Cheah; Chuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheah; Chuan.The latest application filed is for "bond pad and clip configuration for packaged semiconductor device".
Company Profile
2.71.51
- Cheah; Chuan - Torrance CA
- Cheah; Chuan - Redondo Beach CA
- Cheah; Chuan - El Segundo CA
Patent Activity
| Patent | Date |
|---|---|
| Bond pad and clip configuration for packaged semiconductor device Grant 10,692,801 - Cho , et al. | 2020-06-23 |
| Bond Pad and Clip Configuration for Packaged Semiconductor Device App 20190371711 - Cho; Eung San ; et al. | 2019-12-05 |
| Breakable substrate for semiconductor die Grant 10,204,873 - Cho , et al. Feb | 2019-02-12 |
| Breakable Substrate For Semiconductor Die App 20180323156 - Cho; Eung San ; et al. | 2018-11-08 |
| Compact high-voltage semiconductor package Grant 10,083,884 - Cho , et al. September 25, 2 | 2018-09-25 |
| Compact High-voltage Semiconductor Package App 20170365533 - Cho; Eung San ; et al. | 2017-12-21 |
| Compact high-voltage semiconductor package Grant 9,768,087 - Cho , et al. September 19, 2 | 2017-09-19 |
| Stacked half-bridge package Grant 9,601,418 - Cho , et al. March 21, 2 | 2017-03-21 |
| Stacked half-bridge package Grant 9,583,477 - Cho , et al. February 28, 2 | 2017-02-28 |
| Semiconductor package with conductive clips Grant 9,520,341 - Cho , et al. December 13, 2 | 2016-12-13 |
| Power semiconductor package with a common conductive clip Grant 9,461,022 - Cho , et al. October 4, 2 | 2016-10-04 |
| Semiconductor package with heat spreader Grant 9,449,899 - Briere , et al. September 20, 2 | 2016-09-20 |
| Stacked Half-Bridge Package App 20160260697 - Cho; Eung San ; et al. | 2016-09-08 |
| III-Nitride Transistor with Solderable Front Metal App 20160211337 - Cheah; Chuan ; et al. | 2016-07-21 |
| Stacked half-bridge package with a common leadframe Grant 9,349,677 - Cho , et al. May 24, 2 | 2016-05-24 |
| Insertable Power Unit with Mounting Contacts for Plugging into a Mother Board App 20160105983 - Cho; Eung San ; et al. | 2016-04-14 |
| Power Unit with Conductive Slats App 20160105984 - Cho; Eung San ; et al. | 2016-04-14 |
| Compact High-Voltage Semiconductor Package App 20160104697 - Cho; Eung San ; et al. | 2016-04-14 |
| III-Nitride device with solderable front metal Grant 9,312,375 - Cheah , et al. April 12, 2 | 2016-04-12 |
| Power Semiconductor Package with a Common Conductive Clip App 20150279821 - Cho; Eung San ; et al. | 2015-10-01 |
| III-nitride rectifier package Grant 9,142,503 - Cheah , et al. September 22, 2 | 2015-09-22 |
| Semiconductor package with conductive heat spreader Grant 9,105,619 - Briere , et al. August 11, 2 | 2015-08-11 |
| Semiconductor Package with Conductive Clips App 20150194369 - Cho; Eung San ; et al. | 2015-07-09 |
| Half-bridge package with a conductive clip Grant 9,048,230 - Cho , et al. June 2, 2 | 2015-06-02 |
| Semiconductor package with multiple conductive clips Grant 8,987,883 - Cho , et al. March 24, 2 | 2015-03-24 |
| III-NITRIDE Device with Solderable Front Metal App 20150014703 - Cheah; Chuan ; et al. | 2015-01-15 |
| High power semiconductor package with conductive clip Grant 8,896,107 - Cho , et al. November 25, 2 | 2014-11-25 |
| III-Nitride Rectifier Package App 20140327014 - Cheah; Chuan ; et al. | 2014-11-06 |
| High voltage cascoded III-nitride rectifier package with etched leadframe Grant 8,853,707 - Cheah , et al. October 7, 2 | 2014-10-07 |
| High voltage cascoded III-nitride rectifier package with stamped leadframe Grant 8,853,706 - Cheah , et al. October 7, 2 | 2014-10-07 |
| Power device with solderable front metal Grant 8,853,744 - Cheah , et al. October 7, 2 | 2014-10-07 |
| Packaging of electronic circuitry Grant 8,811,030 - Phillips , et al. August 19, 2 | 2014-08-19 |
| Interdigitated conductive support for GaN semiconductor die Grant 8,791,560 - Hu , et al. July 29, 2 | 2014-07-29 |
| High voltage cascoded III-nitride rectifier package Grant 8,790,965 - Cheah , et al. July 29, 2 | 2014-07-29 |
