grant 9,659,903 - Tu , et al. May 23, 2 | 2017-05-23 |
POP structures with dams encircling air gaps and methods for forming the same
Grant 9,659,918 - Yu , et al. May 23, 2 | 2017-05-23 |
Connector structure and method of forming same
Grant 9,646,943 - Chen , et al. May 9, 2 | 2017-05-09 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,646,894 - Chen , et al. May 9, 2 | 2017-05-09 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 9,646,923 - Tseng , et al. May 9, 2 | 2017-05-09 |
Semiconductor Device with Discrete Blocks
App 20170125386 - Hsiao; Ching-Wen ; et al. | 2017-05-04 |
Multi-die package with bridge layer and method for making the same
Grant 9,640,521 - Chang , et al. May 2, 2 | 2017-05-02 |
Interconnection Structure and Method of Forming Same
App 20170117245 - Lin; Yu-Wei ; et al. | 2017-04-27 |
Semiconductor structure and manufacturing method of the same
Grant 9,633,965 - Lin , et al. April 25, 2 | 2017-04-25 |
Wireless Charging Devices, Methods of Manufacture Thereof, and Charging Methods
App 20170104356 - Yu; Chen-Hua ; et al. | 2017-04-13 |
Protecting flip-chip package using pre-applied fillet
Grant 9,620,414 - Tsai , et al. April 11, 2 | 2017-04-11 |
Package-on-package (PoP) device with integrated passive device in a via
Grant 9,613,917 - Hsiao , et al. April 4, 2 | 2017-04-04 |
Copper bump joint structures with improved crack resistance
Grant 9,607,936 - Hsiao , et al. March 28, 2 | 2017-03-28 |
Packaging device having plural microstructures disposed proximate to die mounting region
Grant 9,607,959 - Pan , et al. March 28, 2 | 2017-03-28 |
Warpage Control of Semiconductor Die Package
App 20170069594 - Pan; Kuo Lung ; et al. | 2017-03-09 |
Conductive Contacts Having Varying Widths And Method Of Manufacturing Same
App 20170069587 - Lin; Yen-Liang ; et al. | 2017-03-09 |
Semiconductor packaging having warpage control and methods of forming same
Grant 9,589,861 - Huang , et al. March 7, 2 | 2017-03-07 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20170062371 - Chang; Chih-Horng ; et al. | 2017-03-02 |
Methods and apparatus for bump-on-trace chip packaging
Grant 9,583,367 - Huang , et al. February 28, 2 | 2017-02-28 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20170053885 - Chen; Chen-Shien ; et al. | 2017-02-23 |
Package structures including a capacitor and methods of forming the same
Grant 9,576,821 - Lo , et al. February 21, 2 | 2017-02-21 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20170047298 - Chen; Yu-Feng ; et al. | 2017-02-16 |
Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof
Grant 9,559,069 - Chen , et al. January 31, 2 | 2017-01-31 |
Semiconductor device with discrete blocks
Grant 9,543,278 - Hsiao , et al. January 10, 2 | 2017-01-10 |
Bump-on-Trace Structures with High Assembly Yield
App 20170005059 - Huang; Chih-Fan ; et al. | 2017-01-05 |
Package having substrate with embedded metal trace overlapped by landing pad
Grant 9,536,850 - Yu , et al. January 3, 2 | 2017-01-03 |
Substrate Design with Balanced Metal and Solder Resist Density
App 20160365322 - Lin; Yu-Wei ; et al. | 2016-12-15 |
Method of forming bump structure having a side recess and semiconductor structure including the same
Grant 9,520,379 - Chang , et al. December 13, 2 | 2016-12-13 |
Conical-Shaped or Tier-Shaped Pillar Connections
App 20160358876 - Kuo; Tin-Hao ; et al. | 2016-12-08 |
Substrate and Package Structure
App 20160358878 - LIN; WEI-HUNG ; et al. | 2016-12-08 |
Warpage control of semiconductor die package
