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name:-0.0070710182189941
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Chang; Huang-Hsien Patent Filings

Chang; Huang-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Huang-Hsien.The latest application filed is for "recessed portion in a substrate and method of forming the same".

Company Profile
12.10.20
  • Chang; Huang-Hsien - Kaohsiung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor package device and method for manufacturing the same
Grant 11,411,073 - Chuang , et al. August 9, 2
2022-08-09
Semiconductor package structure and method of manufacturing the same
Grant 11,410,957 - Chuang , et al. August 9, 2
2022-08-09
Recessed Portion In A Substrate And Method Of Forming The Same
App 20220236489 - CHUANG; Shao Hsuan ;   et al.
2022-07-28
Substrate Structure And Method For Manufacturing The Same
App 20220223507 - LIU; Syu-Tang ;   et al.
2022-07-14
Optical Device Package And Method For Manufacturing The Same
App 20220128768 - CHANG; Huang-Hsien ;   et al.
2022-04-28
Wiring Structure And Method For Manufacturing The Same
App 20220122919 - LIU; Syu-Tang ;   et al.
2022-04-21
Electronic Device And Method For Manufacturing The Same
App 20220108826 - CHEN; Yunghsun ;   et al.
2022-04-07
Substrate structure and method for manufacturing the same
Grant 11,289,411 - Liu , et al. March 29, 2
2022-03-29
Recessed portion in a substrate and method of forming the same
Grant 11,262,506 - Chuang , et al. March 1, 2
2022-03-01
Recessed Portion In A Substrate And Method Of Forming The Same
App 20220043215 - CHUANG; Shao Hsuan ;   et al.
2022-02-10
Inductor And Circuit Structure And Method Of Manufacturing The Same
App 20220028596 - LIU; Syu-Tang ;   et al.
2022-01-27
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20220028817 - CHUANG; Shao Hsuan ;   et al.
2022-01-27
Optical device package and method for manufacturing the same
Grant 11,215,762 - Chang , et al. January 4, 2
2022-01-04
Semiconductor Device And Method Of Manufacturing The Same
App 20210296267 - CHEN; Jhao-Cheng ;   et al.
2021-09-23
Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer
Grant 11,107,881 - Chuang , et al. August 31, 2
2021-08-31
Semiconductor Package Structures And Methods Of Manufacturing The Same
App 20210265290 - LIU; Syu-Tang ;   et al.
2021-08-26
Semiconductor Package Device And Method For Manufacturing The Same
App 20210265459 - CHUANG; Shao Hsuan ;   et al.
2021-08-26
Substrate Structure And Method For Manufacturing The Same
App 20210233836 - LIU; Syu-Tang ;   et al.
2021-07-29
Package Structure And Method For Manufacturing The Same
App 20210151407 - LIU; Syu-Tang ;   et al.
2021-05-20
Package Structure, Assembly Structure And Method For Manufacturing The Same
App 20210118812 - LIU; Syu-Tang ;   et al.
2021-04-22
Vertical Capacitor Structure, Capacitor Component, And Method For Manufacturing The Vertical Capacitor Structure
App 20210104595 - LIU; Syu-Tang ;   et al.
2021-04-08
Vertical capacitor structure having capacitor in cavity and method for manufacturing the same
Grant 10,847,602 - Liu , et al. November 24, 2
2020-11-24
Semiconductor Package Devices And Methods Of Making The Same
App 20200343336 - CHUANG; Shao Hsuan ;   et al.
2020-10-29
Semiconductor device package and method of manufacturing the same
Grant 10,796,987 - Lu , et al. October 6, 2
2020-10-06
Substrate structure and method for manufacturing the same
Grant 10,741,483 - Liu , et al. A
2020-08-11
Vertical Capacitor Structure, Capacitor Component, And Method For Manufacturing The Vertical Capacitor Structure
App 20200219968 - LIU; Syu-Tang ;   et al.
2020-07-09
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200144168 - LU; Wen-Long ;   et al.
2020-05-07
Optica device package and method for manufacturing the same
App 20200057201 - Chang; Huang-Hsien ;   et al.
2020-02-20
Semiconductor package device and method of manufacturing the same
Grant 10,344,383 - Shih , et al. July 9, 2
2019-07-09
Semiconductor Package Device And Method Of Manufacturing The Same
App 20190040527 - SHIH; Chuan-Yung ;   et al.
2019-02-07

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