| Half-Bridge Package with a Conductive Clip App 20140203419 - Cho; Eung San ; et al. | 2014-07-24 |
| Packaging of electronic circuitry Grant 8,786,068 - Phillips , et al. July 22, 2 | 2014-07-22 |
| Stacked Half-Bridge Package App 20140191337 - Cho; Eung San ; et al. | 2014-07-10 |
| Semiconductor Package with Multiple Conductive Clips App 20140175630 - Cho; Eung San ; et al. | 2014-06-26 |
| High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor Grant 8,749,034 - Cho , et al. June 10, 2 | 2014-06-10 |
| Semiconductor Package with Heat Spreader App 20140084431 - Briere; Michael A. ; et al. | 2014-03-27 |
| Stacked half-bridge package with a common conductive clip Grant 8,680,627 - Cho , et al. March 25, 2 | 2014-03-25 |
| Stacked half-bridge package with a current carrying layer Grant 8,674,497 - Cho , et al. March 18, 2 | 2014-03-18 |
| High power semiconductor package with multiple conductive clips Grant 8,664,754 - Cho , et al. March 4, 2 | 2014-03-04 |
| High Voltage Cascoded III-Nitride Rectifier Package App 20140030854 - Cheah; Chuan ; et al. | 2014-01-30 |
| Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance Grant 8,629,566 - Shivkumar , et al. January 14, 2 | 2014-01-14 |
| Semiconductor package Grant 8,564,124 - Briere , et al. October 22, 2 | 2013-10-22 |
| High voltage cascoded III-nitride rectifier package utilizing clips on package surface Grant 8,546,849 - Cheah , et al. October 1, 2 | 2013-10-01 |
| Stacked Half-Bridge Package with a Common Leadframe App 20130228794 - Cho; Eung San ; et al. | 2013-09-05 |
| Power Device with Solderable Front Metal App 20130207120 - Cheah; Chuan ; et al. | 2013-08-15 |
| High power semiconductor package with conductive clips and flip chip driver IC Grant 8,497,574 - Cho , et al. July 30, 2 | 2013-07-30 |
| High power semiconductor package with conductive clip on multiple transistors Grant 8,497,573 - Cho , et al. July 30, 2 | 2013-07-30 |
| Semiconductor Package with Conductive Heat Spreader App 20130161803 - Briere; Michael A. ; et al. | 2013-06-27 |
| Stacked half-bridge package with a common conductive leadframe Grant 8,426,952 - Cho , et al. April 23, 2 | 2013-04-23 |
| III-nitride power device with solderable front metal Grant 8,399,912 - Cheah , et al. March 19, 2 | 2013-03-19 |
| High Voltage Cascoded III-Nitride Rectifier Package with Etched Leadframe App 20120280246 - Cheah; Chuan ; et al. | 2012-11-08 |
| High Voltage Cascoded III-Nitride Rectifier Package with Stamped Leadframe App 20120280245 - Cheah; Chuan ; et al. | 2012-11-08 |
| High Voltage Cascoded III-Nitride Rectifier Package Utilizing Clips on Package Support Surface App 20120280247 - Cheah; Chuan ; et al. | 2012-11-08 |
| Semiconductor package with metal straps Grant 8,253,224 - Hu , et al. August 28, 2 | 2012-08-28 |
| Stacked Half-Bridge Package with a Current Carrying Layer App 20120181681 - Cho; Eung San ; et al. | 2012-07-19 |
| Stacked Half-Bridge Package with a Common Conductive Leadframe App 20120181674 - Cho; Eung San ; et al. | 2012-07-19 |
| Stacked Half-Bridge Package with a Common Conductive Clip App 20120181624 - Cho; Eung San ; et al. | 2012-07-19 |
| High Power Semiconductor Package with Conductive Clip on Multiple Transistors App 20120168923 - Cho; Eung San ; et al. | 2012-07-05 |
| High Power Semiconductor Package with Conductive Clip and Flip Chip Driver IC with Integrated Control Transistor App 20120168926 - Cho; Eung San ; et al. | 2012-07-05 |
| High Power Semiconductor Package with Multiple Conductive Clips App 20120168924 - Cho; Eung San ; et al. | 2012-07-05 |
| High Power Semiconductor Package with Conductive Clips and Flip Chip Driver IC App 20120168925 - Cho; Eung San ; et al. | 2012-07-05 |
| High Power Semiconductor Package with Conductive Clip App 20120168922 - Cho; Eung San ; et al. | 2012-07-05 |
| Interdigitated Conductive Support for GaN Semiconductor Die App 20110272705 - Hu; Kunzhong ; et al. | 2011-11-10 |