Grant 9,508,674 - Pan , et al. November 29, 2 | 2016-11-29 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,508,668 - Lin , et al. November 29, 2 | 2016-11-29 |
Protrusion bump pads for bond-on-trace processing
Grant 9,508,637 - Chen , et al. November 29, 2 | 2016-11-29 |
Method For Manufacturing Semiconductor Package Structure
App 20160336298 - TSENG; HUA-WEI ; et al. | 2016-11-17 |
Semiconductor Package And Manufacturing Method Of The Same
App 20160336281 - CHEN; GUAN-YU ; et al. | 2016-11-17 |
Interconnection structure and method of forming same
Grant 9,496,233 - Lin , et al. November 15, 2 | 2016-11-15 |
Bonded Structures for Package and Substrate
App 20160329293 - Cha; Ming-Hong ; et al. | 2016-11-10 |
Pop structures and methods of forming the same
Grant 9,490,167 - Chen , et al. November 8, 2 | 2016-11-08 |
Scheme for connector site spacing and resulting structures
Grant 9,484,317 - Chen , et al. November 1, 2 | 2016-11-01 |
Methods and apparatus for forming package-on-packages
Grant 9,478,474 - Chen , et al. October 25, 2 | 2016-10-25 |
3D Die Stacking Structure with Fine Pitches
App 20160307876 - Yu; Chen-Hua ; et al. | 2016-10-20 |
Semiconductor Packaging Having Warpage Control and Methods of Forming Same
App 20160307815 - Huang; Yu-Chih ; et al. | 2016-10-20 |
Scheme for connector site spacing and resulting structures
Grant 9,472,521 - Chuang , et al. October 18, 2 | 2016-10-18 |
Bump-on-trace structures with high assembly yield
Grant 9,472,525 - Huang , et al. October 18, 2 | 2016-10-18 |
Fan-Out Interconnect Structure and Method for Forming Same
App 20160284654 - Yu; Chen-Hua ; et al. | 2016-09-29 |
Cooling Channels in 3DIC Stacks
App 20160276314 - Ching; Kai-Ming ; et al. | 2016-09-22 |
Connecting function chips to a package to form package-on-package
Grant 9,449,941 - Tsai , et al. September 20, 2 | 2016-09-20 |
Connector Structures of Integrated Circuits
App 20160268227 - Tu; Shang-Yun ; et al. | 2016-09-15 |
Semiconductor package and manufacturing method of the same
Grant 9,431,351 - Chen , et al. August 30, 2 | 2016-08-30 |
Substrate and package structure
Grant 9,425,157 - Lin , et al. August 23, 2 | 2016-08-23 |
Conical-shaped or tier-shaped pillar connections
Grant 9,425,136 - Kuo , et al. August 23, 2 | 2016-08-23 |
Substrate design with balanced metal and solder resist density
Grant 9,425,117 - Lin , et al. August 23, 2 | 2016-08-23 |
Integrated Circuit Packaging Substrate, Semiconductor Package, And Manufacturing Method
App 20160240502 - LIN; Yu-Wei ; et al. | 2016-08-18 |
Packaged semiconductor devices and packaging methods
Grant 9,418,969 - Hu , et al. August 16, 2 | 2016-08-16 |
Passive Devices in Package-on-Package Structures and Methods for Forming the Same
App 20160233161 - Chen; Chih-Hua ; et al. | 2016-08-11 |
Methods For Forming Package-On-Package Structures Having Buffer Dams
App 20160233113 - Hu; Shou-Cheng ; et al. | 2016-08-11 |
Semiconductor Device, Integrated Circuit Structure Using The Same, And Manufacturing Method Thereof
App 20160225729 - CHEN; Yu-Feng ; et al. | 2016-08-04 |
Semiconductor package structure and manufacturing method thereof
Grant 9,406,629 - Tseng , et al. August 2, 2 | 2016-08-02 |
Bonded structures for package and substrate
Grant 9,397,059 - Cha , et al. July 19, 2 | 2016-07-19 |
Contact Area Design For Solder Bonding
App 20160190082 - Tsai; Pei-Chun ; et al. | 2016-06-30 |
Bump-on-Trace Interconnect
App 20160190090 - Yu; Chen-Hua ; et al. | 2016-06-30 |
Semiconductor packaging having warpage control and methods of forming same
Grant 9,379,032 - Huang , et al. June 28, 2 | 2016-06-28 |
3D die stacking structure with fine pitches
