Chau; Ellis

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chau; Ellis.The latest application filed is for "package-on-package assembly with wire bond vias".

Company Profile

9.45.45

Chau; Ellis - San Jose CA
- San Jose CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package-on-package assembly with wire bonds to encapsulation surface Grant 11,424,211 - Sato , et al. August 23, 2	2022-08-23
Package-on-package Assembly With Wire Bond Vias App 20220165703 - Chau; Ellis ; et al.	2022-05-26
Package-on-package assembly with wire bond vias Grant 11,189,595 - Chau , et al. November 30, 2	2021-11-30
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface App 20210050322 - Sato; Hiroaki ; et al.	2021-02-18
Package-on-package Assembly With Wire Bond Vias App 20210035948 - Chau; Ellis ; et al.	2021-02-04
Package-on-package assembly with wire bonds to encapsulation surface Grant 10,833,044 - Sato , et al. November 10, 2	2020-11-10
Package-on-package assembly with wire bond vias Grant 10,756,049 - Chau , et al. A	2020-08-25
Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20200168579 - SATO; Hiroaki ; et al.	2020-05-28
Package-on-package assembly with wire bonds to encapsulation surface Grant 10,593,643 - Sato , et al.	2020-03-17
BVA interposer Grant 10,297,582 - Caskey , et al.	2019-05-21
Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20180350766 - SATO; Hiroaki ; et al.	2018-12-06
Package-on-package assembly with wire bonds to encapsulation surface Grant 10,062,661 - Sato , et al. August 28, 2	2018-08-28
Method for making a microelectronic assembly having conductive elements Grant 9,984,901 - Haba , et al. May 29, 2	2018-05-29
Package-on-package Assembly With Wire Bond Vias App 20180026007 - Chau; Ellis ; et al.	2018-01-25
Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20170287733 - SATO; Hiroaki ; et al.	2017-10-05
Package-on-package assembly with wire bond vias Grant 9,761,558 - Chau , et al. September 12, 2	2017-09-12
Package-on-package assembly with wire bonds to encapsulation surface Grant 9,691,731 - Sato , et al. June 27, 2	2017-06-27
Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface Grant 9,615,456 - Haba , et al. April 4, 2	2017-04-04
BVA interposer Grant 9,502,390 - Caskey , et al. November 22, 2	2016-11-22
Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20160211237 - Sato; Hiroaki ; et al.	2016-07-21
Microelectronic package Grant 9,349,672 - Mohammed , et al. May 24, 2	2016-05-24
Bva Interposer App 20160079214 - Caskey; Terrence ; et al.	2016-03-17
Microelectronic Packages And Methods Therefor App 20160056058 - Haba; Belgacem ; et al.	2016-02-25
Package-on-package assembly with wire bond vias Grant 9,252,122 - Chau , et al. February 2, 2	2016-02-02
Package-on-package assembly with wire bonds to encapsulation surface Grant 9,224,717 - Sato , et al. December 29, 2	2015-12-29
Microelectronic packages and methods therefor Grant 9,218,988 - Haba , et al. December 22, 2	2015-12-22
Flow underfill for microelectronic packages Grant 9,196,581 - Haba , et al. November 24, 2	2015-11-24
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface App 20150334831 - Haba; Belgacem ; et al.	2015-11-19
Impedence controlled packages with metal sheet or 2-layer RDL Grant 9,136,197 - Haba , et al. September 15, 2	2015-09-15
Package-on-package Assembly With Wire Bond Vias App 20150255424 - Chau; Ellis ; et al.	2015-09-10
Package-on-package assembly with wire bond vias Grant 9,105,483 - Chau , et al. August 11, 2	2015-08-11
Package-on-package assembly with wire bonds to encapsulation surface Grant 9,093,435 - Sato , et al. July 28, 2	2015-07-28
Structure for microelectronic packaging with bond elements to encapsulation surface Grant 9,095,074 - Haba , et al. July 28, 2	2015-07-28
Package-on-package assembly with wire bond vias Grant 9,041,227 - Chau , et al. May 26, 2	2015-05-26
Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same Grant 9,029,759 - Singh , et al. May 12, 2	2015-05-12
Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20150091118 - Sato; Hiroaki ; et al.	2015-04-02
Impedance controlled packages with metal sheet or 2-layer rdl Grant 8,981,579 - Haba , et al. March 17, 2	2015-03-17