| III-Nitride Power Device with Solderable Front Metal App 20110198611 - Cheah; Chuan ; et al. | 2011-08-18 |
| Package for monolithic compound semiconductor (CSC) devices for DC to DC converters Grant 7,999,365 - Hu , et al. August 16, 2 | 2011-08-16 |
| Interdigitated conductive lead frame or laminate lead frame for GaN die Grant 7,994,632 - Hu , et al. August 9, 2 | 2011-08-09 |
| Semiconductor package with metal straps App 20110108968 - Hu; Kunzhong ; et al. | 2011-05-12 |
| Method for fabricating a semiconductor package Grant 7,867,823 - Hu , et al. January 11, 2 | 2011-01-11 |
| Copper straps Grant 7,859,089 - Hu , et al. December 28, 2 | 2010-12-28 |
| Multi-chip module Grant 7,804,131 - Cheah , et al. September 28, 2 | 2010-09-28 |
| High current lead electrode for semiconductor device Grant 7,728,420 - Cheah , et al. June 1, 2 | 2010-06-01 |
| Package For Monolithic Compound Semiconductor (csc) Devices For Dc To Dc Converters App 20090072368 - Hu; Kunzhong ; et al. | 2009-03-19 |
| High current lead electrode for semiconductor device App 20080237829 - Cheah; Chuan ; et al. | 2008-10-02 |
| Cascoded rectifier package Grant 7,402,845 - Cheah , et al. July 22, 2 | 2008-07-22 |
| Multi-chip module App 20080048342 - Cheah; Chuan ; et al. | 2008-02-28 |
| Semiconductor package Grant 7,304,372 - Hu , et al. December 4, 2 | 2007-12-04 |
| Semiconductor device module with flip chip devices on a common lead frame Grant 7,301,235 - Schaffer , et al. November 27, 2 | 2007-11-27 |
| Copper straps App 20070267727 - Hu; Kunzhong ; et al. | 2007-11-22 |
| Semiconductor package App 20070210438 - Briere; Michael A. ; et al. | 2007-09-13 |
| Method for fabricating a semiconductor package App 20070212822 - Hu; Kunzhong ; et al. | 2007-09-13 |
| Interdigitated conductive lead frame or laminate lead frame for GaN die App 20070181934 - Hu; Kunzhong ; et al. | 2007-08-09 |
| Cascoded rectifier package App 20070176291 - Cheah; Chuan ; et al. | 2007-08-02 |
| Semiconductor package App 20070063216 - Hu; Kunzhong ; et al. | 2007-03-22 |
| Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance App 20060022333 - Shivkumar; Bharat ; et al. | 2006-02-02 |
| Semiconductor device module with flip chip devices on a common lead frame App 20050280163 - Schaffer, Christopher P. ; et al. | 2005-12-22 |
| Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance Grant 6,949,822 - Shivkumar , et al. September 27, 2 | 2005-09-27 |
| Tin antimony solder for MOSFET with TiNiAg back metal Grant 6,896,976 - Cheah May 24, 2 | 2005-05-24 |
| Tin antimony solder for MOSFET with TiNiAg back metal App 20040200886 - Cheah, Chuan | 2004-10-14 |
| Contact structure for semiconductor device Grant 6,765,292 - Cheah , et al. July 20, 2 | 2004-07-20 |
| Contact structure for semiconductor device App 20030107130 - Cheah, Chuan ; et al. | 2003-06-12 |
| Three commonly housed diverse semiconductor dice Grant 6,448,643 - Cheah , et al. September 10, 2 | 2002-09-10 |
| Chip array with two-sided cooling App 20020070441 - Cheah, Chuan | 2002-06-13 |
| Commonly housed diverse semiconductor Grant 6,404,050 - Davis , et al. June 11, 2 | 2002-06-11 |
| Solder-on back metal for semiconductor die Grant 6,376,910 - Munoz , et al. April 23, 2 | 2002-04-23 |
| Commonly housed diverse semiconductor App 20020008319 - Davis, Christopher ; et al. | 2002-01-24 |
| Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance App 20010050441 - Shivkumar, Bharat ; et al. | 2001-12-13 |
| Three commonly housed diverse semiconductor dice App 20010048154 - Cheah, Chuan ; et al. | 2001-12-06 |
| Co-packaged MOS-gated device and control integrated circuit Grant 6,184,585 - Martinez , et al. February 6, 2 | 2001-02-06 |
| Commonly housed diverse semiconductor die Grant 6,133,632 - Davis , et al. October 17, 2 | 2000-10-17 |
| Semiconductor package Grant 6,040,626 - Cheah , et al. March 21, 2 | 2000-03-21 |
| Commonly housed diverse semiconductor die Grant 5,814,884 - Davis , et al. September 29, 1 | 1998-09-29 |
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