Grant 9,379,078 - Yu , et al. June 28, 2 | 2016-06-28 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20160181223 - Chang; Chih-Horng ; et al. | 2016-06-23 |
Dummy Flip Chip Bumps for Reducing Stress
App 20160181220 - Wu; Sheng-Yu ; et al. | 2016-06-23 |
Connector structures of integrated circuits
Grant 9,373,598 - Tu , et al. June 21, 2 | 2016-06-21 |
Fan-out interconnect structure and method for forming same
Grant 9,368,460 - Yu , et al. June 14, 2 | 2016-06-14 |
POP Structures with Dams Encircling Air Gaps and Methods for Forming the Same
App 20160163683 - Yu; Chen-Hua ; et al. | 2016-06-09 |
Semiconductor Device And Method Of Manufacturing The Same
App 20160155715 - LIN; YEN-LIANG ; et al. | 2016-06-02 |
Stress Reduction Apparatus and Method
App 20160155733 - Chuang; Yao-Chun ; et al. | 2016-06-02 |
Cooling channels in 3DIC stacks
Grant 9,355,933 - Ching , et al. May 31, 2 | 2016-05-31 |
Front side copper post joint structure for temporary bond in TSV application
Grant 9,349,699 - Huang , et al. May 24, 2 | 2016-05-24 |
Passive devices in package-on-package structures and methods for forming the same
Grant 9,343,442 - Chen , et al. May 17, 2 | 2016-05-17 |
Methods for forming package-on-package structures having buffer dams
Grant 9,330,947 - Hu , et al. May 3, 2 | 2016-05-03 |
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
App 20160118360 - Wu; Sheng-Yu ; et al. | 2016-04-28 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20160111384 - TSENG; HUA-WEI ; et al. | 2016-04-21 |
Semiconductor Device with Discrete Blocks
App 20160111398 - Hsiao; Ching-Wen ; et al. | 2016-04-21 |
Semiconductor Package And Manufacturing Method Of The Same
App 20160111378 - CHEN; GUAN-YU ; et al. | 2016-04-21 |
Bump structure having a side recess and semiconductor structure including the same
Grant 9,318,458 - Chang , et al. April 19, 2 | 2016-04-19 |
Improving the Strength of Micro-Bump Joints
App 20160104685 - Shen; Wen-Wei ; et al. | 2016-04-14 |
Conductive pillar structure for semiconductor substrate and method of manufacture
Grant 9,312,230 - Chen , et al. April 12, 2 | 2016-04-12 |
Bump structure for stacked dies
Grant 9,312,225 - Chang , et al. April 12, 2 | 2016-04-12 |
Package and Method for Making the Same
App 20160093597 - Chang; Wei Sen ; et al. | 2016-03-31 |
Bump-on-trace interconnect
Grant 9,299,674 - Yu , et al. March 29, 2 | 2016-03-29 |
Bump-on-Trace Structures with High Assembly Yield
App 20160086901 - Huang; Chih-Fan ; et al. | 2016-03-24 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 9,293,449 - Hu , et al. March 22, 2 | 2016-03-22 |
Semiconductor Packaging Having Warpage Control And Methods Of Forming Same
App 20160079135 - Huang; Yu-Chih ; et al. | 2016-03-17 |
Metal Routing Architecture for Integrated Circuits
App 20160079192 - Kuo; Chen-Cheng ; et al. | 2016-03-17 |
Dummy flip chip bumps for reducing stress
Grant 9,287,234 - Wu , et al. March 15, 2 | 2016-03-15 |
Design Scheme for Connector Site Spacing and Resulting Structures
App 20160071812 - Chen; Yu-Feng ; et al. | 2016-03-10 |
Semiconductor Device And Manufacturing Method Thereof
App 20160064340 - TSENG; HUA-WEI ; et al. | 2016-03-03 |
Chip Packages And Methods Of Manufacture Thereof
App 20160064355 - Pan; Kuo Lung ; et al. | 2016-03-03 |
Bump on Pad (BOP) Bonding Structure
App 20160064347 - Kuo; Chen-Cheng ; et al. | 2016-03-03 |
Packaging Devices, Packaged Semiconductor Devices, and Packaging Methods
App 20160064348 - Pan; Kuo Lung ; et al. | 2016-03-03 |
Hybrid Interconnect for Chip Stacking