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface App 20150034371 - Haba; Belgacem ; et al.	2015-02-05
Method of making wire bond vias and microelectronic package having wire bond vias Grant 8,940,630 - Damberg , et al. January 27, 2	2015-01-27
Structure for microelectronic packaging with bond elements to encapsulation surface Grant 8,878,353 - Haba , et al. November 4, 2	2014-11-04
Impedance Controlled Packages With Metal Sheet Or 2-layer Rdl App 20140291871 - Haba; Belgacem ; et al.	2014-10-02
Package-on-package assembly with wire bond vias Grant 8,836,136 - Chau , et al. September 16, 2	2014-09-16
Flow Underfill For Microelectronic Packages App 20140217584 - Haba; Belgacem ; et al.	2014-08-07
Method Of Making Wire Bond Vias And Microelectronic Package Having Wire Bond Vias App 20140220744 - Damberg; Philip ; et al.	2014-08-07
Microelectronic Packages And Methods Therefor App 20140213021 - Haba; Belgacem ; et al.	2014-07-31
Impedance controlled packages with metal sheet or 2-layer RDL Grant 8,786,083 - Haba , et al. July 22, 2	2014-07-22
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface App 20140175671 - Haba; Belgacem ; et al.	2014-06-26
Microelectronic packages and methods therefor Grant 8,728,865 - Haba , et al. May 20, 2	2014-05-20
No flow underfill Grant 8,697,492 - Haba , et al. April 15, 2	2014-04-15
Bva Interposer App 20140036454 - Caskey; Terrence ; et al.	2014-02-06
Package-on-package assembly with wire bonds to encapsulation surface Grant 8,618,659 - Sato , et al. December 31, 2	2013-12-31
Package-on-package assembly with wire bonds to encapsulation surface Grant 08618659 -	2013-12-31
Package-on-package Assembly With Wire Bond Vias App 20130328219 - Chau; Ellis ; et al.	2013-12-12
Compact Camera Module App 20130270419 - Singh; Harpuneet ; et al.	2013-10-17
Microelectronic Package App 20130249116 - Mohammed; Ilyas ; et al.	2013-09-26
Package-on-package Assembly With Wire Bond Vias App 20130200533 - Chau; Ellis ; et al.	2013-08-08
Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20130203216 - Sato; Hiroaki ; et al.	2013-08-08
Package-on-package Assembly With Wire Bond Vias App 20130093088 - Chau; Ellis ; et al.	2013-04-18
Package-on-package Assembly With Wire Bond Vias App 20130093087 - Chau; Ellis ; et al.	2013-04-18
Package-on-package Assembly With Wire Bond Vias App 20130095610 - Chau; Ellis ; et al.	2013-04-18
Package-on-package assembly with wire bond vias Grant 8,404,520 - Chau , et al. March 26, 2	2013-03-26
Impedence Controlled Packages With Metal Sheet Or 2-layer Rdl App 20120313228 - Haba; Belgacem ; et al.	2012-12-13
Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20120280386 - Sato; Hiroaki ; et al.	2012-11-08
Microelectronic package Grant 8,299,626 - Mohammed , et al. October 30, 2	2012-10-30
Metal can impedance control structure Grant 8,222,725 - Haba , et al. July 17, 2	2012-07-17
No Flow Underfill App 20120104595 - Haba; Belgacem ; et al.	2012-05-03
Metal Can Impedance Control Structure App 20120068365 - Haba; Belgacem ; et al.	2012-03-22
Impedance Controlled Packages With Metal Sheet Or 2-layer Rdl App 20120068338 - Haba; Belgacem ; et al.	2012-03-22
Microelectronic packages and methods therefor Grant 8,093,697 - Haba , et al. January 10, 2	2012-01-10
Microelectronic packages and methods therefor Grant 8,058,101 - Haba , et al. November 15, 2	2011-11-15
Microelectronic Packages And Methods Therefor App 20110165733 - Haba; Belgacem ; et al.	2011-07-07
Microelectronic Packages And Methods Therefor App 20100232129 - Haba; Belgacem ; et al.	2010-09-16
Microelectronic package App 20090045524 - Mohammed; IIyas ; et al.	2009-02-19
Microelectronic packages and methods therefor App 20080185705 - Osborn; Philip R. ; et al.	2008-08-07
Alignment and cutting of microelectronic substrates App 20080156518 - Honer; Kenneth Allen ; et al.	2008-07-03
Microelectronic packages and methods therefor App 20070148822 - Haba; Belgacem ; et al.	2007-06-28
Molding method for foldover package App 20060223227 - Kubota; Yoichi ; et al.	2006-10-05
Foldover packages and manufacturing and test methods therefor App 20050150813 - Thompson, Jesse Burl ; et al.	2005-07-14