App 20160056125 - Pan; Kuo Lung ; et al. | 2016-02-25 |
Semiconductor Structure And Manufacturing Method Of The Same
App 20160043051 - LIN; Yen-Liang ; et al. | 2016-02-11 |
Methods and Apparatus for bump-on-trace Chip Packaging
App 20160035591 - Huang; Chang-Chia ; et al. | 2016-02-04 |
Elongated Bump Structures in Package Structure
App 20160027752 - Chuang; Chita ; et al. | 2016-01-28 |
Substrate Interconnections having Different Sizes
App 20160013162 - Shen; Wen-Wei ; et al. | 2016-01-14 |
Substrate Design with Balanced Metal and Solder Resist Density
App 20150380332 - Lin; Yu-Wei ; et al. | 2015-12-31 |
Bonded Structures for Package and Substrate
App 20150371964 - Cha; Ming-Hong ; et al. | 2015-12-24 |
Bump Structure and Method of Forming Same
App 20150357301 - Chen; Guan-Yu ; et al. | 2015-12-10 |
Conductive Contacts Having Varying Widths And Method Of Manufacturing Same
App 20150325542 - Lin; Yen-Liang ; et al. | 2015-11-12 |
Bump Structure Having A Side Recess And Semiconductor Structure Including The Same
App 20150318253 - CHANG; Chih-Horng ; et al. | 2015-11-05 |
Substrate Pad Structure
App 20150318188 - Liu; Hao-Juin ; et al. | 2015-11-05 |
Warpage Reduction and Adhesion Improvement of Semiconductor Die Package
App 20150303158 - Huang; Yu-Chih ; et al. | 2015-10-22 |
Connector Structures of Integrated Circuits
App 20150303160 - Tu; Shang-Yun ; et al. | 2015-10-22 |
Protecting Flip-Chip Package using Pre-Applied Fillet
App 20150287640 - Tsai; Tsung-Fu ; et al. | 2015-10-08 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20150262898 - Chen; Chih-Hua ; et al. | 2015-09-17 |
Packaged Semiconductor Devices and Packaging Methods
App 20150243636 - Hu; Yen-Chang ; et al. | 2015-08-27 |
Substrate And Package Structure
App 20150243620 - LIN; WEI-HUNG ; et al. | 2015-08-27 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20150194379 - Chen; Chen-Shien ; et al. | 2015-07-09 |
Trace Design for Bump-on-Trace (BOT) Assembly
App 20150187719 - Lin; Yen-Liang ; et al. | 2015-07-02 |
POP Structures and Methods of Forming the Same
App 20150155203 - Chen; Hsu-Hsien ; et al. | 2015-06-04 |
Through Silicon Via Bonding Structure
App 20150137328 - Wang; Dean ; et al. | 2015-05-21 |
Substrate Design with Balanced Metal and Solder Resist Density
App 20150130050 - Lin; Yu-Wei ; et al. | 2015-05-14 |
Bump-on-Trace Structures with High Assembly Yield
App 20150130051 - Huang; Chih-Fan ; et al. | 2015-05-14 |
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
App 20150123266 - Wu; Sheng-Yu ; et al. | 2015-05-07 |
3D Die Stacking Structure with Fine Pitches
App 20150123268 - Yu; Chen-Hua ; et al. | 2015-05-07 |
Through-Assembly Via Modules and Methods for Forming the Same
App 20150093881 - Chen; Chih-Hua ; et al. | 2015-04-02 |
Bump Structure Having A Single Side Recess
App 20150084186 - CHANG; Chih-Horng ; et al. | 2015-03-26 |
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections
App 20150072476 - Hu; Yen-Chang ; et al. | 2015-03-12 |
Apparatus and Method for a Component Package
App 20150069595 - Chen; Chih-Hua ; et al. | 2015-03-12 |
Semiconductor Wafer Carrier and Method of Manufacturing
App 20150040387 - Lu; Yung-Jean ; et al. | 2015-02-12 |
Strength of Micro-Bump Joints
App 20150037936 - Shen; Wen-Wei ; et al. | 2015-02-05 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 08922005 - | 2014-12-30 |
Elongated bumps in integrated circuit devices
Grant 08922006 - | 2014-12-30 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 08921222 - | 2014-12-30 |
Thin Wafer Handling Structure And Method
App 20100330788A1 - | 2010-12-30 |
| 